KR20150027600A - Cleaning apparatus and method of fabricating the display device including cleaning using the same - Google Patents

Abstract

The present invention relates to a cleaning device to clean a panel on which a printed circuit board (PCB) is integrated and provides the cleaning device and a method for manufacturing a flexible display device including cleaning using the same. The device includes: a cleaning line which includes a plurality of rollers and includes a panel injection zone and a cleaning zone; and a carrier line which is placed close to the cleaning line and includes a carrier unit and a front cover for covering the carrier unit. Only on the cleaning line, deionized water (DI) is sprayed, and penetration of DI into the carrier line is blocked by the front cover. By the rollers and the carrier unit, a panel moves in a direction and the surface of the panel is cleaned.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a cleaning apparatus and a method of manufacturing the same,

A cleaning apparatus capable of cleaning without exposing the PCB to a cleaning liquid in a state where a PCB having a driving circuit is mounted, and a panel in which the PCB is mounted can be continuously inserted. And a method of manufacturing a display device including a cleaning method.

In recent years, as the society has become a full-fledged information age, a display field for processing and displaying a large amount of information has rapidly developed, and various flat panel display devices have been developed in response to this.

Specific examples of such flat panel display devices include a liquid crystal display device (LCD), a plasma display panel (PDP), a field emission display (FED) An organic electroluminescence display device (OLED), and an electrophoretic display device (EPD). These flat panel display devices are excellent in performance of thinning, light weight, and low power consumption, : CRT).

Such a flat panel display device is thin and light compared to a cathode ray tube (CRT), and is advantageous in that it is large in size.

In general, a glass substrate is used for such a flat panel display device in order to withstand the high heat generated during the manufacturing process. The flat panel display device manufactured using such a glass substrate has recently become a trend of display devices, There is a limit to grant.

Therefore, it is possible to maintain the display performance even if it is warped like paper by using a flexible material such as plastic instead of the conventional flexible and relatively heavy glass substrate, and it is relatively light and thin compared to a display made of a glass substrate Is rapidly emerging as a next-generation flat panel display.

On the other hand, in manufacturing such a flexible display device, the plastic film used for providing flexible characteristics is well warped and is directly applied to a conventional manufacturing apparatus for a display device, Hard.

For example, when a plastic film is placed on a robot arm, especially when it is transported by a track device or a robot, the plastic film is severely bent to fall into the robot arm, or when the plastic film is stored in a cassette for accommodating a substrate, The deflection width of the substrate is larger than the width of the cassette stage, which makes it impossible to store the robot by the robot.

Therefore, unlike the manufacture of a display device using a general glass substrate, the manufacture of a display device using a plastic substrate requires an array process in which an array element such as a thin film transistor is formed only of the plastic substrate itself or a color filter Process and so on.

In order to overcome such a problem, the plastic substrate is attached to one side of a carrier substrate capable of carrying a rigid material such as a glass substrate by using an adhesive or the like, And the device manufacturing process is proceeded to complete the flexible display device.

On the other hand, in such a flexible display device, a process of removing and attaching a carrier substrate is carried out in order to separate the carrier substrate from the flexible panel, and the carrier substrate is very flexible in its detachment.

In the case of manufacturing a flat panel display device using a glass substrate, a process of mounting a PCB for driving the display is performed in a state where two substrates are finally assembled to form a display panel. However, in the case of a flexible display device, After detachment, it has very flexible characteristics, and the PCB can not be mounted due to the flexible characteristics of the panel.

Therefore, mounting of the PCB is also performed before detaching the carrier substrate.

In order to detach the carrier substrate from the carrier substrate with the PCB mounted thereon, a laser beam is irradiated onto the entire surface of the carrier substrate in order to weaken the bonding force between the carrier substrate and the plastic substrate. The entire surface of the carrier substrate should be irradiated so as to have a uniform energy density.

If a foreign matter or the like is present on the surface of the carrier substrate, a laser beam of a proper density for detachment or detachment of the carrier substrate can not be irradiated to the portion where the foreign object is located due to refraction, diffraction, reflection or absorption of the laser beam. The adhesive force between the flexible panel and the carrier substrate is maintained when the carrier substrate is detached from the flexible panel. As a result, the plastic substrate, which is a component of the flexible panel, is scratched or torn, resulting in a large number of defects. Sex is being reduced.

Therefore, before the removable flexible panel and the carrier substrate on which the PCB is mounted, more precisely, the cleaning process is performed on the carrier substrate before the laser beam irradiation.

1 is a schematic plan view of a cleaning apparatus for cleaning a panel (hereinafter referred to as a carrier panel) in which a conventional flexible panel on which a PCB is mounted and a carrier substrate are stuck together.

