KR20100078476A - Apparatus for peeling a protective film of printed circuit board, and method of the same - Google Patents

Abstract

The present invention relates to a protective film peeling apparatus of the printed circuit board, and a method thereof, wherein the adhesive tape is adhered to both ends of the upper or lower protective film attached on the printed circuit board, and the static electricity on the printed circuit board is used by using an ionizer. By removing, the protective film can be easily peeled off. The protective film peeling apparatus of the printed circuit board according to the present invention for this purpose, the product supply unit for supplying a printed circuit board with a protective film on the upper or lower surface; Adhesive tapes bonded to both ends of the protective film on the upper or lower surface of the printed circuit board to peel the protective film; A top and bottom peeling module having two filler modules with adjustable left and right spacing according to the size of the printed circuit board, and peeling the protective film on the printed circuit board using adhesive tapes adhered to both ends of the protective film on the upper or lower surface. ; An adhesive tape loading unit loading the adhesive tape so that the adhesive tape is mounted on the peeling module when the adhesive tape is damaged; And a product discharge part for discharging the printed circuit board product having the protective film peeled off by the upper and lower peeling modules, wherein the upper and lower peeling modules include: a filler module; An ionizer for removing static electricity on the printed circuit board from which the protective film has been peeled off; And an ionizer rotation driver for driving up and down rotation of the ionizer.

Description

Apparatus for Peeling a Protective Film of Printed Circuit Board, And Method of The same}

The present invention relates to a protective film peeling apparatus and a method of the printed circuit board, and more particularly, by using an adhesive tape bonded to both ends of the protective film attached to the printed circuit board (PCB) A protective film peeling apparatus for a printed circuit board capable of peeling a film and a method thereof.

In general, a printed circuit board (PCB) prints the wiring of a circuit required for a thin plate made of epoxy or phenol resin using copper foil to connect each electronic device to each other, and to apply power. It means a substrate capable of operating the circuit after. The design of the printed circuit board is directly related to the operation, performance, lifespan, and reliability of the product, and thus plays a very important role in the manufacture of electronic products.

The printed circuit board (PCB) includes a flexible printed circuit board (FPCB) and a rigid printed circuit board (RPCB). The flexible printed circuit board (FPCB) of the printed circuit board (PCB), unlike the conventional rigid printed circuit board (RPCB) of rigid substrates are thin and flexible material, so the demand is rapidly increasing according to the multimedia and light and thin and short of electronic products have.

The printed circuit board (PCB) protects the substrate surface by attaching a protective film on the upper and lower surfaces of the printed circuit board (PCB) with respect to the product which has confirmed the abnormality of the product by removing the contaminants that are attached to the surface of the substrate during the manufacturing process To make it happen. Therefore, in order to be able to insert various components such as semiconductors, capacitors and resistors on the printed circuit board, the protective film attached to the PCB surface must be removed.

However, in the related art, since the operator directly peels the protective film from the printed circuit board to peel off the protective film attached to the upper and lower surfaces of the printed circuit board (PCB) to protect the substrate surface, as described above, the efficiency of the work is lowered. There is a problem that the work efficiency was not effective. In particular, the flexible printed circuit board (FPCB) among the printed circuit board (PCB) has a thin material and is flexible, so that when the protective film is attached to the surface of the substrate, the protective film is firmly attached when it is made by hand. It is difficult to cause damage such as folding or scratching of the flexible printed circuit board (FPCB).

On the other hand, as a technique for removing a printed circuit board protective film, a technique using an adhesive tape has been provided, but in the case of the protective film removing device according to the prior art in the longitudinal direction before and after removing the protective film from the printed circuit board Since the adhesive tape is formed by attaching and removing the adhesive tape, a large amount of tape is consumed because the adhesive tape attached to the printed circuit board protection film must be attached in the longitudinal direction before and after. Therefore, there is a problem that the maintenance and repair of the equipment is difficult due to the problem that the consumption of the adhesive tape is very large.

