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KR900010966A - 다이 본딩 장치 - Google Patents

다이 본딩 장치

Info

Publication number
KR900010966A
KR900010966A KR1019880018017A KR880018017A KR900010966A KR 900010966 A KR900010966 A KR 900010966A KR 1019880018017 A KR1019880018017 A KR 1019880018017A KR 880018017 A KR880018017 A KR 880018017A KR 900010966 A KR900010966 A KR 900010966A
Authority
KR
South Korea
Prior art keywords
die bonding
bonding device
die
bonding
Prior art date
Application number
KR1019880018017A
Other languages
English (en)
Other versions
KR910006240B1 (ko
Inventor
김용기
Original Assignee
삼성항공산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성항공산업 주식회사 filed Critical 삼성항공산업 주식회사
Priority to KR1019880018017A priority Critical patent/KR910006240B1/ko
Publication of KR900010966A publication Critical patent/KR900010966A/ko
Application granted granted Critical
Publication of KR910006240B1 publication Critical patent/KR910006240B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
KR1019880018017A 1988-12-30 1988-12-30 다이 본딩 장치 KR910006240B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019880018017A KR910006240B1 (ko) 1988-12-30 1988-12-30 다이 본딩 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019880018017A KR910006240B1 (ko) 1988-12-30 1988-12-30 다이 본딩 장치

Publications (2)

Publication Number Publication Date
KR900010966A true KR900010966A (ko) 1990-07-11
KR910006240B1 KR910006240B1 (ko) 1991-08-17

Family

ID=19281016

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880018017A KR910006240B1 (ko) 1988-12-30 1988-12-30 다이 본딩 장치

Country Status (1)

Country Link
KR (1) KR910006240B1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100434832B1 (ko) * 2001-05-29 2004-06-07 주식회사 탑 엔지니어링 플립칩본더장치 및 그 작동방법
US10621899B2 (en) 2016-10-12 2020-04-14 Samsung Electronics Co., Ltd. Display apparatus and method of controlling thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100434832B1 (ko) * 2001-05-29 2004-06-07 주식회사 탑 엔지니어링 플립칩본더장치 및 그 작동방법
US10621899B2 (en) 2016-10-12 2020-04-14 Samsung Electronics Co., Ltd. Display apparatus and method of controlling thereof

Also Published As

Publication number Publication date
KR910006240B1 (ko) 1991-08-17

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Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19881230

PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19881230

Comment text: Request for Examination of Application

PG1501 Laying open of application
G160 Decision to publish patent application
PG1605 Publication of application before grant of patent

Comment text: Decision on Publication of Application

Patent event code: PG16051S01I

Patent event date: 19910722

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 19911116

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 19911122

Patent event code: PR07011E01D

PR1002 Payment of registration fee

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