The conventional cleaning apparatus 10 of the carrier panel is composed of a charging zone (zone 1), a cleaning zone (zone 2), a drying zone (zone 3) and a pickup zone (zone 4) of the carrier panel.

The stage 16 in which the carrier panel 70 is mounted and the stage 16 are positioned on the rail 13 and are further provided with the rails 13 in the input zone zone 1 and the cleaning zone 2, And a rotary cover 19 attached to the rotary shaft.

The cleaning zone zone 2 is provided with a plurality of nozzles 22 through which DI (Deionized water) is injected. A rear end of the nozzle 22 is in contact with the surface of the carrier panel 70, And an air knife 30 is provided at one end of the cleaning zone (zone 2). As shown in FIG.

In the drying zone (zone 3), a supporting means 35 on which the cleaned carrier panel 70 is placed is located and on one side of the supporting means 35 is irradiated with hot air on the surface of the carrier panel 70 Drying means 40 is provided.

A robot 45 is provided in the pick-up zone zone 4 to pick up a carrier panel that has passed through the cleaning zone zone 2 and position the carrier panel in the drying zone zone 3, And a robot 45 for moving the panel 70 to a cassette (not shown) or other process equipment (not shown) for further processing.

When the carrier panel 70 is placed on the stage 16 located in the input zone zone 1, the conventional cleaning apparatus 10 having such a configuration aligns the carrier panel 70, The rotation cover 19 rotates corresponding to the PCB 73 mounted on the PCB 70 and is positioned on the PCB 73 so that the PCB 73 is covered.

The stage 16 is moved to the cleaning zone zone 2 by moving along the rail 13 in a state where the PCB 73 is covered by the rotary cover 19, DI is sprayed from the plurality of nozzles 22 onto the surface of the carrier panel 70, and then cleaning is performed to remove foreign matters adhered to the surface of the carrier panel 70 by the physical foreign material removing means 25. [

At this time, the PCB 73 is kept covered by the rotary cover 19, so that the PCB 73 is prevented from being exposed to sprayed DI.

After the surface of the carrier panel 70 in the cleaning zone 2 is cleaned, the carrier panel 70 is moved to the drying zone zone 3 by the robot 45 located in the pickup zone 4 The carrier panel 70 is moved to a position where the air knife 30 is positioned while the one end of the cleaning zone zone 2 is positioned on the stage 16 before moving to the drying zone zone 3, Most of the DI remaining on the surface of the substrate is removed.

Next, in the carrier panel 70 having passed through the air knife 30 and DI is removed from the surface thereof, the rotation cover 19 is rotated to expose the PCB 73.

The carrier panel 70 in a state in which the PCB 73 is exposed by the rotation of the rotary cover 19 is transferred by the robot 45 located in the pickup zone zone 4, And then the DI is dried by the drying means 40. As a result, the minute DI remaining on the surface of the carrier panel 70 is completely removed, thereby completing the cleaning process do.

However, as described above, the cleaning process of the carrier panel 70, which proceeds through the conventional cleaning device 10, is performed by mounting the carrier panel 70 on the carrier panel 70 after mounting the carrier panel 70 on one stage 16 The other carrier panel 70 is moved to the cleaning device 10 until the cleaning of one carrier panel 70 is completed because the cleaning of the PCB 73 is maintained while the rotation cover 19 is covered It can not be input.

That is, even if the conventional cleaning device 10 for a carrier panel is excluded from the cleaning zone zone 2 where cleaning of the carrier panel 70 is purely performed, the stage 16 can not be moved in the closing zone zone 1, Since the time for reciprocating movement in the zone (zone 2) is the waiting time for the actual cleaning, the cleaning processing force per unit time is reduced due to a lot of wasted time in addition to the time for pure cleaning. Thus, It is a fact that it is getting worse.

In order to improve the cleaning performance per unit time, a large number of cleaning devices 10 are required. This increases the investment cost and increases the area of the manufacturing line for manufacturing a flexible display device. Therefore, This is a factor that increases the cost.

In order to solve the above-described problems, the present invention provides a cleaning device capable of improving the cleaning treatment force per unit time by allowing the PCB to be cleaned without being exposed to the cleaning liquid or DI, and being able to continuously inject the carrier panel without waiting time, And it is an object of the present invention to improve the productivity of a display device.

In order to achieve the above object, a cleaning apparatus according to the present invention is a cleaning apparatus for cleaning a panel on which a printed circuit board (PCB) is mounted, the cleaning apparatus comprising a plurality of rollers, A cleaning line provided; And a conveying line located adjacent to the cleaning line and having a front cover covering the conveying means and the conveying means, wherein DI is sprayed only on the cleaning line and the conveying line is sprayed on the front cover And the panel is moved in one direction by the roller and the conveying means, and the surface of the panel is cleaned.

