KR102607186B1 - antenna built-in heat dissipation pad, and manufacturing method thereof - Google Patents
antenna built-in heat dissipation pad, and manufacturing method thereof Download PDFInfo
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- KR102607186B1 KR102607186B1 KR1020220104538A KR20220104538A KR102607186B1 KR 102607186 B1 KR102607186 B1 KR 102607186B1 KR 1020220104538 A KR1020220104538 A KR 1020220104538A KR 20220104538 A KR20220104538 A KR 20220104538A KR 102607186 B1 KR102607186 B1 KR 102607186B1
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 238000009792 diffusion process Methods 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 26
- 230000008707 rearrangement Effects 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 10
- 238000003825 pressing Methods 0.000 claims abstract description 3
- 239000011230 binding agent Substances 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
본 발명은 안테나 내장형 방열패드 및 그 제조방법에 관한 것으로, 보다 상세하게는 안테나가 내장된 방열패드의 수직방향으로의 방열 성능을 향상시키기 위한 안테나 내장형 방열패드 및 그 제조방법에 관한 것이다.
또한, 본 발명에 따른 안테나 내장형 방열패드의 제조방법은 판상의 열확산재가 수평 방향으로 배열된 열전도 레이어를 공급하는 제1 공급단계와 상기 제1 공급단계를 통해 공급된 열전도 레이어의 상면에 기 설정된 패턴으로 에칭가공된 금속 재질의 안테나를 올려놓는 제2 공급단계와 상기 제2 공급단계를 통해 공급된 안테나를 가압하여 안테나에 눌려진 판상의 열확산재가 수직방향으로 재배열되면서 형성되는 재배열부를 성형하는 재배열단계를 포함하는 것을 특징으로 한다.The present invention relates to a heat dissipation pad with a built-in antenna and a method of manufacturing the same. More specifically, it relates to a heat dissipation pad with a built-in antenna and a method of manufacturing the same for improving the heat dissipation performance in the vertical direction of the heat dissipation pad with a built-in antenna.
In addition, the method of manufacturing an antenna-embedded heat dissipation pad according to the present invention includes a first supply step of supplying a heat-conducting layer in which a plate-shaped heat diffusion material is arranged in the horizontal direction, and a preset pattern on the upper surface of the heat-conducting layer supplied through the first supply step. A second supply step of placing an antenna made of metal that has been etched, and a material for forming a rearrangement portion formed by pressing the antenna supplied through the second supply step and rearranging the plate-shaped heat diffusion material pressed on the antenna in the vertical direction. It is characterized by including an arrangement step.
Description
본 발명은 안테나 내장형 방열패드 및 그 제조방법에 관한 것으로, 보다 상세하게는 안테나가 내장된 방열패드의 수직방향으로의 방열 성능을 향상시키기 위한 안테나 내장형 방열패드 및 그 제조방법에 관한 것이다.The present invention relates to a heat dissipation pad with a built-in antenna and a method of manufacturing the same. More specifically, it relates to a heat dissipation pad with a built-in antenna and a method of manufacturing the same for improving the heat dissipation performance in the vertical direction of the heat dissipation pad with a built-in antenna.
일반적으로 전자기기는 전기에너지를 사용함에 따라 열을 방출하게 된다.In general, electronic devices emit heat as they use electrical energy.
특히 컴퓨터, 태블릿, 스마트폰과 같은 연산기능을 가진 IT기기에서 발생되는 발열은 다른 전자기기보다 발열량이 많으며, 발열에 의한 성능저하 또는 오류를 일으키는 문제점이 있으며, 발열을 보다 효율적으로 냉각시키기 위한 냉각핀, 냉각팬 등 다양한 장치들을 사용하고 있다.In particular, the heat generated from IT devices with computational functions such as computers, tablets, and smartphones generates more heat than other electronic devices, and there are problems with performance degradation or errors caused by heat generation, and cooling to cool the heat more efficiently. Various devices such as fins and cooling fans are used.
