JP3487162B2 - Bonding tools and bonding equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding tool and a bonding apparatus for bonding a bonded article such as an electronic component to a surface to be bonded such as an electrode of a substrate.

[0002]

2. Description of the Related Art As a method of bonding a bonded article such as an electronic component to a surface to be bonded such as an electrode of a substrate, a method using ultrasonic pressure welding is known. In this method, ultrasonic vibration is applied to the bonded object while pressing the bonded object against the surfaces to be bonded, and the bonded surface is vibrated minutely to generate friction, thereby bringing the bonded surfaces into close contact. The bonding tool used in this method has a horn that is an elongated rod body that transmits the vibration of the ultrasonic oscillator, which is the vibration source, to the bonded object. The part corresponding to is fixed, and the part corresponding to the antinode having the largest amplitude is pressed against the joint to effectively use the vibration.

[0003]

By the way, the ultrasonic transducer is attached to the end portion of the horn and transmits the vibration in the longitudinal direction of the horn, that is, the longitudinal vibration to the horn. And in order to efficiently transmit this longitudinal vibration to the joint, the shape of the horn is such that the cross-sectional area of the rod is tapered from the end where the ultrasonic transducer is attached to the center where it is pressed against the joint. It has a reduced shape, and the amplitude of the longitudinal vibration is amplified by this shape and transmitted to the joint. That is, in order to efficiently use ultrasonic vibration, it is necessary to increase the cross-sectional area ratio between the end portion and the central portion of the horn.

However, since the above-described amplification effect cannot be obtained in a shape in which the cross-sectional area changes abruptly, in the conventional bonding tool horn, if the cross-sectional area ratio is increased to obtain the amplification effect, the horn is required. Inevitably, the entire length dimension must be increased, resulting in an increase in the width of the bonding tool. As described above, the conventional bonding tool has a problem that if the ultrasonic vibration is used efficiently, the horn becomes large and hinders downsizing of the device.

Therefore, an object of the present invention is to provide a bonding tool which is compact and can efficiently utilize vibration, and a bonding apparatus using this bonding tool.

[0006]

A bonding tool according to claim 1 is a bonding tool for crimping a bonded object to a surface to be bonded while applying load and vibration to the bonded object, and an elongated horn, An oscillator that imparts longitudinal vibration to this horn, and a protrusion that protrudes from this horn in a substantially symmetrical shape in a direction substantially orthogonal to the longitudinal vibration direction at a position corresponding to the antinode of the standing wave of the longitudinal vibration of the horn. It has a part, further pre
An inner hole for vacuum suction is formed on the horn, and one end of this inner hole is formed.
To the one end of the protrusion so that the adsorbing hole for the joint is formed.
In addition, the other end of the inner hole is opened to form a suction hole,
A suction pad that comes into contact with this suction hole and is sucked by the suction device
A pad is provided, and one end of the protrusion is pressed against the bonded article so that the load and vibration act on the bonded article.

According to a second aspect of the present invention, there is provided a bonding tool according to the first aspect, wherein a node of a standing wave of longitudinal vibration is equidistantly spaced from the position corresponding to the antinode toward both ends of the horn. The fixing portion for fixing the horn is provided integrally with the horn at a position corresponding to the above.

A bonding apparatus according to a third aspect of the present invention is a bonding apparatus that press-bonds a bonded object to a surface to be bonded while applying load and vibration to the bonded object, and has an elongated horn, and longitudinal vibration is applied to the horn. possess a vibrator imparting to, a protruding portion protruding substantially symmetrical shape of the longitudinal vibration in a position corresponding to the antinode of the standing wave from the horn in the direction direction substantially perpendicular of the longitudinal vibration of the horn, further For vacuum suction on the horn
An inner hole is formed, and one end of this inner hole is connected to one end of the protrusion.
To form a suction hole for the joint,
Open the other end of the to make a suction hole, and touch the suction hole.
A bonding tool provided with a suction pad that is sucked by a suction device, and a pressing unit that presses one end of the protruding portion against the bonded object and presses the bonded object against a surface to be bonded. It was

According to a fourth aspect of the present invention, there is provided the bonding apparatus according to the third aspect, wherein the pressing means is provided with a longitudinal vibration that is equidistant from both ends of the horn from a position corresponding to the antinode. The pressing force is transmitted to the horn through the position corresponding to the node of the standing wave.

