CN104551301A - Full-automatic intelligent-welding assembly line - Google Patents
Full-automatic intelligent-welding assembly line Download PDFInfo
- Publication number
- CN104551301A CN104551301A CN201410839762.0A CN201410839762A CN104551301A CN 104551301 A CN104551301 A CN 104551301A CN 201410839762 A CN201410839762 A CN 201410839762A CN 104551301 A CN104551301 A CN 104551301A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- bad
- solder joint
- aoi device
- coordinate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 title claims abstract description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 31
- 238000005476 soldering Methods 0.000 claims abstract description 29
- 238000005507 spraying Methods 0.000 claims abstract description 29
- 230000002950 deficient Effects 0.000 claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 claims abstract description 19
- 229910000679 solder Inorganic materials 0.000 claims description 37
- 239000000843 powder Substances 0.000 claims description 9
- 238000001514 detection method Methods 0.000 claims description 4
- 230000008439 repair process Effects 0.000 abstract description 5
- 150000003071 polychlorinated biphenyls Chemical class 0.000 abstract 4
- 239000003595 mist Substances 0.000 abstract 3
- 230000004907 flux Effects 0.000 abstract 2
- 238000012423 maintenance Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 235000012364 Peperomia pellucida Nutrition 0.000 description 3
- 240000007711 Peperomia pellucida Species 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/082—Flux dispensers; Apparatus for applying flux
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the technical field of manufacture of PCB (printed circuit board) electron and power control boards, in particular to a full-automatic intelligent-welding assembly line. The full-automatic intelligent-welding assembly line comprises an AOI device, a selective mist sprayer, a selective soldering machine and a conveying device, wherein the AOI device is used for photographing PCBs to be compared with images of non-defective PCBs and calculating coordinates of defective soldering points through software; the selective mist sprayer is used for spraying soldering flux to the defective soldering points on the PCBs; the selective soldering machine is used for correcting soldering of the defective soldering points; the conveying device is used for sequentially conveying the PCBs to the AOI device, the selective mist sprayer and the selective soldering machine. The defective soldering points can be accurately positioned, the soldering flux and soldering tin can be sprayed one to one, maintenance and repair rate is high, production efficiency and quality of products are improved, and labor cost is reduced.
Description
Technical field
The present invention relates to pcb board manufacture technology field, specifically, relate to a kind of intelligent welding automatic production line.
Background technology
Along with the development of society, electronic product gets more and more, electronic product and our daily life closely bound up, in the production process of electronic product, in the grafting welding process of electronic component, generally there will be defective products solder joint, therefore need to detect pcb board, the solder joint of defective products is processed again, to improve yields, at present, a lot of producers adopts AOI device to detect pcb board, if find that there is bad solder joint, then bad solder joint is marked, and then by manually repairing; Because the welding process requirement of pcb board is higher, adopt and manually repair, difficult quality guarantee, and efficiency is lower.
Summary of the invention
The object of the invention is to solve the deficiencies in the prior art, provide a kind of intelligent welding automatic production line, this this production line can mark defective pcb board, when the later stage repairs, revise targetedly, substitute artificial reparation, increase work efficiency, quality is guaranteed.
For achieving the above object and adopt technical scheme be:
A kind of intelligent welding automatic production line, comprising:
AOI device, for for carrying out image photographic to pcb board and non-defective unit pcb board image forms comparison, being calculated the coordinate of bad bump, and externally being sent by the coordinate information of bad bump by software;
Select spraying machine, for spraying scaling powder to the bad solder joint on pcb board; First receive the coordinate information of the bad bump that AOI device sends, then for bad bump spraying scaling powder;
Select tin soldering machine, for carrying out correction scolding tin to bad solder joint; First receive the coordinate information of the bad bump that AOI device sends, scolding tin is carried out to bad solder joint;
Conveyer, for being transferred to AOI device successively, selecting spraying machine and select tin soldering machine by pcb board.
