KR20140072847A - Pressurizing apparatus for handler and handler - Google Patents

Abstract

According to the present invention, there is provided a module IC handler in which a position of a module module mounted on a carrier can be corrected, and a technique for reducing manufacturing cost while improving the reliability of a test, .

Description

[0001] PRESSURIZING APPARATUS FOR HANDLER AND HANDLER [0002]

Field of the Invention [0002] The present invention relates to a module IC handler, and more particularly to a carrier used for carrying a module IC in a loaded state.

A module IC (also referred to as a module IC or a 'module RAM') is an independent circuit formed by fixing a plurality of ICs and other devices on one side or both sides of a substrate, and is an important part necessary for operation of a computer device. It is expensive.

Therefore, strict performance tests must be performed before shipment after product completion.

In order to test such a module, you need a module IC handler that can electrically connect the module IC to the tester in addition to the tester.

The module ICH handler loads the module IC by the pick-up device in the loading section, carries the module IC by the transfer device to the test chamber, supports testing of the module ICs loaded in the carrier, After the carriers tested by the module modules are transferred to the sorting section by another transfer device, a series of operations for sorting module modules according to the test results is performed.

An example of such a module CI handler is a technique disclosed in Korean Patent Publication No. 2002-0056255 (the name of the invention: a carrier for a module CI handler) (hereinafter referred to as a "prior art").

The carrier shown in the prior art has a complicated structure in which the socket holding the module IC is fixed so as not to be movable and the socket itself has a compression spring 136 and a separate pressing member 134.

On the other hand, the module children loaded in the carrier in the test chamber must be electrically connected to the test sockets at exactly the right correspondence with the test sockets on the tester. This is because, if the position of some or all of the module ICs tested at the same time is out of position with the test socket, there is a possibility that the module IC can not make an accurate electrical connection with the test socket.

However, according to the prior art, since the sockets are fixed so as not to move, even if some or all of the module children held in the sockets do not exactly correspond to the position of the test socket, There is a problem.

Further, according to the related art, there is also a problem that the manufacturing cost of the carrier is increased due to the complicated configuration of the socket.

A first object of the present invention is to provide a technique capable of correcting the position of a module IC held in a socket.

A second object of the present invention is to provide a technique that can simplify the structure of elements constituting a socket or other carrier, such as the need for a separate pressing member.

In order to accomplish the above object, a module ICH handler according to the present invention comprises: a carrier arranged to load and carry a module IC; And an adjustment device that enables loading or unloading of the module ICU from or to the carrier; Wherein the carrier comprises: a rectangular frame-shaped frame; A pair of coupling bars fixed to the frame and symmetrically arranged in a direction opposite to each other (hereinafter referred to as 'inner direction'); 2 x N (N > = 1) sockets provided in the pair of coupling rods and provided so that two opposing pairs are mutually paired to hold both ends of a module IC, The socket provided in the one side coupling bar and the socket provided in the other side coupling bar are disposed symmetrically with respect to each other in the inward direction; And a plurality of elastic members provided for applying an elastic force inwardly to each of the 2 x N sockets; Wherein the 2 × N sockets are provided on the pair of coupling rods so as to be movable by a predetermined distance in a direction opposite to the inside direction (hereinafter, referred to as 'outside direction'), Move the N sockets outward.

Preferably, each of the pair of coupling bars has N socket insertion slots into which the sockets can be inserted, and a width between opposing wall surfaces of the socket insertion slots is wider than a waterfall of the socket.

Wherein each of the pair of coupling bands has stoppers corresponding to each of the 2 x N sockets and each of the 2 x N sockets has a limiting protrusion that is caught on the stopper when the socket moves outward, The movement of the N number of sockets in the outward direction is prevented.

Preferably, each of the 2.times.N sockets has a guide groove for guiding the position of the socket.

