CN204578942U - Heat radiation assembly - Google Patents

Abstract

The utility model discloses a heat dissipation assembly, it is used for dissipating the heat that a chip unit that sets up on a loading board sent, heat dissipation assembly includes a panel and a slim fin. The plate is arranged on the bearing plate and is positioned above the chip unit, wherein the plate is provided with a heat dissipation area. The thin radiating fins are arranged on the plate and arranged on the radiating area. Wherein, the heat emitted by the chip unit is dissipated through the plate and the thin heat sink in sequence. The utility model provides a radiator unit accessible sets up the structural design of slim fin on a panel, earlier with heat-conducting mode the produced heat of chip unit according to the preface through panel and slim fin and follow the even dissipation of local area to the periphery, removes the heat to external environment through slim fin with thermal radiation's mode again, reaches the even radiating effect of large tracts of land.

Description

Cooling components

technical field

The utility model relates to a structure of a heat dissipation component, in particular to a heat dissipation component with functions of heat conduction and heat radiation.

Background technique

With the high development of electronic devices, the calculation efficiency of electronic components inside the electronic devices is required to be higher and higher, which leads to the temperature of the electronic components to rise easily, thereby causing the problem of heat dissipation. In addition, as the design trend of the electronic device is towards thinner and lighter design, it is easy to cause the extremely compressed space design to cause difficulty in heat dissipation.

In general, known methods achieve the effect of heat dissipation by arranging elements such as fans and heat dissipation fins near the heat source. However, for thin and light electronic products, such as ultra-thin notebook computers, tablet computers, and even smart phones, fans cannot be set up in this way. Therefore, it is easy to cause the above-mentioned notebook computer, tablet computer and smart phone to cause its system instability and then crash due to overheating.

In addition, generally speaking, heat dissipation fins are usually installed on electronic components that generate high heat in a surface-to-face contact manner, and the heat generated by the electronic components is dissipated into the air environment through the high surface area of the heat dissipation fins. However, the surface of the heat dissipation fins cannot be as smooth as expected due to the limitation of the manufacturing process, so there is a gap between the heat dissipation fins and the electronic components, which greatly reduces the heat dissipation efficiency (due to the poor thermal conductivity of air).

Utility model content

In view of the above problems, the utility model provides a heat dissipation assembly, which can pass the heat generated by the chip unit sequentially through the plate in the form of heat conduction through the structural design of arranging the thin heat sink on the plate and the thin heat sink to dissipate evenly from the local area to the periphery, and then remove the heat to the external environment through the thin heat sink in the form of heat radiation, so as to achieve the effect of large-area uniform heat dissipation.

In order to achieve the above object, one embodiment of the present utility model is to provide a heat dissipation assembly for dissipating the heat emitted by a chip unit arranged on a carrier board. The heat dissipation assembly includes a plate and a thin heat dissipation piece. The board is arranged on the carrier board, and the board is located above the chip unit, wherein the board has a heat dissipation area. The thin heat dissipation fins are arranged on the plate and located on the heat dissipation area. Wherein, the heat emitted by the chip unit is dissipated sequentially through the board and the thin heat sink.

Another embodiment of the present invention provides a heat dissipation assembly for dissipating the heat generated by a chip unit disposed on a carrier board. The heat dissipation assembly includes a board and a thin heat sink. The board is arranged on the carrier board, and the board is located above the chip unit, wherein the board has a heat dissipation area. The thin heat sink is arranged and located on the heat dissipation area. Wherein, the heat emitted by the chip unit is dissipated sequentially through the thin heat sink and the board.

Further, the heat dissipation component further includes an adhesive layer, and the adhesive layer is arranged between the board and the thin heat sink.

Further, the heat dissipation assembly further includes a heat conduction medium layer, and the heat conduction medium layer is arranged between the chip unit and the board.

Further, the thin heat sink includes a base material and a thermal diffusion radiation layer, the thermal diffusion radiation layer is disposed on the base material, and the base material is disposed on the board.

Further, the base material includes a first substrate and a second substrate, and the thermal diffusion radiation layer is disposed between the first substrate and the second substrate.

Further, one of the first substrate and the second substrate is provided with a plurality of uniformly or non-uniformly distributed heat dissipation holes.

