JP3729153B2 - Electronic component bonding apparatus and bonding tool - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component bonding apparatus and bonding tool for bonding an electronic component such as a flip chip to a surface to be bonded such as an electrode of a substrate.
[0002]
[Prior art]
As a method for bonding an electronic component to a surface to be bonded such as an electrode of a substrate, a method using ultrasonic pressure welding is known. In this method, ultrasonic vibration is applied to the electronic component while pressing the electronic component against the surface to be joined, and the joining surface is brought into close contact by causing the joining surface to vibrate minutely to generate friction. The bonding tool used in this method has a horn that is an elongated rod body that transmits vibrations of an ultrasonic vibrator, which is a vibration generation source, to an electronic component, and a bonding action provided on the lower surface of the horn. The electronic component is pressed against the surface to be bonded and bonded while applying a load and vibration to the electronic component by bringing the portion into contact with the electronic component.
[0003]
By the way, a bonding tool for electronic parts often serves also as a transfer tool for transferring electronic parts and mounting them on a substrate. In such a bonding tool having a transfer function, a suction hole for vacuum suction is provided in a bonding portion that contacts the electronic component, and the electronic component is sucked and held by vacuum suction from the suction hole. It has become. Therefore, a vacuum suction circuit for connecting an external vacuum suction source and the suction hole is provided inside the horn.
[0004]
The vacuum suction circuit is connected to a vacuum suction source by connecting a piping means such as a tube to a vacuum suction hole opened on the outer surface of the horn. Since lateral vibration is applied to the horn, the position of this vacuum suction hole is conventionally the position where the amplitude of this vibration is the smallest, that is, the node of standing wave vibration induced in the horn by the ultrasonic transducer. It was provided in the position.
[0005]
[Problems to be solved by the invention]
However, when the position of the vacuum suction hole for connection is set in this way, the position of the joint action part provided by selecting the position where the amplitude of vibration in the horn is the largest and the position of the connection part do not coincide with each other. The path and shape of the internal hole for communicating between the part and the connection part must be complicated. For this reason, it takes time to process the internal hole in the production of the bonding tool, which increases the manufacturing cost, and the presence of the internal hole impairs the structural symmetry in the horn and maintains good vibration transmission characteristics. It was difficult.
[0006]
SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component bonding apparatus and a bonding tool that can simplify the machining of internal holes and can maintain good vibration transmission characteristics.
[0007]
[Means for Solving the Problems]
An electronic component bonding apparatus according to claim 1 is an electronic component bonding apparatus that crimps the electronic component to a surface to be bonded while applying a load and vibration to the electronic component, and a bonding tool for bonding the electronic component; A pressing means for pressing the bonding tool against the electronic component, the bonding tool comprising a horizontally long horn that is supported at both ends by a fixed portion, a vibrator that applies vibration to the horn, and a stationary position of the horn. A bonding action portion that is provided on the lower surface side of the position corresponding to the antinode of the wave vibration and contacts and presses against the electronic component; an adsorption hole for adsorbing the electronic component opened in the bonding action portion; and An internal hole communicating with a vacuum suction hole provided on the upper surface side at a position corresponding to the belly and a connection means for connecting the vacuum suction hole and a vacuum suction source were provided.
[0008]
A bonding tool for an electronic component according to claim 2 is a bonding tool for crimping the electronic component to a surface to be bonded while applying a load and vibration to the electronic component, and a horizontally long horn supported on both ends by a fixed portion; A vibrator that applies vibration to the horn, a bonding action portion that is provided on the lower surface side of the position corresponding to the antinode of the standing wave vibration of the horn and presses against the electronic component, and the bonding action portion Connects the suction hole for sucking the opened electronic component, the internal hole communicating with the vacuum suction hole provided on the upper surface side of the position corresponding to the antinode, and the vacuum suction hole and the vacuum suction source Connecting means.
