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KR920022482A - 전자부품 탑재모듈 - Google Patents

전자부품 탑재모듈 Download PDF

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Publication number
KR920022482A
KR920022482A KR1019920007576A KR920007576A KR920022482A KR 920022482 A KR920022482 A KR 920022482A KR 1019920007576 A KR1019920007576 A KR 1019920007576A KR 920007576 A KR920007576 A KR 920007576A KR 920022482 A KR920022482 A KR 920022482A
Authority
KR
South Korea
Prior art keywords
electronic component
mounting module
necking portion
module according
necking
Prior art date
Application number
KR1019920007576A
Other languages
English (en)
Inventor
다까시 호소가와
히로까즈 이노우에
마모루 사와하따
마사끼 후꾸오까
Original Assignee
가나이 쯔도무
가부시기가이샤 히다찌 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가나이 쯔도무, 가부시기가이샤 히다찌 세이사꾸쇼 filed Critical 가나이 쯔도무
Publication of KR920022482A publication Critical patent/KR920022482A/ko

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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
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    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

내용 없음.

Description

전자부품 탑재모듈
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 의한 제1의 실시예를 나타낸 사시도.
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Claims (45)

  1. 배선기판과, 그 배선기판에 복수의 돌기전극군을 거쳐 접속된 전자부품을 갖는 것에 있어서, 그 전자부품을 접속하는 그 복수의 돌기전극군 중 2개 이상의 돌기전극이, 그 전자부품의 접속면과 그 기판의 접속면과의 사이에 넥킹부를 가지고, 그 넥킹부의 평단면의 두께치수와 폭치수 또는 짧은 직경과 긴 직경 이 다른 것을 특징으로 하는 전자부품 탑재모듈.
  2. 제1항에 있어서, 상기 복수의 돌기전극군은 그 전자부품의 외주 또는 변을 따라 배열되어 있는 것을 특징으로 하는 전자부품 탑재모듈.
  3. 제1항에 있어서, 상기 넥킹부의 평단면의 두께 치수 또는 짧은 직경은, 폭치수 또는 긴직경 보다도 작고, 그 넥킹부의 폭방향 또는 긴직경은, 상기 전자부품의 외주 또는 변을 따라 배열되어 있는 것을 특징으로 하는 전자부품 탑재모듈.
  4. 제1항에 있어서, 상기 넥킹부의 평단면은 대략 4각형인 것을 특징으로 하는 전자부품 탑재모듈.
  5. 제1항에 있어서, 상기 네킹부의 평단면은 대략 타원형인 것을 특징으로 하는 전자부품 탑재모듈.
  6. 제2항에 있어서, 상기 돌기전극군 중 그 전자부품의 각부(모서리부)에 위치하는 돌기전극군의 넥킹부의 폭방향 또는 긴직경은, 그 모서리부에 대하여 교차하도록 배치되어 있는 것을 특징으로 하는 전자부품 탑재모듈.
  7. 제1항에 있어서, 상기 돌기전극군은, 상기 전자부품의 탑재면의 대략 중심점을 둘러싸고 배열되어 있는 것을 특징으로 하는 전자부품 탑재모듈.
  8. 제3항에 있어서, 상기 돌기전극군 중 그 전자부품의 모서리부에 위치하는 돌기전극의 넥킹부의 폭방향 또는 긴직경은 그 모서리부에 대하여 교차하도록 배열되어 있는 것을 특징으로 하는 전자부품 탑재모듈.
  9. 배선기판과, 그 배선기판에 복수의 돌기전극군을 거쳐 접속된 반도체 소자를 가지는 것에 있어서, 그 반도체 소자를 접속하는 그 복수의 돌기전극군이, 그 반도체 소자의 접속면과 그 기판의 접속면과의 사이에 넥킹부를 가지고, 그 넥킹부의 두께치수와 폭치수 또는 짧은 직경과 긴직경이 다르게 되어 있는 것을 특징으로 하는반도체 소자 탑재모듈.
