KR20170111780A - Multi Source Mixture Ratio Supporting Apparatus for Multi Source Co-Deposition - Google Patents

Abstract

The present invention relates to a combined evaporation apparatus capable of evaporating a plurality of kinds of evaporation materials to respective distinct evaporation temperatures, and in accordance with the present invention, a plurality of kinds of evaporation materials to be deposited on a substrate side can be separately accommodated A receiving portion having a plurality of receiving rooms; A heater unit coupled to at least a part of the outside of the accommodating room of the accommodating unit and supplying heat energy necessary for evaporating each of the evaporating materials accommodated in the accommodating room of the accommodating unit; And a mixing part provided on the upper side of the receiving part and providing a mixing space in which a plurality of types of evaporated material evaporated on the receiving part side are mixed in a vaporized state and an outlet port facing the substrate side is formed on the upper side, Wherein the mixing unit includes a baffle for supplying heat energy to the plurality of evaporation materials evaporated into the mixing space provided inside the mixing unit so as to be uniformly mixed and moved to the substrate side, Disclosed herein is a technique capable of suppressing the occurrence of denaturation in the evaporation process of a deposition material, and capable of uniformly mixing a plurality of types of evaporated material vaporized and depositing the same on a substrate.

Description

(Multi Source Mixture Ratio Supporting Apparatus for Multi Source Co-Deposition) which can complement a mixing ratio of a plurality of kinds of deposition materials,

More particularly, the present invention relates to an evaporation apparatus used for performing a deposition process on a substrate, and more particularly, to an evaporation apparatus for evaporating deposition materials having different physical and chemical characteristics at the same time and mixing them at a uniform mixing ratio, To a composite evaporation apparatus capable of ensuring uniformity of a mixing ratio of evaporated deposition materials.

Of the display devices, an organic light emitting display device has a wide viewing angle, an excellent contrast, and a very high response speed. Therefore, the OLED display device has attracted attention as a next generation display device.

BACKGROUND ART [0002] In a flat panel display device such as an organic light emitting display device, a vacuum deposition method is widely used in which an organic material or a metal used as an electrode is deposited in a vacuum atmosphere to form a thin film on a flat plate.

In the vacuum deposition method, a substrate on which an organic thin film is to be formed is placed in a vacuum chamber, an evaporation mask having the same pattern as that of a thin film to be formed is brought into close contact with the substrate, Evaporation or sublimation of an evaporation material to deposit on a substrate. Particularly, when a doping layer is to be formed using two or more kinds of evaporation materials on a substrate, the evaporation materials are evaporated at the same time and deposited on the substrate .

Various techniques have been proposed and studied for a deposition apparatus for forming a doping layer using various types of deposition materials. Among the techniques related to such a deposition apparatus are Korean Patent Registration No. 10-0532657 entitled " Device for controlling evaporation area for deposition of uniformly mixed thin films in simultaneous vapor deposition using a multi-evaporation source " .

According to this prior art, there is disclosed a technique for forming a uniformly mixed thin film layer by depositing a plurality of deposition materials in the same area on the substrate surface in a uniformly overlapping manner.

However, the prior art has the following problems. In order to simultaneously deposit a plurality of types of deposition materials, each of the deposition materials must be evaporated. In order to vaporize the deposition material evaporated at a high temperature, the applied heat is transferred to the evaporated material at a low temperature, There was a problem.

Also, since the evaporated deposition material is mixed in the form of superimposed deposition just before deposition near the substrate surface, the mixing ratio sometimes becomes locally inconsistent. Therefore, there is also a problem that it is difficult to obtain a deposition layer in which the evaporation material is uniformly mixed at a constant mixing ratio.

It is an object of the present invention to solve the above-mentioned problems of the prior art, and it is an object of the present invention to provide a method and apparatus for supplying evaporative deposition materials having different physical and chemical characteristics to respective evaporation temperatures, Which are uniformly mixed even in local portions on the mixed space, so that the evaporation material deposited on the substrate can be deposited on the substrate at a generally uniform mixing ratio.