At this time, the roller and the conveying means are synchronized with each other and rotate at the same speed, thereby moving the PCB and the printed circuit board (PCB) mounted on the roller and the conveying means at the same speed. Further, the panel is located on the roller, and the panel and the PCB are connected to each other via FPCB, and the PCB is positioned on the return line, so that the PCB is covered by the front cover.

The front cover has a top surface corresponding to the conveying means and a side surface bent from the top surface. At this time, the end of the side surface of the front cover is spaced from the top surface of the plurality of rollers And the same gap is formed with respect to the entire cover.

The front cover may have a configuration in which a portion corresponding to the input zone is bent upward in a direction perpendicular to a horizontal plane connecting the upper surfaces of the plurality of rollers. In this case, The upper surface and the side surface located at the portion corresponding to the input zone all have a certain angle with respect to any one of the reference lines in the width direction perpendicular to the longitudinal direction of the transfer line, The upper surface and the side surface of the transfer line are bent with respect to a reference line having a predetermined angle with respect to the longitudinal direction of the transfer line.

Further, the front cover is characterized in that its side face is removed from the input zone.

On the other hand, an air curtain for blowing clean dry air (CDA) in one direction is provided on the inner surface of the upper surface of the front cover, so that continuous flow of CDA occurs between the end of the side surface of the front cover and the separation area of the conveying means, And the like.

The cleaning zone is provided with a plurality of nozzles for spraying the DI on the upper portion of the roller, a physical foreign material removing means and an air knife and drying means, wherein the plurality of nozzles are provided only at the front end of the physical foreign material removing means , Or at the front end and the rear end of the physical removal means.

Further, the physical debris removing means is a polishing cloth or a blade, and the physical removing means rotates in direct contact with a surface of the panel.

A manufacturing method of a display device according to the present invention is a manufacturing method of a display device including cleaning using a cleaning device according to any one of claims 1 to 12, And a carrier panel having a PCB mounted on one side of the first plastic substrate with a flexible printed circuit board (FPCB) mounted thereon; Wherein the main body corresponding to the first and second plastic substrates of the carrier panel is positioned on the roller of the cleaning line and the PCB is positioned on the return line so that the PCB is covered with the front cover, Into an input zone of the apparatus; And removing the foreign matter on the surface of the first carrier substrate by passing the carrier panel through the cleaning zone of the cleaning device.

The step of removing foreign matter from the surface of the first carrier substrate may include irradiating the surface of the first carrier substrate with a laser beam and then detaching the first carrier substrate from the flexible panel.

The step of providing the carrier panel may include: forming a first plastic substrate on the first carrier substrate; Forming a second plastic substrate on a second carrier substrate; The first and second plastic substrates facing each other and then joined together to form a first panel; Cleaning the first panel to remove foreign matter from the surface of the second carrier substrate; Forming a second panel by irradiating a laser beam to a surface of the second carrier substrate and removing the second carrier substrate from the first panel; And mounting the PCB to the flexible panel of the second panel via the FPCB.

The first and second plastic substrates may be bonded together before the first and second plastic substrates are bonded together, and then a component for operating as a liquid crystal display, an organic electroluminescent device, and an electrophoretic display device And forming or forming on the first and second plastic substrates or between the first and second plastic substrates.

The cleaning apparatus according to the present invention is a line type cleaning apparatus in which the carrier panel continuously moves in one direction without performing a reciprocating motion by the stage for cleaning progress of the carrier panel on which the PCB is mounted, It is possible to continuously insert the carrier panel without waiting time for the stage to return from the cleaning zone to the charging zone as shown in Fig. 4A, and the cleaning processing force per unit time is remarkably improved, thereby reducing manufacturing cost of the flexible display device.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic plan view of a cleaning apparatus for cleaning a panel in which a conventional flexible PCB on which a PCB is mounted and a carrier substrate are bonded together. FIG.
2 is a plan view of a cleaning device of a carrier panel according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of a portion cut along the line III-III of FIG. 2; FIG.
4A to 4D are perspective views of a front cover, which is a component of a cleaning apparatus according to the present invention, showing various forms of a portion to which a carrier panel of the cleaning apparatus is charged.
5A to 5J are cross-sectional views illustrating steps of manufacturing a flexible display device including cleaning using a cleaning device according to the present invention.
6 is a cross-sectional view illustrating a carrier panel of a flexible display device having a touch panel as an example of the flexible display device according to the present invention.

Hereinafter, the present invention will be described in more detail with reference to the drawings.