[0009]
According to the present invention, the suction hole for sucking the electronic component opened in the bonding portion provided on the lower surface side of the position corresponding to the antinode of the standing wave vibration of the horn is provided in the vacuum provided above the suction hole. By communicating with the suction hole, it is possible to simplify the processing of the internal hole that constitutes the vacuum suction circuit inside the horn, and to maintain good vibration transmission characteristics.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
(Embodiment 1)
1 is a front view of an electronic component bonding apparatus according to Embodiment 1 of the present invention, FIG. 2 is a perspective view of an electronic component bonding tool according to Embodiment 1 of the present invention, and FIG. 3 is Embodiment 1 of the present invention. FIG. 4 is an operation explanatory diagram of the electronic component bonding tool according to the first embodiment of the present invention.
[0011]
First, the overall structure of an electronic component bonding apparatus will be described with reference to FIG. Reference numeral 1 denotes a support frame, and a first elevating plate 2 and a second elevating plate 3 are provided on the front surface thereof so as to be movable up and down. A cylinder 4 is mounted on the first lifting plate 2, and its rod 5 is coupled to the second lifting plate 3. A bonding head 10 is attached to the second lifting plate 3. A Z-axis motor 6 is provided on the upper surface of the support frame 1. The Z-axis motor 6 rotates a vertical feed screw 7. The feed screw 7 is screwed into a nut 8 provided on the back surface of the first lifting plate 2. Therefore, when the Z-axis motor 6 is driven and the feed screw 7 rotates, the nut 8 moves up and down along the feed screw 7, and the first lifting plate 2 and the second lifting plate 3 also move up and down.
[0012]
In FIG. 1, a substrate 46 whose upper surface is a surface to be joined of an electronic component is placed on a substrate holder 47, and the substrate holder 47 is placed on a table 48. The table 48 is a movable table, and horizontally moves the substrate 46 in the X direction or the Y direction to position the substrate 46 at a predetermined position. The table 48 serves as positioning means for moving the substrate 46 relative to the electronic component 40.
[0013]
Reference numeral 42 denotes a camera, which is mounted on the uniaxial table 43. Reference numeral 44 denotes a lens barrel extending forward from the camera 42. The camera 42 is advanced along the uniaxial table 43, and the tip of the lens barrel 44 is positioned between the electronic component 40 with bumps and held on the lower surface of the bonding tool 14 and the substrate 46 as shown by the chain line. In this state, the positions of the electronic component 40 and the substrate 46 are observed with the camera 42.
[0014]
A recognition unit 53 recognizes images of the electronic component 40 and the board 46 captured by the camera 42 and detects their positions. Reference numeral 50 denotes a main control unit which controls the raising / lowering operation of the Z-axis motor 6, that is, the bonding head 10 through the motor driving unit 51, and positions the table 48, that is, the substrate 46 through the table control unit 52. Further, the main control unit 50 calculates a positional shift between the electronic component 40 and the substrate 46 detected by the recognition unit 53 in the horizontal plane, and drives the table 48 so as to correct the positional shift. Further, a load control unit 54 and a suction device 56 are connected to the main control unit 50.
[0015]
The cylinder 4 as the pressing means is connected to the main control unit 50 via the load control unit 54, and a pressing load that presses the bump of the electronic component 40 against the substrate 46 by the projecting output of the rod 5 of the cylinder 4, that is, the bonding tool 14. Be controlled. The suction device 56 performs suction / release of suction of the electronic component 40 by the bonding tool 14 according to a command from the main control unit 50.
[0016]
The transducer 17 is connected to the main control unit 50 via the ultrasonic transducer driving unit 55, and the transducer 17 is driven by the ultrasonic transducer driving unit 55 in accordance with a command from the main control unit 50. The ultrasonic vibration is applied to the bonding tool 14. At this time, the vibration of the bonding tool 14 is in a resonance state, and the phase difference between the voltage and current applied to the vibrator 17 is almost zero.
