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TW200734435A - Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method and the kit for preparing aqueous dispersion for chemical mechanical polishing - Google Patents

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method and the kit for preparing aqueous dispersion for chemical mechanical polishing

Info

Publication number
TW200734435A
TW200734435A TW095143163A TW95143163A TW200734435A TW 200734435 A TW200734435 A TW 200734435A TW 095143163 A TW095143163 A TW 095143163A TW 95143163 A TW95143163 A TW 95143163A TW 200734435 A TW200734435 A TW 200734435A
Authority
TW
Taiwan
Prior art keywords
mechanical polishing
chemical mechanical
aqueous dispersion
kit
preparing
Prior art date
Application number
TW095143163A
Other languages
Chinese (zh)
Inventor
Masayuki Motonari
Eiichirou Kunitani
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200734435A publication Critical patent/TW200734435A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/7684—Smoothing; Planarisation

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

Disclosed is an aqueous dispersion for chemical mechanical polishing, which contains (A) abrasive grains, (B) an organic acid, (C) an oxidizing agent, (D) a surface active agent and (E) a dispersion medium. In this aqueous dispersion, the above-mentioned (D) the surface active agent has a specific structure.
TW095143163A 2005-11-24 2006-11-22 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method and the kit for preparing aqueous dispersion for chemical mechanical polishing TW200734435A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005338961 2005-11-24

Publications (1)

Publication Number Publication Date
TW200734435A true TW200734435A (en) 2007-09-16

Family

ID=38067099

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095143163A TW200734435A (en) 2005-11-24 2006-11-22 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method and the kit for preparing aqueous dispersion for chemical mechanical polishing

Country Status (3)

Country Link
JP (1) JPWO2007060869A1 (en)
TW (1) TW200734435A (en)
WO (1) WO2007060869A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5013732B2 (en) * 2006-04-03 2012-08-29 Ｊｓｒ株式会社 Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, chemical mechanical polishing kit, and kit for preparing chemical mechanical polishing aqueous dispersion
JP5196112B2 (en) * 2007-07-09 2013-05-15 Ｊｓｒ株式会社 Chemical mechanical polishing aqueous dispersion and method for producing multilayer circuit board
WO2009028256A1 (en) * 2007-08-31 2009-03-05 Jsr Corporation Set for preparation of aqueous dispersion for chemical mechanical polishing and method for preparing aqueous dispersion for chemical mechanical polishing
US20100221918A1 (en) * 2007-09-03 2010-09-02 Jsr Corporation Aqueous dispersion for chemical mechanical polishing and method for preparing the same, kit for preparing aqueous dispersion for chemical mechanical polishing, and chemical mechanical polishing method for semiconductor device
JP2009164188A (en) * 2007-12-28 2009-07-23 Fujimi Inc Polishing composition
JP5403922B2 (en) 2008-02-26 2014-01-29 富士フイルム株式会社 Polishing liquid and polishing method
JP5472585B2 (en) * 2008-05-22 2014-04-16 Ｊｓｒ株式会社 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
JP5495508B2 (en) * 2008-05-23 2014-05-21 日揮触媒化成株式会社 Abrasive particle dispersion and method for producing the same
JP5533664B2 (en) * 2008-11-10 2014-06-25 旭硝子株式会社 Polishing composition and method for manufacturing semiconductor integrated circuit device
JP4990300B2 (en) * 2009-01-14 2012-08-01 パナソニック株式会社 Manufacturing method of semiconductor device
JP5493526B2 (en) * 2009-07-14 2014-05-14 日立化成株式会社 Polishing liquid and polishing method for CMP
JP5493528B2 (en) * 2009-07-15 2014-05-14 日立化成株式会社 CMP polishing liquid and polishing method using this CMP polishing liquid
WO2017213255A1 (en) * 2016-06-09 2017-12-14 日立化成株式会社 Cmp polishing solution and polishing method
JP7161894B2 (en) * 2018-09-04 2022-10-27 株式会社フジミインコーポレーテッド Polishing composition and polishing system
CN115595585A (en) * 2022-11-10 2023-01-13 江西省科学院应用物理研究所（Cn） A kind of preparation method of special metallographic polishing agent for easily oxidized metal

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4253141B2 (en) * 2000-08-21 2009-04-08 株式会社東芝 Chemical mechanical polishing slurry and semiconductor device manufacturing method
JP2003077920A (en) * 2001-09-04 2003-03-14 Nec Corp Method for forming metal wiring
JP2005014206A (en) * 2003-05-30 2005-01-20 Sumitomo Chemical Co Ltd Metal abrasive composition
JP2005045229A (en) * 2003-07-04 2005-02-17 Jsr Corp Water dispersion for chemical mechanical polishing and chemical mechanical polishing method
JP4336550B2 (en) * 2003-09-09 2009-09-30 花王株式会社 Polishing liquid kit for magnetic disk
JP4667013B2 (en) * 2003-11-14 2011-04-06 昭和電工株式会社 Polishing composition and polishing method
JP2005302973A (en) * 2004-04-12 2005-10-27 Jsr Corp Aqueous dispersant for chemical mechanical polishing, and method for the chemical mechanical polishing

Also Published As

Publication number Publication date
WO2007060869A1 (en) 2007-05-31
JPWO2007060869A1 (en) 2009-05-07

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