KR20130091734A - 패턴화된 에어 레이드 부직포 일렉트릿 섬유질 웨브 및 그 제조 및 사용 방법 - Google Patents
패턴화된 에어 레이드 부직포 일렉트릿 섬유질 웨브 및 그 제조 및 사용 방법 Download PDFInfo
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Materials Engineering (AREA)
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- Nonwoven Fabrics (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
- Multicomponent Fibers (AREA)
Abstract
Description
도 1은 본 개시 내용의 예시적인 패턴화된 에어 레이드 부직포 일렉트릿 섬유질 웨브의 사시도.
도 2a는 본 개시 내용의 한 예시적인 실시 형태를 나타낸, 도 1의 예시적인 패턴화된 에어 레이드 부직포 일렉트릿 섬유질 웨브의 일부분의 분해도.
도 2b는 본 개시 내용의 다른 예시적인 실시 형태를 나타낸, 도 1의 예시적인 패턴화된 에어 레이드 부직포 일렉트릿 섬유질 웨브의 일부분의 분해도.
도 3은 본 개시 내용의 패턴화된 에어 레이드 부직포 일렉트릿 섬유질 웨브의 다양한 실시 형태를 제조하는 장치 및 공정을 나타낸 측면도.
도 4는 도 1에 도시된 예시적인 장치의 예시적인 선택적인 열 처리 부분의 개략 확대도.
도 5a 내지 도 5h는 본 개시 내용의 특정의 예시적인 실시 형태에 따른 패턴화된 에어 레이드 부직포 일렉트릿 섬유질 웨브를 형성하는 데 유용한 다양한 예시적인 천공된 패턴화된 컬렉터 표면의 평면도.
도 6은 본 개시 내용의 예시적인 실시 형태에 따른 패턴화된 에어 레이드 부직포 일렉트릿 섬유질 웨브를 형성하는 데 유용한, 도 5f의 예시적인 천공된 패턴화된 컬렉터 표면의 분해도.
도 7a 및 도 7b는 본 개시 내용의 특정의 예시적인 실시 형태에 따른 다양한 예시적인 패턴화된 에어 레이드 부직포 섬유질 웨브의 사진.
축척대로 그려져 있지 않을지도 모르는 상기 도면이 본 개시 내용의 다양한 실시 형태를 나타내고 있지만, 상세한 설명에서 살펴보는 바와 같이, 다른 실시 형태들도 생각되고 있다. 모든 경우에, 본 개시 내용은 여기 개시된 발명을 명백히 제한하는 것이 아니라 예시적인 실시 형태를 대표하는 것으로서 기술하고 있다. 본 기술 분야의 당업자라면 본 발명의 범위 및 정신 내에 속하는 여러 가지 다른 변형예 및 실시예들을 고안할 수 있을 것으로 이해해야 한다.
Claims (43)
- 일렉트릿 섬유를 포함하는 복수의 랜덤하게 배향된 개별 섬유를 포함하는 부직포 일렉트릿 섬유질 웨브로서, 부직포 일렉트릿 섬유질 웨브는 부직포 일렉트릿 섬유질 웨브의 주 표면으로부터 뻗어 있는 복수의 비중공 돌출부, 및 주 표면에 의해 정의되고 그와 실질적으로 평행한 평면에 있는 각각의 인접한 돌출부 사이에 형성된 복수의 실질적으로 평면인 랜드 영역을 추가로 포함하며, 복수의 랜덤하게 배향된 개별 섬유는 적어도 제1 용융 온도를 가지는 제1 영역 및 제2 용융 온도를 가지는 제2 영역을 가지는 다성분 섬유(multi-component fiber)를 추가로 포함하고, 제1 용융 온도는 제2 용융 온도 미만이고,
또한 배향된 개별 섬유의 적어도 일부분이 다성분 섬유의 제1 영역과의 복수의 교차점에서 서로 접합되는 것인 부직포 일렉트릿 섬유질 웨브. - 제1항에 있어서, 다성분 섬유가 부직포 일렉트릿 섬유질 웨브의 총 중량 중 적어도 10 중량%의 양으로 섬유질 웨브에 존재하는 것인 부직포 일렉트릿 섬유질 웨브.
- 제1항에 있어서, 다성분 섬유가 부직포 일렉트릿 섬유질 웨브의 총 중량 중 0 중량% 초과 10 중량% 미만의 양으로 섬유질 웨브에 존재하는 것인 부직포 일렉트릿 섬유질 웨브.
