KR102374266B1 - 백색 발광 모듈 및 led 조명 장치 - Google Patents
백색 발광 모듈 및 led 조명 장치 Download PDFInfo
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- KR102374266B1 KR102374266B1 KR1020150139390A KR20150139390A KR102374266B1 KR 102374266 B1 KR102374266 B1 KR 102374266B1 KR 1020150139390 A KR1020150139390 A KR 1020150139390A KR 20150139390 A KR20150139390 A KR 20150139390A KR 102374266 B1 KR102374266 B1 KR 102374266B1
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Abstract
Description
도2는 본 발명의 일 실시예에 따른 LED 조명 장치의 색가변 원리를 설명하기 위한 CIE 1931 색좌표계이다.
도3은 본 발명의 일 실시예에 따른 LED 조명 장치에 채용가능한 제1 및 제2 백색 LED 패키지와 녹색 LED 패키지 각각의 방출광 스펙트럼을 나타낸다.
도4는 본 발명의 일 실시예에 따른 LED 조명 장치의 주요 구성을 나타내는 블록도이다.
도5는 본 발명의 일 실시예에 따른 LED 조명장치에 채용가능한 백색 발광 모듈의 일 예를 나타내는 개략 사시도이다.
도6은 도5의 백색 발광 모듈에 채용된 각 그룹의 LED 패키지의 회로를 나타내는 개략도이다.
도7은 제1 및 제2 백색 LED 패키지를 구성하기 위한 비닝 과정의 예를 설명하기 위한 CIE 1931 색좌표계이다.
도8은 본 발명의 일 실시예에 따른 백색 발광 모듈에 채용가능한 백색 LED 패키지의 일 예를 나타내는 측단면도이다.
도9는 도8에 도시된 백색 LED 패키지에 채용가능한 LED 칩을 나타내는 측단면도이다.
도10은 본 발명의 일 실시예에 채용가능한 백색 LED 패키지의 다른 예를 나타내는 단면도이다.
도11은 본 발명의 일 실시예에 따른 백색 LED 패키지에 채용 가능한 파장 변환 물질을 설명하기 위한 CIE 1931 좌표계이다.
도12는 본 발명의 일 실시예에 따른 조명장치의 일 예로서, 도5에 도시된 백색 발광 모듈을 채용한 벌브형 조명장치를 나타내는 분해사시도이다.
도13은 본 발명의 일 실시예에 따른 튜브형 조명 장치를 나타내는 분해사시도이다.
도14는 본 발명의 일 실시예에 따른 평판형 조명 장치를 나타내는 개략 사시도이다.
도15는 실내용 조명 제어 네트워크 시스템의 일 예를 설명하기 위한 개략도이다.
도16은 개방적인 공간에 적용된 네트워크 시스템의 일 예를 나타낸다.
도17은 가시광 무선통신에 의한 조명 장치의 스마트 엔진과 모바일 기기의 통신 동작을 설명하기 위한 블록도이다.
색온도 | 6500K | 5700K | 5000K | 4500K | 4000K | 3500K | 3000K | 2700K |
W1 광속비율 | 100% | 83% | 67% | 53% | 39% | 25% | 11% | 0% |
W2 광속비율 | 0% | 14% | 26% | 39% | 52% | 68% | 85% | 100% |
G 광속 비율 | 0% | 3% | 7% | 8% | 9% | 7% | 4% | 0% |
CIE X | 0.3125 | 0.3288 | 0.3442 | 0.3612 | 0.3826 | 0.4077 | 0.4348 | 0.4579 |
CIE Y | 0.3287 | 0.3412 | 0.3550 | 0.3662 | 0.3801 | 0.3918 | 0.4030 | 0.4104 |
CRI | 83 | 83 | 84 | 85 | 87 | 87 | 86 | 84 |
R9 | 7.2 | 7.2 | 12.6 | 20.3 | 24.0 | 23.6 | 18.9 | 12.2 |
용도 | 형광체 |
LED TV BLU | β-SiAlON:Eu2 +, (Ca, Sr)AlSiN3:Eu2 +, La3Si6N11:Ce3 +, K2SiF6:Mn4 +, SrLiAl3N4:Eu, Ln4 -x(EuzM1 -z)xSi12- yAlyO3 +x+ yN18 -x-y(0.5≤x≤3, 0<z<0.3, 0<y≤4), K2TiF6:Mn4 +, NaYF4:Mn4 +, NaGdF4:Mn4 + |
