KR100623730B1 - Evaporation source assembly and deposition apparatus having same - Google Patents

Abstract

 An evaporation source assembly and a deposition apparatus having the same, wherein the external housing constituting the evaporation source assembly includes a guide, and has a shield in which an extension line of the guide faces the same point, or constitutes the evaporation source assembly. By inclining the through-holes of the nozzle unit provided at a predetermined angle, the deposition materials discharged from the respective evaporation sources are induced to be deposited in the same region of the substrate to be deposited, thereby forming a thin film having a uniform composition and providing a uniform thickness. The branches can form a thin film.

Evaporation Source Assembly, Deposition Apparatus, Shield

Description

Evaporating source assembly and deposition apparatus having the same

1 is a view for explaining a deposition apparatus having a plurality of evaporation sources of the prior art.

2 is a view for explaining a deposition apparatus according to an embodiment of the present invention.

3 is a perspective view of an assembly of an evaporation source having two evaporation sources according to an embodiment of the present invention.

4 and 5 are cross-sectional views taken along the line II ′ of the evaporation source assembly of FIG. 2, according to an embodiment of the present invention, to explain an embodiment of inducing a deposition material to be irradiated to the same point on a substrate to be deposited. admit.

FIG. 6 is a cross-sectional view taken along line II ′ of the evaporation source assembly of FIG. 2 according to another embodiment of the present invention to explain an embodiment in which the deposition material is irradiated to the same point of the substrate to be deposited.

 (Explanation of symbols for main parts of drawing)

 10: deposition apparatus 20: chamber

 30: evaporation source assembly 40: evaporation source assembly transfer means

 60, 200: first evaporation source 70, 300: second evaporation source

 90, 100: angle adjustment support 80: shield

 220, 320: nozzle portion 221, 321: through hole

The present invention relates to an evaporation source assembly and deposition apparatus, and more particularly, to an evaporation source assembly and deposition apparatus having a plurality of evaporation sources capable of forming a uniform thin film.

With the advent of the high information age today, there is an increasing demand for consumers to obtain fast and accurate information in their hands, and the development of display devices that are light, thin, easy to carry, and fast in processing of information has been rapidly developed. Among them, the organic electroluminescent device is a self-luminous type in which electrons and holes are recombined in the organic light emitting layer to generate light by applying a voltage to the organic film including the organic light emitting layer. The process can be simplified, and the response speed is the same as the CRT, and it is rapidly rising as a next generation display due to low voltage driving, high luminous efficiency, and wide viewing angle.

Here, according to the material of the organic film, in particular the organic light emitting layer, it is classified into low molecular type organic light emitting device and high molecular type organic light emitting device.

The polymer type organic electroluminescent device may have a single layer structure consisting of an organic light emitting layer between an anode and a cathode, or a double structure including a hole transport layer, thereby manufacturing an organic light emitting device having a thin layer, and the organic Since the film is formed by the wet coating, it can be manufactured even under normal pressure, thereby reducing the cost of the production process, but the organic film due to the organic solvent may be damaged and the life of the device may be reduced.

In contrast, the low molecular organic EL device is formed of a multi-layer low molecular organic film having a different function between the anode and the cathode, and is controlled by doping or replacing with a material having an appropriate energy level so as not to accumulate charges. This makes the device excellent in stability. In addition, since the low molecular organic film is mainly formed by vapor deposition, it is possible to prevent the organic film from being damaged by the organic solvent, thereby preventing the life of the device from being lowered.

In the deposition process, when manufacturing a thin film made of a low molecular organic material in a vacuum, a shadow mask pattern having an opening having a shape to be formed is placed in front of the substrate to deposit an organic material on the substrate. It is possible to form an organic thin film of a desired shape on the top.

Here, in the case of forming the organic layer or the electrode layer of the organic electroluminescent device by the vacuum deposition as described above, in order to co-deposit one or two or more materials simultaneously, a deposition apparatus having a plurality of evaporation sources is required.

