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CN113767458A - Wire bonding device - Google Patents

Wire bonding device Download PDF

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Publication number
CN113767458A
CN113767458A CN202080031826.8A CN202080031826A CN113767458A CN 113767458 A CN113767458 A CN 113767458A CN 202080031826 A CN202080031826 A CN 202080031826A CN 113767458 A CN113767458 A CN 113767458A
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wire
arm
bonding
ultrasonic
voltage
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CN202080031826.8A
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CN113767458B (en
Inventor
富山俊彦
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Shinkawa Ltd
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Shinkawa Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
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    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78353—Ultrasonic horns
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    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78621—Holding means, e.g. wire clampers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78621—Holding means, e.g. wire clampers
    • H01L2224/78631—Means for wire tension adjustments
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    • H01L2224/789—Means for monitoring the connection process
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/789—Means for monitoring the connection process
    • H01L2224/78901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

本发明的打线接合装置(100)包括超声波焊头(10)以及接合臂(20)，且包括：打线夹持器(30)，具有夹持臂(31)以及基体部(32)，所述夹持臂(31)自接合臂(20)的前端朝长度方向突出而夹持打线(45)，所述基体部(32)安装于接合臂(20)的上侧而收纳使夹持臂(31)进行开闭动作的致动器(34)；以及控制部(60)，调整打线夹持器(30)的致动器(34)的开闭动作，且控制部(60)在接合时通过打线夹持器(30)的致动器(34)使夹持臂(31)在张开状态下在开闭方向上振动。

Figure 202080031826

The wire bonding device (100) of the present invention comprises an ultrasonic welding head (10) and a bonding arm (20), and comprises: a wire bonding holder (30) having a clamping arm (31) and a base portion (32), The gripping arm (31) protrudes from the front end of the engaging arm (20) in the longitudinal direction to grip the wire (45), and the base portion (32) is mounted on the upper side of the engaging arm (20) to accommodate the gripper. an actuator (34) for opening and closing the arm (31); and a control part (60) for adjusting the opening and closing of the actuator (34) of the wire-bonding gripper (30), and the control part (60) ) vibrates the gripping arm (31) in the open state in the opening and closing direction by the actuator (34) of the wire-bonding gripper (30) at the time of engagement.

Figure 202080031826

Description

Wire bonding device
Technical Field
The present invention relates to a structure of a bonding apparatus for bonding a wire (wire) to a bonding object.
Background
Wire bonding devices that connect the electrodes of the semiconductor die (die) and the leads (lead) of the lead frame (lead frame) by wire bonding have been widely used. A wire bonding apparatus bonds a wire and an electrode by ultrasonically vibrating a capillary (capillary) in a state where the wire is pressed against the electrode, mounts the wire on a lead, and ultrasonically connects the wire and the lead by pressing the mounted wire against the lead (see, for example, patent document 1).
In the wire bonding apparatus, the direction of ultrasonic vibration of the capillary is the extending direction (hereinafter referred to as Y direction) of the ultrasonic horn (horn). Therefore, the shape of the bonding portion between the wire and the electrode or the bonding portion between the wire and the lead is a shape extending in the Y direction which is the direction of the ultrasonic vibration of the capillary, and a bonding failure may be caused.
Therefore, a structure has been proposed in which a capillary tube is vibrated in a Y direction, which is a vibration direction of an actuator, and in an X direction orthogonal to the Y direction, and is configured by a flexible coupling frame that is elastically deformable between an ultrasonic horn and the actuator (activator) of the ultrasonic horn (see, for example, patent document 2).