Another problem of the printed circuit board protective film removing device using the adhesive tape according to the prior art as described above is that when the protective film is removed from the printed circuit board, a wider range of the tip portion of the protective film is peeled off from the printed circuit board tip. There is a problem that the error occurrence rate due to the removal of the protective film is high.

Meanwhile, as a prior art, Korean Patent Publication No. 2004-83579 (published date: October 06, 2004) discloses a method and apparatus for removing a protective film using an adhesive tape, as shown in FIGS. 1A and 1B. It demonstrates with reference.

1A and 1B are views for explaining the operation of the protective film removing apparatus using the adhesive tape according to the prior art, respectively.

As shown in Figure 1a and Figure 1b, the protective film removing device according to the prior art is an adhesive tape 11, supply rollers (12a, 12b), recovery rollers (13a, 13b), drive devices (14a, 14b) And suction vacuum nozzles 15a and 15b, printed circuit board 21, peeling unit 22, protective films 23a and 23b and collection box 24. Figure 1a shows a state in which the peeling portion of the protective film is in close contact with the vacuum nozzle in the protective film removing apparatus according to the prior art, Figure 1b shows a state in which the protective film is transported to the collection box by the guide device.

1A and 1B, in the protective film removing apparatus according to the related art, when the printed circuit board 21 is supplied through the supply rollers 12a and 12b, the adhesive tape driving devices 14a and 14b are provided. A portion of the protective films 23a and 23b is peeled off from the printed circuit board 21 using. Subsequently, a predetermined air is injected into the peeling part 22 by the compressed air nozzle to drive the adhesive tape on the upper and lower parts in a state in which the peeling part 22 of the protective films 23a and 23b is completely separated from the printed circuit board 21. The vacuum holes of the adsorption vacuum nozzles 15a and 15b of the upper and lower protective films 23a and 23b located on one side of the apparatus 14a and 14b are guided to the upper and lower vacuum drums while the protective films 23a and 23b are separated. . Thereafter, the peeling part 22 of the guided upper film is transferred by driving the upper vacuum drum to guide the protective film collection box 24 according to the guide of the film guide device, and the lower protective film 23b is the lower vacuum drum. It is transported in conjunction with the drive of the protective film is dropped into the collection box 24. As a result, the printed circuit board 21 on which the protective films 23a and 23b are peeled off is recovered through the recovery rollers 13a and 13b.

In addition, as a prior art, Korean Patent Application No. 2005-0080792 (file date: August 31, 2005) discloses a "protective film removing device of a printed circuit board", which will be described with reference to FIG.

2 is a view for explaining a protective film removing device of a printed circuit board according to the prior art.

Referring to FIG. 2, in the protective film removing apparatus 30 of the conventional printed circuit board, the protective film 31a on the printed circuit board 31 is removed by the adhesive tape 34. The tape 34 indicates that the horizontal idle roller 32 is rotated, and the adhesive tape recovery roller 33 is recovered by rotating by the driving force of the motor. However, as shown, since the adhesive tape 34 is provided in a continuous form, the consumption amount of the adhesive tape 34 is large, and the protective film 31a is removed by crossing the center of the printed circuit board 31. There is a problem that the removal of 31a is not easy.

The technical problem to be solved by the present invention is to provide a printed circuit board that can easily peel off the protective film by adhering adhesive tapes to both ends of the upper or lower protective film attached to the printed circuit board. It is to provide a protective film peeling apparatus and its method.

Another technical problem to be solved by the present invention is to provide a protective film peeling apparatus for a printed circuit board and a method thereof, which can reduce the consumption of the adhesive tape as compared to the conventional adhesive tape protective film peeling apparatus. It is to.

Another technical problem to be solved by the present invention for solving the above problems, the protective film peeling apparatus of a printed circuit board that can easily peel off the protective film by removing the static electricity on the printed circuit board using the ionizer and its It is to provide a method.