Further, the thin heat sink includes a carbon composite material, wherein the carbon composite material is one of the group consisting of diamond, artificial graphite, graphene, carbon nanotube, carbon black and carbon fiber.

Furthermore, the heat dissipation assembly further includes a fixing part, the board includes a fixing area, and the fixing area is located at a side of the heat dissipation area, wherein the fixing part is arranged in the fixing area, the The carrier board and the plate are combined with each other through the fixing piece.

Further, the heat dissipation assembly further includes an elastic element, the elastic element is arranged on the board, and the fixing member passes through the elastic element.

Further, the plate is provided with a plurality of uniformly distributed or non-uniformly distributed through holes.

The beneficial effect of the utility model can be that the heat dissipation assembly provided by the embodiment of the utility model can first dissipate the heat produced by the chip unit in a heat conductive manner through the structural design of arranging the thin heat sink on a plate. The heat is evenly dissipated from the local area to the periphery through the plate and the thin heat sink in sequence, and then the heat is removed to the external environment through the thin heat sink in the form of heat radiation, achieving the effect of large-area uniform heat dissipation. In addition, the plate and the carrying plate can be tightly combined through the fixing member, so as to avoid the problem that the plate used to carry the thin heat sink cannot be effectively closely attached to the chip unit. Furthermore, the thermal diffusion radiation layer provided in the thin heat sink of this case can be composed of a resin material, a carbon composite material and thermally conductive filler powder, wherein the carbon composite material is diamond particles, artificial graphite particles, carbon black particles, Carbon fiber particles, graphene, carbon nanotubes or their groups, and the thermally conductive filler powder is metal particles, oxide particles, nitride particles or their groups, so the thermal diffusion radiation layer can have the ability of heat conduction and heat radiation . Thereby, the heat generated by the chip unit can be effectively and quickly removed to the external environment, achieving the effect of rapid heat dissipation.

In order to enable a further understanding of the features and technical content of the present utility model, please refer to the following detailed description and accompanying drawings of the present utility model. However, the attached drawings are only for reference and description, and are not used to limit the present utility model. .

Description of drawings

FIG. 1 is a schematic side view of a heat dissipation assembly according to a first embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view of an aspect of a thin heat sink according to an embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view of another aspect of the thin heat sink according to the embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view of another aspect of the thin heat sink according to the embodiment of the present invention.

FIG. 5 is a schematic side view of the heat dissipation assembly of the second embodiment of the present invention.

FIG. 6 is a schematic side view of a heat dissipation assembly according to a third embodiment of the present invention.

FIG. 7 is a schematic side view of a heat dissipation assembly according to a fourth embodiment of the present invention.

【Symbol Description】

Heat dissipation components P, P’, P”, P”’

Loading board 1

Chip unit 2

Upper surface 21

lower surface 22

Plate 3, 3’

Upper surface 31

lower surface 32

Storage tank 33

through hole 34

Thin heat sink 4, 4’, 4”, 4”’

Substrate 41

Upper surface 411

Lower surface 412

The first substrate 413

Central Area 413a

Thermal diffusion zone 413b

Second Substrate 414

Contact area 414a

Thermal diffusion zone 414b

Thermal diffusion radiation layer 42

Resin material 421

Carbon composite material 422

Thermally conductive filled powder 423

Adhesive layer 43

Cooling hole 44

Adhesive layer 5

Heat conduction medium layer 6

Fixing parts 7

Elastic element 8

Heat dissipation area H

Fixed area F

Detailed ways

The implementation of the "radiation assembly" disclosed in the utility model is described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the utility model from the content disclosed in this specification. The utility model can also be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the utility model. Moreover, the drawings of the present utility model are only for simple illustration, and are not drawn according to the actual size, that is, they do not reflect the actual size of the relevant components, and are described in advance. The following embodiments further describe the relevant technical content of the present invention in detail, but are not intended to limit the technical scope of the present invention.