하지만, 기술이 발전함에 따라 그 크기가 더욱 작아지고 있는 IT기기들에 부피가 큰 냉각핀 또는 냉각팬과 같은 냉각장치를 사용하기에는 어려운 문제점이 있었다.However, as technology advances, it is difficult to use cooling devices such as bulky cooling fins or cooling fans in IT devices, whose sizes are becoming smaller.
이에 따라, 열원으로부터 발생되는 열을 냉각핀으로 보다 빠르게 전달하기 위한 열계면 부재가 개발되었으며, 한국등록특허 제10-0698727호 "흑연시트와 그 제조방법"과 같이 발열부의 열을 보다 넓은 면적으로 확산시켜 냉각할 수 있는 열확산 시트가 개발되었다.Accordingly, a thermal interface member was developed to more quickly transfer the heat generated from the heat source to the cooling fin, and as in Korea Patent No. 10-0698727 "Graphite sheet and manufacturing method thereof," the heat from the heating part is distributed over a larger area. A heat diffusion sheet that can cool by diffusion has been developed.
반면, 종래의 열확산 시트는 대부분 수평방향으로의 열전도도에 비해 수직방향으로의 열전도도가 크게 낮은 문제점이 있으며, 이는 열확산재를 수평하게 배열시킨 상태로 수지계열의 바인더가 열확재를 고정시킴에 따라, 열확산재와 열확산재 사이에 배치되는 수지계열의 바인더가 수십 ~ 수천 개의 층을 이루면서 열전달을 방해하여 수직방향으로의 열전달이 원활하지 않은 문제점이 있었다.On the other hand, most conventional heat diffusion sheets have a problem in that the thermal conductivity in the vertical direction is significantly lower than the thermal conductivity in the horizontal direction. This is because the resin-based binder fixes the heat diffusion material when the heat diffusion material is arranged horizontally. Accordingly, there was a problem in that the heat transfer in the vertical direction was not smooth because the resin-based binder disposed between the heat diffusion material formed tens to thousands of layers and interfered with heat transfer.
즉, 열확산재가 수평 방향만 배열되어 있으며, 수평방향으로 배열된 열확산재 사이에 배치되는 바인더로 인해 수직방향 열전도도가 낮은 문제점이 있었다.That is, the heat spreaders were arranged only in the horizontal direction, and there was a problem of low vertical thermal conductivity due to the binder disposed between the heat spreaders arranged in the horizontal direction.
이에 따라, 한국등록특허 제10-1616239호 "열전도성 시트 및 그의 제조 방법, 및 반도체 장치"와 같이, 침상의 탄소 섬유를 수직(종)방향으로 배향시키기 위한 기술이 개발되었으나, 침상의 탄소 섬유는 단면적이 너무 작아 수직방향으로의 열전도 효율을 향상시키는데 한계가 있고, 수평방향으로의 열전도 효율이 매우 낮은 단점과 생산성이 낮은 문제점이 있었다.Accordingly, a technology for orienting needle-shaped carbon fibers in the vertical (longitudinal) direction has been developed, such as Korean Patent No. 10-1616239, “Thermal conductive sheet, manufacturing method thereof, and semiconductor device.” The cross-sectional area is too small, so there is a limit to improving heat conduction efficiency in the vertical direction, the heat conduction efficiency in the horizontal direction is very low, and productivity is low.
이에 따라, 수평방향으로의 열전도 효율뿐만 아니라, 수직방향으로의 열전도 효율도 복합적으로 크게 향상시키면서 안테나의 기능을 수행하기 위한 기술 개발의 필요성이 제기되고 있다.Accordingly, there is a need to develop technology to perform the function of an antenna while greatly improving not only the heat conduction efficiency in the horizontal direction but also the heat conduction efficiency in the vertical direction.
