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KR870006114A - 이미드를 함유하는 안정한 조성물 - Google Patents

이미드를 함유하는 안정한 조성물 Download PDF

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Publication number
KR870006114A
KR870006114A KR860010856A KR860010856A KR870006114A KR 870006114 A KR870006114 A KR 870006114A KR 860010856 A KR860010856 A KR 860010856A KR 860010856 A KR860010856 A KR 860010856A KR 870006114 A KR870006114 A KR 870006114A
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KR
South Korea
Prior art keywords
composition
alkenyl
component
bis
aminophenyl
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KR860010856A
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English (en)
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KR900005054B1 (ko
Inventor
에이. 쇼드하리 무하마드
제이. 킹 죤
Original Assignee
칼 에프. 조르다
시바-가이기 코오포레이숀
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Application filed by 칼 에프. 조르다, 시바-가이기 코오포레이숀 filed Critical 칼 에프. 조르다
Publication of KR870006114A publication Critical patent/KR870006114A/ko
Application granted granted Critical
Publication of KR900005054B1 publication Critical patent/KR900005054B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D207/00—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D207/02—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom
    • C07D207/44—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members
    • C07D207/444—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5
    • C07D207/448—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5 with only hydrogen atoms or radicals containing only hydrogen and carbon atoms directly attached to other ring carbon atoms, e.g. maleimide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polyethers (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)

Abstract

내용 없음

Description

이미드를 함유하는 안정한 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (13)

  1. (a) 디아미노페닐인단-비스-말레이미드 및 (b) 아민, 알케닐페놀, 알케닐 페놀에테르 또는 이들 혼합물의 혼합물 또는 선 중합체 반응생성물로 구성되는 열 경화성 조성물.
  2. 제1항에 있어서, 성분 (b)가 성분(a) 1몰당 0.05 내지 2.0몰의 농도로 존재하는 조성물.
  3. 제2항에 있어서, 성분(a) 및 (b)가 동몰량으로 존재하는 조성물.
  4. 제1항에 있어서, 성분(b)가 C6-C10아릴렌 디아민, 비스(4-아미노페닐)메탄, 및 디아미노페닐인단으로 구성된 군에서 선택된 방향족 디아민인 조성물.
  5. 제4항에 있어서, 방향족 디아민이 비스(4-아미노페닐)메탄 또는 디아미노페닐인단인 조성물.
  6. 제1항에 있어서, 성분(b)가 일반식(I), (II) 또는 (III)에 상응하는 알케닐페놀이거나, 또는 R3가 C1-C10알킬, C6-C10아릴 또는 C2-C10알케닐인 -OR3라디칼을 적어도 하나 함유하는 이들의 에테르인 조성물 :
    여기서, R1은 직접결합, 메틸렌, 이소프로필리덴, -O-, -S-, -SO- 또는 -SO2-이고 ; 또 R4, R5, R6및 R7은 독립적으로 수소 또는 C2-C10알케닐이며 ; 단, R4내지 R7중 적어도 하나는 알케닐기임.
    상기식에서, R4, R5및 R6는 독립적으로 수소 또는 C2-C10알케닐이며, 단 R4내지 R6중 적어도 하나는 알케닐이고, R8, R9, R10, R11, R12및 R13은 독립적으로 수소, C1-C4알킬 또는 C2-C10알케닐이고, 단 R8내지 R13중 적어도 하나는 알케닐이며, a는 0 내지 10의 수임.
  7. 제6항에 있어서, 알케닐기가 알릴, 메타알릴 또는 프로펜일인 조성물.
  8. 제7항에 있어서, 알케닐 페놀이 0, 0'-디알릴-비스페놀 A인 조성물.
  9. 제1항에 있어서, 성분(b)가 19:1 내지 1:19의 중량비를 갖는 아민 및 페놀의 혼합물인 조성물.
  10. 제9항에 있어서, 중량비가 9:1 내지 1:9 인 조성물.
  11. 제9항에 있어서, 성분(b)가 0, 0'-디알릴-비스페놀 A 및 비스(4-아미노페닐)메탄의 혼합물인 조성물.
  12. 제9항에 있어서, 성분(b)가 0, 0'-디알릴-비스페놀 A 및 디아미노페닐인단의 혼합물인 조성물.
  13. 제1항의 조성물을 100 및 250℃ 사이의 온도에서, 1 내지 20시간동안 가열함으로써 조생성물을 제조하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860010856A 1985-12-16 1986-12-16 이미드를 함유하는 안정한 조성물 KR900005054B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/809,444 US4689378A (en) 1985-12-16 1985-12-16 Stable imide-containing composition from diamino phenyl indane-bis-maleimide and alkenyl phenol
US809444 1985-12-16

Publications (2)

Publication Number Publication Date
KR870006114A true KR870006114A (ko) 1987-07-09
KR900005054B1 KR900005054B1 (ko) 1990-07-19

Family

ID=25201350

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860010856A KR900005054B1 (ko) 1985-12-16 1986-12-16 이미드를 함유하는 안정한 조성물

Country Status (6)

