KR102556611B1 - wire bonding device - Google Patents

Abstract

A wire bonding apparatus 100 having an ultrasonic horn 10 and a bonding arm 20, a clamp arm 31 protruding from the tip of the bonding arm 20 in the longitudinal direction and holding a wire 45, and bonding The wire clamper 30 having a body part 32 that is attached to the upper side of the arm 20 and accommodates the actuator 34 for opening and closing the clamp arm 31, and the actuator 34 of the wire clamper 30 It includes a control unit 60 that adjusts the opening and closing operation, and the control unit 60 vibrates the clamp arm 31 in the opening and closing direction in the open state by the actuator 34 of the wire clamper 30 during bonding.

Description

wire bonding device

The present invention relates to a configuration of a bonding device for bonding a wire to a bonding target.

A wire bonding device for connecting a wire between an electrode of a semiconductor die and a lead of a lead frame is widely used. In the wire bonding device, in a state where a wire is pressed down on an electrode by a capillary, the capillary is ultrasonically vibrated to bond the wire and the electrode, and then the wire is crossed over to the lead, and the wire is pressed down on the lead, The wire and the lead are connected by applying ultrasonic waves to the ring (for example, refer to Patent Document 1).

In the wire bonding device, the direction of ultrasonic vibration of the capillary is the direction in which the ultrasonic horn extends (hereinafter referred to as the Y direction). Because of this, the shape of the junction between the wire and the electrode or the junction between the wire and the lead extends in the Y-direction, which is the direction of the ultrasonic vibration of the capillary, resulting in poor junction.

Therefore, a structure in which an elastically deformable flexible connection frame is configured between the ultrasonic horn and the actuator of the ultrasonic horn, and the capillary vibrates in the Y direction, which is the vibration direction of the actuator, and in the X direction orthogonal to the Y direction, has been proposed (eg For example, see Patent Document 2).

International Application Publication No. 2017/217385 Japanese Patent No. 6073991

By the way, bonding is required to be performed in a very short time of about 10 msec. For this reason, it is required to vibrate the tip of the capillary in the X direction at a high frequency during bonding. Regarding this, in the configuration described in Cited Document 2, since the flexible connecting frame and the ultrasonic horn are integrally vibrated in the X direction, the mass vibrating in the X direction is large, and the ultrasonic horn is vibrated in the X direction at a high frequency. It was difficult. For this reason, when bonding is performed in a short time, the number of times of vibration of the tip of the capillary during bonding may decrease and the bonding quality may deteriorate.

Then, an object of the present invention is to improve bonding quality in a wire bonding device.

The wire bonding device of the present invention includes an ultrasonic horn to which a bonding tool through which a wire is inserted is attached to the front end, and a bonding arm to which the ultrasonic horn is attached, and a wire bonding method in which the wire is bonded to a bonding object by folding the bonding tool to a bonding object. A device, comprising: a wire clamper having a clamp arm protruding from the bonding arm in the longitudinal direction to hold the wire, and a body portion attached to the upper side of the bonding arm and accommodating an actuator for opening and closing the clamp arm, and an opening and closing operation of the actuator of the wire clamper And a control unit for adjusting the, characterized in that the control unit vibrates the clamp arm in the opening and closing direction in the open state by the actuator of the wire clamper during bonding.

During bonding, the clamp arm can be vibrated at a high frequency by vibrating the lightweight clamp arm in the X direction, which is the opening direction. In addition, the high-frequency vibration generated from the clamp arm may be transmitted to the tip of the ultrasonic horn to vibrate the bonding tool in the X direction at high frequency during bonding. Thereby, even when bonding is performed in a short time, the number of times of vibration of the tip of the bonding tool in the X direction during bonding can be increased, and bonding quality can be improved.

In the wire bonding device of the present invention, the controller may drive the clamp arm in the opening/closing direction at a frequency of 80% to 120% of the resonance frequency of the clamp arm with an actuator of the wire clamper during bonding.

Thereby, the clamp arm can be greatly vibrated with little input energy, and the bonding tool can be sufficiently vibrated in the X direction at the time of bonding. Thereby, bonding quality can be improved.

In the wire bonding device of the present invention, the length of the clamp arm of the wire clamper may be 80% to 120% of the length of the ultrasonic horn.

