KR20060097250A - Automated Optical Inspection System and Method - Google Patents

Abstract

The present invention relates to an optical automatic inspection system and method for automatically inspecting the appearance of an inspection object in the form of a film or tape in which flexible printed circuit board units are continuously formed using an optical method. The optical automatic inspection system of the present invention includes a unloader (loader) provided with an inspection object; A vision inspection unit which inspects a surface of the inspection object provided from the unwinding unit; A marking unit which displays a unit which is determined as defective among the flexible printed circuit board units formed on the inspection object; And a unloader on which the inspection object is wound after the inspection; The vision inspection unit may include imaging members configured to photograph the film tapes having different views. According to the present invention having such a configuration, a higher inspection quality can be obtained, and the inspection quality can be improved because either the reflected light or the transmissive light can be selectively used according to the characteristics of each visual field (inspection area). It can have a special effect.

Printed Circuit Boards, TAB, COF

Description

Optical automatic inspection system and method {SYSTEM AND METHOD FOR OPTICAL AUTOMATED INSPECTION}

1 is a block diagram for explaining the present invention;

2 shows a main configuration of an optical automatic inspection system according to an embodiment of the present invention;

3 is a view showing the main configuration of the primary vision inspection unit;

4 shows a support of a primary vision inspection unit;

5 is a view showing image pickup members for imaging an inspection object with different fields of view (inspection area);

6 is a flow chart of the inspection method by the optical automatic inspection system of the present invention.

Explanation of symbols on the main parts of the drawings

102: unwinding unit

110: primary vision inspection unit

150: secondary vision inspection unit

160: marking part

106: Gunguin

The present invention relates to an optical automatic inspection system, and more particularly, to an optical automatic inspection system and method for automatically inspecting the appearance of an object to be inspected in the form of a film or tape in which flexible printed circuit board units are continuously formed using an optical method. It is about.

Printed circuit boards, which are one of the main materials used in the manufacture of various semiconductor devices such as driver integrated circuits and memories of liquid crystal displays, are flexible such as film and tape types according to the trend of miniaturization and light weight of semiconductor devices. Flexible printed circuit boards are used a lot. Among flexible printed circuit boards, for example, a tape automatic bonding (TAB), a chip on film (COF) substrate, and the like are formed, and a fine circuit pattern is formed on the substrate through an exposure, development, and etching process. Therefore, in the inspection of pre-shipment, the manufacturers of flexible printed circuit boards have the external inspection such as plating area, solder resist area, and area where semiconductor wafer is mounted (inner lead part) as a key inspection item. It is being divided.

That is, in the production of flexible printed circuit boards for semiconductor IC manufacturing, effective inspection of the inspection items becomes a key to productivity and quality control.

However, in the existing optical automatic inspection system, undetection, which is actually defective, is judged as good quality, or overdetection by good quality foreign matter and dust (for example, judgment of good quality as standard) is generated. In particular, over-detection automatically scraps hard-worked good products, greatly reducing productivity, which immediately leads to deterioration of profitability of manufacturing companies. Existing optical automatic inspection systems introduced to printed circuit board manufacturers in the form of films and tapes acquire images by using only transmitted light or only reflected light. Many detection phenomena appear.

In the conventional optical automatic inspection system, even if overdetection occurs, the inspection is continuously performed, and the printed circuit board determined as defective in the defective processing unit according to the inspection result is poorly processed, such as punching or marking. As a result, the good product was overdetected as defective by foreign matter or dust, etc., and the good product in the product standard was inevitably treated as defective according to the detection result of the optical inspection device.

In addition, the existing optical automatic inspection system has a difficulty in installing multiple cameras in a limited space, so the number of cameras can be limited, and if additional cameras are to be installed, the system size must be as large as the installation space. Have

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and the object thereof is a new form which can obtain inspection reliability by preventing over-detection which is determined to be defective even though it is defective in standard but not good as standard. To provide an optical automatic inspection system and method. It is another object of the present invention to provide a new type of optical automatic inspection system and method for increasing the space utilization for mounting a large number of cameras in a limited space. It is another object of the present invention to provide a new type of optical automatic inspection system and method that can more accurately inspect defect types.

