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KR20130045175A - 부상 반송 장치 - Google Patents

부상 반송 장치 Download PDF

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Publication number
KR20130045175A
KR20130045175A KR1020120113586A KR20120113586A KR20130045175A KR 20130045175 A KR20130045175 A KR 20130045175A KR 1020120113586 A KR1020120113586 A KR 1020120113586A KR 20120113586 A KR20120113586 A KR 20120113586A KR 20130045175 A KR20130045175 A KR 20130045175A
Authority
KR
South Korea
Prior art keywords
valve
differential pressure
substrate
main pipe
floating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020120113586A
Other languages
English (en)
Korean (ko)
Inventor
켄지 하마카와
토시히로 모리
Original Assignee
도레 엔지니아린구 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도레 엔지니아린구 가부시키가이샤 filed Critical 도레 엔지니아린구 가부시키가이샤
Publication of KR20130045175A publication Critical patent/KR20130045175A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
    • B65G49/069—Means for avoiding damage to stacked plate glass, e.g. by interposing paper or powder spacers in the stack
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
    • B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
    • B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Fluid Pressure (AREA)
KR1020120113586A 2011-10-25 2012-10-12 부상 반송 장치 Ceased KR20130045175A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011233533A JP5871366B2 (ja) 2011-10-25 2011-10-25 浮上搬送装置
JPJP-P-2011-233533 2011-10-25

Publications (1)

Publication Number Publication Date
KR20130045175A true KR20130045175A (ko) 2013-05-03

Family

ID=48411123

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120113586A Ceased KR20130045175A (ko) 2011-10-25 2012-10-12 부상 반송 장치

Country Status (3)

Country Link
JP (1) JP5871366B2 (ja)
KR (1) KR20130045175A (ja)
CN (1) CN103112719B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102355530B1 (ko) * 2021-12-15 2022-01-24 권태성 Nct가공장치

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103771133A (zh) * 2014-01-23 2014-05-07 南通剑桥输送设备有限公司 一种可调节高度的气动传输装置
CN104555348A (zh) * 2014-11-28 2015-04-29 祥鑫科技股份有限公司 气吹浮起式输料带
CN105084000B (zh) * 2015-06-23 2017-04-19 武汉华星光电技术有限公司 一种玻璃放置和取出方法
CN105712045B (zh) * 2016-04-27 2017-12-12 京东方科技集团股份有限公司 传送设备
WO2017221229A1 (en) * 2016-06-21 2017-12-28 Core Flow Ltd. Noncontact support platform with edge lifting
CN106044225B (zh) * 2016-06-28 2019-05-31 江苏东旭亿泰智能装备有限公司 气浮平台、气浮装置及玻璃基板传送装置
US9889995B1 (en) * 2017-03-15 2018-02-13 Core Flow Ltd. Noncontact support platform with blockage detection
JP6829118B2 (ja) * 2017-03-16 2021-02-10 株式会社日本製鋼所 レーザ照射装置、レーザ照射方法、及び半導体装置の製造方法
CN111601763B (zh) * 2017-07-11 2022-03-29 康宁公司 玻璃加工设备及方法
CN108249746B (zh) * 2018-02-09 2020-12-11 京东方科技集团股份有限公司 移载基台及采用该移载基台切割基板的切割方法
US11673748B2 (en) * 2018-06-10 2023-06-13 Core Flow Ltd. Non-contact support platform with open-loop control
CN112830256B (zh) * 2020-12-31 2023-07-28 合肥工业大学 薄板气浮支承系统弹性稳压装置
CN115402635A (zh) * 2022-08-16 2022-11-29 合肥工业大学 一种基于多孔质表面抑制振动的气浮支承
CN119117690B (zh) * 2024-11-12 2025-02-07 合肥浩普智能装备科技有限公司 一种气浮式倒包输送机

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09287768A (ja) * 1996-04-22 1997-11-04 Sekisui Chem Co Ltd 空調換気方法及び空調換気装置
JP3799469B2 (ja) * 1999-09-27 2006-07-19 株式会社日立プラントテクノロジー 差圧保持ダンパ
JP4306354B2 (ja) * 2003-07-14 2009-07-29 大成建設株式会社 排熱回収空調機構
JP4413789B2 (ja) * 2005-01-24 2010-02-10 東京エレクトロン株式会社 ステージ装置および塗布処理装置
JP4570545B2 (ja) * 2005-09-22 2010-10-27 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5145524B2 (ja) * 2007-10-25 2013-02-20 株式会社ブイ・テクノロジー 露光装置
JP2010260715A (ja) * 2009-04-07 2010-11-18 Myotoku Ltd 浮上ユニット及び浮上装置
JP4916035B2 (ja) * 2009-08-28 2012-04-11 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102355530B1 (ko) * 2021-12-15 2022-01-24 권태성 Nct가공장치

Also Published As

Publication number Publication date
JP5871366B2 (ja) 2016-03-01
JP2013091540A (ja) 2013-05-16
CN103112719B (zh) 2016-08-10
CN103112719A (zh) 2013-05-22

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