Documents of the prior art
Patent document
Patent document 1: international application publication No. 2017/217385
Patent document 2: japanese patent No. 6073991
Disclosure of Invention
Problems to be solved by the invention
However, it is required to perform the bonding within a very short time of about 10 msec. Therefore, it is required to vibrate the tip of the capillary in the X direction at a high frequency during bonding. In this regard, in the structure described in reference 2, since the flexible link and the ultrasonic horn are integrally vibrated in the X direction, the mass vibrating in the X direction is large, and it is difficult to vibrate the ultrasonic horn in the X direction at a high frequency. Therefore, when joining is performed in a short time, the number of times the tip of the capillary vibrates during joining is reduced, and the joining quality may be degraded.
Therefore, an object of the present invention is to improve bonding quality in a wire bonding apparatus.
Means for solving the problems
The wire bonding device of the present invention comprises: an ultrasonic bonding tool (bonding tool) with a wire bonding insert mounted on the front end thereof; and a bonding arm (bonding arm) to which the ultrasonic horn is attached, and which brings the bonding tool into contact with/away from the bonding object to bond the wire to the bonding object, the wire bonding apparatus characterized by comprising: a wire clamp (wire clamp) having a clamp arm (clamp arm) that protrudes in a longitudinal direction from the bonding arm and holds a wire, and a base portion that is attached to an upper side of the bonding arm and accommodates an actuator that causes the clamp arm to perform an opening and closing operation; and a control part for adjusting the opening and closing action of the actuator of the wire clamp, and the control part enables the clamping arm to vibrate in the opening and closing direction in an opening state through the actuator of the wire clamp when in jointing.
When the clamp arms are engaged, the light-weight clamp arms are vibrated in the X direction, which is the opening direction, so that the clamp arms can be vibrated at a high frequency. Further, it is possible to transmit high-frequency vibration generated by the clamp arm to the tip of the ultrasonic horn and vibrate the bonding tool in the X direction at high frequency at the time of bonding. Thus, even when the joining is performed in a short time, the number of times the tip of the joining tool vibrates in the X direction during the joining process can be increased, and the joining quality can be improved.
In the wire bonding apparatus of the present invention, the control section may drive the clamp arm in the opening and closing direction at a frequency of 80% to 120% of the resonant frequency of the clamp arm by the actuator of the wire clamp at the time of bonding.
Thus, the clamp arm can be vibrated largely with a small input energy, and the bonding tool can be vibrated sufficiently in the X direction at the time of bonding. This improves the bonding quality.
In the wire bonding apparatus of the present invention, the length of the holding arm of the wire bonding holder may be set to 80% to 120% of the length of the ultrasonic horn.
As a result, the resonance frequency of the clamp arm in the X direction and the resonance frequency of the ultrasonic horn in the X direction become substantially the same frequency, and the ultrasonic horn resonates in the X direction in accordance with the resonance of the clamp arm in the X direction. Therefore, the vibration caused by the resonance of the clamp arm is smoothly transmitted to the ultrasonic horn, and the capillary attached to the distal end of the ultrasonic horn can be sufficiently vibrated in the X direction. This improves the bonding quality.
In the wire bonding apparatus of the present invention, the wire clamp is configured such that the clamp arm is in an open state when a predetermined opening voltage is applied to the actuator, and the clamp arm is in a closed state when no voltage is applied to the actuator, and the control unit vibrates the clamp arm in the open state in the opening and closing direction by applying a variation voltage to the actuator, the variation voltage being the same as the predetermined opening voltage or varying in a predetermined voltage range around a base voltage slightly lower than the predetermined opening voltage. In this case, the base voltage may be 80% to 100% of the predetermined opening voltage, and the predetermined voltage range may be 8% to 30% of the predetermined opening voltage.
Thus, the holding arm can be vibrated while keeping the holding arm in an open state where the holding arm is not in contact with the wire. Therefore, the vibration frequency of the clamp arm can be set to a resonance frequency or a frequency near the resonance frequency.
The wire bonding apparatus of the present invention includes an ultrasonic transducer for ultrasonically vibrating an ultrasonic horn in a longitudinal direction, and the control unit can adjust driving of the ultrasonic transducer, and vibrate a clamp arm in an open state in an open/close direction by an actuator of a wire clamp during bonding, and ultrasonically vibrate the ultrasonic transducer to ultrasonically vibrate the ultrasonic horn in the longitudinal direction.