According to an aspect of the present invention for achieving the above object, an optical automatic inspection system of an inspection object in which the flexible printed circuit board units are continuously formed, the unloader (loader) provided with the inspection object; A vision inspection unit which inspects a surface of the inspection object provided from the unwinding unit; Comprising the unloader (unloader) is unloaded the inspection object after the inspection; The vision inspection unit may include imaging members configured to photograph the film tapes having different views.

In a preferred embodiment of this aspect, each of the imaging members is arranged to have a field of view corresponding to the inspection items of the inspection object.

In a preferred embodiment of this aspect, the inspection items of the inspection object may include a return hole of the inspection object, an inner lead region, a pattern plating region, a solder rester region, and the like.

In a preferred embodiment of this feature, each of the imaging member includes a camera and an illumination member for irradiating light to the inspection object; The illumination member may include at least one of a transmission light for irradiating the light to the inspection object and a reflection light for irradiating the reflected light to the inspection object.

In an exemplary embodiment of the present invention, the image pickup members may include: a first camera configured to image the inner lead area to inspect bending, discoloration, scratches, foreign matters, etc. of the inner leads of the flexible printed circuit board unit; A second image capturing the pattern plating region and the solder resist region in order to inspect surface inspection (discoloration, scratch, foreign matter) of the pattern plating region of the flexible printed circuit board unit, and pinholes, scratch position misalignment, etc. of the solar resistor region. camera; And a third camera for capturing the width of the inspection object in order to inspect pinholes, scratch positions, distortions, and tearing of the transport reference hole in the solar register area of the flexible printed circuit board unit.

According to a preferred embodiment of the present invention, the vision inspection unit may include: a first processing unit which determines warpage, discoloration, scratches, foreign matters, etc. of the inner leads of the flexible printed circuit board unit by an image captured by the first camera; A second processing unit for determining a surface inspection (discoloration, scratch, foreign matter) of the pattern plating region of the flexible printed circuit board unit, pinholes of the solar register region, a scratch position shift, etc. by the image photographed by the second camera; And a third processing unit for determining a surface inspection (pinhole, scratch position, distortion, etc.) of the solar register area of the flexible printed circuit board unit, and tearing of a transport reference hole using an image captured by the third camera. It may further include a processing unit.

In a preferred embodiment of this aspect, the vision inspecting section captures two imaging members of the imaging members having the same field of view (inspection region); The two imaging members for imaging the same field of view (inspection area) are each configured to image the defect type using the reflected light and the transmitted light.

In a preferred embodiment of this aspect, the vision inspection unit further comprises a round transfer unit for transporting the inspection object round; The imaging members may image the surface of the inspection object to be transported roundly.

In a preferred embodiment of this feature, the round transfer portion includes support portions for supporting the inspection object so that bending or sagging of the inspection object does not occur; The supports may be disposed along the radius of the round to transport the inspection object roundly.

In a preferred embodiment of this aspect, each of the imaging member includes a camera and a lighting member for irradiating light to the inspection object, the support portion includes a pair of support rollers spaced apart from each other, the illumination The member irradiates light to the inspection object through a gap between the pair of support rollers.

In a preferred embodiment of this aspect, the optical automatic inspection system may further include a secondary vision inspection unit for final imaging of the inspection object picked up by the imaging members in the vision inspection unit to determine whether there is a defect. .

In a preferred embodiment of this aspect, the secondary vision inspection unit may include an area camera for imaging the flexible printed circuit board unit by an area scan method.

In a preferred embodiment of the feature, the secondary vision inspection unit further comprises a color camera for capturing a portion found to be defective with the image captured by the primary vision inspection unit and the area camera as a color image, The image processing unit displays an image of a portion of the image captured by the primary vision inspection unit and the area camera, which is found to be defective, and a color image captured by the color camera, to the operator to determine whether or not the final quantity is or not. It may include a final processing unit.