조명 | Lu3Al5O12:Ce3 +, Ca-α-SiAlON:Eu2 +, La3Si6N11:Ce3 +, (Ca, Sr)AlSiN3:Eu2+, Y3Al5O12:Ce3 +, K2SiF6:Mn4 +, SrLiAl3N4:Eu, Ln4 -x(EuzM1-z)xSi12-yAlyO3+x+yN18-x-y(0.5≤x≤3, 0<z<0.3, 0<y≤4), K2TiF6:Mn4+, NaYF4:Mn4 +, NaGdF4:Mn4 + |
Side View (Mobile, Note PC) |
Lu3Al5O12:Ce3 +, Ca-α-SiAlON:Eu2 +, La3Si6N11:Ce3 +, (Ca, Sr)AlSiN3:Eu2+, Y3Al5O12:Ce3 +, (Sr, Ba, Ca, Mg)2SiO4:Eu2 +, K2SiF6:Mn4+, SrLiAl3N4:Eu, Ln4 -x(EuzM1 -z)xSi12- yAlyO3 +x+ yN18 -x-y(0.5≤x≤3, 0<z<0.3, 0<y≤4), K2TiF6:Mn4 +, NaYF4:Mn4 +, NaGdF4:Mn4 + |
전장 (Head Lamp, etc.) |
Lu3Al5O12:Ce3 +, Ca-α-SiAlON:Eu2 +, La3Si6N11:Ce3 +, (Ca, Sr)AlSiN3:Eu2+, Y3Al5O12:Ce3 +, K2SiF6:Mn4 +, SrLiAl3N4:Eu, Ln4 -x(EuzM1-z)xSi12-yAlyO3+x+yN18-x-y(0.5≤x≤3, 0<z<0.3, 0<y≤4), K2TiF6:Mn4+, NaYF4:Mn4 +, NaGdF4:Mn4 + |
Claims (20)
- 조명 하우징;
상기 조명 하우징에 장착된 백색 발광 모듈; 및
상기 백색 발광 모듈에 파워를 공급하는 전원공급부;를 포함하며,
상기 백색 발광 모듈은,
CIE 1931 색좌표계 상에서, (0.3100, 0.3203), (0.3082, 0.3301), (0.3168, 0.3388) 및 (0.3179, 0.3282)에 의해 정의되는 사각형 영역에 해당하는 제1 백색 광을 방출하는 제1 백색 LED 패키지와,
CIE 1931 색좌표계 상에서, (0.4475, 0.3994), (0.4571, 0.4173), (0.4695, 0.4207) 및 (0.4589, 0.4021)에 의해 정의되는 사각형 영역에 해당하는 제2 백색 광을 방출하는 제2 백색 LED 패키지와,
520㎚∼545㎚의 피크 파장을 갖는 녹색 광을 방출하는 녹색 LED 패키지와,
상기 제1 및 제2 백색 광의 광속을 제어하여 원하는 백색 광의 색온도를 선택하고, CIE 1931 색좌표계 상에서 선택된 색온도에 해당되는 백색 광의 색좌표와 흑체 궤선(black body locus)의 차이가 감소되도록 녹색 LED 패키지의 광속을 제어하는 구동 제어부를 포함하는 LED 조명 장치.
- 제1항에 있어서,
상기 제1 및 제2 백색 광과 상기 녹색 광의 광속비율을 각각 W1, W2, G로 나타낼 때에, W1+W2+G=100%이며, W1 및 W2는 각각 0∼100% 범위에서 상보적으로 변하는 LED 조명 장치.
- 제2항에 있어서,
상기 녹색 광 광속비율(G)는 0∼10% 범위에서 변하는 LED 조명 장치.
- 제1항에 있어서,
최종적으로 방출되는 백색 광의 색온도가 2700∼6500 K 구간으로 변화하는 LED 조명 장치.
- 제1항에 있어서,
최종적으로 방출되는 백색 광의 연색지수는 80 이상인 LED 조명 장치.
- 제1항에 있어서,
최종적으로 방출되는 백색 광의 색좌표는 흑체 궤선을 따라 변경되는 LED 조명 장치.
- 제1항에 있어서,
상기 녹색 LED 패키지로부터 방출되는 녹색 광은 10∼50㎚의 반치폭을 갖는 LED 조명 장치.
- 제1항에 있어서,
상기 제1 및 제2 백색 LED 패키지 중 적어도 하나는 복수의 백색 LED 패키지를 포함하는 LED 조명 장치.
- 제8항에 있어서,
상기 복수의 백색 LED 패키지의 적어도 일부는 CIE 1931 색좌표계 상에서 서로 다른 색좌표에 해당하는 광을 방출하며,
상기 복수의 백색 LED 패키지로부터 방출되는 광은 혼합되어 상기 제1 또는 제2 백색 광을 방출하는 LED 조명 장치.
