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MX2008002663A - Termoplasticos termicamente conductivos para envasado a nivel troquel de microelectronicos. - Google Patents

Termoplasticos termicamente conductivos para envasado a nivel troquel de microelectronicos.

Info

Publication number
MX2008002663A
MX2008002663A MX2008002663A MX2008002663A MX2008002663A MX 2008002663 A MX2008002663 A MX 2008002663A MX 2008002663 A MX2008002663 A MX 2008002663A MX 2008002663 A MX2008002663 A MX 2008002663A MX 2008002663 A MX2008002663 A MX 2008002663A
Authority
MX
Mexico
Prior art keywords
microelectronic
level packaging
thermopally
troquel
composition
Prior art date
Application number
MX2008002663A
Other languages
English (en)
Inventor
James D Miller
Original Assignee
Cool Options Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cool Options Inc filed Critical Cool Options Inc
Publication of MX2008002663A publication Critical patent/MX2008002663A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

Se describe una composicion y metodo para envasado a nivel de troquel de microelectronica. La composicion incluye aproximadamente 20% a aproximadamente 80% de un aglomerante base termoplastico; aproximadamente 20% a aproximadamente 70% de un material termicamente conductivo, no metalico, de tal forma que la composicion tiene un coeficiente de expansion termica de menos de 20 ppm/C y una conductividad termica de mas de 1.0 W/mK. Al usar tecnicas de moldeo por inyeccion, la composicion podra fusionarse y despues inyectarse en un troquel que contiene la microelectronica para encapsular la microelectronica en el mismo.
MX2008002663A 2005-08-26 2006-08-25 Termoplasticos termicamente conductivos para envasado a nivel troquel de microelectronicos. MX2008002663A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US71158305P 2005-08-26 2005-08-26
PCT/US2006/033234 WO2007025134A2 (en) 2005-08-26 2006-08-25 Thermally conductive thermoplastics for die-level packaging of microelectronics

Publications (1)

Publication Number Publication Date
MX2008002663A true MX2008002663A (es) 2008-04-04

Family

ID=37772437

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2008002663A MX2008002663A (es) 2005-08-26 2006-08-25 Termoplasticos termicamente conductivos para envasado a nivel troquel de microelectronicos.

Country Status (11)

Country Link
US (1) US20070045823A1 (es)
EP (1) EP1925026A2 (es)
JP (1) JP2009510716A (es)
KR (1) KR20080044304A (es)
CN (1) CN101496163A (es)
AU (1) AU2006282935A1 (es)
BR (1) BRPI0614969A2 (es)
CA (1) CA2620851A1 (es)
MX (1) MX2008002663A (es)
TW (1) TW200717752A (es)
WO (1) WO2007025134A2 (es)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD120108S1 (zh) * 2005-03-31 2007-11-21 首爾半導體股份有限公司 發光二極體
US20080153959A1 (en) * 2006-12-20 2008-06-26 General Electric Company Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof
JP5525682B2 (ja) * 2007-05-15 2014-06-18 出光ライオンコンポジット株式会社 ポリアリーレンサルファイド樹脂組成物及びそれからなる成形品
JP2009010081A (ja) * 2007-06-27 2009-01-15 Mac Eight Co Ltd 発光ダイオード用ソケット
USD576572S1 (en) * 2007-07-13 2008-09-09 Rohm Co., Ltd. Light emitting diode module
USD576574S1 (en) * 2007-07-17 2008-09-09 Rohm Co., Ltd. Light emitting diode module
US8127445B2 (en) * 2008-04-03 2012-03-06 E. I. Du Pont De Nemours And Company Method for integrating heat transfer members, and an LED device
DE102008040466A1 (de) * 2008-07-16 2010-01-21 Robert Bosch Gmbh Leistungselektronikeinrichtung
US8299159B2 (en) * 2009-08-17 2012-10-30 Laird Technologies, Inc. Highly thermally-conductive moldable thermoplastic composites and compositions
JP5391003B2 (ja) * 2009-09-09 2014-01-15 株式会社クラレ 光反射性回路基板
US9287765B2 (en) 2010-07-15 2016-03-15 Delta Electronics, Inc. Power system, power module therein and method for fabricating power module
CN102339818B (zh) * 2010-07-15 2014-04-30 台达电子工业股份有限公司 功率模块及其制造方法
CN102340233B (zh) * 2010-07-15 2014-05-07 台达电子工业股份有限公司 功率模块
FI20106001A0 (fi) * 2010-09-28 2010-09-28 Kruunutekniikka Oy Menetelmä sähköisen toimilaitteen valmistukseen
US8741998B2 (en) 2011-02-25 2014-06-03 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof
US8552101B2 (en) 2011-02-25 2013-10-08 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof
CN104837931B (zh) * 2012-12-20 2017-12-01 陶氏环球技术有限责任公司 无线通信塔用的聚合物复合材料组件
KR101405258B1 (ko) * 2012-12-20 2014-06-10 주식회사 삼양사 열전도성 및 휨 특성이 우수한 전기 절연성 열가소성 수지 조성물
US20230317535A1 (en) * 2022-03-31 2023-10-05 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure and method for fabricating the same