First, a cleaning apparatus for cleaning a carrier panel according to the present invention will be described.

Here, the carrier panel refers to a state in which a carrier substrate made of a glass material is attached to one surface of a flexible display panel manufactured using a plastic substrate having very flexible characteristics, in order to suppress or reduce a flexible characteristic And further, a PCB including a driving circuit is mounted on one side of the display panel.

At this time, the flexible display panel is formed by stacking a liquid crystal display device having a liquid crystal layer between an upper and a lower substrate made of a plastic substrate having flexible characteristics, And an electrophoretic display device including an electrophoretic layer between an upper substrate and a lower substrate made of a plastic substrate having a flexible characteristic.

The carrier panel may further include a touch film or a panel having a touch sensor in addition to the flexible panel constituting the liquid crystal display device, the organic electroluminescent device, and the electrophoretic display device described above. At this time, the touch film or the touch panel may further have a touch driving PCB mounted on one side of the touch film or the touch panel to enable touch driving connected to the touch sensor.

It will be appreciated that the cleaning apparatus according to the present invention is not necessarily limited to the carrier panel, but may be applied to any panel or substrate having the PCB mounted thereon.

FIG. 2 is a plan view of a cleaning apparatus for a carrier panel according to an embodiment of the present invention, and FIG. 3 is a schematic cross-sectional view of a portion taken along line III-III of FIG.

As shown in the drawing, a wringing device 100 for a carrier panel according to the present invention mainly includes a cleaning line L1 to which DI is sprayed, and a PCB transfer line (not shown) L2.

At this time, the cleaning line L1 and the PCB conveyance line L2 have the same length. To prevent exposure to DI (Deionized water) ejected from the cleaning line L1 to the PCB conveyance line L2, And a front cover 110 is provided on the entire surface of the transfer line L2.

A cleaning device according to the present invention will be described in more detail.

The cleaning line L1 includes a plurality of rollers 113 for moving the carrier panel 170 in one direction and a plurality of nozzles 118 for spraying the DI, A physical foreign object removing means 122 for removing foreign objects attached to one surface of the carrier panel 170 and an air cutter 125 for removing DI remaining on the surface of the carrier panel 170 are provided, A drying unit 128 is provided outside the air cutter 125.

At this time, the plurality of rollers 113 are all rotated at a constant speed in one direction to move the carrier panel 170, which is placed on the carrier panel 170, at a constant speed.

The roller 113 is automatically rotated when the carrier panel 170 passes through the section provided with the nozzle 118 for spraying the DI to which the actual cleaning is performed and where the physical foreign material removing unit 122 is located. The rotation speed is slowed or stopped so that the contaminated portion of the one surface of the carrier panel 170 and the portion to which the foreign matter is adhered can be sufficiently removed.

The plurality of nozzles 118 and physical debris removing means 122 and the air cutter 125 are positioned above the roller 113. The nozzle 118 and the air cutter 125 and the drying means 128 are fixed at an appropriate position above the roller 113. [

The plurality of nozzles 118 spray DI and the carrier panel 170 passes the nozzles 118 spraying the DI at a constant speed to remove the organic and inorganic substances present on the surface of the carrier panel 170 Remove it.

At this time, the plurality of nozzles 118 may be located at the front end, or the front end and the rear end, of the physical debris removing means 122, or may include a region provided with the physical debris removing means 122, The DI may be configured to spray DI on a constant area of the DI.

In the case of the nozzle 118a positioned at the front end of the physical foreign object removing means 122, the DI is sprayed on the surface of the carrier panel 170 preferentially, And serves as an abrasive softener when rubbing against the surface of the carrier panel 170.

The nozzle 118b located at the rear end of the physical foreign material removing unit 122 serves to wash the surface of the carrier panel 170 after removing the foreign material.

The physical destruction removing means 122 is provided with a rotating polishing cloth or a blade and is located above the roller 113 but is movable up and down. The surface of the carrier panel 170, more precisely, the surface of the first carrier substrate (not shown) and the rotating abrasive cloth or blade come into contact with each other when they pass through the position where the foreign material removing means 122 is located, Foreign matter adhering to the surface of the carrier panel 170 is effectively removed.

The air cutter 125 blows strong wind so that DI is sprayed so that the surface of the carrier panel 170 is finally left with DI so that DI remaining on the surface of the carrier panel 170 And moves in one direction on the surface of the carrier panel 170 and removes it.

The drying means 128 has an internal temperature atmosphere of 70 to 90 ° C. and the carrier panel 170 is left on the surface of the carrier panel 170 by passing through the drying means 128 at a constant speed It completely removes fine DI. At this time, the drying means 128 may further include a blowing means (not shown) therein to allow hot air having a temperature of 70 to 90 ° C to be incident on the surface of the carrier panel 170.