With this structure, the bonding can be performed in a state where the tip of the bonding tool is vibrated in the XY direction. This can prevent the bonding portion of the wire from being deformed in a shape extending in the Y direction to cause a bonding failure, thereby improving the bonding quality.
ADVANTAGEOUS EFFECTS OF INVENTION
The invention can improve the bonding quality in the wire bonding device.
Drawings
Fig. 1 is a system diagram showing a side surface and a control system of a wire bonding apparatus according to an embodiment.
Fig. 2A is a bottom view of the bonding arm and ultrasonic horn of the wire bonding apparatus shown in fig. 1.
Fig. 2B is a plan view of the bonding arm and wire clamp of the wire bonding apparatus shown in fig. 1.
Fig. 3 is a graph showing a relationship between an applied voltage to the wire clamping device and an opening dimension G of the tip of the clamping arm.
Fig. 4 is a plan view showing the opening dimension G of the distal end of the grip arm when the applied voltage V shown in fig. 3 is the splay voltage V0, the applied voltage VB1, and the applied voltage VB 2.
Fig. 5A is a vertical view showing a state of the ultrasonic horn and the wire clamp when the lower end of the wire is formed into a free air ball (free air ball) before bonding.
Fig. 5B is a vertical view showing the state of the ultrasonic bonding head and the wire bonding holder when wire bonding the semiconductor element.
Fig. 5C is a vertical view showing the state of the ultrasonic bonding head and the wire clamp when bonding a wire to a substrate.
Fig. 6A is a bottom view showing the vibration of the ultrasonic horn in the state shown in fig. 5B and 5C.
Fig. 6B is a plan view showing vibration of the clamp arm in the state shown in fig. 5B and 5C.
Detailed Description
Hereinafter, the wire bonding apparatus 100 according to the embodiment will be described with reference to the drawings. In the following description, in the extending direction of the ultrasonic horn 10 and the bonding arm 20, or the longitudinal direction of the bonding arm 20 and the ultrasonic horn 10, the direction from the bonding arm 20 toward the ultrasonic horn 10 is the Y direction, the above direction is the Z direction, and the direction orthogonal to the Y direction and the Z direction is the X direction. The description will be given with the positive side in the Y direction as the tip side, the negative side in the Y direction as the root side, the positive side in the Z direction as the upper side, the negative side in the Z direction as the lower side, the positive side in the X direction as the right side, and the negative side in the X direction as the left side.
As shown in fig. 1, wire bonding apparatus 100 includes: the ultrasonic bonding tool 10, the bonding arm 20, the wire bonding clamper 30, the control unit 60, and a bonding stage (bonding stage)51 for holding a substrate 52 or a semiconductor element 53 to be bonded.
As shown in fig. 1 and 2A, the ultrasonic horn 10 includes: a bonding tool body 11; a base (base) portion 12 formed on the Y-direction negative side (hereinafter referred to as root side) of the horn body 11; an opening 13 formed in the base portion 12; and an ultrasonic transducer 16 housed in the opening 13. The base portion 12 includes a flange 14 projecting in the X direction. The root-side flange 14 is attached to a Y-direction leading end 21 (hereinafter referred to as a leading end 21) of the joint arm 20 by a bolt (bolt) 15. The length from the flange 14 of the ultrasonic horn 10 fixed to the leading end 21 of the joint arm 20 to the Y-direction positive-side end of the horn body 11 is a length Lh. A capillary 41 as a bonding tool is attached to the Y-direction positive side end of the horn body 11 of the ultrasonic horn 10. The capillary 41 is a cylindrical member having a through hole at the center and a pointed tip. A wire 45 is inserted through the center hole of the capillary 41.