본 발명의 목적은 상술한 바와 같은 문제점을 해결하기 위해 안출된 것으로서, 안테나가 내장된 방열패드의 방열 성능을 향상시키기 위한 안테나 내장형 방열패드 및 그 제조방법을 제공하는 것이다.The purpose of the present invention is to solve the problems described above and to provide a heat dissipation pad with a built-in antenna and a manufacturing method thereof to improve the heat dissipation performance of the heat dissipation pad with a built-in antenna.
상기 목적을 달성하기 위해 본 발명에 따른 안테나 내장형 방열패드는 열확산재가 혼합된 열전도 레이어와 기 설정된 패턴으로 에칭가공된 금속 재질의 안테나를 포함하는 것을 특징으로 한다.In order to achieve the above object, the heat dissipation pad with a built-in antenna according to the present invention is characterized by including a heat conductive layer mixed with a heat diffusion material and an antenna made of metal etched in a preset pattern.
또한, 판상의 열확산재가 수평 방향으로 배열된 열전도 레이어와 상기 열전도 레이어의 상면에 올려진 후 가압에 의해 열전도 레이어에 소정의 깊이로 삽입되는 기 설정된 패턴으로 에칭가공된 금속 재질의 안테나와 상기 열전도 레이어에 안테나가 소정의 깊이로 삽입될 때, 안테나에 눌려 수직방향으로 재배열되는 판상의 열확산재로 구성된 재배열부를 포함하는 것을 특징으로 한다.In addition, a plate-shaped heat diffusion material is placed on a heat conduction layer arranged in the horizontal direction and an upper surface of the heat conduction layer, and then inserted into the heat conduction layer to a predetermined depth by pressure. An antenna made of metal etched in a preset pattern and the heat conduction layer. When the antenna is inserted to a predetermined depth, it is characterized in that it includes a rearrangement unit made of a plate-shaped heat diffusion material that is pressed by the antenna and rearranged in the vertical direction.
또한, 본 발명에 따른 안테나 내장형 방열패드의 제조방법은 판상의 열확산재가 수평 방향으로 배열된 열전도 레이어를 공급하는 제1 공급단계와 상기 제1 공급단계를 통해 공급된 열전도 레이어의 상면에 기 설정된 패턴으로 에칭가공된 금속 재질의 안테나를 올려놓는 제2 공급단계와 상기 제2 공급단계를 통해 공급된 안테나를 가압하여 안테나에 눌려진 판상의 열확산재가 수직방향으로 재배열되면서 형성되는 재배열부를 성형하는 재배열단계를 포함하는 것을 특징으로 한다.In addition, the method of manufacturing an antenna-embedded heat dissipation pad according to the present invention includes a first supply step of supplying a heat-conducting layer in which a plate-shaped heat diffusion material is arranged in the horizontal direction, and a preset pattern on the upper surface of the heat-conducting layer supplied through the first supply step. A second supply step of placing an antenna made of metal that has been etched, and a material for forming a rearrangement portion formed by pressing the antenna supplied through the second supply step and rearranging the plate-shaped heat diffusion material pressed on the antenna in the vertical direction. It is characterized by including an arrangement step.
상술한 바와 같이, 본 발명에 따른 안테나 내장형 방열패드 및 그 제조방법에 의하면, 안테나가 삽입되면서 판상의 열확산재가 수직방향으로 재배열되어 수직방향으로의 방열 성능을 크게 향상시킬 수 있는 효과가 있다.As described above, according to the antenna-embedded heat dissipation pad and its manufacturing method according to the present invention, the plate-shaped heat diffusion material is rearranged in the vertical direction as the antenna is inserted, which has the effect of significantly improving heat dissipation performance in the vertical direction.
도 1은 본 발명에 따른 안테나 내장형 방열패드의 제조방법을 순서대로 도시한 순서도.
도 2는 본 발명에 따른 안테나 내장형 방열패드의 제조방법 중 제1 공급단계를 통해 공급된 열전도 레이어를 도시한 종단면도.
도 3은 본 발명에 따른 안테나 내장형 방열패드의 제조방법 중 제2 공급단계를 통해 공급된 열전도 레이어를 도시한 종단면도.