The PCB conveying means 140 provided on the PCB conveying line is driven synchronously with a motor as one example of driving means (not shown) for rotating the roller 113 in one direction, When a PCB mounted on the carrier panel 170 and a touch panel (not shown) are further provided on the carrier panel 170 as a conveyor having a moving speed equal to the moving speed of the carrier panel 170, The touch PCB (not shown) mounted on the touch panel is seated.

The front cover 110 is fixed to the upper part of the conveyor unit 140. The front cover 110 is bent at an upper surface facing the carrier panel 170 and at an upper surface And a side surface having a predetermined width.

At this time, the side surface of the front cover 110 is spaced apart from the surface of the FPCB (Flexible printed circuit board) 176 connecting the PCB 170 with the PCB, And the PCB (and the touch PCB) 176 mounted on the carrier panel 170 is completely covered.

An air curtain 145 for spraying CDA (clean dry air) is further provided on the inner surface of the front cover 110.

The CDA is continuously blown from one end of the inner surface of the upper surface of the front cover 110 to one end of the side surface of the front cover 110 by the air curtain 145 so that the PCB 173 and the carrier panel A CDA flow from the inside to the outside is generated in a spaced-apart area between the one side of the side surface of the front cover 110 and the surface of the FPCB 176, which is located on the FPCB 176 connecting the CDA 170, The DI sprayed by the plurality of nozzles 118 in the cleaning line L1 is prevented from penetrating into the surface of the PCB 173 by the flow.

 4A to 4D are perspective views of a front cover, which is a component of a cleaning apparatus according to the present invention, and show various forms of a portion where the carrier panel of the cleaning apparatus is charged. In this figure, the dotted line drawn away from the front cover shows a horizontal plane connecting the upper surface of the roller on which the carrier panel is seated.

4A, the front cover 110 includes a top surface 110a and a side surface 110b formed at one end of the top surface 110a. In this case, the top surface 110a and the side surface 110a, 110b may be configured to have the same straight planar state as the entire front cover 110. Alternatively, as shown in Figs. 4b and 4c, (170 in Fig. 2) of the cleaning apparatus (100 in Fig. 2), the side surface 110b may be removed .

2), and the body of the carrier panel (170 in FIG. 2) is configured to be cleaned (cleaned) The PCB 173 must be placed in the cleaning apparatus (100 in Fig. 2) so as to be located in the line L1 and the PCB 173 to be located in the PCB conveyance line L2.

2) is provided with a front cover 110. One end of the side surface 110b of the front cover 110 extends toward the roller 113, more precisely, And is located very close to one horizontal plane (hereinafter referred to as a roller horizontal plane). One end of the side surface 110b of the front cover 110 is configured to be very adjacent to the horizontal surface of the roller when the distance between the front cover 110 and the surface of the FPCB (176 in FIG. 2) So that the DI sprayed in the cleaning line (L1 in FIG. 2) is effectively prevented from invading the PCB (173 in FIG. 2).

However, when one end of the side surface 110b of the front cover 110 is adjacent to the horizontal surface of the roller, when the carrier panel (170 of FIG. 2) itself is inserted into the cleaning device 100 Be very careful.

That is, even if the carrier panel (170 in FIG. 2) flows only slightly in the vertical direction, the FPCB (176 in FIG. 2) contacts the side surface 110b of the front cover 110 Or the carrier panel (170 in FIG. 2) itself is moved and can not be seated in a desired position inside the cleaning device (100 in FIG. 2), so that the carrier panel A part of the carrier panel 170 itself may be damaged by the collision, or the PCB (173 of FIG. 2) itself may not be covered by the front cover 110, so that DI or the like may penetrate to cause a short defect.

Accordingly, in order to solve this problem, the front cover 110 can be modified into various shapes as shown in FIGS. 4B to 4D.

The entire upper surface 110a and the side surface 110b of the carrier zone (170 in FIG. 2) are placed in the loading zone, as shown in FIG. 4B, at a predetermined angle And a large clearance d2 between the one end of the side face 110b of the front cover 110 and the horizontal plane of the roller is larger than the other clearance d2 of the other area (the area where the actual carrier panel is cleaned) Or only a part of the upper surface 110a adjacent to the side surface 110b and the side surface 110b of the front cover 110 at the portion corresponding to the input zone may be set as the reference The distance d2 between the one end of the side face 110b of the front cover 110 and the horizontal plane of the roller is set to be different from the distance d2 in the other area Done (D1) of the gap (d1).