  10. 제9항에 있어서, 상기 넥킹부의 두께치수 또는 짧은 직경은, 긴직경 보다도 작고, 그 넥킹부의 폭방향 또는 긴 직경은 그 반도체 소자의 외주 또는 변에 따라 배열되어 있는 것을 특징으로 하는 전자부품 탑재모듈.
  11. 제9항에 있어서, 상기 복수의 돌기전극군은, 상기 반도체 소자의 외주 또는 변을 따라 배열되어 있는 것을 특징으로 하는 전자부품 탑재모듈.
  12. 제9항에 있어서, 상기 넥킹부의 두께 치수는, 폭치수 보다도 작고, 그 넥킹부의 폭방향은 그 전자부품의 변을 따라 배열되어 있는 것을 특징으로 하는 반도체 소자 탑재모듈.
  13. 제9항에 있어서, 상기 돌기전극군 중 그 반도체 소자의 모서리부에 위치하는 돌기전극의 넥킹부의 폭방향 또는 긴 직경이 그 모서리부에 대하여 교차하도록 배치되어 있는 것을 특징으로 하는 반도체 소자 탑재모듈.
  14. 제9항에 있어서, 상기 넥킹부의 평단면은 대략 장방형인 것을 특징으로 하는 반도체 소자 탑재모듈.
  15. 제9항에 있어서, 상기 넥킹부의 평단면은, 대략 타원형인 것을 특징으로 하는 반도체 소자 탑재모듈.
  16. 제9항에 있어서, 상기 돌기전극군은, 그 반도체 소자의 탑재면의 대략 중심점을 둘러싸고 배치되어 있는 것을 특징으로 하는 반도체 소자 탑재모듈.
  17. 제9항에 있어서, 상기 넥킹부의 평단면은 타원형인 것을 특징으로 하는 반도체 소자 탑재모듈.
  18. 배선기관과, 그 배선기판에 복수의 돌기전극군을 거쳐 접속된 전자부품을 가지는 것에 있어서, 그 전자부품을 접속하는 그 복수의 돌기전극군이, 그 전자부품의 접속면과 그 기판의 접속면과의 사이에 넥킹부를 가지고, 그 넥킹부의 평단면의 두께치수 또는 짧은 직경은, 폭치수 또는 긴 직경 보다도 작고, 또한 그 넥킹부의 폭방향 또는 긴 긱경은 그 전자부품의 외주 또는 변을 따라 배치되어 있는 것을 특징으로 하는 전자부품 탑재모듈.
  19. 제18항에 있어서, 상기 넥킹부의 평단면은 대략 타원형인 것을 특징으로 하는 반도체 소자 탑재모듈.
  20. 제18항에 있어서, 상기 넥킹부의 평단면은 대략 장방형인 것을 특징으로 하는 반도체 소자 탑재모듈.
  21. 배선기판과, 그 배선기판에 탑재해야 할 전자부품의 접속면에 대응한 복수의 돌기전극군을 가지는 것에 있어서, 그 복수의 돌기전극군 중 2개 이상의 돌기전극이, 그 전자부품의 접속면과 그 기판의 접속면과의 사이에 넥킹부를 가지고, 그 넥킹부의 평단면의 두께치수와 폭치수, 또는 짧은 직경과 긴 직경이 다르게 되어 있는 것을 특징으로 하는 전자부품 탑재모듈.
  22. 제21항에 있어서, 상기 넥킹부의 두께치수 또는 짧은 직경은, 폭치수 또는 긴 직경보다도 작고, 그 넥킹부의 폭방향은, 상기 전자부품의 변에 따라 배치되어 있는 것을 특징으로 하는 반도체 소자 탑재모듈.
  23. 제21항에 있어서, 상기 복수의 돌기전극군은 그 전자부품의 외주 또는 변에 따라 배열되어 있는 것을 특징으로 하는 전자부품 탑재모듈.
  24. 제21항에 있어서, 상기 넥킹부의 평단면의 두께치수 또는 짧은 직경은, 폭치수 또는 긴 직경 보다도 작고 그 넥킹부의 폭방향은, 그 전자부품의 외주 또는 변에 따라 배치되어 있는 것을 특징으로 하는 전자부품 탑재모듈.
  25. 제21항에 있어서, 상기 넥킹부의 평단면의 두께치수 또는 짧은 직경은 폭치수 또는 긴 직경 보다도 작고, 그 넥킹부의 폭방향 또는 긴 직경은, 그 전자부품의 외주 또는 변을 따라 배치되어 있는 것을 특징으로 하는 전자부품 탑재모듈.
  26. 제21항에 있어서, 상기 돌기전극군 중, 그 전자부품의 모서리부에 위치하는 돌기전극군의 넥킹부의 폭방향 또는 긴 직경이 상기 모서리부에 대하여 교차하도록 배치되어 있는 것을 특징으로 하는 반도체 소자 탑재모듈.
  27. 제2l항에 있어서, 상기 넥킹부의 평단면은 대략 장방형인 것을 특징으로 하는 반도체 소자 탑재모듈.
  28. 제21항에 있어서, 상기 넥킹부의 평단면은 대략 타원형인 것을 특징으로 하는 반도체 소자 탑재모듈.
  29. 배선기판과, 상기 배선기판에 탑재해야 할 전자부품을 접속하기 위한 복수의 돌기전극군을 가지는 것에 있어서, 그 복수의 돌기전극군이, 그 전자부품의 접속면에 대응하는 접속변과 그 기판의 접속면과의 사이에 넥킹부를 가지고, 그 넥킹부의 평단면의 두께치수 또는 짧은 직경은, 폭치수와 긴 직경 보다도 작고, 또한 그 넥킹부의 폭방향 또는 긴 직경은 상기 전자부품의 외주 또는 변에 따라 배치되어 있는 것을 특징으로 하는 전자부품 탑재모듈.
  30. 제29항에 있어서, 상기 넥킹부의 평단면은 대략 타원형인 것을 특징으로 하는 반도체 소자 탑재모듈.