As a result, the resonance frequency of the clamp arm in the X direction and the resonance frequency of the ultrasonic horn in the X direction become substantially the same frequency, and the ultrasonic horn resonates in the X direction corresponding to the resonance of the clamp arm in the X direction. Therefore, vibration due to resonance of the clamp arm is smoothly transmitted to the ultrasonic horn, and the capillary attached to the tip of the ultrasonic horn can be sufficiently vibrated in the X direction. Thereby, bonding quality can be improved.

In the wire bonding device of the present invention, the clamp arm is in an open state when a predetermined open voltage is applied to the actuator, and the clamp arm is in a closed state when no voltage is applied to the actuator. The clamp arm may vibrate in the open/close direction in the open state by applying a variable voltage that varies in a predetermined voltage range centered on a base voltage equal to or slightly lower than the predetermined open-circuit voltage. At this time, the base voltage is a voltage of 80% to 100% of the predetermined open-circuit voltage, and the predetermined voltage width may be a voltage of 8% to 30% of the predetermined open-circuit voltage.

This makes it possible to vibrate the clamp arm while maintaining an open state in which the clamp arm does not come into contact with the wire. For this reason, the vibration frequency of the clamp arm can be set to a resonance frequency or a frequency near the resonance frequency.

In the wire bonding device of the present invention, an ultrasonic vibrator for ultrasonically vibrating an ultrasonic horn in a longitudinal direction is included, and the control unit adjusts driving of the ultrasonic vibrator to open the clamp arm by an actuator of the wire clamper during bonding. At the same time as vibrating in the opening/closing direction, the ultrasonic vibrator may be ultrasonically vibrated and the ultrasonic horn may be ultrasonically vibrated in the longitudinal direction.

With this configuration, bonding can be performed in a state where the tip of the bonding tool is vibrated in the XY direction. Thereby, it is possible to suppress that the joint portion of the wire becomes a deformed shape extending in the Y direction, resulting in poor bonding, and the bonding quality can be improved.

The present invention can improve bonding quality in a wire bonding device.

BRIEF DESCRIPTION OF THE DRAWINGS It is a system diagram which shows the side surface of the wire bonding apparatus of embodiment, and a control system.
Fig. 2A is a bottom view showing a bonding arm and an ultrasonic horn of the wire bonding apparatus shown in Fig. 1;
Fig. 2B is a plan view showing a bonding arm and a wire clamper of the wire bonding apparatus shown in Fig. 1;
Fig. 3 is a graph showing the relationship between the voltage applied to the wire clamper and the opening dimension G of the tip of the clamp arm.
Fig. 4 is a plan view showing the open dimension G of the tip of the clamp arm when the applied voltage V shown in Fig. 3 is the open-circuit voltage V0, the applied voltage VB1, and the applied voltage VB2.
5A is an elevational view showing the state of the ultrasonic horn and the wire clamper when the lower end of the wire is formed into a free air ball before bonding.
Fig. 5B is a elevational view showing a state of an ultrasonic horn and a wire clamper when bonding a wire to a semiconductor element.
5C is an elevational view showing a state of an ultrasonic horn and a wire clamper when bonding a wire to a substrate.
Fig. 6A is a bottom view showing the vibration of the ultrasonic horn in the state shown in Figs. 5B and 5C.
Fig. 6B is a plan view showing the vibration of the clamp arm in the state shown in Figs. 5B and 5C.

(Mode for implementing the invention)

Hereinafter, the wire bonding apparatus 100 of embodiment is demonstrated, referring drawings. In the following description, the ultrasonic horn 10 is removed from the bonding arm 20 in the direction in which the ultrasonic horn 10 and the bonding arm 20 extend or in the longitudinal direction of the bonding arm 20 and the ultrasonic horn 10. The direction to be directed will be described as the Y direction, the upward direction as the Z direction, and the direction orthogonal to the Y and Z directions as the X direction. Further, the positive side in the Y direction is referred to as the tip side, the negative side in the Y direction as the root side, the positive side in the Z direction as the upper side, the negative side in the Z direction as the lower side, the positive side in the X direction as the right side, and the negative side in the X direction as the left side.