- 제1항에 있어서, 복수의 배향된 개별 섬유의 0 중량% 초과 10 중량% 미만이 다성분 섬유인 부직포 일렉트릿 섬유질 웨브.
- 제1항 내지 제4항 중 어느 한 항에 있어서, 다성분 섬유가 2 성분 섬유인 부직포 일렉트릿 섬유질 웨브.
- 제1항 내지 제5항 중 어느 한 항에 있어서, 다성분 섬유가 폴리에스테르, 폴리아미드, 폴리올레핀, 사이클릭 폴리올레핀, 폴리올레핀계 열가소성 탄성중합체, 폴리(메트)아크릴레이트, 폴리비닐 할라이드, 폴리아크릴로니트릴, 폴리우레탄, 폴리락트산, 폴리비닐 알코올, 폴리페닐렌 설파이드, 폴리설폰, 폴리옥시메틸렌, 유체 결정 중합체, 및 그 조합으로 이루어진 그룹 중에서 선택되는 중합체를 포함하는 것인 부직포 일렉트릿 섬유질 웨브.
- 제1항 내지 제6항 중 어느 한 항에 있어서, 복수의 미립자를 추가로 포함하고, 미립자들의 적어도 일부분이 다성분 섬유의 적어도 일부분의 적어도 제1 영역에 접합되어 있는 것인 부직포 일렉트릿 섬유질 웨브.
- 일렉트릿 섬유를 포함하는 복수의 랜덤하게 배향된 개별 섬유를 포함하는 부직포 일렉트릿 섬유질 웨브로서, 부직포 일렉트릿 섬유질 웨브는 부직포 일렉트릿 섬유질 웨브의 주 표면으로부터 뻗어 있는 복수의 비중공 돌출부, 및 주 표면에 의해 정의되고 그와 실질적으로 평행한 평면에 있는 각각의 인접한 돌출부 사이에 형성된 복수의 실질적으로 평면인 랜드 영역을 추가로 포함하며,
복수의 랜덤하게 배향된 개별 섬유가 제1 용융 온도를 가지는 단성분 열가소성 개별 섬유(monocomponent discrete thermoplastic fiber)의 제1 집단, 및 제1 용융 온도 초과의 제2 용융 온도를 가지는 단성분 개별 섬유들의 제2 집단을 추가로 포함하며, 단성분 개별 섬유들의 제1 집단의 적어도 일부분이 단성분 개별 섬유들의 제2 집단의 적어도 일부분에 접합되는 것인 부직포 일렉트릿 섬유질 웨브. - 제8항에 있어서, 단성분 열가소성 개별 섬유들의 제1 집단이 복수의 랜덤하게 배향된 개별 섬유의 0 중량% 초과 10 중량% 미만을 포함하는 것인 부직포 일렉트릿 섬유질 웨브.
- 제8항 또는 제9항에 있어서, 단성분 열가소성 개별 섬유들의 제1 집단이 폴리에스테르, 폴리아미드, 폴리올레핀, 사이클릭 폴리올레핀, 폴리올레핀계 열가소성 탄성중합체, 폴리(메트)아크릴레이트, 폴리비닐 할라이드, 폴리아크릴로니트릴, 폴리우레탄, 폴리락트산, 폴리비닐 알코올, 폴리페닐렌 설파이드, 폴리설폰, 폴리옥시메틸렌, 유체 결정 중합체, 및 그 조합으로 이루어진 그룹 중에서 선택되는 중합체를 포함하는 것인 부직포 일렉트릿 섬유질 웨브.
- 제1항 내지 제10항 중 어느 한 항에 있어서, 제1 용융 온도가 적어도 50℃이고, 또한 제2 용융 온도가 제1 용융 온도보다 적어도 10℃ 더 높은 것인 부직포 일렉트릿 섬유질 웨브.
- 제11항에 있어서, 제1 용융 온도가 적어도 100℃이고, 또한 제2 용융 온도가 제1 용융 온도보다 적어도 30℃ 더 높은 것인 부직포 일렉트릿 섬유질 웨브.
- 제8항 내지 제12항 중 어느 한 항에 있어서, 복수의 미립자를 추가로 포함하고, 미립자들 중 적어도 일부분이 단성분 개별 섬유들의 제1 집단의 적어도 일부분에 접합되는 것인 부직포 일렉트릿 섬유질 웨브.