도 4는 본 발명에 따른 안테나 내장형 방열패드의 제조방법 중 재배열단계를 통해 성형된 열전도 레이어를 도시한 종단면도.1 is a flow chart sequentially showing a method of manufacturing a heat dissipation pad with a built-in antenna according to the present invention.
Figure 2 is a longitudinal cross-sectional view showing a heat conduction layer supplied through the first supply step in the method of manufacturing a heat dissipation pad with an antenna built-in according to the present invention.
Figure 3 is a longitudinal cross-sectional view showing a heat conduction layer supplied through the second supply step in the method of manufacturing a heat dissipation pad with an antenna built-in according to the present invention.
Figure 4 is a longitudinal cross-sectional view showing a heat-conducting layer formed through a rearrangement step in the manufacturing method of the antenna-embedded heat dissipation pad according to the present invention.
본 명세서에 개시되어 있는 본 발명의 개념에 따른 실시 예들에 대해서 특정한 구조적 또는 기능적 설명은 단지 본 발명의 개념에 따른 실시 예들을 설명하기 위한 목적으로 예시된 것으로서, 본 발명의 개념에 따른 실시 예들은 다양한 형태들로 실시될 수 있으며 본 명세서에 설명된 실시 예들에 한정되지 않는다.Specific structural or functional descriptions of the embodiments according to the concept of the present invention disclosed in this specification are merely illustrative for the purpose of explaining the embodiments according to the concept of the present invention, and the embodiments according to the concept of the present invention are It may be implemented in various forms and is not limited to the embodiments described herein.
본 발명의 개념에 따른 실시 예들은 다양한 변경들을 가할 수 있고 여러 가지 형태들을 가질 수 있으므로 실시 예들을 도면에 예시하고 본 명세서에서 상세하게 설명하고자 한다. 그러나, 이는 본 발명의 개념에 따른 실시 예들을 특정한 개시 형태들에 대해 한정하려는 것이 아니며, 본 발명의 사상 및 기술 범위에 포함되는 모든 변경, 균등물, 또는 대체물을 포함한다.Since the embodiments according to the concept of the present invention can make various changes and have various forms, the embodiments will be illustrated in the drawings and described in detail in this specification. However, this is not intended to limit the embodiments according to the concept of the present invention to specific disclosed forms, and includes all changes, equivalents, or substitutes included in the spirit and technical scope of the present invention.
이하, 본 발명의 바람직한 실시예를 첨부된 도면을 참조하여 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described with reference to the attached drawings.
도 1은 본 발명에 따른 안테나 내장형 방열패드의 제조방법을 순서대로 도시한 순서도이며, 도 2는 본 발명에 따른 안테나 내장형 방열패드의 제조방법 중 제1 공급단계를 통해 공급된 열전도 레이어를 도시한 종단면도이고, 도 3은 본 발명에 따른 안테나 내장형 방열패드의 제조방법 중 제2 공급단계를 통해 공급된 열전도 레이어를 도시한 종단면도이며, 도 4는 본 발명에 따른 안테나 내장형 방열패드의 제조방법 중 재배열단계를 통해 성형된 열전도 레이어를 도시한 종단면도이다.Figure 1 is a flowchart sequentially showing the manufacturing method of the antenna-embedded heat dissipation pad according to the present invention, and Figure 2 shows the heat-conducting layer supplied through the first supply step in the manufacturing method of the antenna-embedded heat dissipation pad according to the present invention. It is a longitudinal cross-sectional view, and Figure 3 is a vertical cross-sectional view showing a heat conductive layer supplied through the second supply step in the manufacturing method of the antenna-embedded heat dissipation pad according to the present invention, and Figure 4 is a manufacturing method of the antenna-embedded heat dissipation pad according to the present invention. This is a longitudinal cross-sectional view showing the heat conduction layer formed through the rearrangement step.