Further, described AOI device is provided with image capturing system, image capturing system stores non-defective unit pcb board image, image capturing system is compared to the pcb board image gathered and non-defective unit pcb board image, coordinate division is carried out to the pcb board image gathered simultaneously, when bad solder joint appears in pcb board, image capturing system carries out coordinate mark to the bad solder joint on pcb board, records the coordinate of bad solder joint; Described AOI device is also provided with sender unit, and the coordinate information of pcb board picture and bad solder joint externally sends by sender unit, and described selection spraying machine and selection tin soldering machine are equipped with signal receiving device.
Further, described a kind of intelligent welding automatic production line, also comprises: cross trigger for the detection AOI device rechecked pcb board with for what distinguish non-defective unit, detect AOI device with trigger signal be connected.
Beneficial effect of the present invention is: the present invention accurately can locate bad solder joint, and man-to-man spraying scaling powder and scolding tin, detect and repair rate very high, improve production efficiency and quality thereof, reduce cost of labor.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the present invention is further illustrated.
Embodiment:
A kind of intelligent welding automatic production line, comprising:
AOI device, for for carrying out image photographic to pcb board, and being formed comparison with non-defective unit pcb board image, being calculated the coordinate of bad bump by software;
Select spraying machine, for spraying scaling powder to the bad solder joint on pcb board;
Select tin soldering machine, for carrying out correction scolding tin to bad solder joint;
Conveyer, for being transferred to AOI device successively, selecting spraying machine and select tin soldering machine by pcb board.
In the specific implementation, pcb board is transferred to AOI device, selects spraying machine and select tin soldering machine by conveyer successively.Pcb board is first transferred to the detection position of AOI device by conveyer, AOI device carries out image photographic to pcb board and non-defective unit pcb board image forms comparison, the coordinate of bad bump is calculated by software, and the coordinate of bad bump given selection spraying machine and select tin soldering machine, select spraying machine and selection tin soldering machine to carry out spraying scaling powder and scolding tin respectively according to the bad solder joint of the coordinate of bad bump.This production line forms full-automatic structure, substitutes and manually repairs, full process automatization process, improves yields and formation efficiency.AOI device is optical detector, and conveyer can be belt conveyer, chain transmission device etc.Pcb board, when carrying out image photographic, is moved to desired location by fixture by AOI device, as desired location is provided with sensor, then stops mobile, locate for auxiliary photo-taking when fixture moves to sensing station; When acquisition pcb board image, carry out division coordinate to pcb board image, and compare with non-defective unit pcb board image, the image of non-defective unit pcb board can first be stored in the memory of AOI device; Find out bad bond pad locations by software and calculate the coordinate of bad solder joint, then the coordinate of bad solder joint being sent to and select spraying machine and select tin soldering machine.
Further, described AOI device is provided with image capturing system, image capturing system stores non-defective unit pcb board image, image capturing system is compared to the pcb board image gathered and non-defective unit pcb board image, coordinate division is carried out to the pcb board image gathered simultaneously, when bad solder joint appears in pcb board, image capturing system carries out coordinate mark to the bad solder joint on pcb board, records the coordinate of bad solder joint; Described AOI device is also provided with sender unit, and the coordinate information of pcb board picture and bad solder joint externally sends by sender unit, and described selection spraying machine and selection tin soldering machine are equipped with signal receiving device.Select spraying machine to carry out spraying scaling powder to bad solder joint, select tin soldering machine to carry out scolding tin to bad solder joint.
In the technical program, be provided with image capturing system by AOI device, this image capturing system carries out coordinate division to pcb board picture, and compares with non-defective unit pcb board image, finds out bad solder joint; Bad bond pad locations is corresponded in the coordinate of picture, bad solder joint can be oriented accurately, and the coordinates transmission of bad solder joint given selection spraying machine and select tin soldering machine, select spraying machine to realize man-to-man scaling powder spraying according to coordinate data to bad solder joint, select tin soldering machine also according to coordinate data, bad solder joint to be realized to man-to-man scolding tin, drags tin.In the specific implementation, sender unit, signal receiving device can be all WiFi device, arrange a WiFi router on a production line; By WiFi router, signal is forwarded.Conveniently coordinate value shares, and AOI device, selection spraying machine, selection tin soldering machine all adopt identical workbench, namely adopt identical control pcb board motion.