As shown in FIG. 1, the wire bonding device 100 includes an ultrasonic horn 10, a bonding arm 20, a wire clamper 30, a control unit 60, and a substrate 52 or semiconductor to be bonded. A bonding stage 51 having elements 53 is included.

As shown in FIGS. 1 and 2A, the ultrasonic horn 10 includes a horn body 11, a base portion 12 formed on the negative side in the Y direction of the horn body 11 (hereinafter referred to as the root side), , an opening 13 formed in the base portion 12, and an ultrasonic vibrator 16 accommodated in the opening 13. The base portion 12 has a flange 14 protruding in the X direction. The proximal flange 14 is attached to the Y-direction positive side end 21 (hereinafter referred to as the distal end 21) of the bonding arm 20 with a bolt 15. The length from the flange 14 of the ultrasonic horn 10 fixed to the front end 21 of the bonding arm 20 to the positive side end of the horn body 11 in the Y direction is Lh. A capillary 41 serving as a bonding tool is attached to the plus side end of the horn body 11 of the ultrasonic horn 10 in the Y direction. The capillary 41 is a cylindrical member having a through hole at the center and a pointed tip. A wire 45 is inserted through the center hole of the capillary 41.

When the ultrasonic vibrator 16 ultrasonically vibrates in the Y direction at a predetermined frequency, the horn body 11 resonates in the Y direction and vibrates in the longitudinal direction, and the capillary 41 attached to the front end side of the horn body 11 ) in the Y direction.

As shown in FIG. 1, the bonding arm 20 is rotatably supported in a direction indicated by an arrow 90 at a rotational center 26 arranged at substantially the same height as the upper surface of the substrate 52 or the semiconductor element 53. has been At the rear end, a Z-direction motor 27 for driving the capillary 41 connected to the front end of the ultrasonic horn 10 in the Z-direction, and a base 28 on which the Z-direction motor 27 is mounted are mounted in the XY direction. An XY drive mechanism 29 driven by is attached. In addition, a piezoelectric element 17 is attached to the upper surface of the distal end side of the bonding arm 20 with a bolt 18 . The piezoelectric element 17 detects a pressing force of the capillary 41 against the substrate 52 or the semiconductor element 53.

As shown in FIG. 1 and FIG. 2B, the wire clamper 30 is attached to the upper side of the bonding arm 20. As shown in FIG. The wire clamper 30 includes a clamp arm 31 and a body part 32 . The body part 32 is fixed with bolts 25 on the seat 24 on the upper side of the bonding arm 20 . The body part 32 has a square opening 33 in the center, and an actuator 34 is accommodated in the opening 33. The actuator 34 may be formed of, for example, a piezo element.

On the positive side in the Y direction of the body portion 32, left and right arm attachment portions 36 extending toward the distal end are provided. A clamp arm 31 is fixed to the arm attachment portion 36 with bolts 35 . The tip of the clamp arm 31 protrudes in the Y direction from the tip 21 of the bonding arm 20 to grip the wire 45 . Further, between the left and right arm attachment portions 36, a concave portion 38 is provided. An elastic hinge 37 that rotates around the Z-direction axis is formed at the base of the arm attachment portion 36 by the concave portion 38 . The length from the elastic hinge 37 to the tip of the clamp arm 31 is the length Lc. The length Lc is approximately the same length as the length Lh from the flange 14 of the ultrasonic horn 10 fixed to the front end 21 of the bonding arm 20 to the plus side end of the horn body 11 in the Y direction. has been

Next, referring to FIGS. 3 and 4 , the relationship between the voltage V applied to the actuator 34 of the wire clamper 30 and the opening size G of the clamp arm 31 will be described. As shown in FIG. 3, when a predetermined voltage is not applied to the actuator 34, the opening dimension G of the clamp arm 31 becomes zero, and the wire clamper 30 is in a closed state . At this time, when there is a wire 45 between the left and right clamp arms 31, the clamp arm 31 grips the wire 45.

When a predetermined open circuit voltage (V0) is applied to the actuator 34, the clamp arm 31 rotates around the elastic hinge 37, and as shown by the solid line in FIG. 4, the tip of the clamp arm 31 moves in the opening and closing direction It spreads in the X direction, and the opening dimension G becomes the fully opening dimension G0. Since the fully open dimension G0 is greater than the diameter d of the wire 45, the clamp arm 31 opens the wire 45.