In this case, organic materials emitted from a plurality of evaporation sources may not be uniformly mixed and formed on the substrate, or a thin film having a uniform thickness may not be formed, thereby reducing stability and performance of the organic EL device. Here, the larger the substrate, the greater the difficulty in forming a uniform thin film.

According to Korean Patent No. 071595, an apparatus for controlling an evaporation region for depositing a uniformly mixed thin film in simultaneous deposition using a plurality of evaporation sources 1 is disclosed.

1 is a view for explaining in more detail a deposition apparatus having a plurality of evaporation sources of the prior art.

Referring to FIG. 1, a region control plate 2 is provided between the evaporation source and the evaporation source, and the size of the opening O of the housing 3 containing the evaporation source is controlled to control the size of the deposition material discharged from the evaporation source. It is proposed that a uniform thin film can be formed on the substrate S to be deposited by limiting the discharge direction. However, as in the above patent, it is not easy to control the size of the region control plate 2 and the opening O which define the direction of the deposition material discharged from the evaporation source.

An object of the present invention has been made to solve the above-mentioned problems of the prior art, the present invention is an evaporation source assembly which can form a uniform thin film by depositing a plurality of evaporation materials emitted from a plurality of evaporation source to the same area of the substrate to be deposited. And to provide a vapor deposition apparatus having the same.

One aspect of the present invention to achieve the above technical problem provides an evaporation source assembly. The evaporation source assembly has an outer housing divided into at least two cells at least partially opened. Each evaporation source is located inside each cell. At this time, it is located on both sides of the opening of each cell, it is connected to the outer housing, provided with a shield having a guide, the extension line of the guide is characterized in that facing the same point. Thus, the deposition material discharged from the respective evaporation sources may be irradiated onto the same surface of the substrate to be deposited.

Here, at least one evaporation source of the evaporation source is preferably inclined at a predetermined angle with respect to the ground. In this case, it is more preferable that the evaporation source has the openings through which the deposition material is discharged to face the same point of the substrate to be deposited.

In addition, the evaporation source may contain the same deposition material. Alternatively, at least one evaporation source of the evaporation source may contain a deposition material for forming a thin film formed on one surface of the substrate to be deposited, and the other at least one evaporation source may contain an additive different from the deposition material for inclusion in the thin film.

In order to achieve the above technical problem there is provided an evaporation source assembly of another aspect of the present invention. The evaporation source assembly is positioned with an outer housing divided into at least two cells at least partially open. Each evaporation source is located inside each cell.

Each of the evaporation sources may include a nozzle having a reservoir having a portion which is the same as an opening direction of the cell, a body connected to the opened portion of the reservoir, and a through hole penetrating through the body, wherein the nozzle portion and the A housing surrounding the storage unit and a heating unit interposed between the housing and the nozzle unit,

The through hole constituting the nozzle portion is inclined at a predetermined angle with respect to the housing.

Here, it is preferable that the through holes forming the nozzle portions of the evaporation source respectively meet at the same point of the substrate to be deposited.

The outer housing may be disposed at both sides of the opening of each cell, and may include a shield having a guide facing the substrate to be deposited. At this time, it is preferable that at least one guide is inclined at an angle such that the guide of each shield has its extension line facing the same point.

In addition, another aspect of the present invention provides a deposition apparatus including the evaporation source assembly in order to achieve the above technical problem.

Hereinafter, an evaporation source assembly and a deposition apparatus including the same according to the present invention will be described in detail. The following embodiments are provided as examples to sufficiently convey the spirit of the present invention to those skilled in the art. Accordingly, the invention is not limited to the embodiments described below and may be embodied in other forms. In the drawings, the size and thickness of the device may be exaggerated for convenience. Like numbers refer to like elements throughout.

2 is a view for explaining a deposition apparatus according to an embodiment of the present invention.

Referring to FIG. 2, the deposition apparatus 10 according to the embodiment of the present invention sprays deposition material particles onto one surface of a chamber 20 and a substrate to be deposited S, which form the body of the deposition apparatus 10. And an evaporation source assembly 30 having at least one evaporation source for moving the evaporation source assembly 30 and moving the evaporation source assembly 30 in a direction perpendicular to the ground.