The adjusting device comprising: an adjusting plate having 2 x N guide rods each of which can be inserted into guide grooves formed in each of the 2 x N sockets; And a moving source for moving the adjusting plate to the carrier side so that the guide rods can be inserted into the guide grooves; And the center of the guide rod is located outside the center of the corresponding guide groove so that the guide rod is inserted into the guide groove so that the socket can overcome the elastic force of the elastic member and move in the outward direction .

Each of the 2 x N guide rods is preferably divided into an insertion portion which is inserted first in the guide groove and a non-insertion portion which is wider than the insertion portion when the adjustment plate is moved toward the carrier side by the movement of the source Do.

According to the present invention as described above, since the position of the module IC mounted on the carrier can be corrected, the electrical connection between the module IC and the test socket can be accurately derived to improve the reliability of the test, Can be saved.

1 is a perspective view of a carrier according to an embodiment of the present invention.
Figure 2 is a partially exploded perspective view of the carrier of Figure 1;
3 is an exaggerated view for reference to explain the carrier of Fig.
4 is a reference diagram for explaining a state in which the module A is loaded on the carrier shown in FIG.
Figures 5A-5C are schematic diagrams for reference to illustrate the operation in which the module AIC is loaded on the carrier of Figure 1;
6 is a perspective view of an adjustment device according to an embodiment of the present invention.
Figs. 7 to 10 are reference views for describing the adjustment device of Fig.
11 is a reference diagram for reference to a description of the position correction of the module IC mounted on the carrier.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. For simplicity of description, redundant description is omitted or compressed as much as possible.

<Example of Carrier>

FIG. 1 is a perspective view of a carrier 100 according to an embodiment of the present invention, and FIG. 2 is a partially exploded perspective view of the carrier 100 of FIG.

1 and 2, the carrier 100 includes a frame 110, a pair of coupling bases 121 and 122, 2 x 16 sockets 131a to 131p, 132a to 132p, 2x16 A pair of springs 141a to 141p, 142a to 142p, a pair of departure prevention bars 151 and 152, and the like.

The frame 110 has a rectangular frame shape and includes the pair of coupling bars 121 and 122, the 2x16 sockets 131a to 131p and 132a to 132p, the 2x16 springs 141a to 141p and 142a 142p and a pair of departure prevention bars 151, 152, etc., directly or indirectly.

The pair of coupling bars 121 and 122 are fixed to the frame 110 and disposed symmetrically with respect to each other in a direction facing each other (hereinafter referred to as 'inner direction'). Sixteen socket insertion grooves IG into which the sockets 131a to 131p and 132a to 132p can be inserted are formed in the pair of coupling bars 121 and 122 so as to be opened inward, 131p, 132a to 132p have a stopper SP for restricting movement in a direction opposite to the inward direction (hereinafter, referred to as "outward direction"). 3, the width W ₁ between the opposed wall surfaces of the socket insertion groove IG is wider than the width W ₂ of the sockets 131a to 131p and 132a to 132p, The sockets 131a to 131p and 132a to 132p inserted in the insertion groove IG can be moved to a certain extent in the direction of arrow a.

The 2 x 16 sockets 131a to 131p and 132a to 132p are divided into a pair of coupling bars 121 and 122 so as to be movable in the outer direction by a predetermined distance, (Not shown), and the remaining 16 are provided on the other coupling base 122. As shown in the reference diagram of FIG. 4, a pair of sockets 131a and 132a, facing each other, are formed in one module ia, (M). Each of the sockets 131a to 131p and 132a to 132p has guide grooves GG (see FIG. 5A and the like) for guiding the positions of the sockets 131a to 131p and 132a to 132p on the bottom surface thereof And limiting projections (LP) projecting downward so that over travel due to the elastic force of the springs (141a to 141p, 142a to 142p) can be restricted. When the sockets 131a to 131p and 132a to 132p are moved in the outward direction by an external force applied in the outward direction, the limit projections LP are formed on the stoppers SP of the coupling bars 121 and 122, Thereby limiting the movement of the sockets 131a to 131p, 132a to 132p in the outward direction. This is because when the socket 131a to 131p or 132a to 132p moves in the outward direction or the socket 131a to 131p or 132a to 132p moves excessively outward due to aging or assembly failure of the equipment during use, This is because the module C can fall down without being caught by the sockets 131a to 131p and 132a to 132p.