According to an aspect of the present invention, there is provided a composite deposition apparatus including: an accommodating portion having a plurality of accommodating chambers for accommodating a plurality of types of deposition materials to be deposited on a substrate; A heater unit coupled to at least a part of the outside of the accommodating room of the accommodating unit and supplying heat energy necessary for evaporating each of the evaporating materials accommodated in the accommodating room of the accommodating unit; And a mixing part provided on the upper side of the receiving part and providing a mixing space in which a plurality of types of evaporated material evaporated on the receiving part side are mixed in a vaporized state and an outlet port facing the substrate side is formed on the upper side, The baffle may include a baffle for supplying thermal energy to the plurality of evaporation materials evaporated into the mixing space provided inside the mixing unit so that the plurality of evaporation materials introduced into the mixing space can be uniformly mixed and moved It may be a feature.

The discharge port may be a discharge slit formed in a long direction in one direction or a plurality of discharge nozzles arranged in a long direction in one direction so that the deposition materials mixed in the mixing space may flow into the substrate side .

In addition, a roof is provided on each of the plurality of accommodating rooms to separate the accommodating room and the mixing section from each other and to prevent the evaporated materials present in the mixed space from being reversely introduced. It can also be a feature.

Further, the loop may further include a guide hole for guiding evaporated evaporated materials in the accommodating chamber to the mixed space side of the mixed portion.

Furthermore, the guide hole may be a guide slit formed in a long direction in one direction.

Furthermore, the guide slit may be characterized by being formed to have a constant slope with respect to the bottom surface of the receiving room or the loop.

In addition, the guide hole may be a guide nozzle having a predetermined size, and it may be a feature that a plurality of the guide nozzles are provided for one loop.

Further, the guide nozzle may be formed so as to have a predetermined inclination angle with respect to the loop or the bottom surface of the receiving room.

The plurality of the accommodating rooms provided in the accommodating portion may have a height of the bottom surface with respect to the neighboring accommodating room in order to suppress the thermal effect or thermal interference from the neighboring accommodating room Another feature may be another feature.

And a heat transfer restraining means provided between each of the plurality of accommodating rooms and for suppressing thermal interference to a neighboring accommodating room, wherein the heater portion and the heat transfer suppressing means Each of the accommodating rooms of the first and second accommodating chambers can be controlled to an individual temperature.

Further, the heater unit may include a plurality of heater zones that are divided to supply different heat energy to each of the plurality of accommodating rooms, and the heat transfer suppressing unit may be a heat plate or a cooling plate.

The complex evaporation apparatus according to the present invention can suppress the generation of denaturation that may be caused by excessive heat supplied to the evaporation material by supplying thermal energy at a level suitable for the evaporation temperature for each evaporation material, The thermal energy is supplied through the baffle so as to be more uniformly mixed in the mixing space, so that the evaporated materials introduced into the mixing space can be mixed evenly. Therefore, it is possible to maintain the mixing ratio of the deposition materials stably during the introduction to the substrate side, thereby suppressing the occurrence of deposition defects.

In addition, since a plurality of accommodating chambers are arranged adjacent to each other, the volume of the evaporator can be greatly reduced, and spatial waste can be suppressed.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a combined vaporization apparatus according to an embodiment of the present invention; FIG.
2 is a schematic view of a combined vaporization apparatus according to an embodiment of the present invention.
3 is a schematic view of a combined vaporization apparatus according to another embodiment of the present invention.
4 is a schematic view of a combined vaporization apparatus according to another embodiment of the present invention.
5 is a schematic view of a combined vaporization apparatus according to another embodiment of the present invention.
FIG. 6 is a schematic view of a combined vaporization apparatus according to another embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic view of a combined vaporization apparatus according to an embodiment of the present invention, FIG. 2 is a schematic view of a combined vaporization apparatus according to an embodiment of the present invention, and FIGS. FIG. 2 is a schematic view showing a combined vaporization apparatus according to another embodiment of the present invention.

Referring to FIGS. 1 and 4, a combined vaporization apparatus 100 and 110 according to an embodiment of the present invention includes a mixing unit 400 having a baffle, a receiving unit 200, 300).

First, the accommodating portion 200 accommodates deposition materials m1, m2, and m3, and includes a plurality of accommodating chambers 211, 213, and 215. Here, the accommodating chambers 211, 213, and 215 are provided so that a plurality of types of deposition materials m1, m2, and m3 to be deposited on the substrate side are separately accommodated, and the number of the deposition materials is equal to the number of deposition materials to be used in the deposition process. And, one kind of deposition material is accommodated in one accommodating room. The accommodating portion 200 includes a plurality of accommodating rooms 211, 213, and 215 as described above.