According to the invention described in each of the claims, a protrusion protruding from the horn in a direction substantially orthogonal to the longitudinal vibration direction is provided at a position corresponding to the antinode of the standing wave of the longitudinal vibration of the horn of the bonding tool. By having one end of the protruding portion pressed against the joint and transmitting the vibration, it is possible to transmit the vibration in which the bending vibration generated in the protruding portion is superimposed and the amplitude is amplified to the joint. Utilization efficiency can be improved.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front view of a bonding apparatus for bumped electronic components according to an embodiment of the present invention, FIG. 2 is a perspective view of a bonding tool for bumped electronic components, and FIG.
3A is a front view of the bonding tool for the electronic component with bumps, FIG. 3B is a plan view of the bonding tool for the electronic component with bumps, and FIG. 4 is a partial perspective view of the bonding tool for the electronic component with bumps. is there.

First, the overall structure of a bonding apparatus for electronic components with bumps will be described with reference to FIG. Reference numeral 1 denotes a support frame, on the front surface of which a first elevating plate 2 and a second elevating plate 3 are vertically movable. A cylinder 4 is mounted on the first lift plate 2, and a rod 5 of the cylinder 4 is mounted on the second lift plate 3.
Is bound to. A bonding head 10 is attached to the second lift plate 3. Z is on the upper surface of the support frame 1.
A shaft motor 6 is provided. The Z-axis motor 6 rotates the vertical feed screw 7. The feed screw 7 is screwed into a nut 8 provided on the back surface of the first elevating plate 2. Therefore Z
When the shaft motor 6 is driven and the feed screw 7 rotates, the nut 8 moves up and down along the feed screw 7 to move the first lift plate 2 and the second lift plate 2.
The lift plate 3 also moves up and down.

In FIG. 1, a substrate 32 as a surface to be joined is shown.
Is placed on the substrate holder 34, and the substrate holder 34
Is placed on the table 35. The table 35 is a movable table and horizontally moves the substrate 32 in the X direction and the Y direction to position the substrate 32 at a predetermined position.

Reference numeral 42 denotes a camera, which is a uniaxial table 43.
Is attached to. A lens barrel 44 extends forward from the camera 42. The camera 42 is moved forward along the uniaxial table 43, and the tip end of the lens barrel 44 is adsorbed and held on the lower surface of the bonding tool 14 as shown by a chain line, and between the bumped electronic component 30 and the substrate 32. Then, the positions of the bumped electronic component 30 and the substrate 32 are observed by the camera 42 in this state. Then, the relative displacement between the electronic component with bump 30 and the substrate 32 is detected based on this observation result. The detected positional deviation is corrected by driving the table 35 to horizontally move the substrate 32 in the X direction and the Y direction, whereby the electronic component with bumps 30 and the substrate 32 are aligned.

In FIG. 1, reference numeral 50 is a main control unit, which controls the Z-axis motor 6 via a motor drive unit 51, controls the table 35 via a table control unit 52, and also recognizes a unit 53. Connected to the camera 42. Further, the cylinder 4 as the pressing means is connected to the main control unit 50 via the load control unit 54, and the rod 5 of the cylinder 4 is connected.
Of the bump output, that is, the bonding tool 14 controls the pressing load for pressing the bumped electronic component 30 against the substrate 32.

A holder 12 is connected to the lower end of the main body 11 of the bonding head 10. A block 13 is attached to the holder 12, and a bonding tool 14 is fixed to the block 13. The block 13 and the bonding tool 14 will be described below with reference to FIGS.