[0017]
A holder 12 is coupled to the lower end of the main body 11 of the bonding head 10. A block 13 is attached to the holder 12, and a bonding tool 14 is fixed to the block 13. The suction pad 19 attached to the central portion of the block 13 is connected to a suction device 56. The suction pad 19 abuts on the upper surface of the horn 15 as will be described later. Can be done.
[0018]
Hereinafter, the bonding tool 14 will be described with reference to FIGS. 2 and 3. FIG. 2A is a perspective view of the bonding tool 14 removed from the block 13 from above, and FIG. 2B partially shows the horn 15 with the bonding tool 14 turned upside down. Yes. FIG. 3 shows a graph of the amplitude of standing wave vibration induced in the horn 15 by the vibrator 17 together with a front view of the bonding tool 14.
[0019]
As shown in FIG. 2A, the bonding tool 14 is mainly composed of a horizontally long horn 15. The horn 15 is made of a metal material (for example, stainless steel, aluminum, titanium, etc.) and the like, and is a rod-like body having a rectangular cross section with a height dimension H and a width dimension W. A vibrator 17 is attached. In addition, H or W may change the dimension continuously or stepwise along the longitudinal direction of the horn. Thereby, it is possible to adjust the vibration applied by the vibration applying means to be enlarged or reduced in the horn 15. By driving the vibrator 17, longitudinal vibration is applied in the direction of the arrow a along the longitudinal direction of the horn 15. Accordingly, the vibrator 17 serves as a vibration applying unit that applies vibration in a direction along the longitudinal direction of the horn 15.
[0020]
On both side surfaces 15b of the horn 15, ribs 15c are provided so as to be integrated with the horn 15 in two centrally arranged locations. The dimension between the two ribs 15c is set to be equal to the half wavelength (L / 2) of the longitudinal vibration applied by the vibrator 17 in order to minimize vibration attenuation by fixing the vibration component. (See FIG. 3). In addition, the said dimension should just be the range which can attenuate | dampen a vibration, and does not necessarily need to be equal to L / 2.
[0021]
The rib 15c protrudes outward from the horn 15, and a bolt (not shown) is inserted into a mounting hole 15d provided in the rib 15c and fastened to the block 13, so that the horn 15 is supported by the block 13 at both ends. Fixed in a supported state. That is, the four (two sets) ribs 15 c are fixing portions that fix the horn 15 to the block 13.
[0022]
In fixing the horn 15, the four ribs 15 c are arranged symmetrically with respect to the center point of the horn 15, so that the bonding tool 14 can be fixed to the block 13 in a well-balanced manner, and from the pressing means to the horn 15. The applied load can be supported in a well-balanced manner. The number of ribs 15c is not limited to four, and two ribs 15c may be provided above the node of the horn 15, for example. In short, it is only necessary to support the load applied to the horn 15 in a well-balanced manner, and as long as this is the case, the number of ribs may be any number. Further, when the bolt is inserted into the mounting hole 15d and fastened, the bolt does not protrude from the lower surface of the horn 15, and can be fixed without causing interference with electronic components on the substrate during bonding. Yes.
[0023]
At approximately the center position of the two sets (four pieces) of ribs 15c, a convex portion 30 is formed protruding in the direction of arrow b. The material of the convex portion 30 is preferably the same material as that of the horn 15 because it can be formed integrally with the horn 15, but may be a different material. In the case of a different material, the shape and dimensions of the convex portion 30 are set in consideration of differences in density, Young's modulus and Poisson's ratio with the material of the horn 15.
[0024]
At the convex end portion of the convex portion 30, a bonding action portion 31 that comes into contact with the electronic component 40 to be bonded is provided. The bump of the electronic component 40 is pressed against the substrate 46 by applying a pressing load to the bonding tool 14 in a state where the electronic component 40 is in contact with the bonding operation portion 31. In this state, the vibrator 17 is driven to apply longitudinal vibration to the horn 15, so that the electronic component 40 is pressure-bonded to the substrate 46 by load and vibration. At this time, since the convex portion 30 is located at the center of the four ribs 15c, a uniform pressing state is realized even when targeting a large component requiring a large pressing load.