Further, described a kind of intelligent welding automatic production line, also comprises: cross trigger for the detection AOI device rechecked pcb board with for what distinguish non-defective unit, detect AOI device with trigger signal be connected.
After selection tin-spraying machine carries out scolding tin to bad solder joint, drags tin, pcb board is sent on another AOI device and rechecks by conveyer, the image capturing system of AOI device classifies (non-defective unit and substandard products) to pcb board, and the data-signal of classification was passed to trigger, cross trigger to classify to pcb board, the pcb board still with bad solder joint collects defective products district, and qualified pcb board enters into next step technique.
The present invention has done to explain, and those of ordinary skill in the art should be appreciated that and can modify to technical scheme of the present invention or equivalent replacement, and does not depart from essence and the scope of technical solution of the present invention, as simple alteration of form.
Claims (3)
1. an intelligent welding automatic production line, is characterized in that: comprising:
AOI device, for for carrying out image photographic to pcb board and non-defective unit pcb board image forms comparison, being calculated the coordinate of bad bump, and externally being sent by the coordinate information of bad bump by software;
Select spraying machine, first receive the coordinate information of the bad bump that AOI device sends, then for bad bump spraying scaling powder;
Select tin soldering machine, first receive the coordinate information of the bad bump that AOI device sends, scolding tin is carried out to bad solder joint;
Conveyer, for being transferred to AOI device successively, selecting spraying machine and select tin soldering machine by pcb board.
2. a kind of intelligent welding automatic production line according to claim 1, it is characterized in that: described AOI device is provided with image capturing system, image capturing system stores non-defective unit pcb board image, image capturing system is compared to the pcb board image gathered and non-defective unit pcb board image, coordinate division is carried out to the pcb board image gathered simultaneously, when bad solder joint appears in pcb board, image capturing system carries out coordinate mark to the bad solder joint on pcb board, records the coordinate of bad solder joint; Described AOI device is also provided with sender unit, the coordinate information of pcb board picture and bad solder joint externally sends by sender unit, described selection spraying machine and selection tin soldering machine are equipped with signal receiving device, select spraying machine to carry out spraying scaling powder to bad solder joint, select tin soldering machine to carry out scolding tin to bad solder joint.
3. a kind of intelligent welding automatic production line according to claim 1, it is characterized in that: described a kind of intelligent welding automatic production line, also comprise: cross trigger for the detection AOI device rechecked pcb board with for what distinguish non-defective unit, detect AOI device and be connected with trigger signal excessively.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410839762.0A CN104551301A (en) | 2014-12-30 | 2014-12-30 | Full-automatic intelligent-welding assembly line |
