KR102741460B1 - 산화갈륨 기판, 및 산화갈륨 기판의 제조 방법 - Google Patents
산화갈륨 기판, 및 산화갈륨 기판의 제조 방법 Download PDFInfo
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- KR102741460B1 KR102741460B1 KR1020217031454A KR20217031454A KR102741460B1 KR 102741460 B1 KR102741460 B1 KR 102741460B1 KR 1020217031454 A KR1020217031454 A KR 1020217031454A KR 20217031454 A KR20217031454 A KR 20217031454A KR 102741460 B1 KR102741460 B1 KR 102741460B1
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- 239000000758 substrate Substances 0.000 title claims abstract description 124
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 title claims abstract description 117
- 229910001195 gallium oxide Inorganic materials 0.000 title claims abstract description 117
- 238000000034 method Methods 0.000 title claims description 28
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 238000005259 measurement Methods 0.000 claims abstract description 5
- 238000005498 polishing Methods 0.000 claims description 170
- 239000002245 particle Substances 0.000 claims description 34
- 239000002002 slurry Substances 0.000 claims description 18
- 238000009826 distribution Methods 0.000 claims description 3
- 238000002296 dynamic light scattering Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 13
- 239000013078 crystal Substances 0.000 description 11
- 238000012546 transfer Methods 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000008119 colloidal silica Substances 0.000 description 7
- 229910003460 diamond Inorganic materials 0.000 description 7
- 239000010432 diamond Substances 0.000 description 7
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002612 dispersion medium Substances 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/18, H10D48/04 and H10D48/07, with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
- H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/463—Mechanical treatment, e.g. grinding, ultrasonic treatment
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G15/00—Compounds of gallium, indium or thallium
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/16—Oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/50—Physical imperfections
- H10D62/57—Physical imperfections the imperfections being on the surface of the semiconductor body, e.g. the body having a roughened surface
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
도 2는, 도 1의 1차 편면 연마를 실시하는 편면 연마 장치의 일례를 도시하는 사시도이다.
도 3은, 도 1의 1차 편면 연마를 실시하는 편면 연마 장치의 일례를 도시하는 단면도이다.
도 4는, 도 1의 양면 연마를 실시하는 양면 연마 장치의 일례를 도시하는 사시도이다.
도 5는, 도 1의 양면 연마를 실시하는 양면 연마 장치의 일례를 도시하는 단면도이다.
도 6은, 제1 최대 고저차(PV1)를 측정할 때의, 산화갈륨 기판의 상태의 일례를 도시하는 단면도이다.
도 7은, j=1(n=0, m=0), j=2(n=1, m=1), j=4(n=2, m=0), j=9(n=4, m=0)의 각각의 znm(r,θ)를 도시하는 도면이다.
도 8은, 제2 최대 고저차(PV2)를 측정할 때의, 산화갈륨 기판의 상태의 일례를 도시하는 단면도이다.
11: 제1 주표면
12: 제2 주표면
Claims (5)
- 제1 주표면과, 상기 제1 주표면과는 반대 방향의 제2 주표면을 갖는, 산화갈륨 기판으로서,
상기 제1 주표면은, {001}면이거나 {001}면에 대하여 원하는 오프각을 갖는 면이고,
상기 제1 주표면의 최소 제곱 평면을 기준면으로 하는 상기 제1 주표면의 고저차의 측정 데이터 z0(r,θ)를 하기 식 (1)의 z(r,θ)로 근사하면,
상기 제2 주표면을 수평한 평탄면에 마주보게 하여 적재한 때의, j가 4, 9, 16, 25, 36, 49, 64, 81인 모든 anmznm(r,θ)를 더한 성분의 제1 최대 고저차(PV1)를 상기 제1 주표면의 직경(D)으로 나눈 값(PV1/D)이 0.39×10-4 이하이고,
상기 제2 주표면을 평탄한 척면에 마주보게 하여 전체면 흡착한 때의, j가 4 이상 81 이하인 모든 anmznm(r,θ)를 더한 성분의 제2 최대 고저차(PV2)를 상기 제1 주표면의 직경(D)으로 나눈 값(PV2/D)이 0.59×10-4 이하인, 산화갈륨 기판.
상기 식 (1)∼(5)에 있어서, (r,θ)는 기준면 상의 극좌표이며, n은 0 이상 k 이하의 자연수이며, k는 16이고, n이 짝수인 경우에는 m은 -n부터 +n까지의 범위의 짝수만이며, n이 홀수인 경우에는 m은 -n부터 +n까지의 범위의 홀수만이며, j는 n과 k의 조합을 나타내는 지수이며, anm은 계수이다. - 제1항에 있어서, 상기 제1 최대 고저차(PV1)가 2㎛ 이하이고,
상기 제2 최대 고저차(PV2)가 3㎛ 이하인, 산화갈륨 기판. - 제1 주표면과, 상기 제1 주표면과는 반대 방향의 제2 주표면을 갖는, 산화갈륨 기판의 제조 방법으로서,
상기 제1 주표면은, {001}면이거나 {001}면에 대하여 원하는 오프각을 갖는 면이고,
상기 제조 방법은, 모스 경도가 7 이하인 입자를 포함하는 연마 슬러리에 의해, 상기 제1 주표면과 상기 제2 주표면을 동시에 연마하는 것을 포함하는, 산화갈륨 기판의 제조 방법. - 제3항에 있어서, 상기 연마 슬러리에 포함되는 상기 입자의 동적 광산란법으로 측정한 입자경 분포에 있어서의 체적 기준의 적산 분율의 50% 직경이 1㎛ 이하인, 산화갈륨 기판의 제조 방법.