In a preferred embodiment of the present invention, the camera is a line scan camera, and the optical automatic inspection system may further include a marking unit for displaying a unit determined to be defective among the flexible printed circuit board units formed on the inspection object. have.

According to an aspect of the present invention for achieving the above object, an optical automatic inspection method of an inspection object in which the flexible printed circuit board units are continuously formed comprises the steps of: providing the inspection object; A primary vision inspection step of inspecting a surface of the inspection object provided from the unwinding unit; Comprising the step of unloading the inspection object after the inspection; The first vision inspection step includes imaging the inspection object by the imaging members having a field of view (inspection region) corresponding to each of the inspection items.

In a preferred embodiment of the present invention, the first vision inspection step may be performed by image scanning the inner lead area of the flexible printed circuit board unit by line scan method, such as bending, discoloration, scratch, A first processing step of discriminating foreign matters and the like; The pattern plating area and the solder resist area of the flexible printed circuit board unit are imaged by a line scan method, and the surface inspection (discoloration, scratch, foreign matter) of the pattern plating area of the flexible printed circuit board unit, and the pinhole of the solar resistor area are performed. A second processing step of determining a scratch position misalignment and the like; And a third camera photographing the width of the inspection object by a line scan method to determine surface inspection (pinhole, scratch position, distortion, etc.) of the solar register area of the flexible printed circuit board unit, and tearing of the conveyance reference hole. It may include a third processing step.

In a preferred embodiment of this aspect, the primary vision inspection step includes a dual imaging step of comparing and inspecting respective image features by imaging the same inspection area of the inspection object using reflected light and transmitted light, respectively, in at least two imaging members. It may further include.

In a preferred embodiment of this aspect, the optical automatic inspection method further comprises a second vision inspection step of determining whether or not there is a defect by imaging the inspection object photographed by the imaging members in the first vision inspection step. It may further include.

In a preferred embodiment of this aspect, the secondary vision inspection step may include an area scan processing step of imaging the flexible printed circuit board unit by an area scan method and calculating an inspection result for the unit.

In a preferred embodiment of this aspect, the secondary vision inspection step is performed by capturing an image of a portion found to be defective in the primary vision inspection step and the area scan processing step and a color image of the portion found to be defective. By displaying the color image may further comprise a final processing step for the operator to determine whether the final amount, whether or not.

In a preferred embodiment of this aspect, the method may further include a marking step of displaying a unit which is determined to be defective among the flexible printed circuit board units formed on the inspection object.

For example, embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. This embodiment is provided to more completely explain the present invention to those skilled in the art. Accordingly, the shape of the elements in the drawings and the like are exaggerated to emphasize a clearer description.

An embodiment of the present invention will be described in detail with reference to FIGS. 1 to 6. In addition, in the drawings, the same reference numerals are denoted together for components that perform the same function.

1 is a block diagram for explaining the present invention, Figure 2 is a view showing the main configuration of an optical automatic inspection system according to an embodiment of the present invention. 3 is a view showing the main configuration of the primary vision inspection unit. 4 is a view showing a support of the primary vision inspection unit. 5 is a view showing image pickup members for picking up an inspection object with different fields of view (inspection regions). 6 is a flow chart of the inspection method by the optical automatic inspection system of the present invention.

1 and 2, the optical automatic inspection system 100 of the present invention is a film, tape type, etc. in which the flexible printed circuit board unit 12 (shown in FIG. 5) is continuously formed. It is a system for automatically inspecting the inspection object 10 using a plurality of line scan cameras, an area scan camera and a color camera. In the accompanying drawings, the symbol '⇒' indicates a moving path of the test object, and the symbol '→' indicates signal transmission.

The optical automatic inspection system 100 includes a feed roller 102, a primary vision inspection unit 110, a secondary vision inspection unit 150, a marking unit 160, and a winding roller, an unloader; 106).