The chamber 20 is configured to maintain a vacuum inside the vacuum pump (not shown). In addition, an evaporation source assembly transfer means 40 capable of moving the evaporation source assembly 30 in the vertical direction with respect to the ground is installed in the chamber 20 to move the evaporation source assembly 30 in the deposition direction.

The evaporation source assembly transport means 40 is a vertical transport device suitable for use in the chamber 20 maintained in a vacuum, and is configured to adjust the moving speed of the evaporation source assembly 30 according to process conditions.

On the other hand, the substrate S to be deposited in the chamber 20 is located in a substantially vertical direction for deposition of the deposition material.

In addition, a mask pattern M that determines a shape of a deposition material to be deposited is disposed between the entire surface of the substrate S to be deposited, that is, between the evaporation source assembly 30 and the substrate S to be deposited. Therefore, the deposition material evaporated from the evaporation source 30 is deposited on the substrate S to be deposited while passing through the mask pattern M so that a thin film having a predetermined shape is formed on the substrate S to be deposited.

On the other hand, the deposition source assembly 30 is provided with an evaporation source having at least two, to receive the deposition material to be deposited on the substrate (S) to be deposited in the chamber 20, and the evaporation of the received deposition material by heating Then, it is sprayed onto the substrate S to be deposited to function to form a thin film on the substrate S to be deposited. The deposition material may be an organic film forming material or an electrode forming material of an organic light emitting display device.

3 is a perspective view of an evaporation source assembly 30 having two evaporation sources according to an embodiment of the invention. In the present embodiment, an evaporation source assembly having two evaporation sources will be described, but is not limited thereto. The evaporation source assembly may include three or more evaporation sources.

Referring to FIG. 3, the evaporation source assembly 30 according to the embodiment of the present invention includes a first evaporation source 60 and a second evaporation source 70 inside the outer housing 50.

The outer housing 50 is a support for supporting the evaporation sources 60 and 70 and is preferably made of a cooling plate to prevent heat generated from the evaporation source from being conducted to the outside. Here, the cooling plate may cool the heat inside the evaporation source using a refrigerant.

Here, the outer housing 50 may be provided with a shield (80) including a guide (80a) for guiding the deposition direction of the deposition material to the inlet from which the deposition material is injected from the evaporation source. Thus, the deposition material emitted from the evaporation source can be prevented from being reflected by the shield to contaminate the deposition source assembly. In addition, it is possible to limit the width to which the deposition material is radiated so that when having at least two evaporation sources as in the present invention, the regions deposited on the substrate from the respective evaporation sources are always superimposed on the substrate. Not only can it form a uniform thin film, but it can also reduce the shadow effect.

Here, the shield 80 may be separated and replaced independently of the outer housing 50. In addition, the shield 80 is preferably made of a stainless steel material sanding (sanding) so that the deposition material does not fall again after the deposition material adheres to the surface. As a result, it is possible to prevent the material adsorbed on the shield from falling off during the deposition process and being deposited on the substrate to be deposited.

On the other hand, the first evaporation source 60 and the second evaporation source 70 may contain the same deposition material, and may form a thin film having a uniform thickness and moving vertically on the substrate to be deposited. It is advantageous when applied to a large substrate.

Alternatively, the first evaporator 60 and the second evaporator 70 may contain different deposition materials. As a result, the two deposition materials are mixed and deposited on the deposition substrate S during the deposition process, so that the thin film formed on the deposition substrate may have a uniform composition. For example, the first evaporation source 60 is an evaporation source for spraying a deposition material forming a thin film formed on one surface of the substrate to be deposited on one surface of the substrate to be deposited. In contrast, the second evaporation source 70 is an evaporation source for including an additive for improving the properties of the thin film in the thin film.

As such, in an evaporation source assembly having two or more than two evaporation sources, it is preferable to induce the deposition material radiating from each evaporation source to irradiate the same point on the substrate to be deposited to form a uniform thin film. As a result, a thin film having a uniform thickness and a uniform composition can be formed.