[First embodiment]

First, please refer to FIG. 1 , which is a schematic side view of the heat dissipation assembly according to the first embodiment of the present invention. The first embodiment of the present invention provides a heat dissipation assembly P for dissipating heat generated by a chip unit 2 disposed on a carrier board 1 , which includes a board 3 and a thin heat sink 4 . For example, the carrier board 1 can be a circuit substrate, and the chip unit 2 can be electrically connected to the circuit substrate and disposed on the circuit substrate, but the present invention is not limited thereto. In other words, the chip unit 2 can also be directly disposed on the carrier board 1 and connected to other electronic components through wires, or surrounded by the carrier board 1 .

Next, according to the first embodiment of the present invention, the chip unit 2 may have an upper surface 21 and a lower surface 22 , and the lower surface 22 of the chip unit 2 may be disposed on the carrier board 1 . At the same time, the board 3 is also disposed on the carrier board 1 , and the board 3 is located above the upper surface 21 of the chip unit 2 . For example, the composition of the board 3 can be a board 3 made of aluminum or copper, but the present invention is not limited thereto. As shown in FIG. 1 , the board 3 may have a heat dissipation area H, and the chip unit 2 is located below the heat dissipation area H, whereby the chip unit 2 dissipates the heat emitted by the chip unit 2 through the heat dissipation area H. The thin heat sink 4 can be disposed on the board 3 , and the thin heat sink 4 is disposed on the heat dissipation area H, whereby the heat emitted by the chip unit 2 is dissipated through the board 3 and the thin heat sink 4 in sequence.

Based on the above, for example, in the first embodiment of the present utility model, the plate 3 can have an upper surface 31 and a lower surface 32, and an adhesive layer 5 can be further arranged on the upper surface 31 of the plate 3 and the thin heat sink 4, so as to attach the thin heat sink 4 and the board 3 to each other, and the material of the adhesive layer 5 can be, for example, double-sided adhesive, thermally conductive adhesive or penetrating agent. In addition, a thermally conductive medium layer 6 can be further arranged between the chip unit 2 and the plate 3 to increase the heat transfer efficiency of the chip unit 2 . For example, the thermally conductive medium layer 6 can be a soft thermally conductive medium material (Thermal Interface Material), such as thermally conductive paste, thermally conductive glue, etc., but the present invention is not limited thereto. For example, there may not be an adhesive layer 5 between the plate 3 and the chip unit 2, and the heat of the chip unit 2 can be transferred to the plate 3 through a gas layer (not shown) between the plate 3 and the chip unit 2. Thin heat sink 4. In other words, there may be a gap (not shown) between the board 3 and the chip unit 2 . In addition, it is worth mentioning that the thin heat sink 4 may be a thin heat sink 4 made of graphene, but the present invention is not limited thereto.

For example, please refer to FIG. 2 . FIG. 2 is a schematic cross-sectional view of an aspect of a thin heat sink according to an embodiment of the present invention. According to the embodiment of the present utility model, the thin heat sink 4' includes a substrate 41 and a thermal diffusion radiation layer 42, the thermal diffusion radiation layer 42 is disposed on the substrate 41, and the substrate 41 is disposed on the upper surface 31 of the board 3 superior. For example, the thermal diffusion radiation layer 42 can be bonded to the upper surface 411 of the substrate 41 by sticking or coating. Thereby, the heat generated by the chip unit 2 can be conducted to the vicinity of the upper surface 411 through the lower surface 412 of the substrate 41 , and can be effectively dissipated to the outside through the thermal diffusion radiation layer 42 . Additionally, substrate 41 may be, but is not limited to, a metal substrate such as an aluminum, iron or copper substrate.

Based on the above, the thermal diffusion radiation layer 42 can be composed of a resin material 421 , a carbon composite material 422 and a thermally conductive filling powder 423 . For example, the resin material 421 can be (but not limited to) epoxy resin, acrylic resin, urethane resin, silicone rubber resin, parylene resin, bismaleimide resin At least one selected from the group consisting of resin and polyimide resin. The carbon composite material 422 can be (but not limited to) diamond, artificial graphite, graphene, carbon nanotubes, carbon black, carbon fiber, or a group formed by any of the above-mentioned carbon materials, and its shape includes granular, flake and/or or dumbbells. In addition, the thermally conductive filling powder 423 may include (but not limited to) metal particles, oxide particles, nitride particles, or any group formed by the above particles. Among them, metal particles can be (but not limited to) gold, silver, copper, nickel or aluminum particles, oxide particles can be (but not limited to) aluminum oxide or zinc oxide particles, nitride particles can be (but not limited to) nitrogen boron or aluminum nitride particles.