The inspection object is wound around the reel 104 in the take-out unit 102, and the inspection object 10 sent out from the take-out unit 102 passes through the guide rollers 105 of the primary vision inspection unit 110. It is supplied to the round conveying part. The inspection object is wound on the reel 108 of the winding unit 106 via the primary vision inspection unit 110, the secondary vision inspection unit 150, and the marking unit 160.

2 to 4, the first vision inspection unit 110 has four round members 112a and four imaging members 120a for imaging the inspection object with different fields of view (inspection area or imaging area). -120d). Here, each of the imaging members 120a-120d is disposed to have a field of view corresponding to the inspection items of the inspection object.

The round transfer part 112 has support parts 114 disposed along a predetermined radius to support the test object 10 to be rounded and to support the test object. The support part 114 includes a pair of support rollers 116 spaced apart from each other.

Since the first vision inspection unit 110 is transported round the inspection object 10, the first vision inspection unit 110 has a relatively wide length compared to the straight length of the inspection object is transported in a straight line, so that a large number of cameras can be installed without mutual interference. have. In general, since the camera is provided with a set of fixing brackets (a) and adjusting members (b) for adjusting the camera position, a mounting space much larger than the camera size is required.

The imaging members 120a-120d are disposed around the round transfer part 112, and the imaging members 120a-120d have one camera 122a-122d and two lights for irradiating light onto the inspection object. Member 124. The illumination member 124 is composed of a transmission light (124a) for irradiating the transmitted light to the inspection object, and a reflection light (124b) for irradiating the reflected light to the inspection object, according to the characteristics of the reflected light and Any one of the transmission lights may be selectively used. The transmission light 124a is installed in the support part 114 and irradiates the transmitted light to the inspection object 10 through a gap between the pair of support rollers 116. The reflected light 124b is disposed between the camera and the inspection object and irradiates the reflected light to the inspection object. For example, a line scan camera may be used for the camera.

For example, defect types such as bending of inner leads of the flexible printed circuit board unit, misalignment of solder resistor regions, tearing of pinholes, and conveyance reference holes, etc., can improve inspection quality by irradiating transmission light rather than reflection light. . On the contrary, defect types such as surface inspection (discoloration, scratch, foreign matter, etc.), solder resist surface inspection, and conveyance reference hole surface inspection of the inner lead / pattern plating region of the flexible printed circuit board unit are performed by reflecting illumination rather than through illumination. It can improve inspection quality.

Below are the types of defects that can be most clearly distinguished by transmission and reflection lighting.

Transmitted light: 1st camera (inner lead bending test of TAB products), 2nd camera (position of solder resistor area, pinhole), 3rd camera (torn of transfer reference hole, misalignment of solder resistor area, pinhole) )

Reflective light: 1st camera (COF inner lead, pattern plating area surface inspection-discoloration, SCRATCH, foreign material, etc.), 2nd camera (pattern plating area surface inspection-discoloration, SCRATCH, foreign material / solder resist on the surface Foreign objects, pinholes, etc., 3rd camera (foreignness, pinholes, etc. on the surface of solder register / surface inspection of pattern plating area-discoloration, scratch, foreign material / conveyance surface inspection)

As such, the primary vision inspection unit 110 may accurately determine various types of defects by selectively using reflected light and transmitted light.

Since the optical automatic inspection system 100 of the present invention can selectively use the transmission light or the reflection light according to the characteristics of the item to be inspected, the optical automatic inspection system 100 has a special effect of improving the inspection quality.

The imaging members 120a-120d will be described in more detail below.

As shown in FIGS. 3 and 5, the first camera 122a of the first photographing member 120a may inspect warpage, discoloration, scratches, foreign objects, etc. of the inner leads of the flexible printed circuit board unit 12. In order to image the inner lead region. The second camera 122b of the second image pickup member 120b includes surface inspection (discoloration, scratches, foreign matters) of the pattern plating area of the flexible printed circuit board unit 12, pinholes of the solder resist area, scratch positions, and the like. The pattern plating area and the solder resist area are photographed to examine the pattern. The third camera 122c of the third image pickup member 120c may inspect the inspection object 10 to inspect pinholes, scratch positions, distortions, and tearing of the transfer reference hole in the solder resist area of the flexible printed circuit board unit 12. ) Width of the image.