[0025]
On the opposite side of the convex portion 30 in the longitudinal direction of the horn 15, a vibration balance portion 32 that protrudes in substantially the same shape as the convex portion 30 is provided. The material of the vibration balance portion 32 is preferably the same material as the horn 15 because it can be formed integrally with the horn 15, but may be a different material. In the case of a different material, the shape and dimensions of the vibration balance portion 32 are set in consideration of differences in density, Young's modulus and Poisson's ratio with the material of the horn 15. The vibration balance portion 32 is provided in the bonding tool 14 in order to maintain the vibration balance of the horn 15 up and down mainly by maintaining the mass balance. The vibration balance portion 32 makes the vibration distribution and mass distribution of the horn 15 substantially symmetric with respect to the central axis in the first direction, ensuring uniform vibration transmission.
[0026]
Next, the vibration characteristics of the horn 15 will be described. An appropriate frequency corresponding to the horn 15 by the ultrasonic transducer driving unit 55 (a frequency that causes the horn 15 to resonate is sufficient, but is preferably 40 kHz to 70 kHz, and more preferably about 60 kHz). 3 is desirable for the bonding of the electronic components.), And the horn 15 is given a longitudinal vibration in the first direction to create a resonance state, so that the horn 15 has a standing wave vibration as shown in the graph of FIG. Occur.
[0027]
That is, in the standing wave vibration of the horn 15, the position of the rib 15c is a node with almost no horizontal displacement, and the position of the convex portion 30 located at the center of the rib 15c corresponds to the antinode where the horizontal amplitude is maximum. To do. The vibration of the convex portion 30 is transmitted to the electronic component 40 through the bonding action surface 31a. It is desirable that the position of the convex portion 30 coincides with the position of the antinode of this standing wave vibration, but as long as it is located at the approximate center of the rib 15c for fixing the horn 15, the standing wave It may be slightly deviated from the position of the vibration belly.
[0028]
Next, the vacuum suction circuit provided in the horn 15 will be described. As shown in FIG. 2B, an adsorption hole 31 b is opened in the bonding action surface 31 a on the lower surface of the bonding action portion 31. As shown in FIG. 3, the suction hole 31b communicates with a vacuum suction hole 16b (see FIG. 2A) opened in the vibration balance portion 32 via a suction path 16a formed in the vertical direction inside the horn 15. are doing. The suction path 16 a is an internal hole that allows the suction hole 31 b to communicate with the vacuum suction hole 16 b provided on the upper surface side of the bonding portion 31.
[0029]
When the bonding tool 14 is fixed to the block 13, the suction pad 19 provided on the block 13 comes into contact with the upper surface of the vibration balance portion 32 (see FIG. 1), whereby the suction hole 31b is connected to the suction path 16a and the vacuum suction. The suction pad 19 communicates with the hole 16b. That is, the suction pad 19 serves as a connecting means for connecting the vacuum suction hole 16b and a suction device 56 (see FIG. 1) as a vacuum suction source. By driving the suction device 56 and sucking air, The electronic component 40 can be vacuum-sucked and held on the bonding surface 31a by vacuum suction from the suction hole 31b. The convex portion 30 presses the electronic component 40 against the substrate 46 and also has a function as an adsorber that holds the electronic component 40 by adhering to the upper surface of the electronic component 40.
[0030]
Next, the connection between the vacuum suction hole 16b and the suction device 56 by the suction pad 19 will be described with reference to FIG. FIG. 4A shows a bonding operation in which ultrasonic vibration is applied to the horn 15 by the vibrator 17 and the electronic component 40 is pressed against the substrate 46 via the bonding action portion 31. As shown in FIG. 4A, the suction pad 19 is at such a height that a slight gap C is secured between the upper surface of the vibration balance portion 32 and the lip portion 19a at the lower end portion in the steady mounting state. Fixed.