| TW104220148U TWM528570U (en) | 2014-12-30 | 2015-12-15 | Intelligent welding fully automatic production line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410839762.0A CN104551301A (en) | 2014-12-30 | 2014-12-30 | Full-automatic intelligent-welding assembly line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104551301A true CN104551301A (en) | 2015-04-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410839762.0A Pending CN104551301A (en) | 2014-12-30 | 2014-12-30 | Full-automatic intelligent-welding assembly line |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104551301A (en) |
| TW (1) | TWM528570U (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104965322A (en) * | 2015-07-17 | 2015-10-07 | 深圳晶华显示器材有限公司 | Method for preventing LCD product deficient segment leak detection |
| CN107403737A (en) * | 2016-05-18 | 2017-11-28 | 财团法人工业技术研究院 | Automatic packaging production line, packaging method and packaging system |
| CN107743342A (en) * | 2017-10-18 | 2018-02-27 | 广东生益科技股份有限公司 | PCB surface treatment method and equipment |
| CN108882543A (en) * | 2018-10-17 | 2018-11-23 | 快克智能装备股份有限公司 | A kind of automatic AOI repair welding system and method |
| CN110455822A (en) * | 2019-07-10 | 2019-11-15 | 苏州卓融新能源科技有限公司 | A kind of detection method of pcb board defect |
| CN110961742A (en) * | 2019-11-21 | 2020-04-07 | 嘉兴光弘科技电子有限公司 | Wave-soldering selective spraying process |
| CN112247304A (en) * | 2020-09-09 | 2021-01-22 | 东莞市神州视觉科技有限公司 | Selective wave soldering method and system for PCB board repair |
| CN112548256A (en) * | 2020-11-27 | 2021-03-26 | 温州瓯斯达电器实业有限公司 | Direct-insertion type electric heating mosquito-repellent incense piece heater circuit board welding production line |
| CN112916978A (en) * | 2021-01-22 | 2021-06-08 | 苏州浪潮智能科技有限公司 | Automatic repair method for poor wave soldering and DIP (dual in-line package) process |
| CN113305384A (en) * | 2021-05-08 | 2021-08-27 | 苏州加贺智能设备有限公司 | Intelligent repair welding method and system |
| CN114062391A (en) * | 2020-08-06 | 2022-02-18 | 苏州加贺智能设备有限公司 | Detection method and system of automatic optical detection equipment |
| CN114522898A (en) * | 2022-02-17 | 2022-05-24 | 立川(无锡)半导体设备有限公司 | AOI (automated optical inspection) method for component |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004117276A (en) * | 2002-09-27 | 2004-04-15 | Ricoh Microelectronics Co Ltd | Soldering quality determining method, device and system, and printed board manufacturing system and program |
| CN1504742A (en) * | 2002-11-28 | 2004-06-16 | 威光机械工程股份有限公司 | Automatic optical detection system for defective components on printed circuit board |
| CN1677118A (en) * | 2004-03-31 | 2005-10-05 | 安立株式会社 | Printed circuit board checking device |
| CN1828217A (en) * | 2005-03-04 | 2006-09-06 | Aju高技术公司 | Automatic optical detection system and method |
| JP2007242944A (en) * | 2006-03-09 | 2007-09-20 | Fuji Electric Holdings Co Ltd | Method and device for evaluating solder wettability |
| CN101592620A (en) * | 2008-05-28 | 2009-12-02 | 华硕电脑股份有限公司 | Circuit substrate detection device and method |
| CN102145324A (en) * | 2011-03-16 | 2011-08-10 | 深圳创维－Rgb电子有限公司 | Automatic spray coating method and device |
| WO2012000648A1 (en) * | 2010-06-28 | 2012-01-05 | Precitec Kg | Method for closed-loop controlling a laser processing operation and laser material processing head using the same |
| KR20130023603A (en) * | 2011-08-29 | 2013-03-08 | 삼성테크윈 주식회사 | Apparatus for detecting flux condition and detecting method thereof |
| CN103624359A (en) * | 2012-08-22 | 2014-03-12 | 深圳市鑫金桥自动化设备有限公司 | Device and method for spraying scaling powder in fixed-point mode |
| CN103687328A (en) * | 2012-09-26 | 2014-03-26 | 光宝电子(广州)有限公司 | A soldering tin detecting and automatically-repairing system and a method thereof |
-
2014
- 2014-12-30 CN CN201410839762.0A patent/CN104551301A/en active Pending
-
2015
- 2015-12-15 TW TW104220148U patent/TWM528570U/en not_active IP Right Cessation
