KR20090033029A - 코팅 와이어 및 피막 저항기 - Google Patents
코팅 와이어 및 피막 저항기 Download PDFInfo
- Publication number
- KR20090033029A KR20090033029A KR1020080093684A KR20080093684A KR20090033029A KR 20090033029 A KR20090033029 A KR 20090033029A KR 1020080093684 A KR1020080093684 A KR 1020080093684A KR 20080093684 A KR20080093684 A KR 20080093684A KR 20090033029 A KR20090033029 A KR 20090033029A
- Authority
- KR
- South Korea
- Prior art keywords
- glass
- resistor
- wire
- coating
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011521 glass Substances 0.000 claims abstract description 64
- 238000000576 coating method Methods 0.000 claims abstract description 53
- 239000011248 coating agent Substances 0.000 claims abstract description 50
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 47
- 229910052709 silver Inorganic materials 0.000 claims abstract description 38
- 239000004332 silver Substances 0.000 claims abstract description 38
- 239000000919 ceramic Substances 0.000 claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 17
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 12
- 239000004020 conductor Substances 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims abstract description 8
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 8
- 229910000679 solder Inorganic materials 0.000 claims abstract description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 37
- 238000000034 method Methods 0.000 claims description 14
- 239000011162 core material Substances 0.000 claims description 10
- 239000002241 glass-ceramic Substances 0.000 claims description 4
- 238000009792 diffusion process Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 8
- 239000002184 metal Substances 0.000 abstract description 8
- 238000009713 electroplating Methods 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 39
- 239000010409 thin film Substances 0.000 description 9
- 238000000926 separation method Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 239000011324 bead Substances 0.000 description 4
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 4
- 239000010956 nickel silver Substances 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000002485 combustion reaction Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000009501 film coating Methods 0.000 description 3
- 239000011195 cermet Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005524 ceramic coating Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- PCLURTMBFDTLSK-UHFFFAOYSA-N nickel platinum Chemical compound [Ni].[Pt] PCLURTMBFDTLSK-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
- G01K7/183—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer characterised by the use of the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/002—Inhomogeneous material in general
- H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49087—Resistor making with envelope or housing
- Y10T29/49098—Applying terminal
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Non-Adjustable Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Details Of Resistors (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
Description
Claims (10)
- 전기 절연 기판 상의 백금 측정 저항기와 상기 측정 저항기에 연결된 연결 와이어를 갖는 피막 저항기로서, 상기 연결 와이어는 코팅된 니켈 코어를 갖는 피막 저항기에 있어서,상기 코팅은 은으로 구성되거나 은과 유리 또는 세라믹의 혼합물로 구성되는 것을 특징으로 하는 피막 저항기.
- 제1항에 있어서,은 코팅 또는 은 상 또는 니켈 코어는 최소한 99 wt.%의 순도를 갖는 것을 특징으로 하는 피막 저항기.
- 제1항 또는 제2항에 있어서,니켈 코어는 100 ㎛ 내지 400 ㎛ 의 직경을 가지며 은 코팅은 0.2 내지 5 ㎛의 두께를 갖는 것을 특징으로 하는 피막 저항기.
- 제1항 내지 제3항 중 어느 한 항에 있어서,피막 저항기는 코팅된 연결 와이어를 가지며, 그 코팅은 그 전기 전도도 및 그 기계적 특성에 있어서 코어 재료의 확산으로 인해 부정적 영향을 받지 않는 것을 특징으로 하는 피막 저항기.
- 제1항 내지 제4항 중 어느 한 항에 있어서,측정 저항기 및 연결 와이어는 상기 측정 저항기에 부착된 그들의 단부 영역에서 유리 또는 유리 세라믹으로 덮히는 것을 특징으로 하는 피막 저항기.
- 기판의 전기 절연 표면, 전기 절연 표면에 배치된 트랙 도체(track conductor), 트랙 도체와 연결된 두 개의 연결 와이어 및 트랙 도체와 트랙 도체와 연결된 와이어 단부를 밀봉하는 유리 커버를 포함하는, 특히 제1항 내지 제5항 중 어느 한 항에 따르는 피막 저항기에 있어서,상기 연결 와이어는 니켈 및 은 코팅으로 구성되는 코어를 갖는 것을 특징으로 하는 피막 저항기.
