[go: up one dir, main page]

MY143042A - Polishing composition - Google Patents

Polishing composition

Info

Publication number
MY143042A
MY143042A MYPI20040668A MY143042A MY 143042 A MY143042 A MY 143042A MY PI20040668 A MYPI20040668 A MY PI20040668A MY 143042 A MY143042 A MY 143042A
Authority
MY
Malaysia
Prior art keywords
polishing composition
polishing
appplication
abrasive
substrate
Prior art date
Application number
Inventor
Tomohide Kamiya
Noritaka Yokomichi
Toshiki Owaki
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of MY143042A publication Critical patent/MY143042A/en

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

THE PRESENT INVENTION RELATES TO A POLISHING COMPOSITION MORE SUITABLE FOR APPPLICATION IN POLISHING A SUBSTRATE FOR A MAGNETIC DISK. THE POLISHING COMPOSITION INCLUDES SILICON OXIDE SERVING AS AN ABRASIVE, METHANESULFONIC ACID, HYDROGEN PEROXIDE, AND WATER.
MYPI20040668 2003-02-28 2004-02-27 Polishing composition MY143042A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003054867A JP4202157B2 (en) 2003-02-28 2003-02-28 Polishing composition

Publications (1)

Publication Number Publication Date
MY143042A true MY143042A (en) 2011-02-28

Family

ID=33119088

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20040668 MY143042A (en) 2003-02-28 2004-02-27 Polishing composition

Country Status (3)

Country Link
JP (1) JP4202157B2 (en)
CN (1) CN100350008C (en)
MY (1) MY143042A (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006077127A (en) * 2004-09-09 2006-03-23 Fujimi Inc Polishing composition and polishing method using the composition
US7901474B2 (en) 2004-12-22 2011-03-08 Showa Denko K.K. Polishing composition and polishing method
JP2006315160A (en) * 2005-05-16 2006-11-24 Fuji Electric Holdings Co Ltd Finish polishing method for glass substrate of magnetic disk
US20070068902A1 (en) * 2005-09-29 2007-03-29 Yasushi Matsunami Polishing composition and polishing method
JP2008053371A (en) * 2006-08-23 2008-03-06 Fujifilm Corp Polishing method of semiconductor device
US7955522B2 (en) 2008-02-26 2011-06-07 General Electric Company Synergistic acid blend extraction aid and method for its use
US8247326B2 (en) * 2008-07-10 2012-08-21 Cabot Microelectronics Corporation Method of polishing nickel-phosphorous
JP5617387B2 (en) 2010-07-06 2014-11-05 富士電機株式会社 Method for manufacturing substrate for perpendicular magnetic recording medium, and substrate for perpendicular magnetic recording medium manufactured by the manufacturing method
CN102373014A (en) * 2010-08-24 2012-03-14 安集微电子(上海)有限公司 Chemical-mechanical polishing solution
JP6222907B2 (en) * 2012-09-06 2017-11-01 株式会社フジミインコーポレーテッド Polishing composition
US20160009955A1 (en) 2013-05-15 2016-01-14 Basf Se Chemical-mechanical polishing compositions comprising n,n,n',n'-tetrakis-(2-hydroxypropyl)-ethylenediamine or methanesulfonic acid
US10745589B2 (en) * 2016-06-16 2020-08-18 Versum Materials Us, Llc Chemical mechanical polishing (CMP) of cobalt-containing substrate
JP7058097B2 (en) * 2017-09-29 2022-04-21 株式会社フジミインコーポレーテッド Method for manufacturing polishing composition and magnetic disk substrate
CN109778190A (en) * 2017-11-10 2019-05-21 深圳市华星光电技术有限公司 A kind of Cu-MoTi etching solution

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4092021B2 (en) * 1998-10-02 2008-05-28 花王株式会社 Polishing liquid composition
JP4238951B2 (en) * 1999-09-28 2009-03-18 株式会社フジミインコーポレーテッド Polishing composition and method for producing memory hard disk using the same
JP2002231666A (en) * 2001-01-31 2002-08-16 Fujimi Inc Composition for polishing, and polishing method using the composition
JP4439755B2 (en) * 2001-03-29 2010-03-24 株式会社フジミインコーポレーテッド Polishing composition and method for producing memory hard disk using the same

Also Published As

Publication number Publication date
CN100350008C (en) 2007-11-21
JP4202157B2 (en) 2008-12-24
CN1532245A (en) 2004-09-29
JP2004263074A (en) 2004-09-24

Similar Documents

Publication Publication Date Title
MY143042A (en) Polishing composition
SG157354A1 (en) Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios
MY155900A (en) Cleaning and/or polishing compositions and method for use thereof
TWI347356B (en) Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios
TW200725721A (en) Polishing method, polishing composition and polishing composition kit
EP2357059A3 (en) Method for chemical mechanical planarization of a tungsten-containing substrate
TW200516134A (en) Novel slurry for chemical mechanical polishing of metals
EP1295680A3 (en) Polishing pad for semiconductor wafer
TW200734434A (en) Compositions and methods for tantalum CMP
TW200511422A (en) Treatment or processing of substrate surfaces
ATE484551T1 (en) SURFACE MODIFIED SILICON DIOXIDE-TITANIUM DIOXIDE MIXED OXIDES
TW200802580A (en) Polishing slurry for chemical mechanical polishing (CMP) and polishing method
MY155495A (en) Polishing composition and polishing method using the same
TW200643157A (en) Abrasive for semiconductor integrated circuit device, method for polishing semiconductor integrated circuit device and semiconductor integrated circuit device manufacturing method
TW200734435A (en) Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method and the kit for preparing aqueous dispersion for chemical mechanical polishing
SG161170A1 (en) Method for polishing both sides of a semiconductor wafer
SG116418A1 (en) Semiconductor wafer grinding method.
WO2009060902A1 (en) Ceramic substrate, method for producing ceramic substrate, and method for producing substrate for power module
TW200710210A (en) Slurry for chemical mechanical polishing of aluminum
GB2412868A (en) Cosmetic compositions containing phenyl silicones
TW200617151A (en) Polishing composition and polishing method using the same
IL179570A0 (en) Cmp composition for improved oxide removal rate
MY154434A (en) Polishing composition and polishing method
EP1517972A4 (en) Metal polish composition, polishing method using the composition and method for producing wafer using the polishing method
TW200602157A (en) Polishing pad having grooves configured to promote mixing wakes during polishing