In the following, inspection items for each camera and examples of their use were described.

One). First camera (25 mm field of view):

* TAB Product Inspection Item Inspects the warpage of inner leads using the amount of penetration.

* In case of COF, surface inspection on inner lead using reflected light (discoloration, scratch, foreign material, etc.).

2). Second camera (field of view -35mm):

* Surface inspection (discoloration, scratch, foreign material, etc.) and solder resist area (pinhole, scratch, dislocation, etc.) of the pattern plating area using reflected light.

* The transmitted light may be used according to the inspection criteria of the product and customer.

3). Third camera (field of view-50mm):

* Solder Resister area (pinhole, position shift, etc.) and conveyance standard hole (hole tearing, etc.) using reflected light

* Reflective or transmitted light may be used depending on the inspection object (product) and the inspection standard of the user.

* By referring to the image (image data) of the second camera, a new inspection method can be proposed to prevent the overdetection by foreign objects.

The fourth camera 122d of the fourth imaging member 120d has the same field of view (inspection area) as that of the first camera 122a. However, the fourth image capturing member 120d photographs using different illumination from the first image capturing member 120a. For example, if the inner lead of the flexible printed circuit board unit is captured by the reflective light by the first imaging member 120, the inner lead of the flexible printed circuit board unit is captured by the transmissive light by the fourth imaging member 120d. It is characterized by that.

The fourth imaging member 120d may be selectively installed according to a user's request, and the fourth imaging member 120d may be an inspection area deemed to be important among the visual fields (inspection areas) photographed by the preceding cameras. This is the configuration for imaging once again.

On the other hand, the conveying speed of the inspection object is preferably adjusted to correspond to the image acquisition speed (image speed) of the first camera having the narrowest field of view among the 1-3 cameras. In addition, the image acquisition speed of the second and third cameras may be adjusted (slower) according to the transfer speed of the inspection object adjusted to match the image acquisition speed of the first camera.

Thus, the present invention has a special effect of obtaining a higher inspection quality by imaging the same inspection area in the two cameras (122a, 122d) with the transmission light and the reflection light respectively and comparing their respective image features.

1 and 2, an image (image data) captured by the cameras of the first vision inspection unit 110 is provided to the image processing unit 140. The image processor 140 is provided as a typical computer system, and controls and processes various operations according to automatic optical inspection. The image processor 140 receives an image from the cameras and inspects various inspection items.

The image processor 140 may determine the quantity of the entire flexible printed circuit board unit by inspecting various inspection items and integrating the results with the images provided for each field of view (inspection region) from the respective cameras.

The image processor 140 includes a first-4 processor. The first processing unit 142a determines the bending, discoloration, scratches, foreign matters, etc. of the inner leads of the flexible printed circuit board unit 12 based on the images captured by the first and fourth cameras 122a and 122d. . The second processing unit 142b is an image captured by the second camera 122b to inspect the surface of the pattern plating area of the flexible printed circuit board unit (discoloration, scratch, foreign matter), and pinholes and scratches of the solder resist area. Position misalignment is determined. The third processing unit 142c is an image picked up by the third camera 122c to inspect the surface of the solar resistor area of the flexible printed circuit board unit (pinholes, scratch positions, twists, etc.), and tearing of the transfer reference hole. Will be determined. The fourth processor 142d and the final processor 144 will be described together with the secondary vision inspector 150.

 The secondary vision inspection unit 150 is to determine whether there is a defect by finally photographing the inspection object that has been inspected by the primary vision inspection unit 110, and the secondary vision inspection unit 150 is an area. It has a scan camera 152 and a color camera 154. The secondary vision inspection unit 150 is an optional item and can be added or omitted according to a user's request.