- 제1항에 있어서,
상기 제1 및 제2 백색 LED 패키지는 각각 복수의 백색 LED 패키지를 포함하며, 서로 교대로 위치하도록 배열되는 LED 조명 장치.
- 제10항에 있어서,
상기 녹색 LED 패키지는 복수의 녹색 LED 패키지를 포함하는 LED 조명 장치.
- 제11항에 있어서,
상기 제1 및 제2 백색 LED 패키지와 상기 녹색 LED 패키지는 좌우 대칭 또는 회전 대칭으로 배열되는 LED 조명 장치.
- 제1항에 있어서,
최종적으로 방출되는 백색 광을 검출하여 분석하는 광검출부를 더 포함하며,
상기 구동 제어부는 상기 백색 광의 분석된 정보를 입력받고 입력된 정보에 기초하여 상기 제1 및 제2 백색 LED 패키지와 상기 녹색 LED 패키지 중 적어도 하나의 광속을 제어하는 LED 조명 장치.
- 제1항에 있어서,
최종적인 백색 광의 방출 방향에 배치된 광확산부를 더 포함하는 LED 조명 장치.
- CIE 1931 색좌표계 상에서, (0.3100, 0.3203), (0.3082, 0.3301), (0.3168, 0.3388) 및 (0.3179, 0.3282)에 의해 정의되는 사각형 영역에 해당하는 제1 백색 광을 방출하는 제1 백색 LED 패키지와,
CIE 1931 색좌표계 상에서, (0.4475, 0.3994), (0.4571, 0.4173), (0.4695, 0.4207) 및 (0.4589, 0.4021)에 의해 정의되는 사각형 영역에 해당하는 제2 백색 광을 방출하는 제2 백색 LED 패키지;
520㎚∼545㎚의 피크 파장을 갖는 녹색 광을 방출하는 녹색 LED 패키지; 및
상기 제1 및 제2 백색 광의 광속을 제어하여 원하는 백색 광의 색온도를 선택하고, CIE 1931 색좌표계 상에서 선택된 색온도에 해당되는 백색 광의 색좌표와 흑체 궤선(black body locus)의 차이가 감소되도록 녹색 LED 패키지의 광속을 제어하는 구동 제어부를 포함하는 백색 발광 모듈.
- 제15항에 있어서,
상기 제1 및 제2 백색 광과 상기 녹색 광의 광속비율을 각각 W1, W2, G로 나타낼 때에, W1+W2+G=100%이며, W1 및 W2는 각각 0∼100% 범위에서 상보적으로 변하고, 상기 녹색 광 광속비율(G)는 0∼10% 범위에서 변하는 백색 발광 모듈.
- 제15항에 있어서,
상기 제1 백색 LED 패키지는 제1 그룹의 복수의 백색 LED 패키지를 포함하며,
상기 제1 그룹의 복수의 백색 LED 패키지 중 적어도 일부는 CIE 1931 색좌표계 상에서 서로 다른 색좌표에 해당하는 광을 방출하되, 상기 제1 그룹의 복수의 백색 LED 패키지로부터 방출되는 광은 혼합되어 상기 제1 백색 광을 방출하는 백색 발광 모듈.
- 제15항에 있어서,
상기 제2 백색 LED 패키지는 제2 그룹의 복수의 백색 LED 패키지를 포함하며,
상기 제2 그룹의 복수의 백색 LED 패키지 중 적어도 일부는 CIE 1931 색좌표계 상에서 서로 다른 색좌표에 해당하는 광을 방출하되, 상기 제2 그룹의 복수의 백색 LED 패키지로부터 방출되는 광은 혼합되어 상기 제2 백색 광을 방출하는 백색 발광 모듈.
- CIE 1931 색좌표계 상에서, (0.3100, 0.3203), (0.3082, 0.3301), (0.3168, 0.3388) 및 (0.3179, 0.3282)에 의해 정의되는 사각형 영역에 해당하는 제1 백색 광을 방출하는 복수의 제1 백색 LED 패키지와,
CIE 1931 색좌표계 상에서, (0.4475, 0.3994), (0.4571, 0.4173), (0.4695, 0.4207) 및 (0.4589, 0.4021)에 의해 정의되는 사각형 영역에 해당하는 제2 백색 광을 방출하는 복수의 제2 백색 LED 패키지;
녹색 광을 방출하는 적어도 하나의 녹색 LED 패키지; 및
최종 백색 광의 색온도가 CIE 1931 색좌표계 상에서 흑체 궤선을 따라 가변되도록 상기 제1 및 제2 백색 광의 광속과 상기 녹색 광의 광속을 개별적으로 제어하는 구동 제어부를 포함하는 백색 발광 모듈.