Here, each of the accommodating rooms 211, 213, and 215 is opened so that at least a portion thereof from the upper side can communicate with the mixing unit 400 side. The mixing unit 400 may include a plurality of evaporation materials m1, m2, and m3 evaporated from the receiving unit 200 to be mixed in a vaporized state Thereby providing a mixing space 433. And the mixing space 433 provided inside the mixing unit 400 is spatially communicated with the accommodating rooms 211, 213, and 215, respectively.

In addition, each of the accommodation rooms 211, 213, and 215 may have various arrangements with respect to each other. Here, it is important that each of the accommodating rooms 211, 213, 215 are arranged so as not to subject them to thermal interference or thermal influence with respect to each other. In addition, it is desirable that each of the plurality of accommodating rooms 211, 213, and 215 can be controlled to individual temperatures. Each type of deposition material has its own unique physical and chemical properties. For example, at evaporation temperatures, there is a unique evaporation temperature for each deposition material, and excessive heat energy supply can result in denaturation of the deposition material.

Therefore, thermal energy is supplied to the respective receiving rooms 211, 213, and 215 so as to attain an appropriate level of temperature for evaporation for each of the evaporation materials, and thermal interference between the receiving rooms 211, It is preferable that the temperature is individually controlled so as to be heated to the evaporation temperature suitable for the deposition materials m1, m2, m3 contained in the deposition materials m1, m2, m3.

For example, in order to suppress the thermal effect or thermal interference from neighboring accommodation rooms 211, 213 and 215 as referenced in FIGS. 1 to 3, the respective adjacent accommodation rooms 221, 213, It is preferable that the height of the bottom surface of the base plate is different.

The portions of the evaporation materials m1, m2, and m3 accommodated in the respective accommodating rooms 211, 213 and 215 are provided at different heights with respect to the adjacent accommodating rooms 211, 213, and 215 through the heater unit 300, By heating independently, it becomes possible to heat the deposition materials m1, m2, m3 to the required appropriate evaporation temperature.

The height of the deposition material m1, m2, m3, which is formed by receiving the deposition materials m1, m2, m3 in the receiving chambers 211, 213, 215, (m1, m2, m3) is not overlapped with the height of the receptive layer (that is, the level of the deposition material m1, m2, m3 is smaller than the level of the adjacent deposition material m1, m2, m3) It is possible to further suppress the possibility of the thermal influence or the thermal interference between the respective accommodation rooms 211, 213 and 215 to occur.

Further, in addition to the arrangement of the receiving room as referred to in Figs. 1 to 3, there are also applicable embodiments including the heat transfer suppressing means as shown in Fig. 4 to Fig.

The heat transfer suppressing means is provided to suppress thermal influence or thermal interference between the accommodating rooms 211, 213 and 215 and the accommodating rooms 211, 213 and 215. That is, the heat transfer suppressing means is provided between the accommodating chambers disposed adjacent to each other and suppresses thermal interference between the adjacent accommodating chambers 211, 213, and 215.

Therefore, the heater unit 300 that supplies the thermal energy required to evaporate the evaporation materials m1, m2, and m3 contained in the accommodation rooms 211, 213, and 215 of the accommodation unit 200 and the heat transfer suppression unit Thereby allowing each of the plurality of accommodating rooms 211, 213, and 215 to be controlled to individual temperatures.

There may be a heat shield or a cooling plate in a preferred form as such a heat transfer suppressing means. The heat shield is preferably disposed between neighboring accommodating rooms 211, 213, and 215 so that thermal interference between the two accommodating rooms 211, 213, and 215 can be suppressed.

4 to 6 schematically show that the cooling plate 510 is used as the heat transfer suppressing means.

The cooling plate 510 is also disposed between adjacent storage rooms 211, 213, and 215. And maintains a temperature lower than the temperature of the adjacent two accommodating rooms 211, 213, and 215. To this end, a coolant pipe (not shown) through which the coolant flows may be installed inside the cooling plate 510. The cooling plate 510 maintains the temperature lower than the temperatures of the two adjacent accommodation rooms 211, 213 and 215 to suppress the thermal influence or the thermal interference between the two accommodation rooms 211, 213 and 215 .