As shown in FIG. 2, the bonding tool 1
The horn 15 of No. 4 is an elongated rod-shaped body, and ribs 15 are provided on four side surfaces equidistantly from the center of the horn 15.
a is provided integrally with the horn 15. The bonding tool 14 is fixed to the lower surface of the block 13 by the rib 15a. That is, the rib 15a is the horn 1
It is a fixing part for fixing 5.

On the lower surface of the central portion of the bonding tool 14, there is provided a protruding portion 15e having a protruding shape for holding the electronic component 30 with bumps by vacuum suction. The lower surface of the protruding portion 15e is a suction surface for sucking the electronic component. It is 15f. One end of an inner hole 16 for vacuum suction provided in the horn 15 is opened on the suction surface 15f to form a suction hole 16a.
The other end of the inner hole 16 is opened at the position of the rib 15a on the upper surface of the horn 15 to form a suction hole 16b.

A protrusion 15g is formed on the upper surface of the central portion of the bonding tool 14 substantially symmetrically with the protrusion 15e. The protrusion 15g serves to minimize the eccentricity of the mass and rigidity of the horn 15 with respect to the central axis of the horn 15 to make lateral vibration (vibration in a direction orthogonal to the length direction of the horn 15) less likely to occur in the horn 15. When the horn 15 vibrates laterally, the suction surface 15f vibrates in a direction perpendicular to the surface, that is, in the vertical direction, and the electronic component with bumps 3
Not only hindering the bonding of 0, but also electronic components with bumps 3
0 may cause mechanical damage.

A protrusion 13 provided on the side surface of the block 13
The pipe portion 18 is provided at a so as to project downward, and
As shown in FIG. 3, the suction pad 19 attached to the lower end of the pipe portion 18 is in contact with the position of the suction hole 16b on the upper surface of the horn 15. Therefore, the protrusion 13a is connected to the protrusion 13a.
A tube 20 communicating with the tube portion 18 through the inner hole 13b of
From the above, by sucking air by driving the suction device 21, the suction hole 1 opened to the suction surface 15e through the inner hole 16
6a (FIGS. 3A and 3B) can be vacuum-sucked, and the electronic component 30 with bumps can be vacuum-suctioned and held on the suction surface 15f.

On the side end surface of the horn 15, a vibrator 17 as a vibration applying means is mounted. By driving the vibrator 17, vertical vibration is applied to the horn 15, and the protrusion 15e vibrates in the horizontal direction (direction of arrow a shown in FIG. 3A). As shown in FIG. 3 (b), the shape of the horn 15 is such that the width is gradually reduced from both end portions 15 b to the central portion 15 d via the taper portion 15 c, so that it protrudes from the vibrator 17. The amplitude of the ultrasonic vibration is amplified in the path transmitted to the portion 15e, and the vibration having the amplitude equal to or larger than the amplitude oscillated by the vibrator 17 is transmitted to the protruding portion 15e.

Next, the mode of vibration excited in the horn 15 by the vibrator 17 will be described. As shown in FIG. 3A, the standing wave of the vibration excited in the horn 15 is
The positions of the protruding surface 15e located on the mounting surface of the vibrator 17 and the center of the horn 15 are the antinodes of the standing wave, and the positions of the ribs 15a and the suction holes 16b as the fixing portions that fix the horn 15 to the block 13 are the fixed positions. It is shaped like a wave node. That is, such a standing wave can be generated in the horn 15 by appropriately setting the shape size and mass distribution of each part of the horn 15.