- 제7항 또는 제13항에 있어서, 복수의 미립자가 연마재 미립자, 금속 미립자, 세제 미립자, 계면 활성제 미립자, 살생물제 미립자, 흡착제 미립자, 흡수제 미립자, 마이크로캡슐, 및 그 조합으로 이루어진 그룹 중에서 선택되는 유익한 미립자를 포함하는 것인 부직포 일렉트릿 섬유질 웨브.
- 제14항에 있어서, 유익한 미립자가 활성탄 미립자, 활성 알루미나 미립자, 실리카겔 미립자, 건조제 미립자, 음이온 교환 수지 미립자, 양이온 교환 수지 미립자, 분자체(molecular sieve) 미립자, 규조토 미립자, 항균성 화합물 미립자, 및 그 조합으로 이루어진 그룹 중에서 선택되는 화학적 활성 미립자를 포함하는 것인 부직포 일렉트릿 섬유질 웨브.
- 제15항에 있어서, 화학적 활성 미립자가 실질적으로 부직포 일렉트릿 섬유질 웨브의 전체 두께에 걸쳐 분포되어 있는 것인 부직포 일렉트릿 섬유질 웨브.
- 제16항에 있어서, 화학적 활성 미립자가 실질적으로 복수의 비중공 돌출부의 표면 상에 분포되어 있는 것인 부직포 일렉트릿 섬유질 웨브.
- 제17항에 있어서, 부직포 일렉트릿 섬유질 웨브의 적어도 10 중량%가 복수의 미립자를 포함하는 것인 부직포 일렉트릿 섬유질 웨브.
- 제1항 내지 제18항 중 어느 한 항에 있어서, 복수의 배향된 개별 섬유의 적어도 일부분이 천연 섬유, 비열가소성 중합체성 섬유, 탄소 섬유, 세라믹 섬유, 금속 섬유, 및 그 조합으로 이루어진 그룹 중에서 선택되는 것인 부직포 섬유질 웨브.
- 제1항 내지 제19항 중 어느 한 항에 있어서, 복수의 배향된 개별 섬유의 적어도 일부분이 폴리프로필렌, 폴리에틸렌, 폴리에스테르, 폴리에틸렌 테레프탈레이트, 폴리부틸렌 테레프탈레이트, 폴리아미드, 폴리우레탄, 폴리부텐, 폴리락트산, 폴리비닐 알코올, 폴리페닐렌 설파이드, 폴리설폰, 유체 결정 중합체, 폴리에틸렌-코-비닐아세테이트, 폴리아크릴로니트릴, 사이클릭 폴리올레핀, 폴리옥시메틸렌, 폴리올레핀계 열가소성 탄성중합체, 또는 그 조합을 포함하는 것인 부직포 일렉트릿 섬유질 웨브.
- 제1항 내지 제20항 중 어느 한 항에 있어서, 실질적으로 어떤 비섬유질 결합제도 없는 것인 부직포 일렉트릿 섬유질 웨브.
- 제1항 내지 제21항 중 어느 한 항에 있어서, 복수의 랜덤하게 배향된 개별 섬유의 적어도 일부분을 덮고 있는 결합제 코팅을 추가로 포함하고, 결합제가 실질적으로 화학적 활성 미립자의 표면을 가리지 않는 것인 부직포 일렉트릿 섬유질 웨브.
- 제1항 내지 제22항 중 어느 한 항에 있어서, 복수의 비중공 돌출부 각각이, 부직포 일렉트릿 섬유질 웨브의 제1 주 표면에 실질적으로 평행한 방향에서 볼 때, 원형, 타원형, 다각형, 나선형, 및 그 조합으로 이루어진 그룹 중에서 선택되는 단면 기하 형상을 나타내는 것인 부직포 일렉트릿 섬유질 웨브.
- 제1항 내지 제23항 중 어느 한 항에 있어서, 복수의 비중공 돌출부가 부직포 일렉트릿 섬유질 웨브의 주 표면 상에 2차원 어레이를 형성하는 것인 부직포 일렉트릿 섬유질 웨브.
- 제1항 내지 제24항 중 어느 한 항에 있어서, 스크린, 스크림, 메쉬, 부직포 천, 직포 천, 편성물, 발포체층, 다공성 필름, 천공 필름(perforated film), 섬유의 어레이, 멜트-피브릴화된(melt-fibrillated) 섬유질 웨브, 멜트블로운 섬유질 웨브, 스펀 본드 섬유질 웨브, 에어 레이드 섬유질 웨브, 웨트 레이드 섬유질 웨브, 카디드 섬유질 웨브, 습식 엉킴 섬유질 웨브, 및 그 조합으로 이루어진 그룹 중에서 선택된 지지층을 추가로 포함하는 부직포 일렉트릿 섬유질 웨브.