As indicated by the solid line (a) in FIG. 3 , the voltage V applied to the actuator 34 and the opening size G of the tip of the clamp arm 31 are in a substantially proportional relationship, so that the applied voltage V is increased. If so, the opening dimension G of the tip of the clamp arm 31 also increases along with it. As shown in FIG. 3 , when the applied voltage V is set to an applied voltage V1 slightly lower than the open-circuit voltage V0, the open-end dimension G of the tip of the clamp arm 31 is indicated by a broken line in FIG. Like the clamp arm 31 indicated by , it has a largely open dimension G1 that is slightly smaller than the fully open dimension G0. In addition, when the applied voltage V is set to an applied voltage VB2 lower than the applied voltage VB1, the opening dimension G of the tip of the clamp arm 31 is the clamp arm 31 indicated by the dashed-dotted line in FIG. Like this, it becomes the small opening size G2 smaller than the large opening size G1. Since the small opening size G2 is larger than the diameter d of the wire 45, even when the opening size G of the tip of the clamp arm 31 is the small opening size G2, the clamp arm 31 has the wire 45 ), the wire clamper 30 maintains an open state. Therefore, when the applied voltage V is varied between the applied voltages VB1 and VB2, the opening size G of the tip of the clamp arm 31 is changed to the major opening size G1 while maintaining the open state of the wire clamper 30. ) and a small opening dimension (G2). Here, in order to make the applied voltage V a fluctuating voltage between the applied voltage VB1 and the applied voltage VB2, the median value of the applied voltage VB1 and the applied voltage VB2 is taken as the base voltage VB, The applied voltage V may be increased or decreased by a voltage width ΔV centered on the base voltage VB. The base voltage (VB) and the voltage width (ΔV) can be freely selected. For example, the base voltage (VB) is 80% to 100% of the open-circuit voltage (V0), and the voltage width (ΔV) is open-circuit. It is good also as a voltage of 8% - 30% of voltage V0.

The control unit 60 includes a clamper control unit 61 and a bonding control unit 62. The clamper controller 61 adjusts the applied voltage V of the actuator 34 of the wire clamper 30 to open and close the clamp arm 31 . The bonding control unit 62 receives a signal from the piezoelectric element 17 and adjusts the Z-direction motor 27 to move the front end of the capillary 41 in the direction of contact with respect to the substrate 52 or the semiconductor element 53. driven by In addition, the XY drive mechanism 29 is controlled to adjust the position of the capillary 41 in the XY direction. Further, the ultrasonic transducer 16 of the ultrasonic horn 10 is driven to ultrasonically vibrate the horn body 11 in the Y direction.

Next, the bonding operation of the wire bonding device 100 configured as described above will be described with reference to FIGS. 5A to 5C, FIG. 6B, and FIG. 6B.

As shown in FIG. 5A, the clamper control unit 61 sets the applied voltage V of the actuator 34 of the wire clamper 30 to zero, closes the wire clamper 30, and closes the wire clamper 30. to grip the wire 45. The bonding controller 62 generates a spark between a torch electrode (not shown) and a wire 45 extending from the tip of the capillary 41 to mold the lower end of the wire 45 into a free air ball 50. do.

As shown in FIG. 5B, the clamper control unit 61 adjusts the applied voltage V to the actuator 34 of the wire clamper 30 of the voltage width ΔV around the base voltage VB shown in FIG. It vibrates at a frequency f0 in the range.