Each of the 2 x 16 springs 141a to 141p and 142a to 142p is arranged to elastically support between the coupling bands 121 and 122 and the sockets 131a to 131p and 132a to 132p and the sockets 131a to 131p and 132a To 132p) as an elastic member for applying an elastic force in the inward direction.

Each of the pair of departure prevention bars 151 and 152 is fixed to a pair of coupling bars 121 and 122 so as to prevent the sockets 131a to 131p and 132a to 132p from being separated upward do.

The operation in which the module 100 is loaded on the carrier 100 having the above configuration will be described with reference to the schematic views of FIGS. 5A to 5C.

As shown in FIG. 5A, when the springs 141a and 142a elastically press the sockets 131a and 132a in the inward direction, the interval between the opposing sockets 131a and 132a is narrow, It can not be done.

However, as shown in FIG. 5B, when an external force is applied to the sockets 131a and 132a and the sockets 131a and 132a are pushed outwardly and moved a predetermined distance, the gap between the sockets 131a and 132a facing each other is widened (M) can be loaded.

When the external force applied to the both sockets 131a and 132a is removed in a state where both ends of the modules are held by the sockets 131a and 132a facing each other, as shown in FIG. 5C, the spring 141a The modules 131 and 132 are moved inward by the resilient restoring force of the module screws 142a and 142a so that the module core M can be firmly gripped by pressing the both ends of the module core M held inside. That is, according to the present invention, the sockets 131a to 131p and 132a to 132p themselves serve as a pressing member for pressing the module core M, instead of a separate pressing member.

<Example of adjustment device>

As described above, in order to load the module 100 on the carrier 100, a separate external force is applied to the sockets 131a to 131p and 132a to 132p to set the gap between the socket pairs 131a-132a to 131p-132p facing each other And a separate adjustment device 600 as shown in FIG. 6 is provided to perform this role.

6, the adjusting device 600 includes an adjusting plate 610 and a cylinder 620. The adjusting plate 610 includes a cylinder 620,

The adjustment plate 610 is ascendable and descendable and has 2 x 16 guide rods GB1a to GB1p, GB2a to GB2p on its upper surface. Each of the 2 x 16 guide rods GB1a to GB1p and GB2a to GB2p is inserted into the guide groove GG formed on the bottom surface of the 2x16 socket 131a to 131p or 132a to 132p of the carrier 100, (131a to 131p, 132a to 132p).

Each guide rod GB1a to GB1p and GB2a to GB2p has a larger outer diameter of the lower portion B than the upper portion T as shown in the reference diagram of Fig. If the lower portions B of the guide rods GB1a to GB1p and GB2a to GB2p are designed to have the same outer diameter as that of the upper portion T, the long guide rods GB1a to GB1p, GB2a to GB2p, The outer diameters of the portions excluding the portions to be inserted into the sockets 131a to 131p and 132a to 132p are increased to prevent the guide rods GB1a to GB1p and GB2a to GB2p from being bent. 8, the center Ca of the guide rods GB1a to GB1p, GB2a to GB2p is inclined to the guide grooves GG of the sockets 131a to 131p, 132a to 132p, (S) of the center Cb. And the upper portion T has a shape in which its outer diameter becomes larger toward the lower side. 9, when the adjustment plate 610 is lifted, the sharp ends of the guide rods GB1a to GB1p, GB2a to GB2p are inserted into the edge of the guide groove GG, To 131p, 132a to 132p in the outward direction.

