[go: up one dir, main page]

NL7906603A - Werkwijze voor het vervaardigen van een printplaat bestaande uit meerdere lagen. - Google Patents

Werkwijze voor het vervaardigen van een printplaat bestaande uit meerdere lagen. Download PDF

Info

Publication number
NL7906603A
NL7906603A NL7906603A NL7906603A NL7906603A NL 7906603 A NL7906603 A NL 7906603A NL 7906603 A NL7906603 A NL 7906603A NL 7906603 A NL7906603 A NL 7906603A NL 7906603 A NL7906603 A NL 7906603A
Authority
NL
Netherlands
Prior art keywords
conductor
conductor tracks
insulating layer
conductor track
printed circuit
Prior art date
Application number
NL7906603A
Other languages
English (en)
Dutch (nl)
Original Assignee
Int Standard Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Int Standard Electric Corp filed Critical Int Standard Electric Corp
Publication of NL7906603A publication Critical patent/NL7906603A/nl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
NL7906603A 1978-09-07 1979-09-04 Werkwijze voor het vervaardigen van een printplaat bestaande uit meerdere lagen. NL7906603A (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19782838982 DE2838982B2 (de) 1978-09-07 1978-09-07 Verfahren zum Herstellen von Mehrebenen-Leiterplatten
DE2838982 1978-09-07

Publications (1)

Publication Number Publication Date
NL7906603A true NL7906603A (nl) 1980-03-11

Family

ID=6048893

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7906603A NL7906603A (nl) 1978-09-07 1979-09-04 Werkwijze voor het vervaardigen van een printplaat bestaande uit meerdere lagen.

Country Status (7)

Country Link
BE (1) BE878645A (es)
DE (1) DE2838982B2 (es)
ES (1) ES483975A1 (es)
FR (1) FR2447131A1 (es)
GB (1) GB2030781B (es)
NL (1) NL7906603A (es)
SE (1) SE7907298L (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4816070A (en) * 1985-08-29 1989-03-28 Techo Instruments Investments Ltd. Use of immersion tin and alloys as a bonding medium for multilayer circuits
US4715894A (en) * 1985-08-29 1987-12-29 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
JPS6276600A (ja) * 1985-09-29 1987-04-08 株式会社　アサヒ化学研究所 基板に導電回路を形成する方法
SE455148B (sv) * 1985-11-15 1988-06-20 Leeb Karl Erik Anordning innefattande ett substrat och derpa applicerat ledningsmonster vid framstellning av monsterkort samt forfarande for framstellning av anordningen
GB8630392D0 (en) * 1986-12-19 1987-01-28 Prestwick Circuits Ltd Producing printed circuit boards
US4804575A (en) * 1987-01-14 1989-02-14 Kollmorgen Corporation Multilayer printed wiring boards
JPH03196691A (ja) * 1989-12-26 1991-08-28 Cmk Corp プリント配線板の絶縁層の形成方法
DE4237611A1 (de) * 1992-11-09 1994-05-11 Lueberg Elektronik Gmbh & Co R Verfahren zur Herstellung von Leiterplatten

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB892451A (en) * 1957-12-03 1962-03-28 Radio And Allied Ind Ltd Improvements in and relating to the manufacture of printed circuits
US3349162A (en) * 1965-08-23 1967-10-24 Automatic Elect Lab Intra-connection techniques for multilayer printed wiring boards
DE1924775B2 (de) * 1969-05-14 1971-06-09 Verfahren zur herstellung einer leiterplatte
GB1310880A (en) * 1969-06-13 1973-03-21 Microponent Dev Ltd Multi-layer printed circuit board assemblies

Also Published As

Publication number Publication date
GB2030781B (en) 1982-10-13
SE7907298L (sv) 1980-03-08
FR2447131A1 (fr) 1980-08-14
DE2838982A1 (de) 1980-03-20
DE2838982B2 (de) 1980-09-18
ES483975A1 (es) 1980-04-01
BE878645A (nl) 1980-03-07
GB2030781A (en) 1980-04-10

Similar Documents

Publication Publication Date Title
US4722765A (en) Process for preparing printed circuits
JP3059568B2 (ja) 多層プリント回路基板の製造方法
US5948280A (en) Multilayer printed circuit board laminated with unreinforced resin
JPH11126978A (ja) 多層配線基板
US7259333B2 (en) Composite laminate circuit structure
NL7906603A (nl) Werkwijze voor het vervaardigen van een printplaat bestaande uit meerdere lagen.
JPH09275273A (ja) 多層配線板の製造方法
US6586687B2 (en) Printed wiring board with high density inner layer structure
JP2579960B2 (ja) 多層印刷配線板の製造法
JPS63182886A (ja) プリント配線板およびその製法
KR100516621B1 (ko) 전층 ｉｖｈ 공법의 인쇄회로기판 및 이의 제조방법
CA1283591C (en) Method for making a flush surface laminate for a multilayer circuit board
JP2002185099A (ja) プリント回路板及びその製造方法
JP3780535B2 (ja) プリント配線板の製造方法
JPH10335834A (ja) 多層配線基板
JPH0451079B2 (es)
KR970064913A (ko) 구리- 피복 라미네이트, 다층 구리- 피복 라미네이트 및 그의 제조방법
KR20040065861A (ko) 전층 ｉｖｈ공법의 인쇄회로기판 및 이의 제조방법
JPH0878803A (ja) プリント配線板およびその製造方法
JPS60182195A (ja) 回路基板
JPH05259600A (ja) 配線板およびその製造法
JPH08288657A (ja) 多層配線板
JPH02252294A (ja) 多層板の製造法
JP2005026548A (ja) マルチワイヤ配線板の製造方法
CN116321730A (zh) 线路板制备方法以及线路板

Legal Events

Date Code Title Description
BV The patent application has lapsed