The area scan camera 152 captures the solder resist area of the flexible printed circuit board unit 12 using an area scan method and reflection illumination. The captured image is provided to the fourth processor 142d and the solder resistor area is inspected by the fourth processor. The area scan camera 152 is mainly used for imaging a TAB type flexible printed circuit board unit rather than a COF type. In general, the TAB-type flexible printed circuit board unit is relatively thick (especially thick solder resistor area) compared to the COF-type flexible printed circuit board unit, and thus is difficult to transmit. For this reason, the reliability of foreign material inspection on the surface of the solder resistor area is very low. In the present invention, in order to solve such a problem, the foreign matter inspection on the surface of the solder resist region of the inspection object (particularly, TAB-type flexible printed circuit board unit) is performed by using the reflection light 153 to the area scan camera 152. The inspection reliability can be improved.

The color camera 154 inspects the image picked up in the previous step (the primary vision inspection unit and the area camera) and captures a portion of the color camera that is found to be defective. The color image picked up as described above is provided to the final processing unit 144 of the image processing unit 140, and the final processing unit 144 turns out to be defective in the previous step (the primary vision inspection unit and the area camera) and the color image. An image of the portion is displayed on the monitor 146. The operator compares the two images displayed on the monitor 146 and inputs the final amount or not through the input device 148.

The marking unit 160 displays a failure mark on a unit determined to be defective among the flexible printed circuit board units formed on the inspection object. The marking unit 160 is controlled by the image processor.

On the other hand, the present invention can be variously modified and can take various forms in the optical automatic inspection system consisting of the above configuration. It is to be understood, however, that the present invention is not limited to the specific forms referred to in the above description, but rather includes all modifications, equivalents and substitutions within the spirit and scope of the invention as defined by the appended claims. It should be understood to do.

Next, an operation relationship of the present invention for inspecting an inspection object in which flexible printed circuit board units are continuously formed will be described.

1, 2 and 6, the inspection object 10 sent from the unwinding unit 102 is supplied to the round conveying unit of the primary vision inspection unit 110 via the guide roller 105 (s210). ).

In the first vision inspection unit, the first, second, third, processing, and dual imaging steps are sequentially performed (S220). The primary processing step (s222) is a step (s222a) of imaging the inner lead area (first inspection area) of the flexible printed circuit board unit 12 by the first camera, the first processing unit (142a) And determining warpage, discoloration, scratches, foreign matters, etc. of the inner leads of the flexible printed circuit board unit 12 based on the image photographed by the first camera 122a (s222b).

In the second processing step s224, the pattern plating area and the solar register area of the flexible printed circuit board unit 12 are captured by the second camera 122b (s224a), and the second processing part 142b is performed. Determining the surface inspection (discoloration, scratch, foreign matter) of the pattern plating area of the flexible printed circuit board unit, pinholes of the solar register area, scratch position, etc. by using the image captured by the second camera 122b at (s224b).

The third processing step (s226) is a step (s226a) of capturing the width of the inspection object 10 in the third camera (122c), and by the third camera (122c) in the third processing unit (142c). Surface imaging (pinhole, scratch position, distortion, etc.) of the solar resistor area of the flexible printed circuit board unit and the tearing of the transport reference hole are determined by the captured image (s226b).

The double image capturing step (s228) includes capturing the same field of view (inspection area) as that of the first camera 122a in the fourth camera 122d (s228a), and in the first processing unit 142a, the first image. And determining warping, discoloration, scratches, foreign matters, etc. of the inner leads of the flexible printed circuit board unit 12 using the image photographed by the camera 122a (s228b). Here, the fourth camera is characterized by imaging using a different illumination from the first camera.

The inspection object having completed the first vision inspection in the first vision inspection unit is moved to the second vision inspection unit. In the inspection step s230 of the secondary vision inspection unit, a scan processing step s232 and a final processing step s234 are performed.

In the scan processing step (s232), the area scan camera 152 photographs the solder resist region of the flexible printed circuit board unit 12 by using an area scan method and reflection light (s232a), and And a step (s232b) of inspecting the solder resistor region in the processing unit.