- 제3항 또는 제4항에 있어서, 상기 제1 주표면과 상기 제2 주표면을 동시에 연마하는 시간의 전반기의 50% 이상에서, 연마압이 9.8kPa 이하인, 산화갈륨 기판의 제조 방법.
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JP2019073548 | 2019-04-08 | ||
JPJP-P-2019-073548 | 2019-04-08 | ||
PCT/JP2020/011995 WO2020209022A1 (ja) | 2019-04-08 | 2020-03-18 | 酸化ガリウム基板、および酸化ガリウム基板の製造方法 |
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KR20210146307A KR20210146307A (ko) | 2021-12-03 |
KR102741460B1 true KR102741460B1 (ko) | 2024-12-12 |
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Country Status (6)
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US (2) | US20220028700A1 (ko) |
JP (1) | JP7359203B2 (ko) |
KR (1) | KR102741460B1 (ko) |
CN (2) | CN120158818A (ko) |
TW (1) | TWI849086B (ko) |
WO (1) | WO2020209022A1 (ko) |
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JP7083139B1 (ja) | 2021-08-06 | 2022-06-10 | 株式会社タムラ製作所 | 半導体基板、半導体ウエハ、及び半導体ウエハの製造方法 |
CN114523463B (zh) * | 2022-02-17 | 2023-08-25 | 清华大学 | 一种分布式极坐标定位抓取系统 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008105883A (ja) * | 2006-10-24 | 2008-05-08 | Nippon Light Metal Co Ltd | 酸化ガリウム単結晶基板及びその製造方法 |
JP2014024960A (ja) * | 2012-07-26 | 2014-02-06 | Fujimi Inc | 研磨用組成物、酸化物材料の研磨方法及び酸化物材料基板の製造方法 |
WO2019188747A1 (ja) * | 2018-03-28 | 2019-10-03 | 株式会社フジミインコーポレーテッド | ガリウム化合物系半導体基板研磨用組成物 |
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JP4610151B2 (ja) * | 1999-12-30 | 2011-01-12 | ケーエルエー−テンカー・コーポレーション | 雑音低減方法、雑音低減装置およびウエ−ハ形状の再構成方法 |
TWI305262B (en) * | 2005-05-10 | 2009-01-11 | Nat Applied Res Laboratories | Method for whole field thin film stress evaluation |
US9227295B2 (en) * | 2011-05-27 | 2016-01-05 | Corning Incorporated | Non-polished glass wafer, thinning system and method for using the non-polished glass wafer to thin a semiconductor wafer |
US9716004B2 (en) * | 2011-09-08 | 2017-07-25 | Tamura Corporation | Crystal laminate structure and method for producing same |
JP5807282B2 (ja) * | 2011-09-08 | 2015-11-10 | 株式会社タムラ製作所 | Ga2O3系半導体素子 |
JP6066210B2 (ja) * | 2011-09-08 | 2017-01-25 | 株式会社タムラ製作所 | Ga2O3系半導体素子 |
US9430593B2 (en) * | 2012-10-11 | 2016-08-30 | Kla-Tencor Corporation | System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chucking |
JP5747110B1 (ja) * | 2014-06-30 | 2015-07-08 | 株式会社タムラ製作所 | Ga2O3系単結晶基板 |
JP2016015374A (ja) * | 2014-07-01 | 2016-01-28 | 株式会社タムラ製作所 | 半導体積層構造体及び半導体素子 |
JP6013410B2 (ja) * | 2014-08-07 | 2016-10-25 | 株式会社タムラ製作所 | Ga2O3系単結晶基板 |
CN106711032B (zh) * | 2016-12-09 | 2019-03-29 | 盐城工学院 | 适用于硬脆易解理单晶氧化镓晶片的高效低损伤研磨方法 |
CN110612579A (zh) * | 2017-05-09 | 2019-12-24 | 株式会社Flosfia | 热敏电阻膜及其成膜方法 |
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- 2020-03-18 WO PCT/JP2020/011995 patent/WO2020209022A1/ja active Application Filing
- 2020-03-18 CN CN202510319256.7A patent/CN120158818A/zh active Pending
- 2020-03-18 KR KR1020217031454A patent/KR102741460B1/ko active Active
- 2020-03-18 CN CN202080024107.3A patent/CN113646470B/zh active Active
- 2020-03-18 JP JP2021513541A patent/JP7359203B2/ja active Active
- 2020-03-23 TW TW109109552A patent/TWI849086B/zh active
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2021
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008105883A (ja) * | 2006-10-24 | 2008-05-08 | Nippon Light Metal Co Ltd | 酸化ガリウム単結晶基板及びその製造方法 |
JP2014024960A (ja) * | 2012-07-26 | 2014-02-06 | Fujimi Inc | 研磨用組成物、酸化物材料の研磨方法及び酸化物材料基板の製造方法 |
WO2019188747A1 (ja) * | 2018-03-28 | 2019-10-03 | 株式会社フジミインコーポレーテッド | ガリウム化合物系半導体基板研磨用組成物 |
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US20220028700A1 (en) | 2022-01-27 |
CN120158818A (zh) | 2025-06-17 |
US20250167006A1 (en) | 2025-05-22 |
TWI849086B (zh) | 2024-07-21 |
CN113646470A (zh) | 2021-11-12 |
WO2020209022A1 (ja) | 2020-10-15 |
KR20210146307A (ko) | 2021-12-03 |
CN113646470B (zh) | 2025-04-11 |
JPWO2020209022A1 (ko) | 2020-10-15 |
JP7359203B2 (ja) | 2023-10-11 |
TW202037453A (zh) | 2020-10-16 |
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