- 기판의 전기 절연 표면 상의 최소한 하나의 저항기 패턴, 상기 저항기 패턴을 커버링하는 유리 커버, 및 상기 유리 커버로부터 돌출해 나오는 연결 와이어로서 전기 전도 방식으로 저항기 패턴에 연결되는 연결 와이어로 구성되는 피막 저항기의 제조 방법에 있어서,유리에 함께 싸여진 수개의 피막 저항기들은 파절을 통하여 개별적으로 분리되는 것을 특징으로 하는 피막 저항기의 제조 방법.
- 제1항 내지 제6항 중 어느 한 항에 따르는 측정 저항기 및 그 위에 연결되는 코팅 와이어를 갖는 피막 저항기의 제조 방법에 있어서,코팅 와이어는 열압착에 의해 전기 전도 방식으로 저항 코팅의 접촉 표면에 접합되는 것을 특징으로 하는 피막 저항기의 제조 방법.
- 피막 저항기를 니켈계 와이어에 연결하는 방법에 있어서,측정 저항기로부터 돌출하는 와이어는 연납으로 납땜되는 것을 특징으로 하는 연결 방법.
- 제9항에 있어서,코팅 와이어는 플럭싱제 없이 연납으로 납땜되는 것을 특징으로 하는 연결 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007046907.3A DE102007046907B4 (de) | 2007-09-28 | 2007-09-28 | Schichtwiderstand und Verfahren zu dessen Herstellung |
DE102007046907.3-24 | 2007-09-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090033029A true KR20090033029A (ko) | 2009-04-01 |
KR101494015B1 KR101494015B1 (ko) | 2015-02-16 |
Family
ID=40239595
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR20080093684A Active KR101494015B1 (ko) | 2007-09-28 | 2008-09-24 | 코팅 와이어 및 피막 저항기 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8138881B2 (ko) |
EP (1) | EP2043110B1 (ko) |
JP (1) | JP5231919B2 (ko) |
KR (1) | KR101494015B1 (ko) |
CN (1) | CN101399102B (ko) |
DE (1) | DE102007046907B4 (ko) |
ES (1) | ES2625267T3 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009017676B3 (de) * | 2009-04-16 | 2010-08-05 | Heraeus Sensor Technology Gmbh | Hochtemperatursensor mit Chipdrähten aus Chromoxid bildender Eisenlegierung |
DE102011052365B4 (de) * | 2011-08-02 | 2017-02-09 | Heraeus Sensor Technology Gmbh | Mikrostrukturierter Heißprägestempel |
JP2018066592A (ja) * | 2016-10-17 | 2018-04-26 | Koa株式会社 | 白金温度センサ素子 |
JP6821384B2 (ja) * | 2016-10-17 | 2021-01-27 | Koa株式会社 | 白金温度センサ素子 |
Family Cites Families (35)
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DE1479291U (ko) * | ||||
AT172532B (de) * | 1948-11-15 | 1952-09-25 | Radiofabrik Ingelen Porzellanf | Elektrischer Kleinwiderstand |
DE1007400B (de) * | 1953-09-15 | 1957-05-02 | Philips Nv | Stromfuehrender, im Betrieb keiner hohen Temperatur ausgesetzter Leiter |
DE1883894U (de) * | 1963-03-14 | 1963-12-05 | Telefunken Patent | Schichtwiderstand. |
DE2217769B2 (de) * | 1972-04-13 | 1974-10-03 | Fa. G. Rau, 7530 Pforzheim | Metallischer Verbundkörper und Herstellungsverfahren hierzu |
DE2354045A1 (de) * | 1973-10-29 | 1975-05-07 | Patra Patent Treuhand | Metallischer manteldraht |
NL7416327A (nl) * | 1974-12-16 | 1976-06-18 | Philips Nv | Elektrische weerstand. |
DE3115656A1 (de) * | 1981-04-18 | 1982-11-18 | Robert Bosch Gmbh, 7000 Stuttgart | Elektrischer widerstand mit mindestens einer auf einem traeger aufgebrachten widerstandsschicht und verfahren zur herstellung eines elektrischen widerstandes |
US4683481A (en) * | 1985-12-06 | 1987-07-28 | Hewlett-Packard Company | Thermal ink jet common-slotted ink feed printhead |
JPS63274796A (ja) | 1987-05-06 | 1988-11-11 | Sumitomo Electric Ind Ltd | メッキ線材及びその製造方法 |
US4793182A (en) * | 1987-06-02 | 1988-12-27 | Djorup Robert Sonny | Constant temperature hygrometer |
US5243320A (en) * | 1988-02-26 | 1993-09-07 | Gould Inc. | Resistive metal layers and method for making same |