- 제1항 내지 제25항 중 어느 한 항에 있어서, 복수의 마이크로섬유, 복수의 서브마이크로미터 섬유, 및 그 조합을 포함하는 섬유질 커버층을 추가로 포함하는 부직포 일렉트릿 섬유질 웨브.
- 제26항에 있어서, 섬유질 커버층이 중간 섬유 직경이 1 ㎛ 미만인 서브마이크로미터 섬유들의 집단을 포함하고, 선택적으로 섬유질 커버층이 멜트 블로잉(melt blowing), 용융 방사(melt spinning), 전기 방사(electrospinning), 플렉시필라멘트 형성(plexifilament formation), 기체 젯 피브릴화(gas jet fibrillation), 섬유 분할, 또는 그 조합에 의해 형성되는 것인 부직포 일렉트릿 섬유질 웨브.
- 제1항 내지 제27항 중 어느 한 항의 부직포 일렉트릿 섬유질 웨브를 포함하는 물품으로서, 이 물품이 기체 여과 물품, 액체 여과 물품, 표면 세척 물품, 마루 매트, 절연 물품, 세포 성장 지지 물품, 약물 전달 물품, 개인 위생 물품, 및 상처 드레싱 물품으로 이루어진 그룹 중에서 선택되는 것인 물품.
- 부직포 일렉트릿 섬유질 웨브를 제조하는 방법으로서,
상단부 및 하단부를 가지는 형성 챔버를 제공하는 단계;
일렉트릿 섬유를 포함하는 복수의 섬유를 형성 챔버의 상단부 내로 유입시키는 단계;
섬유들의 집단을 실질적으로 개별 섬유로서 형성 챔버의 하단부로 이송시키는 단계; 및
실질적으로 개별 섬유들의 집단을 패턴화된 표면을 가지는 컬렉터 상에 식별가능 패턴을 가지는 부직포 일렉트릿 섬유질 웨브로서 포착하는 단계를 포함하고, 식별가능 패턴이 부직포 일렉트릿 섬유질 웨브의 주 표면으로부터 뻗어 있는 복수의 비중공 돌출부, 및 주 표면에 의해 정의되고 그와 실질적으로 평행한 평면에 있는 각각의 인접한 돌출부 사이에 형성된 복수의 실질적으로 평면인 랜드 영역을 포함하는 것인 방법. - 제29항에 있어서, 패턴화된 컬렉터 표면으로부터 웨브를 제거하기 전에 접착제를 사용하지 않고 복수의 섬유의 적어도 일부분을 서로 접합시키며, 그로써 섬유질 웨브로 하여금 식별가능 패턴을 보유하게 하는 단계를 추가로 포함하는 방법.
- 제30항에 있어서,
실질적으로 개별 섬유들의 집단을 부직포 일렉트릿 섬유질 웨브로서 포착하기 전에 섬유질 미립자 혼합물을 형성하기 위해, 복수의 화학적 활성 미립자를 형성 챔버 내로 유입시키고 형성 챔버 내에서 복수의 개별 섬유를 복수의 화학적 활성 미립자와 혼합하는 단계; 및
화학적 활성 미립자들 중 적어도 일부분을 부직포 일렉트릿 섬유질 웨브에 고정시키는 단계를 추가로 포함하는 방법. - 제29항 내지 제31항 중 어느 한 항에 있어서, 컬렉터의 패턴화된 표면이 컬렉터를 통해 뻗어 있는 복수의 기하학적 형상의 구멍을 포함하고, 또한 섬유들의 집단을 포착하는 단계가 천공된 패턴화된 컬렉터 표면을 통해 진공을 만드는 단계를 포함하는 것인 방법.
- 제32항에 있어서, 복수의 기하학적 형상의 구멍이 원형, 타원형, 다각형, X자형, V자형, 나선형, 및 그 조합으로 이루어진 그룹 중에서 선택되는 형상을 가지는 것인 방법.
- 제33항에 있어서, 복수의 기하학적 형상의 구멍이 삼각형, 정사각형, 직사각형, 마름모꼴, 사다리꼴, 오각형, 육각형, 팔각형, 및 그 조합으로 이루어진 그룹 중에서 선택되는 다각형 형상을 가지는 것인 방법.
