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KR850008605A - 무선장치용 인쇄회로기판 및 회로조립체 - Google Patents

무선장치용 인쇄회로기판 및 회로조립체 Download PDF

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Publication number
KR850008605A
KR850008605A KR1019850003506A KR850003506A KR850008605A KR 850008605 A KR850008605 A KR 850008605A KR 1019850003506 A KR1019850003506 A KR 1019850003506A KR 850003506 A KR850003506 A KR 850003506A KR 850008605 A KR850008605 A KR 850008605A
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South Korea
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circuit board
printed circuit
base plate
module
terminal pins
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KR1019850003506A
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English (en)
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KR890005141B1 (ko
Inventor
노리오 다니베
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야마모도다꾸마
후지쓰 가부시끼가이샤
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Publication of KR890005141B1 publication Critical patent/KR890005141B1/ko

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H01R12/718—Contact members provided on the PCB without an insulating housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/16—Connectors or connections adapted for particular applications for telephony
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10333—Individual female type metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10871—Leads having an integral insert stop
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Combinations Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Transceivers (AREA)

Abstract

내용 없음

Description

무선장치용 인쇄회로기판 및 회로조립체
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 제1도의 전화기의 요부부분의 분해상태의 사시도로서 RF 회로모듈들을 포함하는 회로조립체를 나타내는 도면.

Claims (11)