Country Link
US (1) US4689378A (ko)
EP (1) EP0227598B1 (ko)
JP (1) JPS62181335A (ko)
KR (1) KR900005054B1 (ko)
CA (1) CA1258944A (ko)
DE (1) DE3664779D1 (ko)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4749767A (en) * 1985-12-16 1988-06-07 Ciba-Geigy Corporation Stable imide-containing composition from diaminophenylindane-bis-imide, amine and alkenyl phenol or ether
US4812511A (en) * 1986-07-15 1989-03-14 Amoco Corporation Ethylenically-unsaturated ethers of alkenyl phenols as reactive diluents for bismaleimides
CA1274048A (en) * 1986-07-15 1990-09-11 Linda A. Domeier Bismaleimide formulations containing olefinic ether modifiers
EP0296112A3 (de) * 1987-06-18 1989-09-06 Ciba-Geigy Ag Lagerstabile härtbare Mischungen
US5095074A (en) * 1987-08-17 1992-03-10 Hercules Incorporated Thermosettable resin compositions
US4962161A (en) * 1987-08-17 1990-10-09 Hercules Incorporated Thermosettable resin compositions
JPH02110158A (ja) * 1988-07-29 1990-04-23 Shell Internatl Res Maatschappij Bv ビスマレイミド含有熱硬化性組成物
FR2638163B1 (fr) * 1988-10-26 1991-01-11 Rhone Poulenc Chimie Polymeres a groupements imides faits a partir de diamines encombrees
JPH0670101B2 (ja) * 1988-11-28 1994-09-07 三井東圧化学株式会社 熱硬化性樹脂組成物
US5120823A (en) * 1989-02-17 1992-06-09 Basf Aktiengesellschaft Toughened thermosetting structural materials
EP0385937A1 (de) * 1989-02-28 1990-09-05 Ciba-Geigy Ag Härtbare Gemische auf Basis von aromatischen Bismaleinimiden
US4988785A (en) * 1989-06-30 1991-01-29 Allied-Signal Bismaleimide resin based on indane bisphenol
US5359020A (en) * 1990-05-22 1994-10-25 Ciba-Geigy Corporation Hardenable compositions comprising bismaleimides, alkenylphenols and phenol diallyl ethers
US5165977A (en) * 1990-08-02 1992-11-24 Northrop Corporation Long shelf life bismaleimide structural adhesive
US5367043A (en) * 1991-11-06 1994-11-22 Enzymol International, Inc. Durable formaldehyde-free phenolic resins, and method of preparing such resins
EP0585205A3 (en) * 1992-08-26 1994-08-17 Ciba Geigy Ag Curable compositions of furylallylnovolaks and bismaleimides
JP4054062B2 (ja) 1995-11-13 2008-02-27 サイテク・テクノロジー・コーポレーシヨン 複合材及び接着剤用途の熱硬化性重合体
DK0861280T3 (da) * 1995-11-13 2002-04-08 Cytec Tech Corp Termohærdende polymere til komposit- og klæbestofanvendelser
DE102007037621B4 (de) * 2007-08-09 2014-09-18 Siemens Aktiengesellschaft Verwendung einer Harz-Formulierung als Folie in einem Verfahren zur planaren Kontaktierung einer elektrischen Kontaktstelle eines elektrischen Bauelements und ein entsprechendes Verfahren
JP5754289B2 (ja) * 2011-08-08 2015-07-29 住友ベークライト株式会社 樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板および半導体装置
JP2014080493A (ja) * 2012-10-16 2014-05-08 Sumitomo Bakelite Co Ltd 樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板及び半導体装置
JP6538027B2 (ja) 2013-05-17 2019-07-03 フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド 新規ポリマー及びそれを含有する熱硬化性組成物
WO2017044896A1 (en) * 2015-09-09 2017-03-16 Dsm Ip Assets B.V. Biomedical adhesive and sealant compositions and methods of use
JP7419801B2 (ja) * 2019-12-25 2024-01-23 Dic株式会社 酸基含有酸基含有（メタ）アクリレート樹脂、硬化性樹脂組成物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材
US20230323000A1 (en) * 2020-09-11 2023-10-12 Panasonic Intellectual Property Management Co., Ltd. Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board
CN114230794B (zh) * 2021-12-31 2023-11-10 苏州生益科技有限公司 改性双马来酰亚胺预聚物及树脂组合物、应用

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE29316E (en) * 1967-07-13 1977-07-19 Rhone-Poulenc S.A. Cross-linked resins
CH615935A5 (ko) * 1975-06-19 1980-02-29 Ciba Geigy Ag
CH597184A5 (ko) * 1976-04-09 1978-03-31 Ciba Geigy Ag
US4288583A (en) * 1978-12-29 1981-09-08 Ciba-Geigy Corporation Curable mixtures based on maleimides and 1-propenyl-substituted phenols

Also Published As

Publication number Publication date
DE3664779D1 (en) 1989-09-07
JPS62181335A (ja) 1987-08-08
US4689378A (en) 1987-08-25
EP0227598B1 (de) 1989-08-02
EP0227598A1 (de) 1987-07-01
CA1258944A (en) 1989-08-29
KR900005054B1 (ko) 1990-07-19

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