- 제32항 내지 제34항 중 어느 한 항에 있어서, 복수의 기하학적 형상의 구멍이 패턴화된 컬렉터 표면 상의 2차원 패턴을 포함하는 것인 방법.
- 제35항에 있어서, 패턴화된 컬렉터 표면 상의 기하학적 형상의 구멍의 2차원 패턴이 2차원 어레이인 방법.
- 제29항 내지 제36항 중 어느 한 항에 있어서, 부직포 일렉트릿 섬유질 웨브의 0 중량% 초과 10 중량% 미만이 적어도 제1 용융 온도를 가지는 제1 영역 및 제2 용융 온도를 가지는 제2 영역을 포함하는 다성분 섬유인 개별 섬유를 포함하고, 제1 용융 온도가 제2 용융 온도 미만이며, 화학적 활성 미립자를 부직포 일렉트릿 섬유질 웨브에 고정시키는 단계가 다성분 섬유를 제1 용융 온도 이상 제2 용융 온도 미만인 온도로 가열하는 단계를 포함하고, 그로써 화학적 활성 미립자들 중 적어도 일부분이 다성분 섬유의 적어도 일부분의 적어도 제1 영역에 접합됨으로써 부직포 일렉트릿 섬유질 웨브에 고정되며, 개별 섬유의 적어도 일부분이 다성분 섬유의 제1 영역과의 복수의 교차점에서 서로 접합되는 것인 방법.
- 제29항 내지 제36항 중 어느 한 항에 있어서, 복수의 개별 섬유가 제1 용융 온도를 가지는 단성분 열가소성 개별 섬유(monocomponent discrete thermoplastic fiber)의 제1 집단, 및 제1 용융 온도 초과의 제2 용융 온도를 가지는 단성분 개별 섬유들의 제2 집단을 추가로 포함하며, 화학적 활성 미립자를 부직포 일렉트릿 섬유질 웨브에 고정시키는 단계가 단성분 열가소성 개별 섬유들의 제1 집단을 제1 용융 온도 이상 제2 용융 온도 미만인 온도로 가열하는 단계를 포함하고, 그로써 화학적 활성 미립자들 중 적어도 일부분이 단성분 개별 섬유들의 제1 집단의 적어도 일부분에 접합되고, 또한 단성분 개별 섬유들의 제1 집단의 적어도 일부분이 단성분 개별 섬유들의 제2 집단의 적어도 일부분에 접합되는 것인 방법.
- 제29항 내지 제38항 중 어느 한 항에 있어서, 화학적 활성 미립자를 부직포 일렉트릿 섬유질 웨브에 고정시키는 단계가 열접합, 자기 접합, 접착제 접합, 분말 결합제 결합, 습식 엉킴(hydroentangling), 바늘 천공(needlepunching), 캘린더링(calendering), 또는 그 조합 중 적어도 하나를 포함하는 것인 방법.
- 제29항 내지 제39항 중 어느 한 항에 있어서, 개별 섬유들의 적어도 일부분을 웨팅하기 위해 액체가 형성 챔버 내로 유입되고, 그로써 화학적 활성 미립자의 적어도 일부분이 형성 챔버에서 개별 섬유들의 웨팅된 부분에 접착되는 것인 방법.
- 제29항 내지 제40항 중 어느 한 항에 있어서, 복수의 화학적 활성 미립자가 상단부에서, 하단부에서, 상단부와 하단부 사이에서, 또는 그 조합으로 형성 챔버 내로 유입되는 것인 방법.
- 제29항 내지 제41항 중 어느 한 항에 있어서, 부직포 일렉트릿 섬유질 웨브를 덮는 섬유질 커버층를 부착하는 단계를 추가로 포함하고, 섬유질 커버층이 에어-레잉(air-laying), 웨트-레잉(wet-laying), 카딩(carding), 멜트 블로잉, 용융 방사, 전기 방사, 플렉시필라멘트 형성, 기체 젯 피브릴화, 섬유 분할, 또는 그 조합에 의해 형성되는 것인 방법.
- 제42항에 있어서, 섬유질 커버층이 멜트 블로잉, 용융 방사, 전기 방사, 플렉시필라멘트 형성, 기체 젯 피브릴화, 섬유 분할, 또는 그 조합에 의해 형성되는 중간 섬유 직경이 1 ㎛ 미만인 서브마이크로미터 섬유들의 집단을 포함하는 것인 방법.
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WO2012006338A2 (en) | 2012-01-12 |
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US20130108831A1 (en) | 2013-05-02 |
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