4D, the front cover 110 may have a shape in which the side surface 110b bent from the top surface 110a is removed from the closing zone of the cleaning apparatus 100 (see FIG. 2) .

In the cleaning apparatus (100 in FIG. 2), the DI is sprayed in the cleaning zone provided with the plurality of nozzles 118 without being actually injected, so that even if the side surface 110b is removed from the injection zone, There is no problem that the PCB (173 in FIG. 2) mounted on the panel (170 in FIG. 2) is exposed to DI.

The cleaning apparatus (110 of FIG. 2) according to the present invention is a cleaning apparatus of the line type (FIG. 2) in which the carrier panel is continuously moved in one direction without reciprocating by the stage for progressing cleaning of the carrier panel (FIG. 1), without the waiting time taken for the stage to return from the cleaning zone (zone 2 in FIG. 1) to the input zone (zone 1 in FIG. 1) as in the conventional cleaning apparatus The cleaning treatment force per unit time is remarkably improved and the manufacturing cost of the flexible display device can be reduced.

Hereinafter, a method of manufacturing the flexible display device including the cleaning method of the carrier panel using the cleaning device having the above-described configuration will be briefly described.

The flexible display device may be a liquid crystal display device as an example, but it may be an organic electroluminescent device or an electrophoretic display device.

5A to 5J are cross-sectional views illustrating steps of manufacturing a flexible display device including cleaning using a cleaning apparatus according to the present invention.

First, as shown in FIG. 5A, a first plastic substrate 172 is formed by attaching a plastic film having very flexible characteristics to a first carrier substrate 171 made of glass, or a first plastic substrate 172 made of glass The liquid plastic material, for example, polyimide (PI) is coated on the substrate 171 and cured to form the first plastic substrate 172. Although not shown in the figure, adhesion between the first carrier substrate 171 and the first plastic substrate 172 is reduced by laser beam irradiation so that the first carrier substrate 171 can be smoothly detached from the first carrier substrate 171 A first intermediate layer (not shown) is further formed.

A gate insulating film (not shown) is formed on the first plastic substrate 172 by performing a general array process for a liquid crystal display device with the first plastic substrate 172 on the first carrier substrate 171. [ A gate and a data line (not shown) intersecting each other with a space therebetween to define a plurality of pixel regions (not shown), and a gate and a data line (not shown) as switching elements in each pixel region And a pixel electrode (not shown) connected to a drain electrode (not shown) of the thin film transistor (not shown) is formed in each pixel region (not shown). At this time, a common electrode (not shown) may be further formed on the pixel region (not shown) so as to be spaced apart from the pixel electrode (not shown) according to a model of the liquid crystal display device, A common electrode (not shown) having a plurality of openings (not shown) may be further formed in each pixel region (not shown) with an insulating layer (not shown) therebetween.

Next, as shown in FIG. 5B, the same method as that of forming the first plastic substrate 172 on the first carrier substrate 171 is performed to form a flexible characteristic on the second carrier substrate 181 made of glass A second plastic substrate 182 is formed.

Thereafter, a black matrix (not shown) having an opening (not shown) corresponding to each pixel region (not shown) is formed on the second plastic substrate 182, and a black matrix (not shown) Thereby forming a color filter layer (not shown) corresponding to the blue color filter pattern. At this time, if a common electrode (not shown) is not formed on the first plastic substrate 172, a common electrode (not shown) is formed on the entire surface of the second plastic substrate 182 over the color filter layer can do.

5C, after the first plastic substrate 172 and the second plastic substrate 182 are positioned to face each other and the liquid crystal layer 190 is resumed, the first or second plastic substrate 172, A seal pattern (not shown) is formed along the rim of the first panel 182 and the first and second plastic substrates 172 and 182 are joined together to form the first panel pn1. At this time, the first and second carrier substrates 171 and 181 are attached to the first panel pn1 outside the first and second plastic substrates 172 and 182, and the PCB 173 is not mounted do.

5D, the first panel pn1 is made of a cleaning line without a PCB conveying line, unlike a general panel cleaning apparatus (not shown), that is, the cleaning apparatus 100 of FIG. (Not shown) to clean the surface of the second carrier substrate 181 to remove foreign matter and contaminated portions on the surface thereof.

Next, as shown in FIG. 5E, the entire surface of the second carrier substrate 181, which has been cleaned by the laser irradiation device (not shown), is irradiated onto the cleaned first panel pn1 with an appropriate energy density The laser beam is irradiated.

The reason for irradiating the laser beam is to activate the second intermediate layer (not shown) positioned between the second plastic substrate 182 and the second carrier substrate 181 to alleviate the adhesive force.