Another technical problem to be solved by the present invention for solving the above problems is to provide a protective film peeling apparatus and a method of a printed circuit board that can easily determine the peeling state of the protective film by mounting the inspection camera in the filler module. It is to provide.

As a means for achieving the above technical problem, the protective film peeling apparatus of a printed circuit board according to the present invention, in the apparatus for peeling the protective film of the printed circuit board loaded on the upper or lower vacuum table, the upper surface or the lower surface Product supply unit for supplying a printed circuit board with a protective film; Adhesive tapes bonded to both ends of the protective film on the upper or lower surface of the printed circuit board to peel the protective film; It is provided with two filler modules, the left and right spacing is adjusted in accordance with the size of the printed circuit board, and using the adhesive tape bonded to both ends of the protective film of the upper or lower surface to peel off the protective film on the printed circuit board Upper and lower peeling modules; An adhesive tape loading unit for loading the adhesive tape so that the adhesive tape can be mounted on the upper and lower peeling modules; And a product discharge part for discharging the printed circuit board product having the protective film peeled off by the upper and lower peeling module, wherein the upper and lower peeling module comprises: a filler module rotating to peel the protective film on the upper or lower surface; An ionizer which rotates up and down corresponding to the position of the printed circuit board and removes static electricity on the printed circuit board on which the protective film is peeled off by the filler module; And an ionizer rotation driver for driving up and down rotation of the ionizer.

Here, the protective film peeling apparatus of the printed circuit board according to the present invention, the protective film collecting box for collecting the protective film peeled off by the upper and lower peeling module; And it may further include a collection box driving unit for adjusting the height of the protective film collection box, and moves the position of the protective film collection box.

Here, the upper and lower peeling module may further include a filler spacing controller for adjusting the left and right spacing of the pillar module using a servo actuator.

Here, the upper and lower peeling module may further include an inspection camera fixed to the inside of the filler module to photograph the surface of the printed circuit board to inspect the peeling state of the protective film.

Here, each of the filler modules, the filler module rotating unit for rotating the filler module up and down; And the adhesive tape is mounted may include a glass (Grasper) for peeling off the protective film of the printed circuit board.

Here, each of the filler modules is characterized in that when the peeling the protective film on the printed circuit board by the adhesive tape, the adhesive tape is sprayed with air so that the adhesive tape is not reattached on the printed circuit board.

Here, the product supply unit, the lower surface roller to be brought into contact with the lower surface of the supplied printed circuit board; And left and right rollers that contact the side of the supplied printed circuit board to guide the movement of the printed circuit board.

On the other hand, as a means for achieving the above technical problem, the method for peeling the protective film of the printed circuit board according to the present invention, in the method for peeling the protective film of the printed circuit board loaded on the upper or lower vacuum table, a) Supplying a printed circuit board having a protective film attached to an upper surface or a lower surface thereof; b) loading and mounting the adhesive tape on two pillar modules whose left and right spacing are adjusted corresponding to the size of the printed circuit board; c) peeling off the protective film attached to the printed circuit board by using the adhesive tape loaded on the two filler modules; d) collecting the protective film peeled off by the two filler modules; e) removing static electricity on the printed circuit board on which the protective film is peeled off by the two filler modules using an ionizer; And f) inspecting a surface of the printed circuit board on which the protective film is peeled off.

Here, step b) may include adjusting a left and right spacing between the two pillar modules using a servo actuator; And loading and mounting the adhesive tape.

In the step c), the loaded adhesive tape is attached to both ends of the protective film on the upper or lower surface of the printed circuit board to peel the protective film, and the protective film on the printed circuit board is bonded by the adhesive tape. When peeling, the adhesive tape is characterized in that for blowing the air so as not to be reattached on the printed circuit board.

Here, the ionizer of step e) is characterized in that it is rotated up and down by the ionizer rotation driver.

According to the present invention, the protective film can be easily peeled off by adhering adhesive tapes to both ends of the upper or lower protective film attached to the printed circuit board.

