CN105486698A - AOI automatic detection device and detection method - Google Patents
AOI automatic detection device and detection method Download PDFInfo
- Publication number
- CN105486698A CN105486698A CN201610005527.2A CN201610005527A CN105486698A CN 105486698 A CN105486698 A CN 105486698A CN 201610005527 A CN201610005527 A CN 201610005527A CN 105486698 A CN105486698 A CN 105486698A
- Authority
- CN
- China
- Prior art keywords
- light source
- ccd camera
- source cover
- transmitting device
- frame
- Prior art date
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- Pending
Links
- 238000001514 detection method Methods 0.000 title abstract description 21
- 230000002950 deficient Effects 0.000 claims abstract description 40
- 238000012545 processing Methods 0.000 claims description 14
- 238000004458 analytical method Methods 0.000 claims description 8
- 239000000428 dust Substances 0.000 claims description 5
- 238000012360 testing method Methods 0.000 claims description 5
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 abstract description 17
- 238000012958 reprocessing Methods 0.000 abstract description 4
- 238000003466 welding Methods 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 description 10
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
- G01N2021/95646—Soldering
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/02—Mechanical
- G01N2201/022—Casings
- G01N2201/0227—Sealable enclosure
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention discloses an AOI automatic detection device and a detection method. The device comprises a rack, a conveying device is arranged in the rack, a CCD camera is arranged on the top of the rack, a lens of the CCD camera faces the conveying device, a light source cover is arranged between the CCD camera and the conveying device, the CCD camera can penetrate through a through hole of the light source cover to photograph a product on the conveying device, and a light source is arranged in the light source cover. The detection device further comprises a control processor connected with the CCD camera. The rack is further provided with a displayer connected with the control processor. AOI detection can be automatically carried out on a PCBA board through the detection device, and coordinate division is carried out on the PCBA board during detection. When defective products are detected, pictures and positions of defective welding points in the defective products can be stored in a defective area recording module, workers can quickly find the defective welding points conveniently during reprocessing, and reprocessing is carried out. When the detection device is used for AOI detection, efficiency is high, and detection is accurate.
Description
Technical field
The present invention relates to PCBA board detection field, particularly AOI automatic checkout equipment and detection method.
Background technology
Along with the development of society, electronic product gets more and more, and the essential core of electronic product is PCBA board, in the grafting welding process of electronic component, generally there will be defective products solder joint, therefore need to detect PCBA board, the solder joint of defective products is processed again, to reduce defective products rate, and market relies on the detection of artificial vision, defective products solder joint cannot be accomplished all to detect, and working strength is large, inefficiency, cannot meet the demand in market.
Summary of the invention
The technical matters that the present invention solves is to provide a kind ofly carries out to PCBA board the AOI automatic checkout equipment that AOI detects automatically.
The technical solution adopted for the present invention to solve the technical problems is: AOI automatic checkout equipment, comprise frame, machine frame inside is provided with transmitting device, frame top is provided with CCD camera, the camera lens of described CCD camera is towards transmitting device, also light source cover is provided with between CCD camera and transmitting device, described CCD camera can be taken a picture to the product on transmitting device through the through hole of light source cover, light source cover inside is provided with light source, also comprise control processor, described control processor is connected with CCD camera, described frame is also provided with display, described display is connected with control processor.
Further: the xsect of described light source cover becomes large by the upper end of light source cover gradually to the lower end of light source cover, and light source cover lower end covers the whole transmitting device of machine frame inside.
Further: the outlet of described frame and transmitting device both sides corresponding to the entrance of frame are also provided with dust cover.
The invention also discloses a kind of AOI automatic testing method, it comprises image capture module, coordinate analysis module, image processing module, non-defective unit picture storage module, defective region logging modle and display module, described image capture module is used for gathering image, described coordinate analysis module is used for image to carry out coordinate division, described image processing module is used for carrying out analyzing and processing to image, described defective region logging modle is used for carrying out coordinate record to the defective region of the defective products detected, described display module is for showing result.
The invention has the beneficial effects as follows: automatically can carry out AOI detection to PCBA board, and when detecting, coordinate division is carried out to PCBA board, when detection place defective products, the picture of the bad solder joint in defective products and position can be stored into defective region logging modle, facilitating workman can find bad solder joint fast when reprocessing, again processing, this equipment is when carrying out AOI and detecting, not only efficiency is high, and detects accurately.