Therefore, the rib 15a, which is a fixed portion, is a standing wave that is equidistantly separated from the protruding portion 15e, which is a position corresponding to the antinode of the standing wave of the vibration of the horn 15, toward both ends of the horn 15. It is provided at a position corresponding to a node. This fixes the bonding tool 14 to the block 13,
At the position of the rib 15a that transmits the pressing force of the cylinder 4 to the horn 15 via the position corresponding to the node of the standing wave, the horn 1 is
The displacement caused by the vertical vibration of 5 is extremely small, and the maximum amplitude is obtained at the position of the holding portion 15e that holds the electronic component 30 with bumps.
Can be most effectively used for bonding.

Next, the shape of the protruding portion 15e provided with the attracting surface 15f for holding and pressing the electronic component which is the bonded article will be described. As shown in FIG. 4, the protruding portion 15e is in the direction of longitudinal vibration in the central portion of the horn 15.
5 can be considered as a cantilever beam having a cross section 1 × b and a length h which has a fixed end in the horn 15 and which is symmetrically projected in a direction orthogonal to the longitudinal direction of 5 in both directions.

By applying vertical vibration to the horn 15,
As a result of the fixed end vibrating (see arrow b), bending vibration is excited on the projecting portion 15e which is a cantilever (see arrow c). Therefore, by appropriately setting the respective dimensions l, b, h of the protrusion 15e with respect to the frequency of the longitudinal vibration of the horn 15, the bending vibration generated in the protrusion 15e can resonate with the longitudinal vibration of the horn 15. it can. As a result, the suction surface 15f, which is the end of the protruding portion 15e, vibrates in the longitudinal direction of the horn 15 with a large amplitude, and is superposed on the longitudinal vibration of the horn 15 itself to obtain a very large amplification effect.

According to the result of the vibration analysis performed on the bonding tool 14 of the present embodiment by using the finite element method, the amplitude of the vibration source generated by the vibrator 17 is compared with that of the horn 15. The amplitude of the vertical vibration in the central portion 15d is about 3 times, and the amplitude on the suction surface 15f is about 9 times, and the excellent vibration amplification effect of the protruding portion 15e is quantitatively confirmed.

Further, the protrusion 1 is formed by the protrusion 15g.
It was confirmed that by reducing the eccentricity of the mass and the rigidity due to 5e, the lateral vibration of the entire horn 15 was suppressed and the vertical vibration on the suction surface 15f was hardly generated.

The bonding apparatus for bumped electronic parts is constructed as described above, and its operation will be described below.
In FIG. 1, the electronic component 30 with bumps is vacuum-sucked and held on the suction surface 15e of the bonding tool 14, and the substrate 3
Position above 2. Then, the lens barrel 44 is moved forward to obtain the images of the bumped electronic component 30 and the substrate 32 by the camera 42, and the image data is sent to the recognition unit 53. Main controller 5
0 indicates the electronic data 30 with bumps and the substrate 3 from this image data.
The relative position shift of 2 is detected, the table 35 is driven according to the detection result, and the substrate 32 is horizontally moved to correct the position.

Next, the Z-axis motor 6 is driven to lower the bonding head 10 and press the bumps of the bumped electronic component 30 against the substrate 32. At this time, the substrate 32 is heated by the heating means (not shown). Then, the vibrator 17 is driven in the pressed state to apply vibration to the bumped electronic component 30. As a result, the pressing surface between the bump 31 and the electrode of the substrate 32 is rubbed by the vibration, and the bump 31 is bonded to the electrode of the substrate 32.

At this time, the shape of the protruding portion 15e of the horn 15 for transmitting the vibration to the bumped electronic component 30 is set so that the resonance due to the bending vibration can be effectively used as described above, and the amplitude is significantly increased. Since the amplified vibration can be transmitted to the bumped electronic component 30, the electronic component 3
0 can be bonded efficiently. Moreover, since a high amplification factor can be achieved by the above effect, it is not necessary to make the length of the horn 15 excessively large for the purpose of amplification, and a compact bonding tool can be provided.

Furthermore, the suction surface 1 is formed by the protrusion 15g.
By suppressing the vertical vibration of 5f, highly reliable bonding of electronic components with bumps can be realized.