According to the present invention, it is possible to reduce the consumption of the adhesive tape compared to the conventional adhesive film protective film peeling apparatus.

According to the present invention, the protective film can be easily peeled off by removing static electricity on the printed circuit board using the ionizer.

According to the present invention, the peeling state of the protective film can be easily grasped by mounting the inspection camera in the filler module.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted for simplicity of explanation, and like reference numerals designate like parts throughout the specification.

As an embodiment of the present invention, by attaching the adhesive tape to both ends of the upper or lower protective film attached to the printed circuit board, and using the ionizer to remove the static electricity on the printed circuit board, the protective film can be easily peeled off. Provided is a protective film peeling apparatus and method for a printed circuit board.

3 is a block diagram of a protective film peeling apparatus of a printed circuit board according to an embodiment of the present invention.

Referring to Figure 3, the protective film peeling apparatus 100 of a printed circuit board according to an embodiment of the present invention, the product supply unit 100, adhesive tape loading unit 120, adhesive tape 130, upper and lower surface peeling module 140, the protective film collecting box 150, the collecting box driving unit 160, and the product discharge unit 170, wherein the upper and lower peeling module 140 includes a filler module 142 and an inspection camera. 143, filler gap adjuster 144, ionizer 146, and ionizer rotation driver 147.

The product supply unit 100 supplies a printed circuit board product 200 having a protective film attached to an upper surface or a lower surface thereof.

The adhesive tape 130 is attached to both ends of the protective film on the upper or lower surface of the printed circuit board 200 to peel the protective film.

The adhesive tape loading unit 120 loads the adhesive tape 130 so that the adhesive tape 130 may be mounted on the upper and lower peeling modules 140.

The upper and lower peeling module 140 includes two filler modules in which left and right intervals are adjusted in correspondence with the size of the printed circuit board 200, and adhesive tapes 130 are attached to both ends of the protective film on the upper or lower surface. Peel off the protective film on the printed circuit board (200).

The filler module 142 of the upper and lower surface peeling module 140 may rotate up and down while peeling off the protective film on the upper or lower surface. In addition, each of the filler modules 142 peels off the protective film on the printed circuit board 200 by the adhesive tape 130, and thus the adhesive tape 130 is applied to the printed circuit board 200. Air can be blown off to prevent adhesion.

The inspection camera 143 of the upper and lower peeling module 140 is fixed inside the filler module 142 to inspect the peeling state of the protective film to photograph the surface of the printed circuit board 200.

The filler gap controller 144 of the upper and lower peeling modules 140 adjusts the left and right gaps of the pillar module 142 using a servo actuator.

The ionizer 146 of the upper and lower stripping module 140 rotates up and down corresponding to the position of the printed circuit board 200, and the printed circuit board 200 having the protective film peeled off by the filler module 142. It serves to remove the static electricity of the phase, the ionizer rotation driver 147 serves to drive the vertical rotation of the ionizer 146.

The protective film collecting box 150 collects the protective film peeled off by the upper and lower peeling module 140, and the collecting box driver 160 adjusts the height of the protective film collecting box 150, and the protective film. The collection box 150 is moved to a cleaning position.

The product discharge unit 170 discharges the printed circuit board product 200 in which the protective film is peeled off by the upper and lower peeling modules 140.

In addition, the control unit 300 is to control the protective film peeling apparatus 100 of the printed circuit board according to an embodiment of the present invention, for example, the control of the loading of the adhesive tape 130, the filler module ( Control of the protective film peeling and vertical rotation of the 142, the control of the collection box drive unit 160, the control of the filler gap adjuster 144 or the inspection camera 143 serves to control.

On the other hand, Figure 4 is an operational flow diagram of a protective film peeling method of a printed circuit board according to an embodiment of the present invention.