As a result, the applied voltage V to the actuator 34 vibrates at the frequency f0 in the range of the applied voltage V1 and the applied voltage V2 shown in FIG. 3, and the tip of the clamp arm 31 As shown in Fig. 4, the opening dimension G vibrates at a frequency f0 between the major opening dimension G1 and the small opening dimension G2. In this way, the clamper control unit 61 vibrates the clamp arm 31 at the frequency f0 while maintaining the open state of the wire clamper 30. Here, if the frequency f0 is set to a frequency close to the resonance frequency f1 at which the clamp arm 31 oscillates in the X direction, as indicated by the arrow 96 in FIG. 6B, the clamp arm 31 responds to resonance. oscillates horizontally in the X direction around the elastic hinge 37. The frequency f0 may be a frequency close to the resonance frequency f1 of the vibration of the clamp arm 31 in the X direction. When the resonance frequency of the clamp arm 31 is, for example, approximately 2 kHz, it is good also as a frequency in the vicinity of 2 kHz, for example, a frequency of about 1.9 kHz to 2.0 kHz. Since the clamp arm 31 is lightweight, it can sufficiently vibrate in the X direction even at such a high frequency. Thereby, even when bonding is performed in a short time, the number of vibrations in the X direction of the front end of the capillary 41 during bonding can be increased. Further, as long as the frequency f0 is a frequency at which the clamp arm 31 resonates in the X direction, it may be selected from a range such as, for example, f1/√2<f0<f1×√2, and the clamp arm 31 It may be selected from a frequency in the range of 80% to 120% of the resonant frequency f1 in the X direction of .

When the clamp arm 31 resonates, vibration of the clamp arm 31 in the X direction is transmitted from the bonding arm 20 to the ultrasonic horn 10 . Here, the length Lc from the elastic hinge 37 of the wire clamper 30 to the front end of the clamp arm 31 is the flange of the ultrasonic horn 10 fixed to the front end 21 of the bonding arm 20 ( 14) to the positive side end in the Y direction of the horn body 11, and is substantially the same as the length Lh. For this reason, the resonance frequency f2 of the ultrasonic horn 10 in the X direction becomes a frequency close to the resonance frequency f1 of the clamp arm 31 in the X direction. For this reason, the resonance vibration of the clamp arm 31 transmitted from the bonding arm 20 in the X direction causes the ultrasonic horn 10 to resonate in the X direction, as indicated by an arrow 97 in FIG. 6A , The front end of the main body 11 vibrates laterally in the X direction. As a result, the capillary 41 attached to the front end of the horn body 11 vibrates in the X direction.

Meanwhile, the bonding control unit 62 applies a predetermined voltage to the ultrasonic vibrator 16 of the ultrasonic horn 10 to ultrasonically vibrate the ultrasonic vibrator 16 . Ultrasonic resonance in the Y-direction occurs in the horn body 11, and as a result, the tip of the capillary 41 vibrates in the Y-direction, as indicated by an arrow 92 in FIG. 5B.

In this way, the clamper control unit 61 vibrates the clamp arm 31 to vibrate the tip of the ultrasonic horn 10 and the capillary 41 in the X direction, and the bonding control unit 62 moves the ultrasonic vibrator 16 is driven to vibrate the tip of the capillary 41 in the Y direction. In this way, in a state where the tip of the capillary 41 vibrates in the XY direction, the bonding control unit 62 operates the Z-direction motor 27, as shown by the arrow 91 in FIG. 5B, The filler 41 is pressed down on the electrode of the semiconductor element 53 to bond the free air ball 50 to the electrode of the semiconductor element 53 .

When bonding to the semiconductor element 53 is completed, the bonding controller 62 operates the Z-direction motor 27 to raise the capillary 41 . Further, the clamper control unit 61 grips the wire 45 with the clamp arm 31 by setting the applied voltage V of the actuator 34 to zero. Then, the bonding control unit 62 operates the Z-direction motor 27 and the XY drive mechanism 29 to loop the front end of the capillary 41 as indicated by the arrow 93 shown in FIG. 5C to form a substrate 52. leads over the electrodes of

Here, the clamper controller 61, similarly to the bonding of the free air balls 50, applies the applied voltage V of the actuator 34 of the wire clamper 30 to the vibration of the clamp arm 31 in the X direction. It vibrates at a frequency f0 close to the resonant frequency f1. As a result, the clamp arm 31 vibrates laterally in the X direction centering on the elastic hinge 37 by resonance, as indicated by an arrow 96 in FIG. 6B. Further, as indicated by an arrow 97 in Fig. 6A, the tip of the horn body 11 vibrates laterally in the X direction, and the tip of the capillary 41 vibrates in the X direction. Further, the bonding controller 62 drives the ultrasonic vibrator 16 to vibrate the tip of the capillary 41 in the Y direction as indicated by the arrow 95 in FIG. 5C. Then, in a state where the tip of the capillary 41 vibrates in the XY direction, the bonding control unit 62 drives the Z-direction motor 27, and as shown by the arrow 94 in FIG. 5C, the capillary ( The wire 45 is bonded to the electrode of the substrate 52 by pressing the tip of the wire 41 down to the electrode of the substrate 52.