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004117276A (en) * | 2002-09-27 | 2004-04-15 | Ricoh Microelectronics Co Ltd | Soldering quality determining method, device and system, and printed board manufacturing system and program |
| CN1504742A (en) * | 2002-11-28 | 2004-06-16 | 威光机械工程股份有限公司 | Automatic optical detection system for defective components on printed circuit board |
| CN1677118A (en) * | 2004-03-31 | 2005-10-05 | 安立株式会社 | Printed circuit board checking device |
| CN1828217A (en) * | 2005-03-04 | 2006-09-06 | Aju高技术公司 | Automatic optical detection system and method |
| JP2007242944A (en) * | 2006-03-09 | 2007-09-20 | Fuji Electric Holdings Co Ltd | Method and device for evaluating solder wettability |
| CN101592620A (en) * | 2008-05-28 | 2009-12-02 | 华硕电脑股份有限公司 | Circuit substrate detection device and method |
| WO2012000648A1 (en) * | 2010-06-28 | 2012-01-05 | Precitec Kg | Method for closed-loop controlling a laser processing operation and laser material processing head using the same |
| CN102145324A (en) * | 2011-03-16 | 2011-08-10 | 深圳创维－Rgb电子有限公司 | Automatic spray coating method and device |
| KR20130023603A (en) * | 2011-08-29 | 2013-03-08 | 삼성테크윈 주식회사 | Apparatus for detecting flux condition and detecting method thereof |
| CN103624359A (en) * | 2012-08-22 | 2014-03-12 | 深圳市鑫金桥自动化设备有限公司 | Device and method for spraying scaling powder in fixed-point mode |
| CN103687328A (en) * | 2012-09-26 | 2014-03-26 | 光宝电子(广州)有限公司 | A soldering tin detecting and automatically-repairing system and a method thereof |
Non-Patent Citations (2)
| Title |
|---|
| 姚立新等: "AOI系统在PCB中的应用", 《电子工业专用设备》, no. 05, 15 May 2004 (2004-05-15) * |
| 鲜飞: "AOI技术在SMT生产上的应用", 《电气制造》, no. 11, 25 November 2008 (2008-11-25) * |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104965322A (en) * | 2015-07-17 | 2015-10-07 | 深圳晶华显示器材有限公司 | Method for preventing LCD product deficient segment leak detection |
| CN107403737A (en) * | 2016-05-18 | 2017-11-28 | 财团法人工业技术研究院 | Automatic packaging production line, packaging method and packaging system |
| CN107743342A (en) * | 2017-10-18 | 2018-02-27 | 广东生益科技股份有限公司 | PCB surface treatment method and equipment |
| CN108882543A (en) * | 2018-10-17 | 2018-11-23 | 快克智能装备股份有限公司 | A kind of automatic AOI repair welding system and method |
| CN108882543B (en) * | 2018-10-17 | 2019-01-29 | 快克智能装备股份有限公司 | A kind of automatic AOI repair welding system and method |
| CN110455822A (en) * | 2019-07-10 | 2019-11-15 | 苏州卓融新能源科技有限公司 | A kind of detection method of pcb board defect |
| CN110961742A (en) * | 2019-11-21 | 2020-04-07 | 嘉兴光弘科技电子有限公司 | Wave-soldering selective spraying process |
| CN114062391A (en) * | 2020-08-06 | 2022-02-18 | 苏州加贺智能设备有限公司 | Detection method and system of automatic optical detection equipment |
| CN112247304A (en) * | 2020-09-09 | 2021-01-22 | 东莞市神州视觉科技有限公司 | Selective wave soldering method and system for PCB board repair |
| CN112548256A (en) * | 2020-11-27 | 2021-03-26 | 温州瓯斯达电器实业有限公司 | Direct-insertion type electric heating mosquito-repellent incense piece heater circuit board welding production line |
| CN112916978A (en) * | 2021-01-22 | 2021-06-08 | 苏州浪潮智能科技有限公司 | Automatic repair method for poor wave soldering and DIP (dual in-line package) process |
| CN113305384A (en) * | 2021-05-08 | 2021-08-27 | 苏州加贺智能设备有限公司 | Intelligent repair welding method and system |
| CN114522898A (en) * | 2022-02-17 | 2022-05-24 | 立川(无锡)半导体设备有限公司 | AOI (automated optical inspection) method for component |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM528570U (en) | 2016-09-11 |
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Application publication date: 20150429 |
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