  31. 제29항에 있어서, 상기 넥킹부의 평단면은 대략 장방형인 것을 특징으로 하는 반도체 소자 탑재모듈.
  32. 제29항에 있어서, 상기 돌기전극군은, 그 전자부품의 탑재면의 대략 중심점을 둘러싸고 배치되어 있는 것을 특징으로 하는 반도체 소자 탑재모듈.
  33. 배선기판과, 그 배선기판에 탑재해야 할 전자부품을 접속하기 위한 복수의 돌기전극군을 가지는 것에 있어서, 상기 돌기전극군이, 그 전자부품의 접속면에 대응하는 접속면과 그 기판의 접속면과의 사이에 넥킹부를 가지고, 그 돌기전극군 중 2개 이상의 돌기전극이 그 전자부품의 외주 또는 변방향으로 복수로 분한되고, 그 넥킹부의 평단면의 두께치수 또는 짧은 직경은, 외주방향 또는 변방향의 합계치수 보다도 작고, 또한 그 넥킹부의 폭방향 또는 긴 직경은 그 전자부품 탑재모듈.
  34. 배선기판과, 그 배선기판에 탑재해야 할 전자부품을 접속하기 위한 복수의 돌기전극군을 가지는 것에 있어서, 그 복수의 돌기전국군이, 그 전자부품의 접속면에 대응하는 접속면과 그 기판의 집속면과의 사이에 넥킹부를 가지고, 그 넥킹부의 평단면의 두께치수 또는 짧은 직경은, 폭치수 또는 긴 직경보다도 작고, 또한 그 넥킹부의 폭방향 또는 긴 직경은 그 전자부품의 외주 또는 변에 따라 2열 이상 배치되어 있는 것을 특징으로 하는 전자부품 탑재모듈.
  35. 전자부품과, 그 전자부품을 탑재해야한 배선기판에 접속하기 원한 복수의 돌기전국군을 가지는 것에 있어서, 그 복수의 돌기전극군이, 그 배선기판의 접속면에 대응하는 접속면과 그 젼자부품의 집속면과의 사이에 넥킹부를 가지고, 그 넥킹부의 평단면의 두께치수 또는 짧은 직경은, 폭치수 또는 긴 직경보다도 작고, 또한 그 넥킹부의 폭방향 또는 긴 직경은 그 배선기판의 의주 또는 변에 따라 2열 이상 배치되어 있는 것을 특징으로 하는 전자부품 탑재모듈.
  36. 제1항에 있어서, 상기 돌기전극의 높이가, 10∼30 미크론인 것을 특징으로 하는 전자부품 탑재모듈.
  37. 제1항에 있어서, 상기 돌기전극의 상기 전자부품 또는 상기 기판과의 접속부가, 2∼10 미크론의 두께를 구비한 형상인 것을 특징으로 하는 전자부품 탑재모듈.
  38. 제37항에 있어서, 상기 접속부가 상기 전자부품 또는 상기 기판과의 적어도 한쪽에 형성되어 있는 것을 특징으로 하는 전자부품 탑재모듈.
  39. 제1항에 있어서, 상기 돌기전극의 상기 전자부품 및 상기 기판으로 부터 가장 먼 부분에 있어서, 긴 지름이 10∼100 미크론이고, 짧은 직경이 긴 직경의 30∼80%인 것을 특징으로 하는 전자부품 탑재모듈.
  40. 제1항에 있어서, 상기 돌기전극이, 동, 금, 은 또는 알루미늄 중 어느 하나인 것을 특징으로 하는 전자부품 탑재모듈.
  41. 제1항에 있어서, 상기 돌기전극이, 납, 인듐. 주석 비스머즈 또는 이들중 적어도 2중 이상을 주성분으로 하는 합금의 어느 하나인 것을 특징으로 하는 전자부품 탑재모듈.
  42. 제1항에 있어서, 상기 돌기전극이, 도전성 수지 또는 도전성 입자를 포함하는 수지인 것을 특징으로 하는 전자부품 탑재모듈.
  43. 전자부품과 배선기판을 대향시켜 배치하고, 상기 전자부품과 상기 배선기판을 도전성의 돌기전극을 사용하여 접속하는 전자부품 탑재모듈의 제조방법에 있어서, 상기 돌기전극과 상기 전자부품 및 상기 배선기판과의 각 접속부에만, 도전성 접착제를 인쇄법에 의하여 공급하여 접속하는 것을 특징으로 하는 전자부품 탑재모듈의 제조 방법.
  44. 제1항 기재의 구성을 가지는 것을 특징으로 하는 액정표시장치.
  45. 제1항 기재의 구성을 가지는 것을 특징으로 하는 IC 카드.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920007576A 1991-05-09 1992-05-04 전자부품 탑재모듈 KR920022482A (ko)

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Application Number Priority Date Filing Date Title
JP91-104117 1991-05-09
JP10411791 1991-05-09

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CN1027945C (zh) 1995-03-15
CN1067138A (zh) 1992-12-16
US5422516A (en) 1995-06-06
EP0514723A1 (en) 1992-11-25

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