4 and 5 are cross-sectional views taken along the line II ′ of the evaporation source assembly of FIG. 2 according to an embodiment of the present invention, in which the deposition material is irradiated to the same point on the substrate S to be deposited. It is a figure for description. Here, although not shown in the drawing, each of the evaporation sources stores a deposition material, a storage portion having a portion opened, a nozzle portion connected to the opened portion of the storage portion and spraying the deposition material, the nozzle portion and the A housing enclosing the storage unit and a heating unit interposed between the nozzle unit and the housing may be provided.

Referring to FIG. 4, in the deposition source assembly of the present invention, an outer housing 50 is located, and the outer housing is divided into two cells having an opening at least partially opened, and the first cell 50a includes a first cell. The evaporation source 60 is fixed by the support 90, and the second evaporation source 70 is fixed to the second cell 50b by the support 100.

The outer housing 50 has a shield 80 with a guide 80a positioned in each cell. At this time, the guide (80a) located in each cell is inclined at a predetermined angle with respect to the horizontal direction of the outer housing 50, the extension line of the guide (80a) located in each cell is the substrate to be deposited ( It is preferable to meet at the same point of S). As a result, the deposition material discharged from the respective evaporation sources may be deposited in the same region (a) of the substrate (S) as the guide (80a) is guided. At this time, even if the guide 80a is not inclined at a predetermined angle with respect to the horizontal direction of the outer housing or the guide 80a is inclined, the extension lines of the guides 80a positioned in each cell do not meet each other. The deposition material cannot be deposited at the same point on the substrate S to be deposited, so that a uniform thin film cannot be formed.

In addition, the width of the guide 80a positioned in any one of the plurality of cells may be adjusted to control the deposition width of the deposition material emitted from the evaporation source. As a result, the shielding material may be prevented from depositing the deposition material discharged from the respective evaporation sources in a region outside the same region (a) of the substrate to be deposited. Therefore, the deposition material discharged from each evaporation source can be more precisely deposited in the same region (a) of the substrate to be deposited.

The shield 80 may be separated and replaced independently of the outer housing 50. As a result, the shield 80 may be replaced or removed when it is contaminated, and then easily cleaned and reassembled. In addition, since the shield 80 can be easily separated and replaced, a shield having various shapes when the deposition material discharged from the respective evaporation sources is deposited on the same area of the substrate S to be deposited ( It can be easily controlled by replacing 80).

 Here, the shield 80 is preferably made of a stainless steel material sanding (sanding) so that the deposition material does not fall again after the deposition material adheres to the surface. As a result, the deposition material may be prevented from falling off from the shield 80 during the deposition process, and thus the deposition material may be prevented from being deposited onto the substrate to be deposited, thereby forming a uniform thin film.

Meanwhile, the first evaporator 60 and the second evaporator 70 may contain the same deposition material, and may vertically move and deposit a uniform thin film on the substrate.

Alternatively, the first evaporation source 60 and the second evaporation source 70 contain different deposition materials, so that the two deposition materials may be mixed and deposited on the deposition substrate S during the deposition process. For example, the first evaporation source 60 is an evaporation source containing a deposition material for forming a thin film formed on one surface of the substrate S to be deposited. In contrast, the second evaporation source 70 is an evaporation source containing an additive included in the thin film to improve the characteristics of the thin film.

The outer housing 50 may be formed of a cooling plate to prevent the heat emitted from the evaporation source located inside the refrigerant to be discharged to the outside.

Furthermore, as shown in FIG. 5, the deposition materials emitted from the two evaporation sources adjust the angle of at least one of the two evaporation sources to deposit on the same region of the substrate to be deposited, so that the evaporation sources are deposited materials. More preferably, the discharged openings face the same point a 'of the substrate. As a result, it may be easier to control the direction of the deposition material emitted from the evaporation source.

