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NL6801149A - - Google Patents

Info

Publication number
NL6801149A
NL6801149A NL6801149A NL6801149A NL6801149A NL 6801149 A NL6801149 A NL 6801149A NL 6801149 A NL6801149 A NL 6801149A NL 6801149 A NL6801149 A NL 6801149A NL 6801149 A NL6801149 A NL 6801149A
Authority
NL
Netherlands
Prior art keywords
plates
carrier
columns
plane
suction
Prior art date
Application number
NL6801149A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6801149A publication Critical patent/NL6801149A/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002Preparing wafers
    • H01L21/02005Preparing bulk and homogeneous wafers
    • H01L21/02008Multistep processes
    • H01L21/0201Specific process step
    • H01L21/02013Grinding, lapping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/27Work carriers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
NL6801149A 1967-03-03 1968-01-25 NL6801149A (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0108629 1967-03-03

Publications (1)

Publication Number Publication Date
NL6801149A true NL6801149A (xx) 1968-09-04

Family

ID=7528929

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6801149A NL6801149A (xx) 1967-03-03 1968-01-25

Country Status (5)

Country Link
US (1) US3562965A (xx)
DE (1) DE1652170B2 (xx)
FR (1) FR1564761A (xx)
GB (1) GB1170897A (xx)
NL (1) NL6801149A (xx)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3803774A (en) * 1972-12-22 1974-04-16 Bell Telephone Labor Inc Technique for correcting the crystallo-graphic orientation angle of crystals by the formation of mesas and double face lapping
US3805458A (en) * 1972-12-22 1974-04-23 Bell Telephone Labor Inc Technique for correcting the crystallographic orientation angle of crystals by double face lapping of overlapping layers
DE2712521C2 (de) * 1977-03-22 1987-03-05 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verfahren zum Aufkitten von Scheiben
US4316757A (en) * 1980-03-03 1982-02-23 Monsanto Company Method and apparatus for wax mounting of thin wafers for polishing
JP2648638B2 (ja) * 1990-11-30 1997-09-03 三菱マテリアル株式会社 ウェーハの接着方法およびその装置
US6010392A (en) * 1998-02-17 2000-01-04 International Business Machines Corporation Die thinning apparatus
US7121924B2 (en) 2004-04-20 2006-10-17 3M Innovative Properties Company Abrasive articles, and methods of making and using the same
US8124455B2 (en) * 2005-04-02 2012-02-28 Stats Chippac Ltd. Wafer strength reinforcement system for ultra thin wafer thinning
CA2690791C (en) * 2007-06-25 2012-10-30 Saint-Gobain Ceramics & Plastics, Inc. Methods of crystallographically reorienting single crystal bodies
CN110370165B (zh) * 2019-07-22 2021-07-13 吉林大学 一种耐磨损的行星研磨盘

Also Published As

Publication number Publication date
FR1564761A (xx) 1969-04-25
DE1652170A1 (de) 1971-02-25
GB1170897A (en) 1969-11-19
US3562965A (en) 1971-02-16
DE1652170B2 (de) 1975-05-22

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