When the ultrasonic transducer 16 ultrasonically vibrates in the Y direction at a predetermined frequency, the horn body 11 resonates in the Y direction and vibrates in the longitudinal direction, and the capillary 41 attached to the tip end side of the horn body 11 vibrates in the Y direction.
As shown in fig. 1, the joint arm 20 is supported rotatably in the direction indicated by an arrow 90 at a rotation center 26 disposed at substantially the same height as the upper surface of the substrate 52 or the semiconductor element 53. At the rear end part: a Z-direction motor (motor)27 that drives a capillary 41 connected to the tip of the ultrasonic horn 10 in the Z-direction; and an XY drive mechanism 29 that drives the base 28 on which the Z-direction motor 27 is mounted in the XY direction. The piezoelectric element 17 is mounted on the upper surface of the distal end side of the joint arm 20 by a bolt 18. The piezoelectric element 17 detects the pressing force of the capillary 41 against the substrate 52 or the semiconductor element 53.
As shown in fig. 1 and 2B, a wire clamper 30 is attached to the upper side of the bonding arm 20. The wire bonding clamper 30 includes a clamping arm 31 and a base portion 32. The base portion 32 is fixed to the seat 24 on the upper side of the joint arm 20 by a bolt 25. The base portion 32 has a square opening 33 at the center, and the actuator 34 is housed in the opening 33. The actuator 34 may comprise, for example, a piezoelectric (piezo) element.
A left and right arm attachment portion 36 extending toward the tip end side is provided on the Y-direction positive side of the base portion 32. The clamp arm 31 is fixed to the arm mounting portion 36 by a bolt 35. The tip of the clamp arm 31 projects in the Y direction from the tip 21 of the bonding arm 20 and holds the wire 45. A recess 38 is provided between the left and right arm mounting portions 36. An elastic hinge (hinge)37 that rotates about the Z-axis is formed at the base of the arm mounting portion 36 by the recess 38. The length from the elastic hinge 37 to the front end of the clamp arm 31 is a length Lc. The length Lc is substantially the same as the length Lh from the flange 14 of the ultrasonic horn 10 fixed to the front end 21 of the joint arm 20 to the Y-direction positive-side end of the horn body 11.
Next, the relationship between the voltage V applied to the actuator 34 of the wire clamp 30 and the opening dimension G of the clamp arm 31 will be described with reference to fig. 3 and 4. As shown in fig. 3, when a predetermined voltage is not applied to the actuator 34, the opening dimension G of the clamp arm 31 is zero, and the wire clamp 30 is in a closed state. At this time, when the wire 45 is provided between the left and right clamp arms 31, the clamp arm 31 holds the wire 45.
When a predetermined opening voltage V0 is applied to the actuator 34, the clamp arm 31 rotates about the elastic hinge 37, and the tip of the clamp arm 31 opens in the X direction, which is the opening and closing direction, as shown by the solid line in fig. 4, and the opening dimension G is the full opening dimension G0. Since full open dimension G0 is greater than diameter d of wire bond 45, clamp arm 31 releases wire bond 45.
As shown by a solid line a in fig. 3, the voltage V applied to the actuator 34 is substantially proportional to the opening dimension G of the distal end of the clamp arm 31, and when the applied voltage V is increased, the opening dimension G of the distal end of the clamp arm 31 is also increased. As shown in fig. 3, when the applied voltage V is set to the applied voltage V1 slightly lower than the opening voltage V0, the opening dimension G of the distal end of the gripper arm 31 becomes a large opening dimension G1 slightly smaller than the full opening dimension G0 as in the gripper arm 31 shown by the broken line in fig. 4. When the applied voltage V is set to the applied voltage VB2 lower than the applied voltage VB1, the opening dimension G of the distal end of the clamp arm 31 becomes a small opening dimension G2 smaller than the large opening dimension G1 as in the clamp arm 31 shown by the one-dot chain line in fig. 4. Since the small opening dimension G2 is larger than the diameter d of the wire 45, even when the opening dimension G of the tip of the clamp arm 31 is the small opening dimension G2, the clamp arm 31 does not contact the wire 45, and the wire clamp 30 is kept open. Therefore, when the applied voltage V is varied between the applied voltages VB1 and VB2, the opening dimension G of the tip of the clamp arm 31 can be varied between the large opening dimension G1 and the small opening dimension G2 while maintaining the open state of the wire clamp 30. Here, in order to set the applied voltage V to a fluctuating voltage between the applied voltage VB1 and the applied voltage VB2, the center value between the applied voltage VB1 and the applied voltage VB2 may be the base voltage VB, and the applied voltage V may be increased or decreased by the voltage range Δ V around the base voltage VB. The substrate voltage VB and the voltage range Δ V can be freely selected, and for example, the substrate voltage VB can be set to a voltage of 80% to 100% of the flare voltage V0, and the voltage range Δ V can be set to a voltage of 8% to 30% of the flare voltage V0.