The final processing step (s234) is a step of inspecting an image captured in a previous step (the primary vision inspection unit and the area camera) in the color camera to capture a portion found to be defective as a color image (s234a), and Displaying a color image and an image of a portion found to be defective in the previous step (the primary vision inspection unit and the area camera) on the monitor 146 (s234b) and the two images displayed by the operator on the monitor 146. Comparing with the final amount, whether or not to input through the input device 148 (s234c).

Thus, the unit finally determined to be defective is marked as defective in the marking unit (s240), and wound around the gusset unit (s250).

In the above, the configuration and operation of the optical automatic inspection system according to the present invention has been shown according to the above description and drawings, but this is merely described for example, and various changes and modifications can be made without departing from the technical spirit of the present invention. Of course.

As described above, the optical automatic inspection system of the present invention captures an inspection object by dividing the field of view (inspection region) corresponding to the inspection items of the inspection object, and has an image provided for each field of view (inspection region). By inspecting the inspection items and integrating the results, the quantity of the entire flexible printed circuit board unit is determined. Therefore, it has a special effect of obtaining a higher inspection quality. In addition, according to the characteristics of each field of view (inspection area) it can be selectively used any one of reflected light and transmitted light has a special effect to improve the inspection quality. In addition, the present invention has a special effect that can obtain a higher inspection quality by double imaging the same field of view (inspection area) in the transmission light and reflection light in each of the two cameras to compare the respective image characteristics. In addition, the present invention has a special effect that can be installed a large number of cameras without mutual interference because the inspection object is transported round, because the inspection object has a relatively wide length compared to the straight length that is conveyed in a straight line.

According to the present invention, since the inspection object that has been inspected by the primary vision inspection unit is finally photographed by the secondary vision inspection unit to determine whether there is a defect, it is possible to prevent undetected or overdetected phenomenon, thereby improving inspection reliability and product productivity and profitability. Can be obtained.

Claims (22)