[0031]
In the bonding operation, if vibration is transmitted by the frictional force between the bonding action surface 31a and the electronic component 40, the electronic component 40 does not necessarily have to be sucked and held by the suction hole 31b. In this case, the suction pad 19 is vacuumed by the suction device 56. No suction is performed. In this state, since the suction pad 19 is not in direct contact with the horn 15, wear of the suction pad 19 due to horizontal vibration of the horn 15 does not occur.
[0032]
FIG. 4B shows a state in which the electronic component 40 is sucked and held by the suction hole 31 b on the lower surface of the bonding operation portion 31. In this state, the suction device 56 is driven to perform vacuum suction from the suction pad 19. Thereby, the space 19b surrounded by the inside of the suction pad 19 and the upper surface of the vibration balance portion 32 is decompressed. Then, due to the differential pressure generated between the space 19b and the outside, the lip portion 19a, which is rich in flexibility and elasticity, is pressed against the upper surface of the vibration balance portion 32, and vacuum leakage during vacuum suction is prevented. .
[0033]
At this time, since the bonding tool 14 is not performing the bonding operation and no ultrasonic vibration is applied to the horn 15, vacuum suction is performed at a position where the vibration displacement is the largest in the horn 15 as in the first embodiment. Even when the holes 16b are arranged, the suction pad 19 is not worn by vibration.
[0034]
Further, in the configuration of the vacuum suction circuit in the horn 15, since the vacuum suction hole 16b is located immediately above the suction hole 31b, the suction path 16a for communicating the vacuum suction hole 16b with the suction hole 31b inside the horn 15 is provided. It becomes a straight hole in the vertical direction of the simplest shape. This simplifies the processing for the vacuum suction circuit in the production of the bonding tool 14, reduces the production cost, and provides structural symmetry within the horn 15 due to the presence of the suction path 16 a and the vacuum suction hole 16 b. Therefore, good vibration transmission characteristics can be maintained.
[0035]
(Embodiment 2)
FIG. 5 is a perspective view of the bonding tool for electronic components according to the second embodiment of the present invention, FIG. 6 is a front view of the bonding tool for electronic components according to the second embodiment of the present invention, and FIGS. It is a fragmentary sectional view of the bonding tool of the electronic component of form 2 of. In the second embodiment, in the bonding tool 114 having a structure similar to that of the bonding tool 14 used by being mounted on the bonding apparatus shown in the first embodiment, the bonding action portion that also serves as an adsorber that adsorbs an electronic component is replaced. For this reason, an example of a detachable configuration is shown.
[0036]
As shown in FIGS. 5 and 6, the bonding tool 114 is mainly composed of a horizontally long horn 115. The horn 115 is an elongated rod-like body, and has a tapered surface 115a that gradually becomes narrower from both sides toward the center in plan view. At the center of the horn 115, an adsorbing portion 130 (crimper) protrudes downward and is detachably mounted.
[0037]
The lower part of the suction part 130 is a bonding action part 130a protruding downward, and the bending vibration of the suction part 130 and the pressing load of the pressing means are applied to the electronic component 40. The adsorbing unit 130 adsorbs and holds the electronic component 40 by the adsorbing hole 132 opened in the bonding operation unit 130a. At the time of bonding, the bonding operation unit 130a contacts the upper surface of the electronic component 40 to place the electronic component 40 on the substrate 46. Press against.
[0038]
Ribs 115 c are provided integrally with the horn 115 at four locations that are equidistant from the suction portion 130. In order to improve the mounting balance to the block 13, the four ribs 115 c protrude symmetrically in plan view with the suction portion 130 at the center of the horn 115 as the center. The bonding tool 114 is detachably mounted on the lower surface of the block 13 by screwing a bolt into the through hole 120 formed in the rib 115c.
[0039]
In FIG. 5, a vibrator 117 serving as a vibration applying unit is attached to a side end portion of the horn 115. By driving the vibrator 117, longitudinal vibration (vibration in the longitudinal direction of the horn 115) is applied to the horn 115, and the suction unit 130 vibrates in the horizontal direction a (longitudinal direction of the horn 15). As shown in FIGS. 6 (a) and 6 (b), the width and height of the horn 115 are successively reduced from both ends toward the center through the side tapered surface 115a and the top and bottom tapered surfaces 115b. It has a shape.