- 제19항에 있어서,
CIE 1931 색좌표계 상에서 상기 색온도가 가변되는 백색 광의 색좌표와 흑체 궤선의 차이가 0.005 범위 이내로 유지되는 백색 발광 모듈.
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Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10893587B2 (en) | 2016-09-23 | 2021-01-12 | Feit Electric Company, Inc. | Light emitting diode (LED) lighting device or lamp with configurable light qualities |
US9801250B1 (en) | 2016-09-23 | 2017-10-24 | Feit Electric Company, Inc. | Light emitting diode (LED) lighting device or lamp with configurable light qualities |
US10334678B2 (en) * | 2016-10-07 | 2019-06-25 | Eaton Intelligent Power Limited | Single control LED dimming and white tuning |
US10085320B1 (en) * | 2016-10-21 | 2018-09-25 | Peter Sussman | Pre-calibrated light box |
US10813197B2 (en) * | 2017-04-10 | 2020-10-20 | Ideal Industries Lighting Llc | Wireless solid state lighting controller |
US10158626B1 (en) * | 2017-06-16 | 2018-12-18 | International Business Machines Corporation | Token-based access control |
CN109150306B (zh) * | 2017-06-16 | 2020-06-30 | 深圳清华大学研究院 | 可见光通信系统及方法 |
JP7341057B2 (ja) * | 2017-07-13 | 2023-09-08 | ソニーグループ株式会社 | 発光装置、表示装置および照明装置 |
CN107359936B (zh) * | 2017-07-13 | 2020-01-03 | 山东大学 | 一种基于可见光通信的新型光源及其功率分配方法 |
CN108048079A (zh) * | 2017-11-27 | 2018-05-18 | 广东晶科电子股份有限公司 | 一种红色荧光粉、白光发光二极管及背光模组 |
EP3503687B1 (en) * | 2017-12-20 | 2020-08-05 | OSRAM GmbH | A lighting device and corresponding method for chromatic compensation |
JP6658787B2 (ja) * | 2017-12-22 | 2020-03-04 | 日亜化学工業株式会社 | 発光装置 |
US10804429B2 (en) | 2017-12-22 | 2020-10-13 | Lumileds Llc | III-nitride multi-wavelength LED for visible light communication |
KR102078862B1 (ko) | 2018-01-26 | 2020-04-07 | 영남대학교 산학협력단 | Led 조명의 최적화 장치 및 방법 |
KR102613239B1 (ko) * | 2018-06-04 | 2023-12-14 | 삼성전자주식회사 | 백색 led 모듈 및 조명 장치 |
KR102532426B1 (ko) * | 2018-06-25 | 2023-05-15 | 삼성전자주식회사 | 사용자의 위치에 기반하여 발광 소자를 이용한 시각적 효과를 제공하는 전자 장치 및 그에 관한 방법 |
US10863599B2 (en) * | 2018-11-07 | 2020-12-08 | Signify Holding B.V. | White light tuning |
US20210402210A1 (en) * | 2018-11-08 | 2021-12-30 | Ecosense Lighting Inc. | Multi-channel bioactive lighting |
CN109673078B (zh) * | 2018-12-14 | 2021-03-30 | 深圳和而泰智能照明有限公司 | 一种色温调节方法、装置和白光led |
CN109827089B (zh) * | 2019-02-15 | 2020-09-11 | 福建省中科生物股份有限公司 | 一种led植物生长灯光谱 |
WO2020236525A1 (en) * | 2019-05-17 | 2020-11-26 | Lumileds Llc | User control modality for led color tuning |
CN110167242B (zh) * | 2019-06-05 | 2021-07-13 | 深圳市光擎光电有限公司 | 一种混光调节方法、装置、系统及存储介质 |
CN112206422B (zh) * | 2019-07-12 | 2022-07-01 | 周卓煇 | 光源于抑制褪黑激素分泌的方法与照明装置 |
EP4408125A3 (en) * | 2019-07-26 | 2024-10-23 | Lutron Technology Company, LLC | Configuring color control for lighting devices |
US11211527B2 (en) | 2019-12-19 | 2021-12-28 | Lumileds Llc | Light emitting diode (LED) devices with high density textures |
US11264530B2 (en) | 2019-12-19 | 2022-03-01 | Lumileds Llc | Light emitting diode (LED) devices with nucleation layer |
CN111065183B (zh) * | 2019-12-31 | 2023-07-25 | 广东晶科电子股份有限公司 | 一种用于控制led台灯的光照强度的方法及系统 |
