CN104568985A - A kind of AOI optical detection equipment - Google Patents

Abstract

The invention relates to AOI optical detection equipment, which comprises an image acquisition module, a detection module and a control module, wherein the image acquisition module is used for photographing a PCB to acquire a surface image of the PCB; the coordinate analysis module is used for carrying out coordinate division on the acquired surface image; the PCB comprises an image analysis module, a storage module and a control module, wherein the image analysis module is used for analyzing a surface image and finding out a bad welding point on the PCB and a coordinate area corresponding to the bad welding point; the signal transmitting module is used for transmitting the surface image information, the image coordinate information and the coordinate information of the bad welding spots of the PCB outwards; and the processor is in signal connection with the image acquisition module, the coordinate analysis module, the image analysis module, the storage module and the signal transmission module respectively. The invention can accurately position bad welding spots and send signals outwards in a carrier time sequence control mode, thereby saving labor cost and improving production efficiency and quality of products.

Description

A kind of AOI optical detection equipment

technical field

The invention relates to the technical field of PCB board production, in particular to an AOI optical detection device.

Background technique

With the development of society, there are more and more electronic products, and electronic products are closely related to our daily life. During the production process of PCB boards in electronic products, and during the plug-in welding process of electronic components, defective solder joints generally appear. Therefore, it is necessary to inspect the PCB board and reprocess the solder joints of defective products to improve the yield rate. At present, many manufacturers use AOI devices to inspect PCB boards. Solder spot PCB boards are marked, and then manually repaired; due to the high requirements of the welding process of PCB boards, manual repairs are used, the quality is difficult to guarantee, and the efficiency is low.

Contents of the invention

The purpose of the present invention is to solve the deficiencies of the prior art, and provide an AOI optical inspection device capable of accurately locating defective solder joints.

The technical scheme adopted for realizing the above purpose is:

An AOI optical inspection equipment, comprising:

The image acquisition module is used to take pictures of the PCB board and obtain the surface image of the PCB board;

The coordinate analysis module is used to divide the obtained surface image into coordinates;

The image analysis module analyzes the surface image to find out the bad solder joints on the PCB and the coordinate areas corresponding to the bad solder joints.

The storage module stores the surface image information, image coordinate information and coordinate information of bad solder joints correspondingly;

The signal transmitting module transmits the surface image information of the PCB board, the image coordinate information and the coordinate information of bad solder joints;

The processor is respectively connected with the image acquisition module, the coordinate analysis module, the image analysis module, the storage module and the signal transmission module in signal connection.

When the technical solution is working, the image acquisition module first collects an image of a good PCB board as a basic image for comparison; The module analyzes and compares the collected PCB board image and the good product PCB board image, and finds the bad points; then the processor calls the coordinate analysis module to divide the coordinates of the PCB board image, and analyzes the coordinates corresponding to the bad solder joints; The coordinate information of the welding spot is stored in the memory.

The image acquisition module performs image acquisition relative to the PCB board, and the image analysis module analyzes the solder joints on the surface; according to the image characteristics of the solder joints, it finds out bad solder joints such as no tin, less tin, and combined tin, and then combines the coordinate analysis module to analyze the solder joints on the PCB board. Divide the coordinates to find out the corresponding coordinate area of the bad solder joint; the coordinate area can be a coordinate point, a certain closed range, etc.; then the processor stores the coordinate information of the bad solder joint in the storage module, and transmits it externally through the signal transmitting module. In order to receive the equipment of the subsequent process.

Further, it also includes a device DPR, the storage module is provided with an A file and a B file, and the bad solder joint coordinate information of the PCB board is written into the A file in a certain format, and the device DPR reads the A file in order, and loads the file according to the record Start working, and write to file B in format when finished.

Further, it also includes the device DPS. The device DPS reads a line of records from the B file in sequence (first judge the serial number that has been written to the C file), and loads the file according to the record to start working, and writes the C file according to the format after the end.

The beneficial effects of the present invention are: the present invention can accurately locate bad solder joints, and send signals externally according to the porter sequence control mode, save labor costs, and improve product production efficiency and quality.

Description of drawings

Fig. 1 is a structural schematic diagram of the present invention.

Detailed ways

The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

Example:

An AOI optical inspection equipment, comprising:

The image acquisition module is used to take pictures of the PCB board and obtain the surface image of the PCB board;

The coordinate analysis module is used to divide the obtained surface image into coordinates;

The image analysis module analyzes the surface image to find out the bad solder joints on the PCB and the coordinate areas corresponding to the bad solder joints.

The storage module stores the surface image information, image coordinate information and coordinate information of bad solder joints correspondingly;

The signal transmitting module transmits the surface image information of the PCB board, the image coordinate information and the coordinate information of bad solder joints;

The processor is respectively connected with the image acquisition module, the coordinate analysis module, the image analysis module, the storage module and the signal transmission module in signal connection.

When this technical solution works, the image acquisition module performs image acquisition relative to the PCB board, analyzes the solder joints on the surface, and finds out bad solder joints such as no tin, less tin, and joint tin according to the image characteristics of the solder joints, and then combines the coordinate analysis module, Divide the coordinates of the PCB board to find out the corresponding coordinate area of the bad solder joint; the coordinate area can be a coordinate point, a certain closed range, etc.; then the processor stores the coordinate information of the bad solder joint in the storage module, and transmits it It is transmitted externally so that the equipment in the subsequent process can receive it.

Further, it also includes a device DPR, the storage module is provided with an A file and a B file, the image information of the PCB board is written into the A file in a certain format, the device DPR reads the A file in sequence, and loads the file according to the record to start working, After the end, write to file B according to the format;

Further, it also includes the device DPS. The device DPS reads a line of records from the B file in sequence (first judge the serial number that has been written to the C file), and loads the file according to the record to start working, and writes the C file according to the format after the end.

The present invention has been described in detail, and those skilled in the art should understand that the technical solution of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solution of the present invention, such as simple shape changes.

Claims (3)

1. An AOI optical detection device, characterized in that: comprising: The image acquisition module is used to take pictures of the PCB board and obtain the surface image of the PCB board; The coordinate analysis module is used to divide the obtained surface image into coordinates; The image analysis module analyzes the surface image to find out the bad solder joints on the PCB and the coordinate areas corresponding to the bad solder joints. The storage module stores the surface image information, image coordinate information and coordinate information of bad solder joints correspondingly; The signal transmitting module transmits the surface image information of the PCB board, the image coordinate information and the coordinate information of bad solder joints; The processor is respectively connected with the image acquisition module, the coordinate analysis module, the image analysis module, the storage module and the signal transmission module in signal connection. 2. A kind of AOI optical detection equipment according to claim 1, it is characterized in that: also comprise equipment DPR, described memory module is provided with A file and B file, the image information of PCB board is written into A file, equipment DPR presses Read the A file sequentially, start working according to the records recorded in the file, and write the file B according to the format after the end. 3. A kind of AOI optical detection equipment according to claim 1, it is characterized in that: also comprise equipment DPS, equipment DPS reads 1 line of record from B file in order, and starts working by record loading file, press format after finishing Write the C file.