Referring to Figure 4, the protective film peeling method of a printed circuit board according to an embodiment of the present invention, first, when the printed circuit board product with a protective film is inserted (S101), the printed circuit board is attached to the upper vacuum table Loading (S102), at this time, the height of the protective film collection box is adjusted (S103).

Next, the adhesive tape is mounted by the adhesive tape loading unit in the two filler modules in which the left and right intervals are adjusted corresponding to the size of the printed circuit board (S104), that is, using the servo actuator (Servo Actuator) Adjust the left and right spacing of the two filler modules, load and mount the adhesive tape, and then peel off the lower protective film of the printed circuit board loaded on the upper vacuum table (S105), that is, the loaded adhesive tape When the adhesive film is peeled off by adhering to both ends of the protective film on the upper or lower surface of the printed circuit board, and the protective film on the printed circuit board is peeled off by the adhesive tape, the adhesive tape is attached to the printed circuit board. Air is sprayed to prevent reattachment on the substrate. Then, the peeled protective film is discharged through the protective film collection box (S106).

Next, the static electricity is removed by ionizing the lower surface of the printed circuit board on which the protective film is peeled off by the filler module using an ionizer (S107), and then the filler module is rotated 180 degrees (S108).

Next, the state of the lower surface of the printed circuit board is peeled off the protective film obtained by the inspection camera mounted in the filler module (S109).

Next, the printed circuit board is loaded on the lower vacuum table (S110), and the height of the protective film collection box is adjusted (S111).

Next, the adhesive tape is mounted by the adhesive tape loading unit in the two filler modules in which the left and right intervals are adjusted according to the size of the printed circuit board (S112), and then the printed circuit board loaded on the lower vacuum table. The protective film is peeled off (S113), ie, the loaded adhesive tape is adhered to both ends of the protective film on the upper or lower surface of the printed circuit board to peel off the protective film. It is discharged through the protective film collection box (S114).

Next, the static electricity is removed by ionizing the lower surface of the printed circuit board on which the protective film is peeled off by the filler module using the ionizer (S115), and then obtained by the inspection camera mounted in the filler module. The upper surface state of the printed circuit board is peeled off the protective film (S116).

Finally, the printed circuit board on which the upper and lower protective films are peeled off is discharged to the outside (S117).

On the other hand, Figure 5 is a perspective view of a protective film peeling apparatus of a printed circuit board according to an embodiment of the present invention.

Referring to FIG. 5, the protective film peeling apparatus 100 of a printed circuit board according to an exemplary embodiment of the present invention peels a protective film of a printed circuit board 200 loaded on upper or lower vacuum tables 101 and 102. In order to, the product supply unit 100, adhesive tape loading unit 120, adhesive tape 130, upper and lower peeling module 140, protective film collection box 150, collection box dongbu 160 and product outlet 170 are shown respectively. For example, the overall size of the protective film peeling apparatus 100 of the printed circuit board 100, that is, the auto peeler, according to an embodiment of the present invention is width (1,500 mm) x length (3,500 mm) x height (2,000 mm). It can be formed into).

Therefore, the protective film peeling apparatus 100 of the printed circuit board according to the embodiment of the present invention, the upper and lower peeling module 140 of the upper vacuum table 101 or the lower vacuum table 102 in accordance with the vertical rotation of the printed circuit board The protective film is peeled off the upper or lower surface of the 200 to collect the protective film through the protective film collection box 150, and the printed circuit board 200 from which the protective film is peeled off is discharged to the outside.

6 is a view illustrating the operation of the rail of the product supply unit according to an embodiment of the present invention.

Referring to FIG. 6, the product supply unit 110 according to the embodiment of the present invention contacts the lower surface of the supplied printed circuit board 200 to enter the lower surface roller 111, and the supplied printed circuit board 200. It may include a left and right roller 112 in contact with the side of the guide to guide the movement of the printed circuit board 200. Specifically, the product supply unit 110 according to the embodiment of the present invention is configured as a rail system to insert the product equipment, for example, the printed circuit board is left and right using an alignment cylinder (not shown) at the initial entry Can be aligned. In addition, the position of the lower roller 111 in the moving section can be manually adjusted, as shown by the reference numeral D1, the material of the lower roller 111 is often PVDF (polyvinylidene fluoride) used in LCD semiconductor process The side roller 112 may be made of polyetheretherketone (PEEK).