The control section 60 includes a gripper control section 61, and an engagement control section 62. The gripper control section 61 adjusts the voltage V applied to the actuator 34 of the wire gripper 30 to open and close the gripping arm 31. The bonding control unit 62 receives a signal from the piezoelectric element 17, adjusts the Z-direction motor 27, and drives the tip of the capillary 41 in the contact/separation direction with respect to the substrate 52 or the semiconductor element 53. The XY drive mechanism 29 is controlled to adjust the position of the capillary 41 in the XY direction. The ultrasonic transducer 16 of the ultrasonic horn 10 is driven to ultrasonically vibrate the horn body 11 in the Y direction.
Next, a bonding operation of wire bonding apparatus 100 configured as described above will be described with reference to fig. 5A to 5C, 6B, and 6B.
As shown in fig. 5A, gripper control section 61 causes wire gripper 30 to grip wire 45 by setting wire gripper 30 to a closed state with application voltage V of actuator 34 of wire gripper 30 set to zero. The bonding controller 62 generates a spark (spark) between a torch (torch) electrode (not shown) and the wire 45 extending from the tip of the capillary 41, and shapes the lower end of the wire 45 into the free air ball 50.
As shown in fig. 5B, the clamper control section 61 vibrates the applied voltage V to the actuator 34 of the wire clamper 30 at the frequency f0 within the range of the voltage range Δ V centering on the base voltage VB shown in fig. 3.
Thereby, the applied voltage V to the actuator 34 vibrates at the frequency f0 within the range of the applied voltage V1 and the applied voltage V2 shown in fig. 3, and the opening dimension G of the distal end of the clamp arm 31 vibrates at the frequency f0 between the large opening dimension G1 and the small opening dimension G2 as shown in fig. 4. In this manner, the gripper control section 61 keeps the open state of the wire gripper 30 and vibrates the gripping arm 31 at the frequency f 0. Here, when the frequency f0 is set to a frequency close to the resonance frequency f1 at which the chucking arm 31 vibrates in the X direction, the chucking arm 31 vibrates laterally in the X direction around the elastic hinge 37 by resonance as indicated by an arrow 96 in fig. 6B. The frequency f0 may be a frequency close to the resonance frequency f1 of the vibration of the clamp arm 31 in the X direction. For example, when the resonance frequency of the clamp arm 31 is approximately 2kHz, the frequency f0 is a frequency around 2kHz, and may be, for example, a frequency around 1.9kHz to 2.0 kHz. Since the clamp arm 31 is lightweight, it can sufficiently vibrate in the X direction even at such high frequencies. Thereby, even in the case where the bonding is performed in a short time, the number of times the tip of the capillary 41 vibrates in the X direction during the bonding process can be increased. If the frequency f0 is a frequency at which the chucking arm 31 resonates in the X direction, it may be selected from the range of f1/√ 2 < f0 < f1 √ 2, or from the range of 80% to 120% of the resonant frequency f1 in the X direction of the chucking arm 31, for example.
