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MX9701735A - Estructura de circuito de microondas-ondas milimétricas con elementos discretos montados en forma de micropastilla volante y método para la fabricacion de la misma. - Google Patents

Estructura de circuito de microondas-ondas milimétricas con elementos discretos montados en forma de micropastilla volante y método para la fabricacion de la misma.

Info

Publication number
MX9701735A
MX9701735A MX9701735A MX9701735A MX9701735A MX 9701735 A MX9701735 A MX 9701735A MX 9701735 A MX9701735 A MX 9701735A MX 9701735 A MX9701735 A MX 9701735A MX 9701735 A MX9701735 A MX 9701735A
Authority
MX
Mexico
Prior art keywords
substrates
flip
circuit
microwave
millimeter wave
Prior art date
Application number
MX9701735A
Other languages
English (en)
Other versions
MXPA97001735A (es
Inventor
Mehran Matloubian
Perry A Macdonald
David B Rensch
Lawrence A Larson
Original Assignee
He Holdings Inc Tambien Llamad
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by He Holdings Inc Tambien Llamad, Hughes Aircraft Co filed Critical He Holdings Inc Tambien Llamad
Publication of MX9701735A publication Critical patent/MX9701735A/es
Publication of MXPA97001735A publication Critical patent/MXPA97001735A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H01L2224/13111—Tin [Sn] as principal constituent
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    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Una estructura de circuito de microondas/ondas milimétricas soporta elementos de circuito discretos (2) mediante el montaje tipo micropastilla volante a una red de interconexion (10), sobre un substrato dieléctrico no cerámico y no semiconductor (2) de bajo costo, preferentemente del tipo Duroid. La necesaria alineacion precisa de los elementos de circuito con las almohadillas de contacto (14), sobre la red del substrato, requerida para la operacion a altas frecuencias se facilita oxidando (20) la red de interconexion, pero proporcionando almohadillas de contacto de un material no oxidable (14') para establecer una humectacion preferencial de la protuberancia de soldadura (8) por las almohadillas. Alternativamente, las protuberancias de contacto en las micropastillas volantes pueden ubicarse precisamente a través de las aberturas correspondientes (28) en una capa de pasivacion (26) sobre la red de interconexion. Para substratos de circuito delgados que son muy suaves para el exitoso montaje tipo micropastilla volante, se laminan substratos de rigidizacion (24) a los substratos de circuito. En una aplicacion de antena inte-grada en la que dos de los substratos de circuito (32, 36) se laminan juntos, con una antena (34) en un lado y la circuitería en el otro lado, un plano de tierra metálica (56) entre los substratos también proporcionan una funcion de rigidizacion.
MXPA/A/1997/001735A 1995-07-07 1997-03-07 Estructura de circuito de microondas-ondas milimétricas con elementos discretos montados en forma de micropastilla volante y método para la fabricacion de la misma MXPA97001735A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/499,800 US5629241A (en) 1995-07-07 1995-07-07 Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same
US08499800 1995-07-07
PCT/US1996/011144 WO1997002733A2 (en) 1995-07-07 1996-07-01 Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same

Publications (2)

Publication Number Publication Date
MX9701735A true MX9701735A (es) 1998-03-31
MXPA97001735A MXPA97001735A (es) 1998-10-15

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Also Published As

Publication number Publication date
JPH10505466A (ja) 1998-05-26
WO1997002733A2 (en) 1997-01-30
CA2198088C (en) 2001-05-15
EP0782766A3 (en) 1997-11-19
WO1997002733A3 (en) 1997-08-21
DE69637906D1 (de) 2009-06-04
CA2198088A1 (en) 1997-01-30
US5757074A (en) 1998-05-26
US5629241A (en) 1997-05-13
EP0782766A2 (en) 1997-07-09
EP0782766B1 (en) 2009-04-22

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