도 1에 도시된 바와 같이, 본 발명에 따른 안테나 내장형 방열패드의 제조방법은 열확산재가 혼합된 열전도 레이어와 기 설정된 패턴으로 에칭가공된 금속 재질의 안테나를 포함하는 안테나 내장형 방열패드를 제조하기 위한 것으로써, As shown in Figure 1, the method of manufacturing a heat dissipation pad with a built-in antenna according to the present invention is to manufacture a heat dissipation pad with a built-in antenna including a heat conductive layer mixed with a heat diffusion material and a metal antenna etched in a preset pattern. write,
열확산재가 포함된 열전도 레이어를 공급하는 제1 공급단계(S1)와 상기 제1 공급단계(S1)를 통해 공급된 열전도 레이어의 상면에 기 설정된 패턴으로 에칭가공된 금속 재질의 안테나를 적층하는 제2 공급단계(S2)로 구성될 수 있다.A first supply step (S1) of supplying a heat-conducting layer containing a heat diffusion material, and a second step of laminating an antenna made of metal etched in a preset pattern on the upper surface of the heat-conducting layer supplied through the first supply step (S1). It may consist of a supply stage (S2).
또는, 기 설정된 패턴으로 에칭가공된 금속 재질의 안테나에 직접적으로 열확산재와 수지 계열의 바인더가 혼합된 용액을 올려 경화시키는 방법으로 안테나 내장형 방열패드를 제조할 수도 있다.Alternatively, a heat dissipation pad with a built-in antenna can be manufactured by directly applying a mixture of a heat diffusion material and a resin-based binder to a metal antenna that has been etched in a preset pattern and curing it.
다른 제조방법으로써, 도 1 내지 도 4에 도시된 바와 같이 판상의 열확산재(10)가 수평 방향으로 배열된 열전도 레이어(1)를 공급하는 제1 공급단계(S1)와 상기 제1 공급단계(S1)를 통해 공급된 열전도 레이어(1)의 상면에 기 설정된 패턴으로 에칭가공된 금속 재질의 안테나(2)를 올려놓는 제2 공급단계(S2)와 상기 제2 공급단계(S2)를 통해 공급된 안테나(2)를 가압하여 안테나(2)에 눌려진 판상의 열확산재(10)가 수직방향으로 배열되면서 형성되는 재배열부(3)를 성형하는 재배열단계(S3)를 포함하도록 구성될 수도 있다.As another manufacturing method, as shown in FIGS. 1 to 4, a first supply step (S1) of supplying a heat conductive layer (1) in which the plate-shaped heat diffusion material 10 is arranged in the horizontal direction, and the first supply step ( A second supply step (S2) of placing a metal antenna (2) etched in a preset pattern on the upper surface of the heat conduction layer (1) supplied through S1) and supply through the second supply step (S2). It may be configured to include a rearrangement step (S3) of pressurizing the antenna 2 to form a rearrangement portion 3 formed by arranging the plate-shaped heat diffusion material 10 pressed against the antenna 2 in the vertical direction. .
이때, 상기 열전도 레이어(1)는 안테나(2)의 가압시 성형이 가능하도록 소정의 유동성이 있는 수지 계열의 바인더에 열확산재(10)가 혼합된 상태로 공급됨이 바람직하다.At this time, the heat conduction layer 1 is preferably supplied in a state in which the heat diffusion material 10 is mixed with a resin-based binder having a certain fluidity so that it can be molded when the antenna 2 is pressed.
이를 통해, 상기 재배열단계(S3)는 제2 공급단계(S2)를 통해 공급된 안테나(2)가 가압에 의해 눌려질때, 완전히 경화되지 않은 수지 계열의 바인더 내에 수평 방향으로 배열된 판상의 열확산재(1) 중 일부가 안테나(2)에 의해 아래 방향으로 눌려지면서 수직방향으로 재배열된 재배열부(3)가 성형된다.Through this, in the rearrangement step (S3), when the antenna (2) supplied through the second supply step (S2) is pressed by pressure, heat diffusion occurs in a horizontally arranged plate shape within a resin-based binder that is not completely cured. As part of the material 1 is pressed downward by the antenna 2, the rearrangement portion 3 rearranged in the vertical direction is formed.