JPH0287030A (ja) | 1988-09-24 | 1990-03-27 | Murata Mfg Co Ltd | 白金温度センサ |
DE4000301C1 (ko) * | 1990-01-08 | 1991-05-23 | Degussa Ag, 6000 Frankfurt, De | |
JPH0444101A (ja) | 1990-06-11 | 1992-02-13 | Fujitsu Ltd | オートスライス装置 |
JPH0444101U (ko) * | 1990-08-13 | 1992-04-15 | ||
DE4125980A1 (de) * | 1991-08-06 | 1993-02-11 | Heraeus Sensor Gmbh | Halbzeug fuer einen elektrischen leiterdraht, anschlussleiter und verfahren zur herstellung des leiterdrahtes sowie dessen verwendung |
JP3070989B2 (ja) * | 1991-08-07 | 2000-07-31 | 日本特殊陶業株式会社 | 白金抵抗体式温度センサのリード取出部接合構造 |
DE4126220A1 (de) * | 1991-08-08 | 1993-02-11 | Duerrwaechter E Dr Doduco | Verfahren zum herstellen von elektrischen kontaktnieten |
JPH071185B2 (ja) * | 1991-08-21 | 1995-01-11 | 日本碍子株式会社 | 抵抗体素子 |
JP3070993B2 (ja) | 1991-08-27 | 2000-07-31 | 日本特殊陶業株式会社 | 白金抵抗体式温度センサ用ロー付材料 |
US5349322A (en) * | 1992-03-27 | 1994-09-20 | Ngk Insulators, Ltd. | Resistors for thermal flowmeters |
JP3058305B2 (ja) | 1993-02-26 | 2000-07-04 | 三菱マテリアル株式会社 | サーミスタ及びその製造方法 |
JPH06290904A (ja) * | 1993-03-30 | 1994-10-18 | Taiyo Yuden Co Ltd | 金属皮膜抵抗器およびその製造方法 |
JPH0729706A (ja) * | 1993-07-08 | 1995-01-31 | Nippondenso Co Ltd | 高温用温度センサ及びその製造方法 |
JPH07312301A (ja) * | 1994-03-24 | 1995-11-28 | Ngk Insulators Ltd | 抵抗体素子 |
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JPH10275707A (ja) | 1997-03-28 | 1998-10-13 | Kyocera Corp | 温度センサー |
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EP0964230A3 (de) * | 1998-06-09 | 2000-01-26 | Heraeus Electro-Nite International N.V. | Elektrischer Widerstand mit wenigstens zwei Anschlusskontaktfeldern auf einem Keramik-Substrat sowie Verfahren zu dessen Herstellung |
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JP4566437B2 (ja) | 2001-03-26 | 2010-10-20 | コーア株式会社 | リード線の接続方法 |
JP4746768B2 (ja) | 2001-06-04 | 2011-08-10 | コーア株式会社 | 抵抗器およびその製造方法 |
DE10153217B4 (de) * | 2001-10-31 | 2007-01-18 | Heraeus Sensor Technology Gmbh | Manteldraht, insbesondere Anschlussdraht für elektrische Temperatursensoren |
-
2007
- 2007-09-28 DE DE102007046907.3A patent/DE102007046907B4/de active Active
-
2008
- 2008-09-22 EP EP08016617.6A patent/EP2043110B1/de active Active
- 2008-09-22 ES ES08016617.6T patent/ES2625267T3/es active Active
- 2008-09-24 KR KR20080093684A patent/KR101494015B1/ko active Active
- 2008-09-24 US US12/236,879 patent/US8138881B2/en active Active
- 2008-09-27 CN CN200810148837.5A patent/CN101399102B/zh active Active
- 2008-09-29 JP JP2008250289A patent/JP5231919B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
EP2043110A2 (de) | 2009-04-01 |
US8138881B2 (en) | 2012-03-20 |
CN101399102A (zh) | 2009-04-01 |
JP2009088529A (ja) | 2009-04-23 |
CN101399102B (zh) | 2016-08-24 |
DE102007046907A1 (de) | 2009-04-23 |
EP2043110B1 (de) | 2017-03-15 |
EP2043110A3 (de) | 2009-09-02 |
US20090091418A1 (en) | 2009-04-09 |
DE102007046907B4 (de) | 2015-02-26 |
JP5231919B2 (ja) | 2013-07-10 |
ES2625267T3 (es) | 2017-07-19 |
KR101494015B1 (ko) | 2015-02-16 |
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