Next, please refer to FIG. 3 . FIG. 3 is a schematic cross-sectional view of another aspect of the thin heat sink according to the embodiment of the present invention. According to the embodiment of the present utility model, in another implementation mode, the substrate 41 may include a first substrate 413 and a second substrate 414, and the thermal diffusion radiation layer 42 may be disposed on the first substrate 413 and the second substrate Between 414. For example, the thermal diffusion radiation layer 42 can be bonded between the first substrate 413 and the second substrate 414 through an adhesive layer 43 , and the material of the adhesive layer 43 can be, for example, double-sided adhesive, thermally conductive adhesive or penetrating agent. In this way, the thermal diffusion radiation layer 42 can maintain good contact with the first substrate 413 and the second substrate 414 respectively, so that the heat dissipation effect of the thin heat sink 4" is better. In addition, the first substrate 413 and the second substrate 414 It can be (but not limited to) metal substrates such as aluminum, iron or copper substrates. And the thermal diffusion radiation layer 42 can be made up of a resin material 421, a carbon composite material 422 and thermal conductivity filling powder 423. It should be noted that the figure The structure and composition of the thermal diffusion and radiation layer 42 shown in FIG. 3 are the same as those of the thermal diffusion and radiation layer 42 shown in FIG. 2 , and will not be repeated here.

Next, please refer to FIG. 4 , which is a schematic cross-sectional view of another aspect of the thin heat sink according to the embodiment of the present invention. In terms of the embodiment of the present utility model, in another implementation mode, in order to discharge the heat generated by the chip unit 2 to the external environment more quickly, the first substrate 413 and the second substrate of the thin heat sink 4"' One of the substrates 414 can be provided with a plurality of uniformly distributed or non-uniformly distributed heat dissipation holes 44. As shown in Figure 4, in terms of the embodiment of the present utility model, the first substrate 413 and the second substrate 414 can be A plurality of heat dissipation holes 44 are opened, and the first substrate 413 may have a central region 413a and two thermal diffusion regions 413b respectively located on opposite sides of the central region 413a. The second substrate 414 may have a contact region 414a and two The thermal diffusion regions 414b are respectively located on the opposite sides of the contact region 414a, and the central region 413a of the first substrate 413 is set correspondingly to the contact region 414a of the second substrate 414. It is worth mentioning that the heat dissipation holes 44 are arranged in the second The density on the first substrate 413 or the second substrate 414 can also be adjusted as required. For example, the density of the thermal vias 44 far away from the contact region 414a of the second substrate 414 can be higher than that of the contact region 414a adjacent to the second substrate 414. Density of thermal vias 44 . Likewise, the density of thermal vias 44 away from the central region 413 a of the first substrate 413 may be higher than the density of thermal vias 44 adjacent to the central region 413 a of the first substrate 413 .

As mentioned above, the heat dissipation assembly P provided by the first embodiment of the present invention can first conduct heat conduction ( heat conductive) to pass the heat generated by the chip unit 2 through the plate 3 and thin heat sinks 4, 4', 4", 4"' in order to dissipate evenly from the local area to the periphery, and then radiate heat The heat is removed to the external environment through thin heat sinks 4, 4', 4", 4"' in a unique way, so as to achieve the effect of large area and uniform heat dissipation.

[Second Embodiment]

First, please refer to FIG. 5 , which is a schematic side view of a heat dissipation assembly according to a second embodiment of the present invention. From the comparison of Fig. 5 and Fig. 1, it can be seen that the difference between the second embodiment and the first embodiment is that the heat dissipation assembly P' provided by the second embodiment can connect the carrier board 1 and the plate 3 to each other through a fixing piece 7 combine with each other. Specifically, the second embodiment of the present invention provides a heat dissipation assembly P' for dissipating the heat emitted by a chip unit 2 disposed on a carrier board 1, which includes a plate 3 and a thin heat sink 4.