When the clamp arm 31 resonates, the vibration of the clamp arm 31 in the X direction is transmitted from the joining arm 20 to the ultrasonic horn 10. Here, the length Lc from the elastic hinge 37 to the tip of the clamp arm 31 of the wire clamp 30 is substantially the same as the length Lh from the flange 14 of the ultrasonic horn 10 fixed to the tip 21 of the bonding arm 20 to the Y-direction positive side end of the horn body 11. Therefore, the resonance frequency f2 of the ultrasonic horn 10 in the X direction is close to the resonance frequency f1 of the clamp arm 31 in the X direction. Therefore, by the resonant vibration of the clamp arm 31 transmitted from the bonding arm 20 in the X direction, the ultrasonic horn 10 resonates in the X direction as indicated by an arrow 97 in fig. 6A, and the tip of the horn body 11 vibrates laterally in the X direction. Thereby, the capillary 41 attached to the tip of the bonding tool body 11 vibrates in the X direction.
On the other hand, the bonding controller 62 applies a predetermined voltage to the ultrasonic transducer 16 of the ultrasonic horn 10 to ultrasonically vibrate the ultrasonic transducer 16. Ultrasonic resonance is generated in the Y direction in the horn body 11, and thereby the tip of the capillary 41 vibrates in the Y direction as indicated by an arrow 92 in fig. 5B.
In this manner, the gripper control unit 61 vibrates the gripper arm 31 to vibrate the ultrasonic horn 10 and the tip of the capillary 41 in the X direction, and the bonding control unit 62 drives the ultrasonic transducer 16 to vibrate the tip of the capillary 41 in the Y direction. As described above, in a state where the tip of the capillary 41 vibrates in the XY direction, the bonding control unit 62 operates the Z-direction motor 27 to press the capillary 41 against the electrode of the semiconductor element 53 as indicated by an arrow 91 in fig. 5B, thereby bonding the free air ball 50 to the electrode of the semiconductor element 53.
When the bonding of the semiconductor element 53 is completed, the bonding controller 62 operates the Z-direction motor 27 to raise the capillary 41. The gripper control section 61 sets the voltage V applied by the actuator 34 to zero and holds the wire 45 by the gripper arm 31. Then, the bonding control unit 62 operates the Z-direction motor 27 and the XY-drive mechanism 29 to guide the tip of the capillary 41 in a loop shape onto the electrode of the substrate 52 as indicated by an arrow 93 shown in fig. 5C.
Here, gripper control unit 61 causes applied voltage V of actuator 34 of wire gripper 30 to vibrate at frequency f0 close to resonant frequency f1 of vibration of gripping arm 31 in the X direction, similarly to the bonding of free air ball 50. Thereby, the clamp arm 31 laterally oscillates in the X direction around the elastic hinge 37 by resonance as indicated by an arrow 96 in fig. 6B. As indicated by an arrow 97 in fig. 6A, the tip of the tip body 11 vibrates laterally in the X direction and the tip of the capillary 41 vibrates in the X direction. The bonding controller 62 drives the ultrasonic transducer 16 to vibrate the tip of the capillary 41 in the Y direction as indicated by an arrow 95 in fig. 5C. Then, in a state where the tip of the capillary 41 is vibrated in the XY direction, the bonding control section 62 drives the Z-direction motor 27 to press the tip of the capillary 41 against the electrode of the substrate 52 as shown by an arrow 94 in fig. 5C, thereby bonding the wire 45 to the electrode of the substrate 52.