[0032]

According to the present invention, the horn of the bonding tool has a protruding portion which is located at a position corresponding to an antinode of a standing wave of longitudinal vibration and which protrudes from the horn in a direction substantially orthogonal to the direction of longitudinal vibration. , By pressing one end of the protrusion against the joint to transmit the vibration, it is possible to transmit the vibration, in which the bending vibration generated in the protrusion is superimposed and the amplitude is amplified, to the joint. It is possible to improve efficiency and efficiently bond a bonded article. Moreover, since a high amplification factor is achieved by this, it is not necessary to make the length of the horn excessively large for the purpose of amplification, and a compact bonding tool can be provided.

[Brief description of drawings]

FIG. 1 is a front view of a bonding apparatus for electronic components with bumps according to an embodiment of the present invention.

FIG. 2 is a perspective view of a bonding tool for electronic components with bumps according to an embodiment of the present invention.

FIG. 3A is a front view of a bonding tool for an electronic component with bumps according to one embodiment of the present invention. FIG. 3B is a plan view of a bonding tool for an electronic component with bumps according to one embodiment of the present invention.

FIG. 4 is a partial perspective view of a bonding tool for an electronic component with bumps according to an embodiment of the present invention.

[Explanation of symbols]

10 Bonding head 13 blocks 14 Bonding tool 15 horn 15a rib 15e protrusion 15f adsorption surface 16a Adsorption hole 17 oscillators 50 Main control unit

Continuation of the front page (56) Reference JP-A-10-22308 (JP, A) JP-A-9-57466 (JP, A) JP-A-9-57468 (JP, A) JP-A-10-15673 (JP , A) JP-A-11-265915 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/607 H01L 21/60 311 B06B 1/02

Claims (4)

(57) [Claims] 1. A bonding tool for press-bonding a bonded object to a surface to be bonded while applying load and vibration to the bonded object, the elongated horn, and a vibrator for imparting longitudinal vibration to the horn, It has a protrusion protruding in a substantially symmetrical shape of the longitudinal vibration in a position corresponding to the antinode of the standing wave in the direction of direction substantially perpendicular to the longitudinal vibration from the horn of the horn, further wherein
An inner hole for vacuum suction is formed on the horn, and one end of this inner hole is
A suction hole for the bonded product is formed by opening one end of the protrusion.
At the same time, open the other end of the inner hole to create a suction hole.
Suction pads that come into contact with the suction holes of the
A bonding tool, characterized in that a bond is provided, and the load and vibration are applied to the bonded object by pressing the one end against the bonded object. 2. A fixing portion for fixing the horn to a position corresponding to a node of a standing wave of longitudinal vibration, which is equidistantly spaced from the position corresponding to the antinode to both ends of the horn, The bonding tool according to claim 1, wherein the bonding tool is integrally provided. 3. A bonding apparatus for press-bonding a bonded object to a surface to be bonded while applying load and vibration to the bonded object, the elongated horn, a vibrator for imparting longitudinal vibration to the horn, and have a protrusion protruding in a substantially symmetrical shape of the longitudinal vibration in a position corresponding to the antinode of the standing wave in the direction of direction substantially perpendicular to the longitudinal vibration from the horn of the horn, further wherein
An inner hole for vacuum suction is formed on the horn, and one end of this inner hole is
A suction hole for the bonded product is formed by opening one end of the protrusion.
At the same time, open the other end of the inner hole to create a suction hole.
Suction pads that come into contact with the suction holes of the
A bonding apparatus comprising: a bonding tool provided with a cord; and a pressing unit that presses one end of the protruding portion against the bonded object and presses the bonded object against a surface to be bonded. 4. The pressing means applies a pressing force to the horn through a position corresponding to a node of a standing wave of longitudinal vibration, which is equidistantly separated from a position corresponding to the antinode toward both ends of the horn. The bonding apparatus according to claim 3, wherein the bonding apparatus transmits the signal.