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KR102656740B1 - 지지체 부착 수지 시트 - Google Patents

지지체 부착 수지 시트 Download PDF

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Publication number
KR102656740B1
KR102656740B1 KR1020170023675A KR20170023675A KR102656740B1 KR 102656740 B1 KR102656740 B1 KR 102656740B1 KR 1020170023675 A KR1020170023675 A KR 1020170023675A KR 20170023675 A KR20170023675 A KR 20170023675A KR 102656740 B1 KR102656740 B1 KR 102656740B1
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KR
South Korea
Prior art keywords
resin
resin composition
support
manufactured
mass
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KR1020170023675A
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English (en)
Korean (ko)
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KR20170100434A (ko
Inventor
히로히사 나라하시
시게오 나카무라
Original Assignee
아지노모토 가부시키가이샤
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Publication of KR20170100434A publication Critical patent/KR20170100434A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
KR1020170023675A 2016-02-25 2017-02-22 지지체 부착 수지 시트 Active KR102656740B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-034435 2016-02-25
JP2016034435A JP6728760B2 (ja) 2016-02-25 2016-02-25 支持体付き樹脂シート

Publications (2)

Publication Number Publication Date
KR20170100434A KR20170100434A (ko) 2017-09-04
KR102656740B1 true KR102656740B1 (ko) 2024-04-15

Family

ID=59717178

Family Applications (1)

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KR1020170023675A Active KR102656740B1 (ko) 2016-02-25 2017-02-22 지지체 부착 수지 시트

Country Status (4)

Country Link
JP (1) JP6728760B2 (zh)
KR (1) KR102656740B1 (zh)
CN (1) CN107118515B (zh)
TW (1) TWI726988B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6993324B2 (ja) * 2017-03-10 2022-01-13 積水化学工業株式会社 樹脂材料、積層フィルム及び多層プリント配線板
JP6870544B2 (ja) * 2017-09-04 2021-05-12 味の素株式会社 樹脂組成物
JP2019157027A (ja) * 2018-03-15 2019-09-19 日立化成株式会社 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及びその製造方法
JP6992635B2 (ja) * 2018-03-22 2022-01-13 味の素株式会社 樹脂組成物
JP7196551B2 (ja) * 2018-11-14 2022-12-27 味の素株式会社 支持体付き樹脂シート及び樹脂組成物層
JP2020094089A (ja) * 2018-12-10 2020-06-18 積水化学工業株式会社 樹脂材料及び多層プリント配線板
JP7363182B2 (ja) * 2019-08-09 2023-10-18 味の素株式会社 感光性樹脂組成物、感光性樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置
WO2021108955A1 (zh) * 2019-12-02 2021-06-10 中国科学院深圳先进技术研究院 一种高频低损耗绝缘胶膜材料及其制备方法
JP7435165B2 (ja) * 2020-03-30 2024-02-21 味の素株式会社 プリント配線板の製造方法
JP7552315B2 (ja) * 2020-12-07 2024-09-18 味の素株式会社 プリント配線板の製造方法
JP7700457B2 (ja) * 2021-01-14 2025-07-01 味の素株式会社 樹脂組成物
WO2022196617A1 (ja) * 2021-03-17 2022-09-22 Ａｇｃ株式会社 金属張積層板および配線基板
JP2024010578A (ja) * 2022-07-12 2024-01-24 富士フイルムビジネスイノベーション株式会社 画像形成装置用樹脂ベルト、定着ベルト、定着装置及び画像形成装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014013854A (ja) * 2012-07-05 2014-01-23 Ajinomoto Co Inc 支持体付き樹脂シート

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI234210B (en) * 2002-12-03 2005-06-11 Sanyo Electric Co Semiconductor module and manufacturing method thereof as well as wiring member of thin sheet
JP2004200668A (ja) * 2002-12-03 2004-07-15 Sanyo Electric Co Ltd 半導体装置およびその製造方法ならびに薄板状配線部材
JP4825286B2 (ja) * 2009-08-07 2011-11-30 ナミックス株式会社 多層配線板の製造方法
JP2013077590A (ja) * 2011-09-29 2013-04-25 Tamura Seisakusho Co Ltd 層間絶縁用の樹脂フィルムおよびビルドアップ配線基板
JP6044139B2 (ja) 2012-07-06 2016-12-14 味の素株式会社 絶縁樹脂シート
JP6098988B2 (ja) * 2012-09-28 2017-03-22 味の素株式会社 支持体含有プレポリマーシート
KR102339434B1 (ko) * 2013-10-03 2021-12-14 주식회사 쿠라레 열가소성 액정 폴리머 필름, 회로 기판, 및 그들의 제조 방법
JP5828881B2 (ja) * 2013-12-24 2015-12-09 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
JP6761224B2 (ja) * 2014-02-19 2020-09-23 味の素株式会社 プリント配線板、半導体装置及び樹脂シートセット
JP6164113B2 (ja) * 2014-02-19 2017-07-19 味の素株式会社 支持体付き樹脂シート
JP2016035969A (ja) * 2014-08-01 2016-03-17 味の素株式会社 回路基板及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014013854A (ja) * 2012-07-05 2014-01-23 Ajinomoto Co Inc 支持体付き樹脂シート

Also Published As

Publication number Publication date
JP6728760B2 (ja) 2020-07-22
JP2017149861A (ja) 2017-08-31
KR20170100434A (ko) 2017-09-04
TWI726988B (zh) 2021-05-11
TW201801589A (zh) 2018-01-01
CN107118515A (zh) 2017-09-01
CN107118515B (zh) 2021-01-01

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