The cylinder 620 serves as a moving source for moving the adjusting plate 610 up and down. As shown in FIG. 10, the cylinder 620 is moved by the operation for raising the adjusting plate 610 toward the carrier 100 Only the upper portions of the guide rods GB1a to GB1p and GB2a to GB2p are inserted into the guide grooves GG and the lower portions of the guide rods GB1a to GB1p and GB2a to GB2p are inserted into the guide grooves GG, It is preferable to implement such that it is not inserted into the terminal.

The operation of adjusting the carrier 100 or releasing the adjustment so that the adjusting device 600 in the carrier 100 and the adjusting device 600 having the above configuration can load the module 100 on the carrier 100 see.

The guide rods GB1a to GB1p and GB2a to GB2p of the adjusting plate 610 are guided to the guide grooves GG of the sockets 131a to 131p and 132a to 132p by the operation of the cylinder 620 The sockets 131a to 131p and 132a to 132p are pushed toward the outside and the sockets 131a to 131p and 132a to 132p are pushed out in the outward direction when the adjustment of the adjusting device 600 is completed So that the module 100 can be loaded on the carrier 100.

When sixteen module modules are loaded on the carrier 100 by a pickup device (not shown), the cylinder 620 is operated in reverse to lower the adjusting plate 610 so that the springs 141a to 141p, 142p, the sockets 131a to 131p, 132a to 132p are moved inward to elastically press both ends of the stacked module cores to firmly fix the module cores.

In the meantime, although the description of the above embodiment is based on the case where the module IC is loaded on the carrier 100, the same applies to the case where the module IC is removed from the carrier 100. [

If a device capable of performing the same function as the guide rods GB1a to GB1p and GB2a to GB2p of the control panel 610 is provided on the test chamber (not shown) or the tester (not shown) It is possible to correct the position of the module IC so as to correspond exactly to the position of the socket 131A to 131P or 132A to 132P in addition to the guide groove GG, Can be considered.

Therefore, as shown in the exaggerated view of FIG. 11, it is possible to correct the position of module module C in the outward and inbound directions D ₁ and in the plane D ₂ perpendicular to the inward and outward directions on the plane, M can be precisely matched to the position of the test socket TS.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. And the scope of the present invention should be understood as the following claims and their equivalents.

100: Carrier
110: frame
121, 122:
IG: Insertion groove, ST: Stopper
131a to 131p, 132a to 132p:
GG: guide groove, LP: restriction projection
141a to 141p, 142a to 142p: spring
151 and 152:
600: adjusting device
610: Adjustment Panel
GB1a to GB1p, GB2a to GB2p:
620: Cylinder

Claims (3)

A pressing member installed on the carrier so as to be movable; And
An elastic member for applying an elastic force to the pressing member in an inward direction; Lt; / RTI &gt;
Wherein the pressing member is provided with a guide groove for guiding the movement of the pressing member,
The guiding rod of the adjusting plate provided on the adjusting device is inserted into the guiding groove along with the rising of the adjusting plate so that an external force is applied to the pressing member in the outward direction, And is formed so as to be biased toward the outside of a predetermined distance from the center.
Handler pressure device. A carrier having a pressing member which is positionally movable and an elastic member which applies an elastic force inward to the pressing member; And
An adjusting device having an adjusting plate having a guide rod for moving the position of the pressing member and a moving source for moving the adjusting plate up and down; / RTI &gt;
Wherein the pressing member is provided with a guide groove for guiding the movement of the pressing member,
When the guide rod is inserted into the guide groove, an external force is exerted on the pressing member in the outward direction, so that the pressing force is applied to the pressing member, Wherein the pressing member is moved in the outward direction, and when the adjusting plate is lowered, the pressing member is moved inward by the action of the elastic member
Handler. 3. The method of claim 2,
The upper portion of the guide bar has a shape that increases in outer diameter toward the lower side so that when the adjustment plate is lifted, a pointed end of the guide rod is inserted into the edge of the guide groove, Characterized by being able to
Handler.

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