Next, according to the second embodiment of the present invention, the chip unit 2 may have an upper surface 21 and a lower surface 22 , and the lower surface 22 of the chip unit 2 may be disposed on the carrier board 1 . At the same time, the board 3 is also disposed on the carrier board 1 , and the board 3 is located above the upper surface 21 of the chip unit 2 . For example, the composition of the board 3 can be a board 3 made of aluminum or copper, but the present invention is not limited thereto. As shown in Figure 5, the board 3 can have a heat dissipation area H and a fixed area F, the fixed area F is located at the side of the heat dissipation area H, and the chip unit 2 is located below the heat dissipation area H, whereby the chip unit 2 passes The heat dissipation area H dissipates the heat emitted by the chip unit 2 . The thin heat sink 4 can be disposed on the board 3 , and the thin heat sink 4 is disposed on the heat dissipation area H, whereby the heat emitted by the chip unit 2 is dissipated through the board 3 and the thin heat sink 4 in sequence.

Based on the above, the heat dissipation assembly P' may further include a fixing part 7, the board 3 includes a fixing area F, and the fixing area F is located on the side of the heat dissipation area H, wherein the fixing part 7 is arranged on the fixing area F, and the carrying plate 1 and The panels 3 are joined to each other by means of fixings 7 . In terms of the second embodiment of the present utility model, the fixing member 7 can be a screw, but the present utility model is not limited thereto. The actual combination of the fixing member 7 and the carrier plate 1 and the plate 3 can be adapted to the actual product. change according to needs. For example, the fixing part 7 can also be a fastener, which can include a top and a hook, and a slot corresponding to the above-mentioned hook can be provided on the loading plate, and the clip of the fastener can be The hook and the slot on the bearing plate 1 are engaged with each other to fix the plate 3 and the bearing plate 1 .

The second embodiment of the present utility model provides a heat dissipation assembly P', which can tightly combine the plate 3 and the supporting plate 1 through the fixing part 7, so as to prevent the plate 3 used to carry the thin heat sink 4 from being effectively tightly connected to the chip unit 2 Fitting problems arise. In addition, since a heat conduction medium layer 6 is arranged between the chip unit 2 and the board 3 to increase the heat transfer efficiency of the chip unit 2, the heat conduction medium layer 6 may change due to temperature changes of the chip unit 2, for example, due to high temperature Evaporation and solidification shrinkage due to low temperature will not meet the durability requirements of the product, and once the board 3 and the chip unit 2 are separated from each other, it will not be able to effectively dissipate the heat generated by the chip unit 2 .

[Third embodiment]

First, please refer to FIG. 6 , which is a schematic side view of a heat dissipation assembly according to a third embodiment of the present invention. From the comparison of Fig. 6 and Fig. 1, it can be seen that the difference between the third embodiment and the second embodiment is that the thin heat sink 4 in the heat dissipation assembly P" provided by the third embodiment can be embedded or arranged on the plate 3 ', specifically, the plate 3' can have a housing groove 33, and the thin heat sink 4 can be set in the housing groove 33. The third embodiment of the utility model provides a heat dissipation component P", which is used to dissipate The heat emitted by a chip unit 2 disposed on a carrier board 1 includes a plate 3 ′ and a thin heat sink 4 .

Next, according to the third embodiment of the present invention, the plate 3' may have a receiving groove 33, and the thin heat sink 4 may be arranged in the receiving groove 33. The upper surface of the thin heat sink 4 can be flush with the upper surface 31 of the plate 3', or protrude from the upper surface 31 of the plate 3'. In this way, the thin heat sink 4 can be accommodated in the U-shaped accommodating groove 33 on the plate 3'. To dissipate the heat emitted by the chip unit 2 .

Based on the above, the chip unit 2 can have an upper surface 21 and a lower surface 22 , and the lower surface 22 of the chip unit 2 can be disposed on the carrier board 1 . At the same time, the board 3' is also arranged on the carrier board 1, and the board 3' is located above the upper surface 21 of the chip unit 2. As shown in Figure 6, the plate 3' can have a heat dissipation area H and a fixed area F, the fixed area F is located on the side of the heat dissipation area H, and the chip unit 2 is located below the heat dissipation area H, whereby the chip unit 2 The heat emitted by the chip unit 2 is dissipated through the heat dissipation area H. The thin heat sink 4 can be arranged on the plate 3', and the thin heat sink 4 is arranged on the heat dissipation area H, whereby the heat emitted by the chip unit 2 can be dissipated through the plate 3' and the thin heat sink 4 in sequence. It should be noted that the structures of the heat dissipation assembly P″ provided in the third embodiment, the supporting board 1 , the chip unit 2 , the fixing member 7 and the thin heat sink 4 are similar to those of the foregoing embodiments, and will not be repeated here.