A cooling plate 510 is provided as a heat transfer suppressing means for suppressing thermal interference between adjacent accommodating rooms 211, 213 and 215 and a portion of evaporation materials m1, m2 and m3 accommodated in the accommodating rooms 211, 213 and 215 It is possible to heat the evaporation materials m1, m2 and m3 to a desired evaporation temperature for each of the evaporation materials m1, m2 and m3 by independently heating them through the heater unit 300 to be described later.

4 to 6 illustrate a configuration in which three accommodating rooms 211, 213 and 215 included in the accommodating unit 200 are provided and a cooling plate 510 is provided between the accommodating rooms 211, 213 and 215 An embodiment in which a larger number of reception rooms are arranged so as to be adjacent to each other in a form as shown in the drawings is also sufficiently possible. In this case, it is preferable that heat transfer suppressing means such as the cooling plate 510 is provided between the adjacent accommodation rooms 211, 213, and 215.

The materials constituting the accommodating rooms 211, 213, and 215 may be made of a material such as a crucible for heating the evaporation materials m1, m2, and m3, and may be made of a ceramic material or the like.

2, 3, 5, and 6, the receiving rooms 211, 213, and 215 may be configured as shown in FIG. 1 or as shown in FIG. 4, It is also preferable that a roof or a discharge port is formed on the upper side of the reception room as shown in FIG. An explanation thereof will be given later.

The heater unit 300 is coupled to at least a part of the outside of the receiving unit 200 and is configured to heat the evaporation materials m1, m2, and m3 contained in the receiving rooms 211, 213, and 215 of the receiving unit 200, 213, 215 to the accommodation rooms (211, 213, 215).

More specifically, the heater unit 300 includes a plurality of heater zones. Here, the heater zone is provided at one side or the other side of the accommodating rooms 211, 213, and 215, and is divided so as to supply different thermal energy to the plurality of accommodating rooms 211, 213, and 215. As an example of a specific form of such a heater zone, the heating plate 310 can be heard.

The left accommodating room 211 is referred to as a first accommodating room 211 and the middle accommodating room 213 is referred to as a second accommodating room 213. [ And the accommodation room 215 on the right side is referred to as a third accommodation room 215, for convenience of explanation.

As shown in the figure, a heating plate 310, which is a heating zone for heating the second evaporation material m2 contained in the second accommodation room 213, is provided so as to be in contact with both outer surfaces of the second accommodation room 213 have.

A heating plate 310 serving as a heating zone for heating the first evaporation material m1 accommodated in the first accommodation room 211 is disposed on the outer side of the first accommodation room 211 And the heating plate 310 for heating the third evaporation material m3 provided in the third accommodating room 215 is provided on the outer surface of the third accommodating room 215 Is shown as an exemplary form.

Each of the heating plates 310 is mounted adjacent to the accommodating chambers 211, 213 and 215 corresponding to the respective heating plates 310 and supplies heat to the accommodating chambers 211, 213 and 215, (m1, m2, m3) are evaporated. It is preferable that the amount of heat applied to each of the accommodating rooms 211, 213, and 215 by the respective heating plates 310 can be individually controlled.

To this end, as described with reference to Figs. 1 to 3, it is also preferable that the level difference between the neighboring accommodating rooms 211, 213, and 215 is configured.

4 to 6, in order to suppress the temperature of each of the receiving rooms 211, 213, and 215 from being lowered due to the cooling plate 510, the cooling plate 510 and the receiving room 211, 213, and 215, respectively.

4 to 6, a plurality of heating plates 310 are provided on the outer sides of the accommodation rooms 211, 213 and 215 as the plurality of heater zones included in the heater unit 300 and the cooling plate 510 and the accommodation room 211 , 213, and 215, respectively.

The configuration of the heating unit 300 may be commonly applied to some other embodiments to be described later.

Next, the mixing section 400 is provided on the upper side of the accommodating section 200. The mixing unit 400 provides a mixing space 433 in which a plurality of kinds of evaporation materials m1, m2, and m3 evaporated from the receiving unit 200 are mixed in a vaporized state. For this purpose, it is preferable that the mixing unit 400 is provided so as to be able to communicate with the upper side of the receiving rooms 211, 213, and 215 of the receiving unit 200 spatially, as shown in the respective figures.