  1. 내부에 내부도체 패턴들과 그의 양면상에 접지층을 갖는 유전체로 된 기부판과, 그리고 상기 내부 도체패턴들과 전기적 연결상태로 상기 기부판상에 단단히 장치되는 단자핀들을 포함하되, 상기 각 단자핀들은 기부판으로부터 돌출하지 않고 기부판에 고정되는 뿌리부분과 기부판으로부터 수직으로 돌출하는 접촉부분을 갖고있는 것이 특징인 무선장치용 인쇄회로기판.
  2. 제1항에서, 상기 단자핀들은 기부판의 일면상에 장치되는 것이 특징인 무선장치용 인쇄회로기판.
  3. 제1항에서, 상기 단자핀들은 기부판의 양면상에 장치되는 것이 특징인 무선장치용 인쇄회로기판.
  4. 제1항에서, 상기 단자핀들은 그의 뿌리부분들이 도체패턴들의 표면들과 접촉하면서 맞물려서 상기 도체 패턴들에 단단히 연결되는 것이 특징인 무선장치용 인쇄회로기판.
  5. 제1항에서, 상기 기부판은 일단이 개방된 구멍들을 갖고있고, 상기 구멍들은 상기 도체패턴들과 전기적 연결상태로 도체들을 구비하고, 있으며, 상기 단자핀들은 상기 도체들과 전기적 연결상태로 상기 구멍들내로 단단히 삽입되는 것이 특징인 무선장치용 인쇄회로기판.
  6. 제1항에서, 적어도 하나의 동축 연결소자를 더 포함하되, 상기 연결소자는, 적어도 하나의 상기 접지층들과 전기 연결상태로 기부판내에 단단히 끼워지는 외부 도체깃과, 그리고 기부판의 상기 도체 패턴들과 접지층들 양자로부터 전기적 절연상태로 유전체를 사이에 두고 상기 깃에 대해 동축으로 배치되어 그내에 고정되는 내부 도체 연결핀을 포함하되, 상기 연결핀은 기부판의 대향측면들 상에서 수직으로 돌출하는 두 개의 접촉부분들을 갖는 것이 특징인 무선장치용 인쇄회로기판.
  7. (A) 모체 인쇄회로 기판으로서, 내부에 내부 도체 패턴들을 갖고 또한 양면상에 접지층을 갖는 유전체로 된 기부판과, 그리고 기부판으로부터 돌출하지 않고 기부판에 고정되는 뿌리부분과 기부판으로부터 수직으로 돌출하는 접촉부분을 갖고있는 단자핀들로서 상기 내부 도체 패턴들과 전기적 연결상태로 상기 기부판상에 단단히 장치되는 단자핀들을 포함하는 모체 인쇄회로기판과, 그리고 (B) 회로 모듈들로서, 각각의 모듈이 : 도체패턴들을 갖는 유전체의 모듈인쇄 회로기판과, 도체패턴들과 전기 연결상태로 모듈인쇄 회로기판상에 장치되는 전기부품들과, 그리고 도체패턴들과 전기연결 상태로 모듈인쇄회로 기판상에 수직으로 장치되는 터미날 잭들을 포함하는 모듈회로 조립체와, 그리고 모듈회로 조립체의 단자잭들 속으로 상기 모체인쇄회로 기판의 단자핀들을 삽입하기 위한 삽입구멍들을 갖고 있으며 또한 전자차폐를 위해 상기 모듈회로 조립체를 봉합시켜주는 차폐패케이지를 포함하되, 상기 회로뮤듈들은 모체인쇄회로 기판상에 장치되어 그의 단자핀들의 접촉부분들이 회로모듈들의 단자잭들내에 삽입되어 함께 연결되어 있는 상기 모체인쇄회로 기판상에 장치되는 회로모듈들을 포함하는 것이 특징인 무선장치용 회로 조립체.
  8. 제7항에서, 상기 모듈회로 조립체의 모듈인쇄기판은 전기부품과 단자잭들이 장치되는 표면에 대향하는 뒷면상에 접지층을 갖고 있는데 모듈인쇄회로 기판의 상기 접지층은 상기 차폐패케이지와 접촉상태에 있고 그리고 회로모듈들의 상기 차폐패케이지들은 모체인쇄회로 기판의 상기 접지층들중 적어도 하나와 접촉상태에 있으며, 그에 의해 모듈회로 조립체들은 금속차폐 패케이지들을 통하여 모체인쇄회로 기판의 접지층에 전기적으로 접지되는 것이 특징인 무선장치용 회로조립체.
  9. 제7항에서, 상기 모체인쇄회로 기판은 그의 일면상에 상기 단자핀들을 구비하고 있고 그리고 상기 회로모듈들은 모체인쇄 회로기판의 상기 일면상에 장치되는 것이 특징인 무선장치용 회로조립체.
  10. 제7항에서, 상기 모체인쇄 회로기판은 그의 양면상에 상기 단자핀들을 구비하고 있고 그리고 상기 회로모듈들은 모듈인쇄 회로기판의 양면상에 장치되는 것이 특징인 무선장치용 회로조립체.
  11. 제7항에서, 상기 모체인쇄 회로기판은 적어도 하나의 동축상의 연결소자를 더 포함하되, 상기 연결소자는 모체인쇄 회로기판의 상기 접지층들중 적어도 하나를 전기적 연결상태로 모체인쇄 회로기판의 기부판내에 단단히 끼워지는 외부도전성 깃과, 그리고 기부판의 상기 도체패턴들과 접지층들 양자로부터 전기적 절연상태로 유전체를 사이에 두고 상기 깃에 대해 동축으로 배치되어 그내에 고정되는 내부도체 연계핀을 포함하며, 상기 연결핀은 모체인쇄 회로기판의 기부판의 대향측면들상에 수직으로 돌출하는 두 개의 접촉부분들을 갖고있으며, 그리고 상기 회로모듈은 모체인쇄 회로기판의 양면상에 장치되며 그리고 모체인쇄 회로기판의 일면상에 장치되는 회로모듈들중 어떤 것이 상기 동축 연결소자를 통하여 모체인쇄 회로기판의 다른면상에 장치되는 대응회로 모듈에 전기적으로 연결되어, 연결핀의 접촉부분들이 상기 회로모듈들의 단자잭들 속으로 연결되어 있는 상태가 되는 것이 특징인 무선장치용 회로조립체.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019850003506A 1984-05-25 1985-05-22 무선장치용 인쇄회로기판 및 회로 조립체 KR890005141B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP59104768A JPS60250699A (ja) 1984-05-25 1984-05-25 高周波モジュ−ルの接続構造
JP104768 1984-05-25
JP59-104768 1984-05-25

Publications (2)

Publication Number Publication Date
KR850008605A true KR850008605A (ko) 1985-12-18
KR890005141B1 KR890005141B1 (ko) 1989-12-11

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KR1019850003506A KR890005141B1 (ko) 1984-05-25 1985-05-22 무선장치용 인쇄회로기판 및 회로 조립체

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US (1) US4736266A (ko)
EP (1) EP0162474B1 (ko)
JP (1) JPS60250699A (ko)
KR (1) KR890005141B1 (ko)
DE (1) DE3577968D1 (ko)

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EP0162474A2 (en) 1985-11-27
JPS60250699A (ja) 1985-12-11
KR890005141B1 (ko) 1989-12-11
EP0162474A3 (en) 1987-06-03
DE3577968D1 (de) 1990-06-28
JPH0447998B2 (ko) 1992-08-05
EP0162474B1 (en) 1990-05-23
US4736266A (en) 1988-04-05

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