Next, as shown in FIG. 5F, the second carrier substrate (FIG. 5E, 181) is subjected to the desorption process with respect to the first panel pn1 after laser beam irradiation, 181 are removed to form the second panel pn2.

Thereafter, as shown in Fig. 5G, the outer surface of the second plastic substrate 182 exposed in the second panel (Fig. 5F pn2) with the second carrier substrate (181 in Fig. 5E) And the first polarizing plate 192 is attached to the side face 110b. Since the second panel (FIG. 5F pn2) still has the first carrier substrate 171 attached thereto, flexibility is suppressed, so that a general liquid crystal display manufacturing line can be used.

The attachment of the first polarizing plate 192 may be omitted in the case of implementing a flexible display device as an organic electroluminescent device or an electrophoretic display device.

Next, the process of mounting the PCB 173 on the second panel (FIG. 5F pn2) to which the first polarizer 192 is attached is performed so that one side of the first plastic substrate 172 on which the array elements are formed A plurality of FPCBs 176 are mounted on the printed circuit board 173 to mount the PCB 173 on which the driving circuit is mounted. The second panel (FIG. 5F pn2) in which the PCB 173 is mounted via the FPCB 176 is defined as the carrier panel 170 in advance.

6 (a cross-sectional view showing a carrier panel of a flexible display device provided with a touch panel as an example of a flexible display device according to the present invention) in a state where the PCB 173 mounting process is completed, A touch film 220 having a touch PCB 210 mounted on an outer surface 110b of the second plastic substrate 182 with an adhesive layer (not shown) interposed therebetween, ) Or a touch panel (not shown).

The touch film 220 or the touch panel (not shown) is not necessarily attached and may be omitted.

Next, as shown in FIG. 5H, the carrier panel 170 with the PCB 173 mounted thereon is mounted on the PCB (and the touch PCB (not shown) by using the cleaning apparatus 100 ) 173, the surface of the first carrier substrate 171 is cleaned without penetration of DI, thereby completely removing foreign substances and contaminants attached to the surface of the first carrier substrate 171.

That is, when the carrier panel 170 is placed in the charging zone of the cleaning apparatus 100 of FIG. 2, the first and second plastic substrates 182, And the PCB conveying means 140 on which the PCB 173 is placed are synchronized with each other and rotate at a constant speed to move the carrier panel 170 in one direction.

Then, the carrier panel 170, which is moved in one direction in this way, more precisely, the main body of the carrier panel 170 reaches the cleaning zone, DI is sprayed onto the surface of the first carrier substrate 171, 2) of the first carrier substrate 171 is operated to remove foreign matter adhered to the surface of the first carrier substrate 171 by friction through direct contact with the surface of the first carrier substrate 171, and at the same time, So that foreign matters separated from the surface of the carrier substrate 171 are washed away.

At this time, in the case of the PCB 173 which is moved through the PCB conveying means 140, the PCB 173 is blocked by the front cover 110 and the air curtain 145 provided on the inner surface of the front cover 110 CDA flow is generated, and the DI sprayed in the cleaning zone is intrinsically blocked from penetration into the PCB 173.

Next, the carrier panel 170 having completed the DI spraying and the physical debris removal passes through the air cutter (125 in FIG. 2), thereby removing the remaining DI on the first carrier substrate 171.

The carrier panel 170 having passed through the air cutter 125 passes through the drying means (128 in FIG. 2) to completely dry the fine DI state remaining on the first carrier substrate 171.

On the other hand, after the cleaning of the carrier panel 170 using the cleaning apparatus 100 (FIG. 2) according to the present invention in which the PCB 173 can be continuously charged without penetration into the PCB 173 as described above, A first intermediate layer (not shown) interposed between the first plastic substrate 172 and the first carrier substrate 171 by irradiating a laser beam onto the surface of the first carrier substrate 171 through a laser irradiation device ). ≪ / RTI >

5J, the first carrier substrate 171 is removed and removed from the carrier panel 170 (FIG. 5I), and the flexible display device 199 is removed, .

If the flexible display device 199 is formed of a liquid crystal display device after the first carrier substrate 171 is detached and removed, the first and second carrier substrates 172 and 174 are formed on the outer surface 110b of the first plastic substrate 172 The process of attaching the second polarizing plate 194 is additionally performed to complete the flexible display device 199.

When the flexible display device is formed of an organic electroluminescent device or an electrophoretic display device, the cleaning process of the carrier panel is performed in the same manner. Only the components formed on the first plastic substrate and the second plastic substrate are changed Since such a process proceeds in the same manner as a general organic electroluminescent device or a general electrophoretic display device manufacturing method, a specific manufacturing method of a flexible display device including an organic electroluminescent display or an electrophoretic display device is omitted.