It is preferable that a baffle 450 is provided inside the mixing part 400. That is, the baffle 450 supplies heat energy such that a plurality of types of evaporated materials evaporated from the receiving rooms 211, 213 and 1215 flow into the mixing space 433 and are uniformly mixed and moved to the substrate side.

The baffle 450 dissipates heat to evaporate the evaporation material so that the evaporation material has sufficient heat energy even in the mixing space 433. 4 to 6 in the exemplary form of the baffle 450, but the present invention is not limited to such a form. The mixed vapor deposition material can be smoothly introduced into the substrate side, .

The vaporized evaporation material must have sufficient heat energy so that the movement of the molecules becomes more active so that it can be mixed more uniformly and the occurrence of the phenomenon of sticking to the periphery of the chamber during the movement to the substrate side can be suppressed, 450) greatly contributes to uniform mixing of the evaporation material and smooth movement to the substrate side.

It is also preferable that a heating plate 310 for supplying thermal energy into the mixing space 433 is provided on the outer surface of the mixing part 400 in addition to the supply of heat energy by the baffle 450. Since the baffle 450 and the heating plate 310 supply the thermal energy into the mixing space 433 of the mixing unit 400, the evaporated evaporation material can smoothly flow toward the substrate with sufficient heat energy in the mixing space 433 .

On the upper side of the mixing portion 400, a discharge port toward the substrate side is formed.

As an example of such an ejection port, as shown in Figs. 1 (a), (b), or 4 (a) and 4 (b), mixed materials in the mixing space 433 may be introduced in one direction Or a plurality of discharge nozzles 436 (see Fig. 1 (c) or 4 (c)) formed to be long in one direction.

The discharge slit 431 is formed as shown in FIG. 1 (a) or FIG. 4 (a), and the evaporated material mixed in the mixing space 433 flows toward the substrate side through the discharge slit 431 do.

A plurality of discharge nozzles 436 are formed as shown in FIG. 1C or FIG. 4C so that the mixed deposition material in the mixing space 433 flows toward the substrate side through the discharge nozzle 436 It is also desirable to be able to.

The evaporation material evaporated in each of the accommodating chambers 211, 213 and 215 is mixed in the mixing space 433 and then introduced into the substrate side to be deposited. Therefore, the mixing ratio of the evaporation materials m1, m2, and m3 is stably maintained .

Although the ejection slit 431 is shown in each of the figures as an example of other applied embodiments, the ejection nozzle 436 as shown in FIG. 1 (c) or 4 (c) It is also noted that the form provided is also quite possible.

1 and 4, the overlapping parts are omitted, and the parts other than those shown in Fig. 1 or Fig. 4 and the parts not described in Fig. 1 or Fig. 4 will be described. .

2, 3, 5, and 6, the accommodating portion 200 separates the accommodating chambers 211, 213, and 215 from the mixing portion 400 on the upper side of the plurality of accommodating chambers 211, 213, and 215, It is also preferable that a roof is provided to prevent evaporation materials present on the mixing space 433 side from being adversely introduced into the accommodation rooms 211, 213, and 215.

The loop 220 is preferably provided with guide holes for guiding evaporated evaporated materials in the accommodating chambers 211, 213, and 215 to be introduced into the mixing space 433 of the mixing unit 400 .

Here, it is preferable that the guide hole is a guide slit 231 formed to be long in one direction or a guide nozzle 236 (refer to FIG. 3 or FIG. 6) having a certain size and arranged long in one direction.

2 or 5, the guide slit 231 is formed so as to have a constant inclination angle? With respect to the bottom surface of the loop 220 or the accommodation room 211, 2113, 215, It is also desirable.

A guide slit 231 as referenced in FIG. 2 or 5 is also preferred, but a guide nozzle 236 having a constant size as shown in FIG. 3 or 6 is also preferred.

3 and FIG. 6 illustratively show that many guide nozzles 236 formed in one loop 220 provided on the upper side of each of the accommodating rooms 211, 213, and 215 are elongated in one direction.

6, guide nozzle 236, also referred to in FIG. 6, may also be formed in loop 220 (see FIG. 6), such that guide slit 231, as referenced in FIG. 2 or FIG. 5, It is also preferable that they are formed so as to have a constant inclination angle with respect to the plane.

