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MY177229A - Cutting apparatus - Google Patents

Cutting apparatus

Info

Publication number
MY177229A
MY177229A MYPI2015000517A MYPI2015000517A MY177229A MY 177229 A MY177229 A MY 177229A MY PI2015000517 A MYPI2015000517 A MY PI2015000517A MY PI2015000517 A MYPI2015000517 A MY PI2015000517A MY 177229 A MY177229 A MY 177229A
Authority
MY
Malaysia
Prior art keywords
vibration signal
vibration
cutting blade
flange member
options
Prior art date
Application number
MYPI2015000517A
Inventor
Kubo Masahiro
Nakanishi Yuji
Izumi Kuniharu
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of MY177229A publication Critical patent/MY177229A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
  • Turning (AREA)

Abstract

A cutting apparatus (2) includes a vibration signal generating unit for generating a vibration signal corresponding to the vibration of a cutting blade (60) and a control unit for determining the condition of the cutting blade (60) according to the vibration signal generated by the vibration signal generating unit. The vibration signal generating unit includes an ultrasonic vibrator (70) provided in a first flange member (46) for generating a voltage corresponding to the vibration signal corresponding to the vibration of the cutting blade (60) and a transmitting unit connected to the ultrasonic vibrator (70) for transmitting the voltage to the control unit. A plurality of options for the first flange member (46) having a plurality of options for the ultrasonic vibrator (70) different in resonance frequency are prepared and any one of the plural options for the first flange member (46) is selected according to the frequency of the vibration of the cutting blade (60) to be detected. Then, this selected option for the first flange member (46) is mounted on a spindle. Figure 3
MYPI2015000517A 2014-03-07 2015-02-27 Cutting apparatus MY177229A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014044994A JP6223237B2 (en) 2014-03-07 2014-03-07 Cutting equipment

Publications (1)

Publication Number Publication Date
MY177229A true MY177229A (en) 2020-09-09

Family

ID=54023049

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015000517A MY177229A (en) 2014-03-07 2015-02-27 Cutting apparatus

Country Status (5)

Country Link
JP (1) JP6223237B2 (en)
KR (1) KR102228492B1 (en)
CN (1) CN104889869B (en)
MY (1) MY177229A (en)
TW (1) TWI651178B (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107756138A (en) * 2016-08-18 2018-03-06 王智中 Cutting tool state online detection method and device
JP6846214B2 (en) * 2017-01-20 2021-03-24 株式会社ディスコ Cutting equipment
JP6846657B2 (en) * 2017-01-20 2021-03-24 株式会社ディスコ Cutting equipment
JP6800774B2 (en) * 2017-02-22 2020-12-16 株式会社ディスコ Cutting equipment
JP6847746B2 (en) * 2017-04-11 2021-03-24 株式会社ディスコ Cutting equipment
JP6866217B2 (en) 2017-04-21 2021-04-28 株式会社ディスコ Cutting equipment
JP6901906B2 (en) 2017-05-12 2021-07-14 株式会社ディスコ Cutting equipment
CN108417508B (en) * 2018-01-22 2020-12-18 西安理工大学 A Micro-arc Discharge Cutting Device for Semiconductors
JP7145710B2 (en) * 2018-09-25 2022-10-03 株式会社ディスコ cutting equipment
CN109530845B (en) * 2018-10-29 2021-03-26 陕西航空电气有限责任公司 Tool for removing solder oxide layer on surface of rectifier tube chip
CN109834521B (en) * 2019-01-23 2024-10-29 南京航空航天大学 Non-contact rotary ultrasonic processing dynamic signal extraction device
JP2021041502A (en) * 2019-09-12 2021-03-18 株式会社ディスコ Cutting blade, manufacturing method for cutting blade and cutting method for wafer
TWI741705B (en) 2020-07-28 2021-10-01 國立中興大學 Power supply outside the spindle
CN118893721B (en) * 2024-10-09 2024-12-13 广东科卓半导体设备有限公司 Edge breakage prevention ultrasonic wafer cutting system and wafer cutting method

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS474816Y1 (en) 1967-03-30 1972-02-21
US4514797A (en) * 1982-09-03 1985-04-30 Gte Valeron Corporation Worn tool detector utilizing normalized vibration signals
JPS6062464A (en) * 1983-09-10 1985-04-10 Kawasaki Steel Corp Side end grinding attachment for metallic belt by rotary grinding wheel
JPH0499946A (en) * 1990-08-20 1992-03-31 Sanko Control Kk Method and apparatus for measuring cutting ability of grinder wheel
JPH05154833A (en) * 1991-12-09 1993-06-22 Nikko Kyodo Co Ltd Dicing machine
JP3534338B2 (en) * 1999-10-07 2004-06-07 松下電器産業株式会社 Cutting equipment
JP2002066879A (en) * 2000-09-04 2002-03-05 Bosch Automotive Systems Corp Acoustic emission detecting device for machine tool
JP4658730B2 (en) * 2005-07-28 2011-03-23 株式会社ディスコ Cutting equipment
EP1977857A1 (en) * 2006-01-12 2008-10-08 Tokyo Seimitsu Co.,Ltd. Working system, contact detecting method, and ae contact detecting device
JP4552883B2 (en) * 2006-04-19 2010-09-29 株式会社デンソー Vibration detection method
JP2008290203A (en) * 2007-05-25 2008-12-04 Nissan Diesel Motor Co Ltd Grinding work monitoring system and grinding work monitoring method
JP2009032726A (en) * 2007-07-24 2009-02-12 Disco Abrasive Syst Ltd Method for dividing wafer
TW201226101A (en) * 2010-12-28 2012-07-01 Nat Univ Chung Hsing Method and device to detect the state of cutting tool in machine tool with multiple sensors
JP5258921B2 (en) * 2011-03-31 2013-08-07 株式会社小松製作所 Machine tool and its processing control device
JP5764031B2 (en) * 2011-10-06 2015-08-12 株式会社ディスコ Cutting equipment
JP5943578B2 (en) * 2011-10-11 2016-07-05 株式会社東京精密 Wafer chamfering apparatus, and method for detecting surface state of chamfering grindstone or processing state of wafer by chamfering grindstone
TW201332704A (en) * 2012-02-10 2013-08-16 中原大學 Cutting edge chip-buildup monitoring method

Also Published As

Publication number Publication date
JP6223237B2 (en) 2017-11-01
CN104889869A (en) 2015-09-09
TW201540451A (en) 2015-11-01
KR20150105221A (en) 2015-09-16
CN104889869B (en) 2019-07-30
TWI651178B (en) 2019-02-21
KR102228492B1 (en) 2021-03-15
JP2015170743A (en) 2015-09-28

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