Further, as shown in FIG. 6 , an elastic element 8, such as a spring, can be further provided on the fixing member 7, and the elastic element 8 can be arranged on the plate 3', and the fixing member 7 passes through the elastic element 8. Thereby, the elastic element 8 is arranged on the fixing member 7, and is located between its top and the plate 3'. When the fixing member 7 is combined with the plate 3' and the carrier plate 1, the elastic element 8 will be located on the upper surface 31 of the plate 3' to exert a force on the plate 3', so that the plate 3' and the chip unit 2 are closely attached combine. At the same time, the elastic force of the elastic element 8 can also prevent excessive pressure from being directly applied to the chip unit 2 to prevent damage to the chip unit 2 .

In addition, it is worth mentioning that, as shown in FIG. 6 , a plurality of uniformly or non-uniformly distributed through-holes 34 can be opened on the plate 3' to further effectively dissipate the heat generated by the chip unit 2. It should be noted that the through hole 34 can be provided in the heat dissipation area H or the fixed area F on the plate 3', or the through hole 34 can be provided in the heat dissipation area H and the fixed area F at the same time.

The third embodiment of the utility model provides a heat dissipation component P", which can tightly combine the board 3' and the supporting board 1 through the fixing part 7, so as to prevent the board 3' used to carry the thin heat sink 4 from being effectively connected to the chip unit. 2. The problem of close fit occurs. In addition, by setting the thin heat sink 4 in the accommodating groove 33 on the plate 3', the distance between the thin heat sink 4 and the chip unit 2 can be closer, so that the The heat generated by the chip unit 2 is effectively dissipated.

[Fourth Embodiment]

First, please refer to FIG. 7 , which is a schematic side view of a heat dissipation assembly according to a fourth embodiment of the present invention. From the comparison of Fig. 7 and Fig. 5, it can be seen that the difference between the fourth embodiment and the second embodiment is that the thin heat sink 4 provided on the plate 3 in the heat dissipation assembly P"' provided by the fourth embodiment can be reversed It is arranged so that the thin heat sink 4 is in contact with the chip unit 2 to dissipate the heat generated by the chip unit 2 .

Specifically, the fourth embodiment of the present utility model provides a heat dissipation assembly P"', which is used to dissipate the heat emitted by a chip unit 2 disposed on a carrier board 1, which includes a plate 3 and a thin heat sink 4. The chip unit 2 can have an upper surface 21 and a lower surface 22, and the lower surface 22 of the chip unit 2 can be arranged on the carrier plate 1. At the same time, the plate 3 is also arranged on the carrier plate 1, and the plate 3 is located on the chip unit 2. Above the upper surface 21. In addition, the adhesive layer 5 is arranged between the lower surface 32 of the plate 3 and the thin heat sink 4, so as to attach the thin heat sink 4 and the plate 3 to each other. Thereby, the thin heat sink 4 can be set by setting The heat conduction medium layer 6 on the upper surface 21 of the chip unit 2 is in contact with the chip unit 2 to dissipate the heat generated by the chip unit 2. The plate 3 can have a heat dissipation area H and a fixed area F, and the fixed area F is located in the heat dissipation area H, and the chip unit 2 is located below the heat dissipation area H, whereby the chip unit 2 dissipates the heat emitted by the chip unit 2 through the heat dissipation area H. The thin heat sink 4 can be arranged on the plate 3 and It is located on the lower surface 32 of the plate 3, and the thin heat sink 4 is arranged on the heat dissipation area H, whereby the heat emitted by the chip unit 2 dissipates through the thin heat sink 4 and the plate 3 in sequence. It should be noted that this The other detailed structural features of the cooling assembly P"' provided by the fourth embodiment of the utility model are similar to those of the foregoing embodiments, and will not be repeated here.

