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KR900010472A - 패턴형성 방법 및 제품 - Google Patents

패턴형성 방법 및 제품 Download PDF

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Publication number
KR900010472A
KR900010472A KR1019890018260A KR890018260A KR900010472A KR 900010472 A KR900010472 A KR 900010472A KR 1019890018260 A KR1019890018260 A KR 1019890018260A KR 890018260 A KR890018260 A KR 890018260A KR 900010472 A KR900010472 A KR 900010472A
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KR
South Korea
Prior art keywords
substrate
pattern
masking
deposition
masking material
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Application number
KR1019890018260A
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English (en)
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KR0169959B1 (ko
Inventor
데비드 켈하운 클라이드
Original Assignee
도날드 밀러 셀
미네소타 마이닝 앤드 매뉴팩츄어링 컴패니
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Publication of KR900010472A publication Critical patent/KR900010472A/ko
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Publication of KR0169959B1 publication Critical patent/KR0169959B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2993—Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2998—Coated including synthetic resin or polymer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

내용 없음

Description

패턴형성 방법 및 제품
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에서 기술한 패턴형성 방법의 흐름도, 제2도는 내지 제8도는 패턴형성 방법의 여러 단계에서의 시이트 물질의 평면도 및 단면도.

Claims (12)

  1. 연질, 시이트형 기재를 제공하여, 상기 시이트의 주요 표면부의 일부분에 상기 기재의 상기 표면에 일반적으로 수직인 물리적 돌출부를 한정하는 에칭 가능한 제1마스킹 물질을 접합시키고, 제2패턴 물질이 상기 기재의 상기주요 표면부의 평면과 평행인 노출된 기재 및 마스크 표면에 주로 침착되도록 마스킹 된 구역의 적어도 일부분위에 상기 제1물질과 화학적으로 다른 패턴 물질을 침착시키고, 상기 마스크 물질이 완전히 덮어씌우거나 봉인되지 않도록 상기 침착을 조절하고, 상기 제2물질의 패턴이 상기 기재상에 남아 있도록 화학 처리제를 사용하여 상기 제1마스킹 물질을 선택적으로 에칭 제거하는 단계를 포함하는 연질 기재상에 패턴 침착물을 제조하는 방법.
  2. 제1항에 있어서, 상기 침착이 연속적이고, 상기 기재를 침착지역으로 연속 이동시킴으로써 실시되는 방법.
  3. 제1항에 있어서, 상기 제2물질이 전기적으로 전도성인 물질, 자기성물질 및 유전성 물질로 구성되는 그룹으로 부터 선택된 물질인 방법.
  4. 제1항에 있어서, 상기 제2패턴 물질이 적어도 하나의 층이 적어도 하나의 등과 화학적으로 다른 다중층을 포함하는 방법.
  5. 기재의 일부분이 기재의 상기 표면에 수직인 물리적인 돌출부를 한정하도록 기재를 제공하여 상기 기재의 적어도 일부분을 에칭 가능한 제1마스킹 물질로 덮어 씌우고, 제2패턴 물질이 상기 기재의 표면과 평행인 상기 제1물질에 주로 침착되도록 마스킹된 구역의 적어도 일부분에 상기 제1마스킹 물질과 화학적으로 다른 패턴 물질을 침착시키고, 상기 모든 마스킹 물질이 완전히 덮어 씌워지기 전에 상기 침착을 중단하고, 상기 패턴 물질의 상기 절편이 상기 기재로부터 박리되도록 화학 처리제를 사용하여 상기 패턴 물질의 하부에 있는 상기 제1마스킹 물질을 선택적으로 에칭 제거하는 단계를 포함하는 예비 선택된 패턴에 상응하는 형상을 지니는 물품의 제조 방법.
  6. 제5항에 있어서, 상기 패턴 물질이 물질의 별개의 아일런드(islands)로서 침착되는 방법.
  7. 제5항에 있어서, 상기 패턴 절편이 상기 에칭 물질 및 상기 기재로 부터 분리되어 함께 회수되는 방법.
  8. 제7항에 있어서, 상기 회수된 절편이 액체 매질중에 분산되는 방법.
  9. 제7항에 있어서, 상기 회수된 절편이 중합체 수지 중에 분산되는 방법.
  10. 제7항의 방법으로 제조된 제품.
  11. 제8항의 방법으로 제도된 제품.
  12. 제9항의 방법으로 제도된 제품.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890018260A 1988-12-09 1989-12-08 패턴 형성 방법 KR0169959B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/281,655 US4964945A (en) 1988-12-09 1988-12-09 Lift off patterning process on a flexible substrate
US281,655 1988-12-09

Publications (2)

Publication Number Publication Date
KR900010472A true KR900010472A (ko) 1990-07-07
KR0169959B1 KR0169959B1 (ko) 1999-05-01

Family

ID=23078237

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890018260A KR0169959B1 (ko) 1988-12-09 1989-12-08 패턴 형성 방법

Country Status (7)

Country Link
US (2) US4964945A (ko)
JP (1) JP2744826B2 (ko)
KR (1) KR0169959B1 (ko)
CA (1) CA2002736A1 (ko)
DE (1) DE3940087A1 (ko)
GB (1) GB2228372B (ko)
MY (1) MY104668A (ko)

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