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US4563488A (en) * 1984-08-20 1986-01-07 Japan Vilene Co. Ltd. Insulator with high thermal conductivity
US5194480A (en) * 1991-05-24 1993-03-16 W. R. Grace & Co.-Conn. Thermally conductive elastomer
US5679457A (en) * 1995-05-19 1997-10-21 The Bergquist Company Thermally conductive interface for electronic devices
JP3461651B2 (ja) * 1996-01-24 2003-10-27 電気化学工業株式会社 六方晶窒化ほう素粉末及びその用途
US5681883A (en) * 1996-03-05 1997-10-28 Advanced Ceramics Corporation Enhanced boron nitride composition and polymer based high thermal conductivity molding compound
US5781412A (en) * 1996-11-22 1998-07-14 Parker-Hannifin Corporation Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size
US6160042A (en) * 1997-05-01 2000-12-12 Edison Polymer Innovation Corporation Surface treated boron nitride for forming a low viscosity high thermal conductivity polymer based boron nitride composition and method
US5945470A (en) * 1997-10-15 1999-08-31 Ali; Mir Akbar Ceramic-polymer composite material and its use in microelectronics packaging
US6705388B1 (en) * 1997-11-10 2004-03-16 Parker-Hannifin Corporation Non-electrically conductive thermal dissipator for electronic components
US6162849A (en) * 1999-01-11 2000-12-19 Ferro Corporation Thermally conductive thermoplastic
US6048919A (en) * 1999-01-29 2000-04-11 Chip Coolers, Inc. Thermally conductive composite material
JP2001172398A (ja) * 1999-12-17 2001-06-26 Polymatech Co Ltd 熱伝導性成形体およびその製造方法
US6649325B1 (en) * 2001-05-25 2003-11-18 The Bergquist Company Thermally conductive dielectric mounts for printed circuitry and semi-conductor devices and method of preparation
US6794435B2 (en) * 2000-05-18 2004-09-21 Saint Gobain Ceramics & Plastics, Inc. Agglomerated hexagonal boron nitride powders, method of making, and uses thereof
US6764975B1 (en) * 2000-11-28 2004-07-20 Saint-Gobain Ceramics & Plastics, Inc. Method for making high thermal diffusivity boron nitride powders
US6645612B2 (en) * 2001-08-07 2003-11-11 Saint-Gobain Ceramics & Plastics, Inc. High solids hBN slurry, hBN paste, spherical hBN powder, and methods of making and using them
US7038009B2 (en) * 2001-08-31 2006-05-02 Cool Shield, Inc. Thermally conductive elastomeric pad and method of manufacturing same
US20030139510A1 (en) * 2001-11-13 2003-07-24 Sagal E. Mikhail Polymer compositions having high thermal conductivity and dielectric strength and molded packaging assemblies produced therefrom

Also Published As

Publication number Publication date
EP1925026A2 (en) 2008-05-28
TW200717752A (en) 2007-05-01
WO2007025134A2 (en) 2007-03-01
AU2006282935A1 (en) 2007-03-01
BRPI0614969A2 (pt) 2016-09-13
US20070045823A1 (en) 2007-03-01
KR20080044304A (ko) 2008-05-20
WO2007025134A3 (en) 2009-04-23
CN101496163A (zh) 2009-07-29
JP2009510716A (ja) 2009-03-12
CA2620851A1 (en) 2007-03-01

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