[0040]
As a result, the amplitude of the ultrasonic vibration is amplified in the path transmitted from the vibrator 117 to the adsorption unit 130, and vibration larger than the amplitude oscillated by the vibrator 117 is transmitted to the adsorption unit 130. It is transmitted to the electronic component 40 via 130a. In the vibration transmission to the electronic component 40, not only the longitudinal vibration transmitted through the horn 115 by the vibrator 117 but also the bending vibration induced in the protruding suction portion 130 by the longitudinal vibration of the horn 115 is superimposed. Is transmitted.
[0041]
Next, with reference to FIGS. 7 and 8, attachment of the suction portion 130 to the horn 115 will be described. As shown in FIG. 7, a through hole 115 h penetrating in the vertical direction is provided at the center of the horn 115. The through-hole 115h is provided at a position corresponding to the antinode of the standing wave vibration induced by the vibrator 117 in the horn 115 so as to be orthogonal to the length direction of the horn 115, and above and below the through-hole 115h. Are respectively provided with inner tapered portions 115g and 115e.
[0042]
An inner screw portion 130b is provided on the upper surface of the suction portion 130, and an outer peripheral surface of the inner screw portion 130b is an outer tapered portion 130c corresponding to the inner tapered portion 115e. The fitting member 134 has an outer taper part 134 a that fits into the inner taper part 115 g, and the outer screw member 133 is inserted into the inner hole 134 b of the fitting member 134. An external thread part 133a that is screwed into the internal thread part 130b of the suction part 130 is provided at the lower part of the external thread member 133. A hexagonal hole for fastening provided on the upper surface is provided inside the external thread member 133. A suction path 133b that communicates from 133c to the lower end is formed. The opening at the bottom of the hexagonal hole 133c of the suction path 133b is a vacuum suction hole 133d.
[0043]
As shown in FIG. 8, when the suction portion 130 is fastened, the outer tapered portion 130c of the suction portion 130 is fitted to the inner tapered portion 115e, and the outer tapered portion 134a of the fitting member 134 is fitted to the inner tapered portion 115g. The outer screw member 133 is inserted into the inner hole 134b of the fitting member 134, and the outer screw portion 133a is screwed into the inner screw portion 130b of the suction portion 130 and tightened. As a result, the outer taper portion 130c of the suction portion 130 is pressed against the taper portion 115e of the horn 115 by the outer screw member 133 and fixedly fastened.
[0044]
In a state where the suction portion 130 and the fitting member 134 are fastened to the horn 115 by the external screw member 133, the vacuum suction hole 133 d communicates with the suction hole 132. That is, in the above-described configuration, the suction path 133b is an internal hole that communicates the suction hole 132 opened in the bonding operation portion 130a with the vacuum suction hole 133d.
[0045]
When the bonding tool 114 is fixed to the block 13 shown in FIG. 1, the suction pad 19 provided on the block 13 abuts on the upper surface of the external screw member 133 (see FIG. 1). It communicates with the suction pad 19 through 133b and the vacuum suction hole 133d. That is, the suction pad 19 is a connecting means for connecting the vacuum suction hole 133d and the suction device 56 (see FIG. 1) as a vacuum suction source, and by sucking air by driving the suction device 56, The electronic component 40 can be vacuum-sucked and held in the bonding portion 130a by vacuum suction from the suction hole 132.
[0046]
Also in the second embodiment, as in the example shown in FIG. 4 in the first embodiment, the suction pad 19 has a slight gap between the upper surface of the outer screw member 133 and the lip portion 19a at the lower end in the steady mounting state. It is fixed at such a height position that the gap C is secured. Thus, during the bonding operation in which the electronic component 40 is pressed against the substrate 46, when the electronic component 40 is not attracted and held, the lip portion 19a does not contact the external screw member 133 and the horn 115 is vibrated in the horizontal direction. There is no wear of the suction pad 19 due to.
