JPS5742157A - Formation of pattern for circuit substrate - Google Patents
Formation of pattern for circuit substrateInfo
- Publication number
- JPS5742157A JPS5742157A JP11742680A JP11742680A JPS5742157A JP S5742157 A JPS5742157 A JP S5742157A JP 11742680 A JP11742680 A JP 11742680A JP 11742680 A JP11742680 A JP 11742680A JP S5742157 A JPS5742157 A JP S5742157A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- pattern
- circuit substrate
- copper foil
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title abstract 4
- 230000015572 biosynthetic process Effects 0.000 title 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 3
- 239000011889 copper foil Substances 0.000 abstract 3
- 238000005530 etching Methods 0.000 abstract 3
- 239000007767 bonding agent Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000000059 patterning Methods 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To readily obtain the pattern of the circuit substrate by providing dry films which are adhesively layered in an element mounting hole in the resin substrate, and performing etching with the back surface of a copper foil in the hole being protected. CONSTITUTION:A bonding agent 2 is applied on a base film 1, and the element mounting hole 3 and a hole 4 are punched. The copper foil 5 is layered, and a dry film 6 is closely adhered to the upper and bottom surfaces. It is especially important to contact it intimately to the inside of the hole 3. It is effective, if the device is put into the gap between a hot roll 10 and a hot roll 11 having teeth 11a. When a mask 8 with a window 8a is applied, the back side 5a of a finger forming part of the copper foil is perfectly protected from etching liquid. When the resist mask is removed after the etching, the patterning of the fingers is completed. In this constitution, complicated conventional processes can be abolished, and the pattern of the circuit substrate can be formed in the simple way.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11742680A JPS5742157A (en) | 1980-08-26 | 1980-08-26 | Formation of pattern for circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11742680A JPS5742157A (en) | 1980-08-26 | 1980-08-26 | Formation of pattern for circuit substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5742157A true JPS5742157A (en) | 1982-03-09 |
Family
ID=14711345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11742680A Pending JPS5742157A (en) | 1980-08-26 | 1980-08-26 | Formation of pattern for circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5742157A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0721595U (en) * | 1992-08-31 | 1995-04-18 | 株式会社北海関東 | Application box |
| KR101045431B1 (en) | 2003-12-27 | 2011-06-30 | 엘지디스플레이 주식회사 | Pattern Forming Method and Manufacturing Method of Thin Film Transistor and Liquid Crystal Display Using It |
| CN104640345A (en) * | 2015-02-26 | 2015-05-20 | 华为技术有限公司 | Printed circuit board and manufacturing method of printed circuit board |
| US9320838B2 (en) | 2007-07-02 | 2016-04-26 | Smith & Nephew Plc | Modular wound treatment apparatus with releasable clip connection |
-
1980
- 1980-08-26 JP JP11742680A patent/JPS5742157A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0721595U (en) * | 1992-08-31 | 1995-04-18 | 株式会社北海関東 | Application box |
| KR101045431B1 (en) | 2003-12-27 | 2011-06-30 | 엘지디스플레이 주식회사 | Pattern Forming Method and Manufacturing Method of Thin Film Transistor and Liquid Crystal Display Using It |
| US9320838B2 (en) | 2007-07-02 | 2016-04-26 | Smith & Nephew Plc | Modular wound treatment apparatus with releasable clip connection |
| CN104640345A (en) * | 2015-02-26 | 2015-05-20 | 华为技术有限公司 | Printed circuit board and manufacturing method of printed circuit board |
| CN104640345B (en) * | 2015-02-26 | 2018-03-06 | 华为技术有限公司 | Printed circuit board (PCB) and board, printed circuit board manufacturing method |
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