In the wire bonding device 100 described above, the length Lc from the elastic hinge 37 of the wire clamper 30 to the tip of the clamp arm 31 and the horn from the flange 14 of the ultrasonic horn 10 It has substantially the same length as the length Lh of the main body 11 to the positive side end in the Y direction. For this reason, the resonance frequency f1 of the clamp arm 31 in the X direction and the resonance frequency f2 of the ultrasonic horn 10 in the X direction have the same frequency. With this configuration, the ultrasonic horn 10 is resonantly vibrated in the X direction by the resonance vibration of the clamp arm 31 in the X direction, so that the tip of the capillary 41 can be vibrated in the X direction. Further, the horn body 11 of the ultrasonic horn 10 can be resonated in the Y direction by the ultrasonic vibrator 16 so that the tip of the capillary 41 can vibrate in the Y direction. For this reason, the wire 45 can be bonded to the electrode of the semiconductor element 53 or the electrode of the substrate 52 in a state where the tip of the capillary 41 is vibrated in the XY direction. Thereby, it is possible to suppress that the joint portion of the wire 45 becomes a deformed shape extending in the Y direction, resulting in poor bonding, and bonding quality can be improved. In addition, the bonding strength between the wire 45 and the electrode of the semiconductor element 53 or the electrode of the substrate 52 can be increased.

In addition, if the X-direction resonance vibration of the clamp arm 31 resonates with the ultrasonic horn 10 in the X-direction to vibrate the tip of the capillary 41 in the X-direction, the length Lc and length (Lh) is not substantially the same length, but it is good also considering length (Lc) as the range of 80% - 120% of length (Lh), for example.

In addition, since the resonance frequency f1 of the clamp arm 31 in the X direction and the resonance frequency f2 of the ultrasonic horn 10 in the X direction are high frequencies around 2 kHz, for example, the capillary 41 The tip can be vibrated in the X direction at a high frequency, and even when bonding is performed in a short time, the number of times of vibration of the tip of the capillary 41 in the X direction during bonding can be increased. Thereby, the quality of bonding can be improved.

In addition, by setting the base voltage (VB) to a voltage of 80% to 100% of the open circuit voltage (V0) and the voltage width (ΔV) to a voltage of 8% to 30% of the open circuit voltage (V0), the wire clamper is reliably The clamp arm 31 can be vibrated in the X direction while keeping the 30 open. Thereby, the clamp arm 31 contacts the wire 45 during vibration, and it can suppress that the vibration of the X direction is disturbed, and bonding quality can be improved.

In addition, in the wire bonding apparatus 100 of the embodiment described above, it has been described that bonding is performed by vibrating the front end of the capillary 41 in the XY direction, but it is not limited to this, and the ultrasonic transducer 16 is driven. Instead, by vibrating only the clamp arm 31 in the X direction, bonding may be performed by vibrating the front end of the capillary 41 only in the X direction. Even in this case, in the wire bonding apparatus 100 of the embodiment, since the tip of the capillary 41 can be vibrated in the X direction at a high frequency, the vibration of the capillary 41 can be reduced even when bonding is performed in a short time. The number of times can be increased, and bonding quality can be maintained.

In addition, depending on the thickness of the wire 45 and bonding conditions, when bonding the free air ball 50 to the electrode of the semiconductor element 53, the clamp arm 31 is not vibrated in the X direction, and the ultrasonic vibrator 16 When the tip of the capillary 41 is ultrasonically vibrated in the Y direction by driving only the capillary 41 and bonding the wire 45 to the electrode of the substrate 52, the ultrasonic vibrator 16 is not driven and only the clamp arm 31 is used. It may vibrate in the X direction so that the front end of the capillary 41 vibrates in the X direction. Thereby, deformation of the compression ball at the time of bonding can be suppressed and bonding quality can be improved.