In the wire bonding apparatus 100 described above, the length Lc from the elastic hinge 37 to the tip end of the clamp arm 31 of the wire clamp 30 is substantially the same as the length Lh from the flange 14 of the ultrasonic horn 10 to the Y-direction positive side end of the horn body 11. Therefore, the resonant frequency f1 of the clamp arm 31 in the X direction is the same as the resonant frequency f2 of the ultrasonic horn 10 in the X direction. With this structure, the tip of the capillary 41 can be vibrated in the X direction by causing the ultrasonic horn 10 to resonate in the X direction by the resonant vibration of the clamp arm 31 in the X direction. The tip of the capillary 41 can be vibrated in the Y direction by resonating the horn body 11 of the ultrasonic horn 10 in the Y direction by the ultrasonic transducer 16. Therefore, the wire 45 can be bonded to the electrode of the semiconductor element 53 or the electrode of the substrate 52 in a state where the tip of the capillary 41 is vibrated in the XY direction. This can prevent the bonding portion of wire 45 from being deformed in a shape extending in the Y direction to cause a bonding failure, thereby improving the bonding quality. Further, the bonding strength between wire 45 and the electrode of semiconductor element 53 or the electrode of substrate 52 can be improved.
Further, if the tip end of the capillary 41 can be vibrated in the X direction by resonant vibration of the ultrasonic horn 10 in the X direction by resonant vibration of the clamp arm 31 in the X direction, the length Lc may not be substantially the same as the length Lh, and the length Lc may be set to a range of 80% to 120% of the length Lh, for example.
Further, since the resonance frequency f1 of the holder arm 31 in the X direction and the resonance frequency f2 of the ultrasonic horn 10 in the X direction are high frequencies of, for example, about 2kHz, the tip of the capillary 41 can be vibrated in the X direction at high frequencies, and the number of times the tip of the capillary 41 vibrates in the X direction during bonding can be increased even when bonding is performed in a short time. This improves the quality of the bonding.
Further, by setting the base voltage VB to a voltage of 80% to 100% of the opening voltage V0 and setting the voltage range Δ V to a voltage of 8% to 30% of the opening voltage V0, the clamp arm 31 can be vibrated in the X direction while the wire clamp 30 is reliably kept in the opened state. Thus, the holding arm 31 is prevented from contacting the wire 45 during vibration and the vibration in the X direction is prevented from being disturbed, thereby improving the bonding quality.
In the wire bonding apparatus 100 according to the above-described embodiment, the bonding is performed by vibrating the tip of the capillary 41 in the XY direction, but the present invention is not limited to this, and the bonding may be performed by vibrating the tip of the capillary 41 only in the X direction without driving the ultrasonic transducer 16 and by vibrating the clamp arm 31 only in the X direction. Even in this case, in the wire bonding apparatus 100 according to the embodiment, since the tip of the capillary 41 can be vibrated in the X direction at a high frequency, the number of times of vibration of the capillary 41 can be increased even when bonding is performed in a short time, and bonding quality can be maintained.
When bonding free air ball 50 to the electrode of semiconductor element 53, depending on the thickness of wire 45 or the bonding conditions, ultrasonic transducer 16 alone is driven without vibrating clamp arm 31 in the X direction to ultrasonically vibrate the tip of capillary 41 in the Y direction, and when bonding wire 45 to the electrode of substrate 52, ultrasonic transducer 16 alone is not driven to vibrate clamp arm 31 in the X direction to vibrate the tip of capillary 41 in the X direction. This can suppress crushing of the pressure-bonding ball at the time of bonding, thereby improving the bonding quality.
In the wire bonding apparatus 100 described above, the case where the flange 14 on the base portion side of the horn body 11 of the ultrasonic horn 10 is attached to the distal end of the bonding arm 20 has been described, but the wire bonding apparatus is not limited to this, and a portion other than the base portion of the horn body 11 may be attached to the center portion or the vicinity of the distal end of the bonding arm 20.