Accompanying drawing explanation
Fig. 1 is AOI automatic checkout equipment schematic diagram.
Fig. 2 is AOI automatic checkout equipment side view.
Fig. 3 is AOI automatic testing method schematic diagram.
Be labeled as in figure: frame 1, transmitting device 2, light source cover 3, dust cover 4.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is further described.
The full name of AOI automatic checkout equipment (AOIAutomaticOpticInspection) is as shown in Figure 1 automatic optics inspection, comprise frame 1, frame 1 inside is provided with transmitting device 2, described transmitting device 2 can be belt transmission, chain transmission etc., frame 1 top is provided with CCD camera, the camera lens of described CCD camera is towards transmitting device 2, light source cover 3 is also provided with between CCD camera and transmitting device 2, described CCD camera can be taken a picture to the product on transmitting device 2 through the through hole of light source cover 3, light source cover 3 inside is provided with light source, also comprise control processor, described control processor is connected with CCD camera, described frame 1 is also provided with display, described display is connected with control processor, when detecting, PCBA board to be detected is placed on transmitting device 2, PCBA board to be detected is transferred to light source cover 3 place by transmitting device 2, when CCD detects PCBA board, it is taken a picture, and picture is sent to control processor, control processor carries out analyzing and processing to picture and result is shown over the display, this complete equipment can carry out AOI to PCBA board and automatically detect, improve detection efficiency and accuracy of detection, and workman only need observe display screen can know that PCBA board to be detected is non-defective unit or non-non-defective unit, decrease the labour intensity of workman.
In addition, the xsect of described light source cover 3 becomes large by the upper end of light source cover gradually to the lower end of light source cover, and light source cover 3 lower end covers the whole transmitting device 2 of frame 1 inside., this makes the light source in light source cover 3 disperse evenly, ensures the homogeneity of the light in PCBA board to be measured, makes to there will not be the bright one piece of dark situation of PCBA board lastblock to be measured, reduces the error that AOI detects.
Further, the outlet of described frame 1 and transmitting device 2 both sides corresponding to the entrance of frame 1 are also provided with dust cover 4, prevent dust from entering from frame 1 side and are scattered in PCBA board to be measured, cause AOI to detect and make mistakes.
The invention also discloses a kind of AOI automatic testing method, it comprises image capture module, coordinate analysis module, image processing module, non-defective unit picture storage module, defective region logging modle, described image capture module is used for gathering image, described coordinate analysis module is used for image to carry out coordinate division, described image processing module is used for carrying out analyzing and processing to image, described defective region logging modle is used for carrying out coordinate record to the defective region of the defective products detected, before detection, first gather the image of non-defective unit and be stored into non-defective unit picture storage module, during test, image acquisition is carried out to product to be tested, and image is sent to image processing module, image processing module respectively with coordinate analysis module, non-defective unit picture storage module is connected with defective region logging modle, image processing module the image collected is carried out coordinate divide and non-defective unit picture storage module in non-defective unit picture carry out analysiss contrast, if identical, then be illustrated as non-defective unit, what detect does not exist together, and illustrates to be bad solder joint herein, when detecting bad solder joint, by the picture of bad solder joint region and coordinate stored in defective region logging modle, and result is shown in display module, this method carries out coordinate division when detecting to PCBA board, when detecting defective products, the picture of the bad solder joint in defective products and position can be stored into defective region logging modle, facilitate workman can find bad solder joint fast when reprocessing, again process, and detect precisely, improve detection efficiency, reduce the labour intensity of workman.
Above-described specific embodiment; object of the present invention, technical scheme and beneficial effect are further described; be understood that; the foregoing is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any amendment made, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (4)
1.AOI automatic checkout equipment, it is characterized in that: comprise frame, machine frame inside is provided with transmitting device (2), frame top is provided with CCD camera, the camera lens of described CCD camera is towards transmitting device, light source cover (3) is also provided with between CCD camera and transmitting device (2), the through hole that described CCD camera can pass light source cover (3) is taken a picture to the product on transmitting device (2), light source cover (3) inside is provided with light source, also comprise control processor, described control processor is connected with CCD camera, (1) is also provided with display to described frame, described display is connected with control processor.
