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MY196583A - Heater Chip Unit - Google Patents

Heater Chip Unit

Info

Publication number
MY196583A
MY196583A MYPI2022004865A MYPI2022004865A MY196583A MY 196583 A MY196583 A MY 196583A MY PI2022004865 A MYPI2022004865 A MY PI2022004865A MY PI2022004865 A MYPI2022004865 A MY PI2022004865A MY 196583 A MY196583 A MY 196583A
Authority
MY
Malaysia
Prior art keywords
trowel
heater chip
contact
temperature measuring
anchoring
Prior art date
Application number
MYPI2022004865A
Other languages
English (en)
Inventor
Shinichiro Suga
Original Assignee
Apollo Giken Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apollo Giken Co Ltd filed Critical Apollo Giken Co Ltd
Publication of MY196583A publication Critical patent/MY196583A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Control Of Resistance Heating (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Electrodes For Cathode-Ray Tubes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Resistance Heating (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
MYPI2022004865A 2020-09-09 2021-07-20 Heater Chip Unit MY196583A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020151045A JP7137237B2 (ja) 2020-09-09 2020-09-09 ヒーターチップユニット
PCT/JP2021/027196 WO2022054421A1 (ja) 2020-09-09 2021-07-20 ヒーターチップユニット

Publications (1)

Publication Number Publication Date
MY196583A true MY196583A (en) 2023-04-19

Family

ID=80632533

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2022004865A MY196583A (en) 2020-09-09 2021-07-20 Heater Chip Unit

Country Status (6)

Country Link
JP (1) JP7137237B2 (zh)
KR (1) KR102772591B1 (zh)
CN (1) CN115461180A (zh)
MY (1) MY196583A (zh)
TW (1) TWI865823B (zh)
WO (1) WO2022054421A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115889928B (zh) * 2022-12-15 2023-09-05 东莞顺为半导体有限公司 一种焊头结构及焊头温度补偿方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55127097A (en) * 1979-03-20 1980-10-01 Matsushita Electric Ind Co Ltd Photocurable resin composition and solder resist
US4424930A (en) * 1981-06-29 1984-01-10 Cooper Industries, Inc. Carbon-based soldering and de-soldering tip and method of manufacturing same
US5297716A (en) * 1993-04-12 1994-03-29 Honeywell Inc. Soldering tool with attached thermocouple
JP3968205B2 (ja) 2000-03-30 2007-08-29 太陽誘電株式会社 熱圧着用ヒーターチップ及びその製造方法
JP4224050B2 (ja) * 2005-10-31 2009-02-12 日本アビオニクス株式会社 ヒーターチップの熱電対取付構造および熱電対取付方法
KR20100097984A (ko) * 2009-02-27 2010-09-06 (주)엠에스테크비젼 납땜용 인두기 및 이를 포함하는 납땜용 인두 장치
US20100243712A1 (en) * 2009-03-27 2010-09-30 Ats Automation Tooling Systems Inc. Thermode, clamping arrangment therefor, and method of manufacture
JP2010253503A (ja) * 2009-04-23 2010-11-11 Miyachi Technos Corp ヒータチップ及び接合装置
JP5457107B2 (ja) * 2009-05-19 2014-04-02 ミヤチテクノス株式会社 ヒータチップ及び接合装置
JP2012183552A (ja) * 2011-03-04 2012-09-27 Miyachi Technos Corp ヒータチップ及び接合装置及び接合方法
JP5794577B2 (ja) * 2011-10-21 2015-10-14 株式会社アマダミヤチ ヒータチップ及び接合装置及び接合方法並びに導体細線と端子の接続構造
US10799977B2 (en) * 2015-08-28 2020-10-13 Kobo Pda Co., Ltd. Heater chip, joining apparatus and joining method
JP6677406B2 (ja) * 2015-09-25 2020-04-08 株式会社 工房Ｐｄａ ヒータチップ及び接合装置及び接合方法
JP6851610B2 (ja) * 2016-07-19 2021-03-31 株式会社 工房Ｐｄａ ヒータチップ及び接合装置及び接合方法

Also Published As

Publication number Publication date
KR20220130802A (ko) 2022-09-27
TW202211744A (zh) 2022-03-16
JP2022045444A (ja) 2022-03-22
JP7137237B2 (ja) 2022-09-14
TWI865823B (zh) 2024-12-11
KR102772591B1 (ko) 2025-02-26
WO2022054421A1 (ja) 2022-03-17
CN115461180A (zh) 2022-12-09

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