Description of the symbols
10: ultrasonic welding head
11: welding head body
12: base part
13. 33: opening of the container
14: flange
15. 18, 25, 35: bolt
16: ultrasonic vibrator
17: piezoelectric element
20: joint arm
21: front end (Y direction positive side end)
24: seat
26: center of rotation
27: z-direction motor
28: base seat
29: XY drive mechanism
30: wire bonding clamp holder
31: clamping arm
32: base body part
34: actuator
36: arm mounting part
37: elastic hinge
38: concave part
41: capillary tube
45: wire bonding
50: free air ball
51: joint platform
52: substrate
53: semiconductor device with a plurality of semiconductor chips
60: control unit
61: clamper control part
62: connection control part
100: wire bonding device

Claims (9)

1. A wire bonding apparatus comprising:
the ultrasonic welding head is provided with a jointing tool for wire bonding and insertion at the front end; and
an engaging arm for mounting the ultrasonic horn, and
bringing the bonding tool into contact with/out of contact with a bonding object to bond the wire to the bonding object, characterized by comprising:
a wire clamp having a clamp arm that projects in a longitudinal direction from the bonding arm and holds the wire, and a base portion that is attached to an upper side of the bonding arm and accommodates an actuator that causes the clamp arm to open and close; and
a control part for adjusting the opening and closing action of the actuator of the wire bonding clamper,
the control section causes the clamp arm to vibrate in an opening and closing direction in an open state by the actuator of the wire clamp at the time of bonding.
2. The wire bonding apparatus of claim 1,
the control unit drives the clamp arm in the opening/closing direction at a frequency of 80% to 120% of the resonance frequency of the clamp arm by the actuator of the wire clamp during bonding.
3. The wire bonding apparatus of claim 1,
the length of the clamping arm of the routing clamp holder is 80% -120% of the length of the ultrasonic welding head.
4. The wire bonding apparatus of claim 2,
the length of the clamping arm of the routing clamp holder is 80% -120% of the length of the ultrasonic welding head.
5. The wire bonding apparatus according to any one of claims 1 to 4,
in the wire bonding clamper, the clamping arm is in an open state when a predetermined open voltage is applied to the actuator, and the clamping arm is in a closed state when no voltage is applied to the actuator,
the control unit vibrates the clamp arm in the open state in the opening/closing direction by applying a variable voltage to the actuator, the variable voltage being the same as the predetermined open voltage or varying in a predetermined voltage range around a base voltage slightly lower than the predetermined open voltage.
6. The wire bonding apparatus of claim 5,
the base voltage is 80% to 100% of the predetermined opening voltage,
the predetermined voltage range is a voltage that is 8% to 30% of the predetermined opening voltage.
7. The wire bonding apparatus of any one of claims 1 to 4, comprising:
an ultrasonic vibrator configured to vibrate the ultrasonic horn in an ultrasonic manner in a longitudinal direction,
the control unit adjusts the drive of the ultrasonic transducer,
the actuator of the wire bonding clamper vibrates the clamping arm in the opening and closing direction in the opening state, and the ultrasonic vibrator is vibrated to make the ultrasonic welding head vibrate in the length direction.
8. The wire bonding apparatus of claim 5, comprising:
an ultrasonic vibrator configured to vibrate the ultrasonic horn in an ultrasonic manner in a longitudinal direction,
the control unit adjusts the drive of the ultrasonic transducer,
the actuator of the wire bonding clamper vibrates the clamping arm in the opening and closing direction in the opening state, and the ultrasonic vibrator is vibrated to make the ultrasonic welding head vibrate in the length direction.
9. The wire bonding apparatus of claim 6, further comprising:
an ultrasonic vibrator configured to vibrate the ultrasonic horn in an ultrasonic manner in a longitudinal direction,
the control unit adjusts the drive of the ultrasonic transducer,
the actuator of the wire bonding clamper vibrates the clamping arm in the opening and closing direction in the opening state, and the ultrasonic vibrator is vibrated to make the ultrasonic welding head vibrate in the length direction.
CN202080031826.8A 2019-08-13 2020-07-14 Wire Bonding Device Active CN113767458B (en)

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JPWO2021029174A1 (en) 2021-02-18
TW202107585A (en) 2021-02-16
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KR102556611B1 (en) 2023-07-19
WO2021029174A1 (en) 2021-02-18

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