100: (for carrier panel) Cleaning device
110: Front cover
113: Roller
118: Nozzle
122: physical foreign material removing means
125: Air knife
128: drying means
140: PCB transfer device
145: Air curtain
170: Carrier panel
173: PCB
176: FPCB
L1: cleaning line
L2: PCB return line

Claims (16)

1. A cleaning apparatus for cleaning a panel on which a printed circuit board (PCB) is mounted,
A cleaning line having a plurality of rollers and equipped with a panel input zone and a cleaning zone;
And a conveying line having a front cover positioned adjacent to the cleaning line and covering the conveying means and the conveying means,
Wherein DI is sprayed only to the cleaning line, the transfer line is prevented from penetrating the DI by the front cover, and the panel is moved in one direction by the roller and the conveying means Wherein the surface of the panel is cleaned.
The method according to claim 1,
Wherein the roller and the conveying means are synchronized with each other to rotate at the same speed so as to move the PCB and the printed circuit board mounted on the panel and the conveying means at the same speed.
3. The method of claim 2,
Wherein the panel is located on the roller and the panel and the PCB are connected to each other via FPCB and the PCB is located on the return line so that the PCB is covered by the front cover.
The method according to claim 1,
Wherein the front cover is composed of an upper surface corresponding to the conveying means and a side bent from the upper surface.
5. The method of claim 4,
Wherein an end of a side surface of the front cover has an equal spacing with respect to the entirety of the front cover with respect to a horizontal plane connecting upper surfaces of the plurality of rollers.
5. The method of claim 4,
Wherein the front cover is bent upward in a direction perpendicular to a horizontal plane connecting upper surfaces of the plurality of rollers with a portion corresponding to the input zone.
The method according to claim 6,
Wherein the front cover comprises:
The upper surface and the side surface of the portion corresponding to the input zone all have a predetermined angle with respect to a reference line in the width direction perpendicular to the longitudinal direction of the conveyance line,
Or a top surface and a side surface located at a portion corresponding to the input zone are bent with reference to a reference line having a predetermined angle with respect to the longitudinal direction of the conveying line.
The method according to claim 1,
Wherein the side surface of the front cover is removed from the closing zone.
The method according to claim 1,
An air curtain for blowing clean dry air (CDA) in one direction is provided on the inner surface of the upper surface of the front cover, so that continuous flow of CDA occurs at the end of the side surface of the front cover and the separation area of the conveying means, Is suppressed.
The method according to claim 1,
Wherein the cleaning zone is provided with a plurality of nozzles for spraying the DI onto the roller, and a physical foreign material removing means and an air knife and drying means.
11. The method of claim 10,
The plurality of nozzles may be provided only at the front end of the physical foreign material removal means,
Or at the front end and the rear end of the physical removal means.
11. The method of claim 10,
Wherein the physical debris removing means is a polishing cloth or a blade, and the physical removing means rotates in direct contact with a surface of the panel.
A manufacturing method of a display device including cleaning using a cleaning device according to any one of claims 1 to 12,
A method of manufacturing a flexible printed circuit board, the method comprising: providing a flexible printed circuit board (PCB) having first and second plastic substrates bonded on a first carrier substrate and having a printed circuit board (PCB) mounted on one side of the first plastic substrate;
Wherein the main body corresponding to the first and second plastic substrates of the carrier panel is positioned on the roller of the cleaning line and the PCB is positioned on the return line so that the PCB is covered with the front cover, Into an input zone of the apparatus;
Removing the foreign matter on the surface of the first carrier substrate by passing the carrier panel through the cleaning zone of the cleaning apparatus
And a second electrode.
14. The method of claim 13,
Irradiating a surface of the first carrier substrate with a laser beam and then detaching the first carrier substrate from the flexible panel after the step of removing foreign matters from the surface of the first carrier substrate.
15. The method of claim 14,
Wherein the step of providing the carrier panel comprises:
Forming a first plastic substrate on the first carrier substrate;
Forming a second plastic substrate on a second carrier substrate;
The first and second plastic substrates facing each other and then joined together to form a first panel;
Cleaning the first panel to remove foreign matter from the surface of the second carrier substrate;
Forming a second panel by irradiating a laser beam to a surface of the second carrier substrate and removing the second carrier substrate from the first panel;
Mounting a PCB on the flexible panel of the second panel via the FPCB
And a second electrode.
16. The method of claim 15,
Before the step of bonding the first and second plastic substrates
The first and second plastic substrates are bonded to each other to form a component for operating either the liquid crystal display device, the organic electroluminescent device or the electrophoretic display device on the first and second plastic substrates, 1 and the second plastic substrate
And a second electrode.

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