7 is a perspective view of the upper and lower surface peeling module according to an embodiment of the present invention.

Referring to FIG. 7, the upper and lower peeling modules 140 according to the embodiment of the present invention may include a filler module support 141, two filler modules 142, two inspection cameras 143, and a filler gap adjuster 144. ), Ionizer support 145, ionizer 146 and ionizer rotary driver 147.

The filler gap adjuster 144 is attached on the pillar module support 141 to adjust the gap between the two pillar modules 142 by a servo actuator. In addition, an ionizer support 145 extends from the filler module support 141 to support the ionizer 146 and ionizer rotation driver 147.

In addition, the two filler modules 142 may be attached to one side of the filler gap adjuster 144 to move from side to side. In this case, the two filler modules 142 may be rotated up and down, and may peel off the upper protective film or the lower protective film of the printed circuit board, respectively.

In addition, the inspection camera 143 may be attached to each of the two filler modules 142 to photograph the surface of the printed circuit board on which the protective film is peeled, thereby inspecting the peeling state of the printed circuit board.

8 is a view for explaining the operation of the ionizer in the upper and lower peeling module according to an embodiment of the present invention.

Referring to FIG. 8, an ionizer 146 is provided in the upper and lower peeling modules 140 according to an embodiment of the present invention, and rotates up and down corresponding to the position of the printed circuit board 200, and the filler module ( 142 serves to remove the static electricity on the printed circuit board 200 is peeled off, the ionizer rotation driver 147 drives the vertical rotation of the ionizer 146. Here, since the ionizer for removing static electricity may be implemented by conventional techniques, a detailed description thereof will be omitted.

9A and 9B are views for explaining the operation of the filler module in the upper and lower peeling modules, respectively, according to an embodiment of the present invention. FIG. 9A illustrates removing the upper protective film, and FIG. 9B removes the lower protective film. To illustrate.

9A and 9B, the filler module 142 in the upper and lower peeling modules according to the embodiment of the present invention is configured to be rotatable vertically. At this time, the filler interval adjuster 143 may adjust the left and right spacing of the pillar module 142 using a servo actuator (Servo Actuator). That is, as shown in Figure 9a, after removing the upper protective film, by rotating to the lower to remove the lower protective film. In addition, the inspection camera 143 is attached on the filler module 142, the filler module 142 rotates together in the vertical rotation, and acquires an image for inspecting the peeling state of the peeled printed circuit board do.

10A and 10B are diagrams for describing detailed operations of the filler module in the upper and lower peeling modules according to the embodiment of the present invention, respectively.

As shown in FIGS. 10A and 10B, the filler module 142 in the upper and lower peeling modules according to the embodiment of the present invention may include the filler module rotating part 142a and the adhesive tape 130 rotating the filler module up and down. It includes a glass (Grasper 142b) is mounted to peel off the protective film of the printed circuit board. In this case, when the protective film on the printed circuit board 200 is peeled off by the adhesive tape 130, the adhesive tape 130 sprays air on the printed circuit board 200 so that the adhesive tape 130 is not reattached. Can be.

11 is a view showing an adhesive tape loading structure according to an embodiment of the present invention.

Referring to FIG. 11, the adhesive tape 130 according to the embodiment of the present invention is provided in a wound form of the adhesive tape loading unit 120, and the adhesive tape 130 wound on the adhesive tape loading unit 120. The upper and lower surfaces may be provided to the peeling module 140.

On the other hand, Figure 12a and Figure 12b is a view showing the height adjustment and position movement of the protective film discharge box according to an embodiment of the present invention, respectively.