At this time, the angle of the evaporation source may be adjusted by the angle adjusting means. In this case, the angle adjusting means may use the angle adjusting support (90, 100). Looking at, the first evaporator 60 is fixed to the angle adjusting support 90 made of a first support 90a and a second support 90b having different heights on both sides thereof, thereby adjusting the first evaporator at a predetermined angle. Thus, the deposition direction of the deposition material emitted from the first evaporation source can be changed.

In addition, the second evaporator 70 is fixed to the second evaporator at a predetermined angle by fixing the second evaporator 70 by the angle adjustment support 100 having the first support 100a and the second support 100b having different heights on both sides thereof. By adjusting, the deposition direction of the deposition material emitted from the second evaporation source may be changed.

Here, as described above, by adjusting the angle of the at least one evaporation source, or by adjusting the angle of the two evaporation sources, the evaporation sources can be directed to the same point (a ') of the deposition substrate (S), The deposition material emitted from the evaporation source may be more precisely deposited in the same region (a) of the substrate (S).

FIG. 6 is a cross-sectional view of the evaporation source assembly of FIG. 2 taken along the line II ′ according to another embodiment of the present invention, for explaining an embodiment of inducing a deposition material to be irradiated to the same point of the substrate S to be deposited. Drawing. In this case, in the present invention, the deposition source assembly including two cells and two evaporation sources in each cell has been described in detail, but the deposition source assembly may include three or more cells and a plurality of evaporation sources.

Referring to FIG. 6, the deposition source assembly of the present invention includes an outer housing 100 separated into a first cell 100a and a second cell 100b. The first evaporator 200 is located in the first cell 100a, and the second evaporator 300 is located in the second cell 100b.

The evaporation sources 200 and 300 store deposition materials, and nozzles for injecting evaporation deposition materials connected to the storage portions 210 and 310 having a portion opened and the opening portions of the storage portions 210 and 310. The housings 220 and 320, the housings 230 and 330 that surround the storage units 210 and 310, and the nozzle units 220 and 320, and the storage units 210 and 310 and the housing 230. , 330 has a structure having a heating portion interposed therebetween.

The nozzle units 220 and 320 spray particles of the deposition material evaporated from the storage unit 310 to one surface of the thinned deposition substrate S approximately vertically, and the particles of the deposition material are deposited on the substrate. It plays a role of determining the form of deposition and distribution on one surface of (S). In this case, the nozzle parts 220 and 320 may include a body 221 and 321 constituting the nozzle part and through holes 222 and 322 penetrating the body. Here, the deposition material evaporated from the storage parts 210 and 310 through the through holes 222 and 322 constituting the nozzle part is emitted toward the outside, that is, the substrate S to be deposited. Here, the through holes 222 and 322 may be inclined at a predetermined angle with respect to the housings 230 and 330. In this case, the deposition direction of the deposition material emitted from the evaporation source may be adjusted according to the slope of the through hole. At this time, it is more preferable that the through holes 222 and 322 of the respective nozzle portions provided in the respective evaporation sources face one point of the substrate to be deposited. As a result, the deposition material emitted from each of the evaporation sources may be induced to be deposited in the same region (b) on the substrate S to be deposited, thereby forming a uniform thin film.

In addition, the nozzles 220 and 320 may be made of graphite having excellent thermal conductivity or an equivalent thereof, but the material is not limited thereto. In addition, the nozzles 220 and 320 may be controlled to allow the deposition material particles to be sprayed according to the opened shape, so that uniform evaporation of the organic material in the storage parts 210 and 310 may be controlled.

The storage units 210 and 310 store a deposition material to be deposited on the deposition substrate S, and are generally made of a crucible. In addition, the storage unit 210, 310 may be made of graphite (graphite) or an equivalent thereof having excellent thermal conductivity, but the material is not limited in the present invention.

In order to prevent the deposition material in the form of a cluster from splashing in the storage units 210 and 310, a splash prevention layer may be further provided on an adjacent region of one open surface of the storage unit or on a body of the nozzle unit.

The housings 220 and 330 are formed to surround the storage 310, and serve to isolate the storage 310 from an external environment.

The heating parts 240 and 340 are interposed between the storage parts 210 and 310 and the housings 230 and 330 to heat the evaporation of the deposition material stored in the storage part 310. .