As shown in FIGS. 2 to 6, embodiments that are slightly different from each other are possible. This is because the deposition materials introduced into the mixing space 433 can be well mixed, and the deposition materials in the mixing space 433 can be accommodated It is possible to select an appropriate form in order to prevent the backward flow to the room side.

The combined evaporation apparatus as described above may be used for physical vapor deposition and may be used for depositing an organic deposition material.

As described above, the combined evaporation apparatus according to the present invention can suppress the occurrence of denaturation which may be caused by excessive heat supplied to the evaporation material by supplying thermal energy at a level suitable for the evaporation temperature for each evaporation material, Since the thermal energy is supplied through the baffle so that the material can be mixed more uniformly in the mixing space, the evaporated materials introduced into the mixing space can be mixed evenly. Accordingly, it is possible to maintain the mixing ratio of the deposition materials stably during the introduction to the substrate side, thereby preventing the deposition defect from occurring.

In addition, since a plurality of accommodating chambers are arranged successively and the mixing section is located on the upper side of each accommodating room, the overall volume of the evaporating apparatus can be largely reduced, so that the size of the deposition chamber on which the evaporating apparatus is mounted can be reduced. Therefore, there is an advantage that the spatial waste in the field where the manufacturing process is performed can be suppressed.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is to be understood that the scope of the present invention is to be construed as being limited only by the embodiments, and the scope of the present invention should be understood as the following claims and their equivalents.

100, 110: Combined evaporator
200: Reception area 211,213,215: Reception room
220: roof 231: guide slit
236: guide nozzle
300: heater part 310: heating plate
400: mixing portion 431: ejection slit
436: Discharge nozzle
510: cooling plate

Claims (11)

An accommodating portion provided with a plurality of accommodating chambers so that a plurality of kinds of evaporation materials to be deposited on the substrate side can be separately accommodated;
A heater unit coupled to at least a part of the outside of the accommodating room of the accommodating unit and supplying heat energy necessary for evaporating each of the evaporating materials contained in the accommodating room of the accommodating unit; And
And a mixing part provided above the accommodation part and providing a mixing space in which a plurality of kinds of evaporation material vaporized at the accommodation part side are mixed in a vaporized state and an outlet port facing the substrate side is formed on the upper side,
The mixing unit
And a baffle for supplying thermal energy to the plurality of kinds of evaporation materials evaporated into the mixing space provided in the mixing part to be uniformly mixed and moved to the substrate side. Evaporation device.
The method according to claim 1,
The discharge port
A discharge slit formed in one direction so as to allow the evaporated materials mixed in the mixing space to flow into the substrate side, or a plurality of discharge nozzles arranged in a long direction in one direction.
The method according to claim 1,
On the upper side of each of the plurality of accommodating rooms,
And a roof for separating the mixing chamber and the accommodating chamber from each other and for preventing the evaporation materials present in the mixing space from being reversely introduced.
The method of claim 3,
In the loop
And a guide hole for guiding evaporated evaporated materials in the mixing chamber to the mixing space side of the mixing chamber.
5. The method of claim 4,
Wherein the guide slit is a guide slit formed in a long direction in one direction.
The method of claim 5, wherein
Wherein the guide slit is formed to have a constant slope with respect to the bottom surface of the room or the loop.
5. The method of claim 4,
The guide hole is a guide nozzle having a predetermined size,
Wherein a plurality of guide nozzles are provided for one loop.
8. The method of claim 7,
Wherein the guide nozzle is formed to have a predetermined angle of inclination with respect to the bottom surface of the receiving room.
The method according to claim 1,
Wherein a plurality of the accommodating rooms provided in the accommodating portion are provided,
Characterized in that the height of the bottom surface with respect to the neighboring accommodation room is set to be different from each other in order to suppress the thermal effect or the thermal interference from the neighboring accommodation room.
The method according to claim 1,
And heat transfer suppressing means provided between each of the plurality of the accommodating rooms for suppressing thermal interference to a neighboring accommodating room,
Wherein each of the plurality of accommodation rooms can be controlled to an individual temperature by the heater unit and the heat transfer suppressing unit.
11. The method of claim 10,
The heater unit includes:
And a plurality of heater zones divided to supply different heat energy to each of the plurality of accommodating rooms,
The heat transfer suppressing means
Wherein the heat exchanger is a heat block or a cold plate.

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