12A and 12B, when the protective film on the printed circuit board is peeled off according to an embodiment of the present invention, the height of the protective film collecting box 150 may be automatically adjusted by the collecting box driving unit 160. In addition, when the protective film 210 is filled in the protective film collection box 150, it may be moved to the cleaning position by the collection box driver 160. For example, as shown by reference numeral D3, the height of the protective film collection box 150 at the time of the upper or lower peeling by the collection box drive unit 160, and also, the protective film collection box 150 When the protective film 210 is full, as shown by reference numeral D4, it can be moved to the cleaning position by the collection box drive unit 160.

On the other hand, Figures 13a and 13b is a view showing a state in which the peeling state is inspected after peeling off the protective film according to an embodiment of the present invention.

13A and 13B, after peeling off the protective film according to an exemplary embodiment of the present invention, an image may be obtained by photographing the surface of the printed circuit board on which the protective film is peeled off by the above-described inspection camera 143. As illustrated by reference numeral B, a portion without a portion of the protective film occurs or as illustrated by reference numeral C, a portion where the protective film is torn occurs. For example, reference numeral 210 denotes a protective film portion, and reference numeral 220 denotes a portion where the protective film is up. Reference numeral 220 denotes a portion where the protective film is raised. As described above, the printed circuit board, which is determined to have a defect according to the peeling state inspection image, is subsequently modified.

As a result, according to an embodiment of the present invention, by attaching an adhesive tape to both ends of the upper or lower protective film attached to the printed circuit board, the protective film can be easily peeled off, and also using the ionizer printed circuit board The protective film can be easily peeled off by removing the static electricity on the phase. In addition, according to the present invention, it is possible to easily determine the peeling state of the protective film by mounting the inspection camera in the filler module.

The description of the present invention is for the purpose of illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

The scope of the present invention is shown by the following claims rather than the above description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention. do.

1A and 1B are views for explaining the operation of the protective film removing apparatus using the adhesive tape according to the prior art, respectively.

2 is a view for explaining a protective film removing device of a printed circuit board according to the prior art.

3 is a block diagram of a protective film peeling apparatus of a printed circuit board according to an embodiment of the present invention.

4 is a flowchart illustrating a method of peeling a protective film of a printed circuit board according to an exemplary embodiment of the present invention.

5 is a perspective view of a protective film peeling apparatus of a printed circuit board according to an embodiment of the present invention.

6 is a view illustrating the operation of the rail of the product supply unit according to an embodiment of the present invention.

7 is a perspective view of the upper and lower surface peeling module according to an embodiment of the present invention.

8 is a view for explaining the operation of the ionizer in the upper and lower peeling module according to an embodiment of the present invention.

9A and 9B are views for explaining the operation of the filler module in the upper and lower peeling modules according to the embodiment of the present invention, respectively.

10A and 10B are diagrams for describing detailed operations of the filler module in the upper and lower peeling modules according to the embodiment of the present invention, respectively.

11 is a view showing an adhesive tape loading structure according to an embodiment of the present invention.

12A and 12B are diagrams illustrating height adjustment and position movement of the protective film discharge box according to the embodiment of the present invention, respectively.

13A and 13B are views illustrating a state in which a peeling state is inspected after peeling off a protective film according to an embodiment of the present invention.

[Brief Description of Drawings]

100: protective film peeling device of the printed circuit board

101: lower vacuum table 102: upper vacuum table

110: product supply section 111: the lower roller

112: left and right roller 120: adhesive tape loading portion

130: adhesive tape 140: upper and lower peeling module

141: pillar module support 142: pillar module

142a: pillar module rotation part 142b: grasser

143: Inspection Camera 144: Filler Spacer

145: ionizer support 146: ionizer

147: ionizer rotary driver 150: protective film collection box

160: collection box drive unit 170: product outlet

200: PCB product 210: protective film

300: control unit

Claims (12)