2. AOI automatic checkout equipment as claimed in claim 1, it is characterized in that: the xsect of described light source cover (3) becomes large by the upper end of light source cover gradually to the lower end of light source cover, and light source cover (3) lower end covers the inner whole transmitting device (2) of frame (1).
3. AOI automatic checkout equipment as claimed in claim 1, is characterized in that: the outlet of described frame (1) and transmitting device (2) both sides corresponding to the entrance of frame (1) are also provided with dust cover (4).
4.AOI automatic testing method, it is characterized in that: comprise image capture module, coordinate analysis module, image processing module, non-defective unit picture storage module, defective region logging modle and display module, described image capture module is used for gathering image, described coordinate analysis module is used for image to carry out coordinate division, described image processing module is used for carrying out analyzing and processing to image, described defective region logging modle is used for carrying out coordinate record to the defective region of the defective products detected, described display module is for showing result.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610005527.2A CN105486698A (en) | 2016-01-07 | 2016-01-07 | AOI automatic detection device and detection method |
Applications Claiming Priority (1)
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CN201610005527.2A CN105486698A (en) | 2016-01-07 | 2016-01-07 | AOI automatic detection device and detection method |
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CN105486698A true CN105486698A (en) | 2016-04-13 |
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CN201610005527.2A Pending CN105486698A (en) | 2016-01-07 | 2016-01-07 | AOI automatic detection device and detection method |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106290400A (en) * | 2016-07-29 | 2017-01-04 | 广东正业科技股份有限公司 | A hole inspection method and hole inspection equipment applied to boards |
CN108241118A (en) * | 2017-11-10 | 2018-07-03 | 精华电子(苏州)有限公司 | A kind of PCB connecting plates patch system of processing and method |
CN115096371A (en) * | 2022-07-13 | 2022-09-23 | 广州安通林灯具有限公司 | PCBA board detects and stamp-pad device |
Citations (5)
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CN101556251A (en) * | 2009-05-08 | 2009-10-14 | 西安理工大学 | CTP plate making quality testing method based on digital signal processor |
CN201653911U (en) * | 2010-02-02 | 2010-11-24 | 方向阳 | Medical print visual detection device |
CN202049155U (en) * | 2011-01-18 | 2011-11-23 | 牛海蛟 | Blood quality vision inspection apparatus |
CN204128986U (en) * | 2014-07-15 | 2015-01-28 | 青岛海之晨工业装备有限公司 | A kind of AOI automatic optical checking machine |
CN104568985A (en) * | 2014-12-30 | 2015-04-29 | 东莞市合易自动化科技有限公司 | A kind of AOI optical detection equipment |
-
2016
- 2016-01-07 CN CN201610005527.2A patent/CN105486698A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101556251A (en) * | 2009-05-08 | 2009-10-14 | 西安理工大学 | CTP plate making quality testing method based on digital signal processor |
CN201653911U (en) * | 2010-02-02 | 2010-11-24 | 方向阳 | Medical print visual detection device |
CN202049155U (en) * | 2011-01-18 | 2011-11-23 | 牛海蛟 | Blood quality vision inspection apparatus |
CN204128986U (en) * | 2014-07-15 | 2015-01-28 | 青岛海之晨工业装备有限公司 | A kind of AOI automatic optical checking machine |
CN104568985A (en) * | 2014-12-30 | 2015-04-29 | 东莞市合易自动化科技有限公司 | A kind of AOI optical detection equipment |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106290400A (en) * | 2016-07-29 | 2017-01-04 | 广东正业科技股份有限公司 | A hole inspection method and hole inspection equipment applied to boards |
CN108241118A (en) * | 2017-11-10 | 2018-07-03 | 精华电子(苏州)有限公司 | A kind of PCB connecting plates patch system of processing and method |
CN108241118B (en) * | 2017-11-10 | 2020-08-18 | 精华电子(苏州)有限公司 | PCB (printed circuit board) connecting plate paster processing system and method |
CN115096371A (en) * | 2022-07-13 | 2022-09-23 | 广州安通林灯具有限公司 | PCBA board detects and stamp-pad device |
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Application publication date: 20160413 |
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