In an optical automatic inspection system for an inspection object in which flexible printed circuit board units are formed continuously: A unloader (loader) provided with the inspection object; A vision inspection unit which inspects a surface of the inspection object provided from the unwinding unit; Comprising the unloader (unloader) is unloaded the inspection object after the inspection; The vision inspection unit And an image pickup member for imaging the film tape with different fields of view. The method of claim 1, And each of the imaging members is disposed to have a field of view corresponding to the inspection items of the inspection object. The method of claim 2, The inspection items of the inspection object include an optical hole, an inner lead region, an inner lead region, a pattern plating region, a solder rester region, and the like. The method of claim 1, Each of the imaging members includes a camera and an illumination member for irradiating light to the inspection object; The illumination member includes at least one of a transmission light for irradiating the light to the inspection object and a reflection light for irradiating the reflected light to the inspection object. The method of claim 1, The imaging members A first camera for capturing the inner lead area to inspect bending, discoloration, scratching, foreign matters, etc. of the inner leads of the flexible printed circuit board unit; A second image capturing the pattern plating region and the solder resist region in order to inspect surface inspection (discoloration, scratch, foreign matter) of the pattern plating region of the flexible printed circuit board unit, and pinholes, scratch position misalignment, etc. of the solar resistor region. camera; And And a third camera for capturing the width of the inspection object to inspect pinholes, scratch positions, distortions, and tearing of the transport reference hole in the solar register area of the flexible printed circuit board unit. The method of claim 5, wherein The vision inspection unit A first processor configured to discriminate warpage, discoloration, scratches, foreign matters, etc. of the inner leads of the flexible printed circuit board unit based on the image photographed by the first camera; A second processing unit for determining a surface inspection (discoloration, scratch, foreign matter) of the pattern plating region of the flexible printed circuit board unit, pinholes of the solar register region, a scratch position shift, etc. by the image photographed by the second camera; And An image processing unit including a third processing unit for determining a surface inspection (pinhole, scratch position, distortion, etc.) of the solar register area of the flexible printed circuit board unit, and tearing of a transport reference hole using an image captured by the third camera; Optical auto inspection system that includes more. The method of claim 1, The vision inspection unit Two imaging members of the imaging members have an image having the same field of view (inspection area); And two imaging members for imaging the same field of view (inspection area), respectively, for imaging defect types by using reflected light and transmitted light. The method of claim 1, The vision inspection unit It further comprises a round transfer unit for transporting the inspection object roundly; And the imaging members are configured to image the surface of the inspection object to be transported roundly. The method of claim 8, The round transfer unit It includes a support for supporting the inspection object so that bending or sagging of the inspection object does not occur; The supports are arranged along the radius of the round optical automatic inspection system, characterized in that for transporting the inspection object round. The method of claim 9, Each of the imaging members includes a camera and an illumination member for irradiating light to the inspection object. The support portion includes a pair of support rollers spaced apart from each other, The illumination member is an optical automatic inspection system, characterized in that for irradiating light to the inspection object through the gap between the pair of support rollers. The method of claim 1, The optical automatic inspection system And a second vision inspection unit configured to finally capture the inspection object photographed by the imaging members in the vision inspection unit and determine whether the inspection object is defective. The method of claim 11, The secondary vision inspection unit And an area camera for imaging the flexible printed circuit board unit by an area scan method. The method of claim 12, The secondary vision inspection unit It further comprises a color camera for capturing a portion found to be defective with a color image taken by the primary vision inspection unit and the area camera, The image processing unit displays an image of a portion of the image captured by the primary vision inspection unit and the area camera, which is found to be defective, and a color image captured by the color camera, to a worker, and determines whether or not the final amount is unsuccessful. Optical automatic inspection system, characterized in that it comprises a final processing unit. The method of claim 4, wherein And the camera is a line scan camera. The method of claim 1, The optical automatic inspection system And a marking unit for displaying a unit which is determined to be defective among the flexible printed circuit board units formed on the inspection object. In the optical automatic inspection method of the inspection object in which the flexible printed circuit board units are continuously formed: Providing the inspection object; A primary vision inspection step of inspecting a surface of the inspection object provided from the unwinding unit; Comprising the step of unloading the inspection object after the inspection; The first vision inspection step And an image pickup member for picking up the inspection object with a field of view (inspection region) corresponding to each of the inspection items. The method of claim 16, The first vision inspection step A first processing step of imaging an inner lead area of the flexible printed circuit board unit by a line scan method to discriminate warpage, discoloration, scratch, foreign matter, etc. of the inner leads of the flexible printed circuit board unit; Image inspection of the pattern plating region and the solder resist region of the flexible printed circuit board unit by line scan method, surface inspection (discoloration, scratch, foreign matter) of the pattern printed region of the flexible printed circuit board unit, pinhole of the solar resistor region, A second processing step of determining scratch position misalignment and the like; And A third camera photographing the width of the inspection object by a line scan method to determine surface inspections (pinholes, scratch positions, distortions, etc.) of the solar resistor area of the flexible printed circuit board unit, and tearing of the conveyance reference hole; Optical automatic inspection method comprising the three processing steps. The method of claim 16, The first vision inspection step And a dual imaging step of comparing and inspecting respective image features by imaging the same inspection area of the inspection object by using reflected light and transmitted light, respectively, in at least two imaging members. The method of claim 17, The optical automatic inspection method And a second vision inspection step of photographing the inspection object photographed by the imaging members in the first vision inspection step to determine whether there is a defect. The method of claim 19, The second vision inspection step And an area scan processing step of imaging the flexible printed circuit board unit by an area scan method and calculating an inspection result for the unit. The method of claim 19, The second vision inspection step The final image is judged by the operator by displaying an image of a portion found to be defective in the first vision inspection step and the area scan processing step and a color image obtained by capturing the portion found to be defective as a color image. Optical automatic inspection method further comprising a processing step. The method of claim 16, And a marking step of displaying a unit which is determined to be defective among the flexible printed circuit board units formed on the inspection object.

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