In the device for peeling the protective film of the printed circuit board loaded on the upper or lower vacuum table, A product supply unit supplying a printed circuit board having a protective film attached to an upper surface or a lower surface thereof; Adhesive tapes bonded to both ends of the protective film on the upper or lower surface of the printed circuit board to peel the protective film; At least one filler module having a left and right gap adjusted according to the size of the printed circuit board, and peeling the protective film on the printed circuit board using an adhesive tape adhered to both ends of the protective film of the upper or lower surface. A top and bottom peel module; An adhesive tape loading unit for loading the adhesive tape so that the adhesive tape can be mounted on the upper and lower peeling modules; And And a product discharge part for discharging the printed circuit board product having the protective film peeled off by the upper and lower peeling modules. The upper and lower peeling module, A filler module rotating to peel off the protective film on the upper or lower surface; An ionizer which rotates up and down corresponding to the position of the printed circuit board and removes static electricity on the printed circuit board on which the protective film is peeled off by the filler module; And An ionizer rotation driver for driving up and down rotation of the ionizer; Protective film peeling apparatus of the printed circuit board comprising a. The method of claim 1, wherein the protective film peeling device: A protective film collecting box for collecting the protective film peeled off by the upper and lower peeling modules; And The protective film peeling apparatus of the printed circuit board further comprising; a collection box driving unit for adjusting the height of the protective film collection box, and moves the position of the protective film collection box. The method of claim 1, wherein the upper and lower peeling module is: A protective film peeling apparatus for a printed circuit board further comprising a filler gap adjuster for adjusting a left and right gap of the filler module by using a servo actuator. The method of claim 1, wherein the upper and lower peeling module is: The protective film peeling apparatus of the printed circuit board further comprises an inspection camera fixed to the inside of the filler module to inspect the peeling state of the protective film to photograph the surface of the printed circuit board. The method of claim 1, wherein each of the filler module, Filler module rotating unit for rotating the filler module up and down; And A protective film peeling apparatus of a printed circuit board comprising: a glass (Grasper) is attached to the adhesive tape is peeled off the protective film of the printed circuit board. The method of claim 5, When each of the filler modules is peeled off the protective film on the printed circuit board by the adhesive tape, the protective film of the printed circuit board, characterized in that to spray the air so that the adhesive tape is not reattached on the printed circuit board. Peeling device. The method of claim 1, wherein the product supply unit, A lower surface roller which is brought into contact with a lower surface of the supplied printed circuit board; And Protective film peeling apparatus of a printed circuit board comprising a; left and right rollers in contact with the side of the supplied printed circuit board to guide the movement of the printed circuit board. In the method of peeling the protective film of the printed circuit board loaded on the upper or lower vacuum table, (a) supplying a printed circuit board having a protective film attached to an upper surface or a lower surface thereof; (b) loading and mounting the adhesive tape on two pillar modules whose left and right spacing are adjusted corresponding to the size of the printed circuit board; (c) peeling off the protective film attached to the printed circuit board by using the adhesive tape loaded on the two filler modules; (d) collecting the protective films peeled off by the two filler modules; (e) removing static electricity on the printed circuit board on which the protective film is peeled off by the two filler modules; And (f) inspecting a surface of the printed circuit board on which the protective film is peeled off; Protective film peeling method of a printed circuit board comprising a. The method of claim 8, wherein step (b) Adjusting left and right spacing of the two pillar modules using a servo actuator; And Loading and mounting the adhesive tape; Protective film peeling method of a printed circuit board comprising a. The method of claim 8, wherein step (c) comprises: And a step of peeling the protective film by adhering the loaded adhesive tape to both ends of the protective film on the upper or lower surface of the printed circuit board. The method of claim 10, wherein step (c) comprises: When the protective film on the printed circuit board is peeled off by the adhesive tape, air is sprayed to prevent the adhesive tape from being reattached on the printed circuit board. The method of claim 8, wherein step (e) A protective film peeling method of a printed circuit board, characterized in that to remove the static electricity using the ionizer.

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