[Possible effects of the embodiment]

To sum up, the beneficial effect of the utility model can be that the heat dissipation components P, P', P", P"' provided by the embodiment of the utility model can connect the plates 3, 3' and the bearing plate through the fixing part 7 1 tight combination, avoiding the problem that the boards 3, 3' used to carry the thin heat sink 4 cannot be effectively bonded to the chip unit 2. In addition, the thermal diffusion radiation layer 42 provided in the thin heat sink 4 of the present invention can be made up of a resin material 421, a carbon composite material 422 and a thermal conductivity filling powder 423, wherein the carbon composite material is diamond particles, artificial graphite particles , carbon black particles, carbon fiber particles, graphene, carbon nanotubes or their groups, and the thermally conductive filling powder 423 is metal particles, oxide particles, nitride particles or their groups, so the thermal diffusion radiation layer can have The ability of heat conduction and heat radiation. In this way, the heat generated by the chip unit 2 can be effectively and quickly removed to the external environment to achieve the effect of rapid heat dissipation.

The above descriptions are only preferred feasible embodiments of the present utility model, and are not intended to limit the patent scope of the present utility model. Therefore, all equivalent technical changes made by using the description and drawings of the utility model are included in the scope of the utility model. within the scope of protection.

Claims (11)

1. a radiating subassembly, be arranged in order to dissipation one heat that the chip unit on a loading plate sends, it is characterized in that, described radiating subassembly comprises:

One sheet material, described sheet material is arranged on described loading plate, and described sheet material is positioned at the top of described chip unit, and wherein said sheet material has a heat dissipation region; And

One thin radiating fins, described thin radiating fins to be arranged on described sheet material and to be positioned in described heat dissipation region;

Wherein, the heat sequentially dissipation by described sheet material and described thin radiating fins that sends of described chip unit.

2. radiating subassembly according to claim 1, is characterized in that, described radiating subassembly also comprises an adhesion layer further, and described adhesion layer is arranged between described sheet material and described thin radiating fins.

3. radiating subassembly according to claim 1, is characterized in that, described radiating subassembly also comprises a heat-conducting medium layer further, and described heat-conducting medium layer is arranged between described chip unit and described sheet material.

4. radiating subassembly according to claim 1, is characterized in that, described thin radiating fins comprises a base material and a thermal diffusion radiating layer, and described thermal diffusion radiating layer is arranged on described base material, and described base material is arranged on described sheet material.

5. radiating subassembly according to claim 4, is characterized in that, described base material comprises a first substrate and a second substrate, and described thermal diffusion radiating layer is arranged between described first substrate and described second substrate.

6. radiating subassembly according to claim 5, is characterized in that, one of them of described first substrate and described both second substrates offers multiple being evenly distributed or the louvre of non-uniform Distribution.

7. radiating subassembly according to claim 1, is characterized in that, described thin radiating fins comprises a carbon composite, and wherein said carbon composite is diamond, Delanium, Graphene, CNT (carbon nano-tube), carbon black or carbon fiber.

8. radiating subassembly according to claim 1, it is characterized in that, described radiating subassembly also comprises a fixture further, described sheet material comprises a fixed area, described fixed area is positioned at the side of described heat dissipation region, wherein said fixture is arranged in described fixed area, and described loading plate and described sheet material are bonded to each other by described fixture.

9. radiating subassembly according to claim 8, is characterized in that, described radiating subassembly also comprises a flexible member further, and described flexible member is arranged on described sheet material, and described fixture is through described flexible member.

10. radiating subassembly according to claim 1, is characterized in that, described sheet material offers multiple being evenly distributed or the perforated holes of non-uniform Distribution.

11. 1 kinds of radiating subassemblies, it is arranged in order to dissipation one heat that the chip unit on a loading plate sends, and it is characterized in that, described radiating subassembly comprises:

One sheet material, described sheet material is arranged on described loading plate, and described sheet material is positioned at the top of described chip unit, and wherein said sheet material has a heat dissipation region; And

One thin radiating fins, described thin radiating fins to be arranged on described sheet material and to be positioned in described heat dissipation region;

Wherein, the heat sequentially dissipation by described thin radiating fins and described sheet material that sends of described chip unit.