In addition, in the wire bonding device 100 described above, the ultrasonic horn 10 has been described as having the flange 14 on the proximal side of the horn body 11 attached to the tip of the bonding arm 20, but it is limited to this. Alternatively, a portion other than the base of the horn body 11 may be configured to be attached to the center portion or near the tip of the bonding arm 20.

10 ultrasonic horn, 11 horn body, 12 base part, 13, 33 opening, 14 flange, 15, 18, 25, 35 volt, 16 ultrasonic transducer, 17 piezoelectric element, 20 bonding arm, 21 tip (plus side end in Y direction), 24 seat, 26 rotation center, 27 Z direction motor, 28 base, 29 XY drive mechanism, 30 wire clamper, 31 clamp arm, 32 body part, 34 actuator, 36 arm attachment part, 37 elastic hinge, 38 concave part, 41 cage Pillar, 45 wire, 50 free air ball, 51 bonding stage, 52 substrate, 53 semiconductor element, 60 control unit, 61 clamper control unit, 62 bonding control unit, 100 wire bonding device.

Claims (9)

An ultrasonic horn to which a bonding tool through which a wire is inserted is attached to the front end;
Equipped with a bonding arm to which the ultrasonic horn is attached,
A wire bonding device for bonding the wire to the bonding target by folding the bonding tool to the bonding target,
A wire clamper having a clamp arm protruding from the bonding arm in the longitudinal direction to hold the wire, and a body portion attached to an upper side of the bonding arm and accommodating an actuator for opening and closing the clamp arm;
And a control unit for adjusting the opening and closing operation of the actuator of the wire clamper,
The control unit
The wire bonding device characterized in that during bonding, the actuator of the wire clamper vibrates the clamp arm in an opening and closing direction in an open state. According to claim 1,
The control unit
The wire bonding device according to claim 1 , wherein the actuator of the wire clamper drives the clamp arm in an opening/closing direction at a frequency of 80% to 120% of a resonant frequency of the clamp arm during bonding. According to claim 1,
The wire bonding device, characterized in that the length of the clamp arm of the wire clamper is 80% to 120% of the length of the ultrasonic horn. According to claim 2,
The wire bonding device, characterized in that the length of the clamp arm of the wire clamper is 80% to 120% of the length of the ultrasonic horn. According to any one of claims 1 to 4,
In the wire clamper, the clamp arm is in an open state when a predetermined open voltage is applied to the actuator, and the clamp arm is in a closed state when no voltage is applied to the actuator,
The control unit
Vibrating the clamp arm in an open/closed direction in an open state by applying a variable voltage that fluctuates in a predetermined voltage width centered on a base voltage equal to or lower than a predetermined open-circuit voltage to the actuator. Characterized by a wire bonding device. According to claim 5,
The base voltage is a voltage of 80% to 100% of the predetermined open-circuit voltage,
The wire bonding device according to claim 1 , wherein the predetermined voltage width is a voltage of 8% to 30% of the predetermined open-circuit voltage. According to any one of claims 1 to 4,
An ultrasonic vibrator for ultrasonically vibrating the ultrasonic horn in a longitudinal direction;
The control unit
By adjusting the driving of the ultrasonic vibrator,
At the time of bonding, the actuator of the wire clamper vibrates the clamp arm in the opening and closing direction from the open state, and at the same time ultrasonically vibrates the ultrasonic transducer to ultrasonically vibrate the ultrasonic horn in the longitudinal direction. Wire bonding device . According to claim 5,
An ultrasonic vibrator for ultrasonically vibrating the ultrasonic horn in a longitudinal direction;
The control unit
By adjusting the driving of the ultrasonic vibrator,
At the time of bonding, the actuator of the wire clamper vibrates the clamp arm in the opening and closing direction from the open state, and at the same time ultrasonically vibrates the ultrasonic transducer to ultrasonically vibrate the ultrasonic horn in the longitudinal direction. Wire bonding device . According to claim 6,
An ultrasonic vibrator for ultrasonically vibrating the ultrasonic horn in a longitudinal direction;
The control unit
By adjusting the driving of the ultrasonic vibrator,
At the time of bonding, the actuator of the wire clamper vibrates the clamp arm in the opening and closing direction from the open state, and at the same time ultrasonically vibrates the ultrasonic transducer to ultrasonically vibrate the ultrasonic horn in the longitudinal direction. Wire bonding device .

Images