[0047]
In the suction holding of the electronic component by the suction hole 132 of the bonding action portion 130a, the lip portion 19a having high flexibility and elasticity is formed by the differential pressure generated by the vacuum suction as in the example shown in FIG. It is pressed against the upper surface of 133, and vacuum leakage during vacuum suction is prevented. At this time, since the bonding tool 114 is not performing a bonding operation and no ultrasonic vibration is applied to the horn 115, vacuum suction is performed at a position where the vibration displacement is the largest in the horn 115 as in the second embodiment. Even when the hole 133d is disposed, the suction pad 19 is not worn by vibration.
[0048]
Further, in the configuration of the vacuum suction circuit in the horn 115, since the vacuum suction hole 133d is provided in the suction portion 130 and the external screw member 133 to be attached and detached, it is necessary to form a vacuum suction circuit inside the horn 115. In addition, in the production of the bonding tool 114, the processing for the vacuum suction circuit is simplified, the production cost can be reduced, and the structural symmetry in the horn 115 is not impaired, and the vibration transmission is good. The characteristics can be kept.
[0049]
【The invention's effect】
According to the present invention, the suction hole for sucking the electronic component opened in the bonding portion provided on the lower surface side of the position corresponding to the antinode of the standing wave vibration of the horn is provided in the vacuum provided above the suction hole. By communicating with the suction hole, it is possible to simplify the processing of the internal hole that constitutes the vacuum suction circuit inside the horn, and to maintain good vibration transmission characteristics.
[Brief description of the drawings]
FIG. 1 is a front view of an electronic component bonding apparatus according to a first embodiment of the present invention. FIG. 2 is a perspective view of an electronic component bonding tool according to a first embodiment of the present invention. FIG. 4 is a front view of the electronic component bonding tool 1 according to the present invention. FIG. 5 is an operation explanatory view of the electronic component bonding tool according to the first embodiment of the present invention. FIG. 6 is a front view of an electronic component bonding tool according to a second embodiment of the present invention. FIG. 7 is a partial cross-sectional view of an electronic component bonding tool according to an embodiment of the present invention. Partial sectional view of bonding tool for electronic component according to embodiment [description of symbols]
14, 114 Bonding tool 15, 115 Horn 16a, 133b Suction path 16b, 133d Vacuum suction hole 17 117 Vibrator 31, 130a Bonding action part 31b, 132 Suction hole 40 Electronic component 46 Substrate

Claims (2)

An electronic component bonding apparatus for pressing an electronic component against a surface to be bonded while applying a load and vibration to the electronic component, a bonding tool for bonding the electronic component, and a pressing means for pressing the bonding tool against the electronic component The bonding tool includes a horizontally long horn that is supported at both ends by a fixed portion, a vibrator that applies vibration to the horn, and a lower surface side of a position corresponding to an antinode of standing wave vibration of the horn. A bonding action portion that contacts and presses against the electronic component, an adsorption hole for sucking an electronic component opened in the bonding action portion, and the suction hole is provided on the upper surface side of the position corresponding to the antinode An electronic component bonding apparatus comprising: an internal hole communicating with a vacuum suction hole; and connection means for connecting the vacuum suction hole and a vacuum suction source. A bonding tool for crimping the electronic component to a surface to be bonded while applying a load and vibration to the electronic component, a horizontally long horn supported by both ends by a fixed portion, a vibrator for applying vibration to the horn, A bonding action portion that is provided on the lower surface side of the position corresponding to the antinode of standing wave vibration of the horn and presses against and presses the electronic component; an adsorption hole for adsorbing electronic components that is opened in the bonding action portion; An internal hole for communicating the suction hole with a vacuum suction hole provided on the upper surface side at a position corresponding to the antinode, and connection means for connecting the vacuum suction hole and a vacuum suction source are provided. Electronic component bonding tool.

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