즉, 상기 안테나(2)의 가압을 통해 재배열되는 재배열부(3)는 안테나(2)의 가압에 의해 곡면진 형태로 점진적으로 아래 방향을 향하는 형태로 열확산재(1)를 수직방향으로 재배열시키게 되며, 수직방향으로의 열전도율을 크게 향상시킬 수 있다.That is, the rearrangement portion 3, which is rearranged through the pressure of the antenna 2, is positioned in a curved shape gradually downward by the pressure of the antenna 2, and places the heat diffusion material 1 in the vertical direction. By arranging them, thermal conductivity in the vertical direction can be greatly improved.
이상과 같이 본 발명은 첨부된 도면을 참조하여 바람직한 실시예를 중심으로 기술되었지만 당업자라면 이러한 기재로부터 본 발명의 범주를 벗어남이 없이 많은 다양한 자명한 변형이 가능하다는 것은 명백하다. 따라서 본 발명의 범주는 이러한 많은 변형의 예들을 포함하도록 기술된 청구범위에 의해서 해석되어져야 한다.As described above, the present invention has been described focusing on preferred embodiments with reference to the accompanying drawings, but it is clear to those skilled in the art that many obvious modifications can be made without departing from the scope of the present invention from this description. Accordingly, the scope of the present invention should be construed by the appended claims to include examples of many such modifications.
1 : 판상의 열확산재
2 : 구상의 열확산재
3 : 재배열부
4 : 골
11 : 제1 열전도 레이어
12 : 제2 열전도 레이어
21 : 휠1: Plate-shaped thermal diffusion material
2: Spherical thermal diffusion material
3: Rearrangement part
4: Goal
11: first heat conduction layer
12: second heat conduction layer
21: wheel
Claims (3)
상기 열전도 레이어의 상면에 올려진 후 가압에 의해 열전도 레이어에 소정의 깊이로 삽입되는 기 설정된 패턴으로 에칭가공된 금속 재질의 안테나와;
상기 열전도 레이어에 안테나가 소정의 깊이로 삽입될 때, 안테나에 눌려 수직방향으로 재배열되는 판상의 열확산재로 구성된 재배열부를 포함하는 것을 특징으로 하는
안테나 내장형 방열패드.
a heat conduction layer in which plate-shaped heat diffusion materials are arranged in a horizontal direction;
an antenna made of metal etched with a preset pattern that is placed on the upper surface of the heat-conducting layer and then inserted into the heat-conducting layer to a predetermined depth by pressure;
When the antenna is inserted into the heat conduction layer at a predetermined depth, it includes a rearrangement portion made of a plate-shaped heat diffusion material that is rearranged in the vertical direction by being pressed by the antenna.
Heat dissipation pad with built-in antenna.
상기 제1 공급단계를 통해 공급된 열전도 레이어의 상면에 기 설정된 패턴으로 에칭가공된 금속 재질의 안테나를 올려놓는 제2 공급단계와;
상기 제2 공급단계를 통해 공급된 안테나를 가압하여 안테나에 눌려진 판상의 열확산재가 수직방향으로 재배열되면서 형성되는 재배열부를 성형하는 재배열단계를 포함하는 것을 특징으로 하는
안테나 내장형 방열패드의 제조방법.
A first supply step of supplying a heat conduction layer in which plate-shaped heat spreaders are arranged in a horizontal direction;
a second supply step of placing a metal antenna etched in a preset pattern on the upper surface of the heat conduction layer supplied through the first supply step;
A rearrangement step of forming a rearrangement portion formed by pressing the antenna supplied through the second supply step and rearranging the plate-shaped heat diffusion material pressed on the antenna in the vertical direction.
Method of manufacturing a heat dissipation pad with built-in antenna.
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