In addition, the evaporation sources 200 and 300 may further include internal heat reflecting plates 250 and 350 attached to inner walls of the housings 230 and 330. The internal heat reflection plates 250 and 350 reflect heat generated by the heating parts 240 and 340 to increase the thermal efficiency of the heating parts 240 and 340.

In addition, the evaporation sources 200 and 300 may further include heat blocking means 260 and 360 attached to the outer surfaces of the nozzle units 220 and 320. The heat blocking means 260 and 360 prevent heat from being emitted through the nozzle parts 220 and 320 and affecting the substrate S to be deposited.

Here, the first evaporation source 200 and the second evaporation source 300 may contain the same deposition material, and may vertically move and deposit a uniform thin film on the deposition substrate S. . Alternatively, the first evaporation source 200 and the second evaporation source 300 may include different deposition materials, so that two deposition materials may be mixed and deposited on the deposition substrate during the deposition process.

Here, by further comprising a shield 270 having a guide located in the cell of each evaporation source, as described above, by controlling the deposition direction and deposition width of the deposition material emitted from the respective evaporation source, The deposition material can be more precisely guided to deposit the same region of the substrate.

Thus, the deposition material emitted from each evaporation source is deposited in the same deposition region b of the substrate to be deposited through the through hole inclined at an angle with respect to the horizontal direction of the housing. In this case, a uniform thin film may be formed by moving the deposition substrate or the evaporation source assembly.

As described above, according to the present invention, the present invention provides a vaporizing evaporation source assembly having at least two evaporation sources, wherein the evaporation materials emitted from each evaporation source are deposited on the same region of the substrate to be deposited to have a uniform composition. In addition to forming a thin film, a thin film having a uniform thickness can be formed.

Thereby, it can have a uniform characteristic and can manufacture a more stable element.

Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art can variously modify and change the present invention without departing from the spirit and scope of the present invention described in the claims below. I can understand that.

Claims (11)

An outer housing divided into at least two cells at least partially opened; And each evaporation source located inside each cell, Evaporation source assembly, characterized in that located on both sides of the opening of each cell, is connected to the outer housing, provided with a shield (shield) having a guide, the extension line of the guide toward the same point. The method of claim 1, At least one evaporation source of the evaporation source is inclined at an angle with respect to the ground. The method of claim 2, The evaporation source assembly is characterized in that the evaporation source assembly is characterized in that the opening portion is discharged toward the same point of the substrate to be deposited. The method of claim 1, And the evaporation source contains the same deposition material. The method of claim 1, At least one evaporation source of the evaporation source contains a deposition material for forming a thin film formed on one surface of the substrate to be deposited, and the other at least one evaporation source contains an additive different from the deposition material for inclusion in the thin film Evaporation source assembly. An outer housing having at least two cells at least partially open; And each evaporation source located inside each cell, Each of the evaporation sources may include a nozzle having a reservoir having a portion which is the same as an opening direction of the cell, a body connected to the opened portion of the reservoir, and a through hole penetrating through the body, wherein the nozzle portion and the A housing surrounding the storage unit and a heating unit interposed between the housing and the nozzle unit, The through-hole forming the nozzle portion is inclined at an angle with respect to the horizontal direction of the housing evaporation source assembly, characterized in that. The method of claim 6, Evaporation source assembly, characterized in that the through-holes respectively forming the nozzle portion of the evaporation source toward the same point of the substrate to be deposited. The method of claim 6, The outer housing is located on both sides of the opening of each cell, the evaporation source assembly, characterized in that it comprises a shield having a guide toward the substrate to be deposited. The method of claim 8, And at least one guide is inclined at an angle such that the guide of each shield has its extension line facing the same point. The method of claim 6, At least one evaporation source of the evaporation source contains a deposition material for forming a thin film formed on one surface of the substrate to be deposited, and the other at least one evaporation source contains an additive different from the deposition material for inclusion in the thin film Evaporation source assembly. A deposition apparatus comprising the evaporation source assembly of claim 1.

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