WO2021141804A1 (en) * | 2020-01-06 | 2021-07-15 | Optimum Semiconductor Technologies Inc. | Improving color rendering accuracy of led lighting device by adding monochromatic light elements |
US11564302B2 (en) | 2020-11-20 | 2023-01-24 | Feit Electric Company, Inc. | Controllable multiple lighting element fixture |
US11147136B1 (en) | 2020-12-09 | 2021-10-12 | Feit Electric Company, Inc. | Systems and apparatuses for configurable and controllable under cabinet lighting fixtures |
CN112802833B (zh) * | 2021-01-13 | 2022-07-15 | 河源市众拓光电科技有限公司 | 一种可见光通信阵列式芯片led灯珠 |
USD1011573S1 (en) | 2021-03-18 | 2024-01-16 | Milwaukee Electric Tool Corporation | Lighting apparatus |
CN112879842A (zh) * | 2021-03-25 | 2021-06-01 | 海南师范大学 | 一种应用于植物生长的激光照明系统 |
CN113301684B (zh) * | 2021-05-20 | 2023-12-08 | 生迪智慧科技有限公司 | Led控制电路 |
CN113671611B (zh) * | 2021-09-22 | 2025-03-18 | 东莞市光志光电有限公司 | 一种修正色坐标的背光模组之银反射片及其制备方法 |
US20230215846A1 (en) * | 2021-12-30 | 2023-07-06 | Seoul Viosys Co., Ltd. | Light emitting device and light emitting module including the same |
US12356520B2 (en) * | 2023-06-14 | 2025-07-08 | Leedarson Lighting Co., Ltd. | Lighting apparatus |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012238596A (ja) | 2011-05-12 | 2012-12-06 | Led Engin Inc | 複数のledを備える放射体を単色のビンに合わせてチューニングするための装置および方法 |
CN203718670U (zh) | 2014-01-22 | 2014-07-16 | 杭州谨德医疗技术有限公司 | 一种台灯用全光谱led发光结构 |
Family Cites Families (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6372608B1 (en) | 1996-08-27 | 2002-04-16 | Seiko Epson Corporation | Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring method |
USRE38466E1 (en) | 1996-11-12 | 2004-03-16 | Seiko Epson Corporation | Manufacturing method of active matrix substrate, active matrix substrate and liquid crystal display device |
US7208725B2 (en) | 1998-11-25 | 2007-04-24 | Rohm And Haas Electronic Materials Llc | Optoelectronic component with encapsulant |
JP3906654B2 (ja) | 2000-07-18 | 2007-04-18 | ソニー株式会社 | 半導体発光素子及び半導体発光装置 |
KR20040029301A (ko) | 2001-08-22 | 2004-04-06 | 소니 가부시끼 가이샤 | 질화물 반도체소자 및 질화물 반도체소자의 제조방법 |
JP2003218034A (ja) | 2002-01-17 | 2003-07-31 | Sony Corp | 選択成長方法、半導体発光素子及びその製造方法 |
JP3815335B2 (ja) | 2002-01-18 | 2006-08-30 | ソニー株式会社 | 半導体発光素子及びその製造方法 |
KR100499129B1 (ko) | 2002-09-02 | 2005-07-04 | 삼성전기주식회사 | 발광 다이오드 및 그 제조방법 |
US7002182B2 (en) | 2002-09-06 | 2006-02-21 | Sony Corporation | Semiconductor light emitting device integral type semiconductor light emitting unit image display unit and illuminating unit |
KR100545334B1 (ko) | 2003-03-18 | 2006-01-24 | 우리조명 주식회사 | 색온도 조정이 가능한 엘이디등(led 燈) 및 엘이디등의 색온도 조정방법 |
KR100714639B1 (ko) | 2003-10-21 | 2007-05-07 | 삼성전기주식회사 | 발광 소자 |
KR100506740B1 (ko) | 2003-12-23 | 2005-08-08 | 삼성전기주식회사 | 질화물 반도체 발광소자 및 그 제조방법 |
US7256557B2 (en) * | 2004-03-11 | 2007-08-14 | Avago Technologies General Ip(Singapore) Pte. Ltd. | System and method for producing white light using a combination of phosphor-converted white LEDs and non-phosphor-converted color LEDs |
KR100664985B1 (ko) | 2004-10-26 | 2007-01-09 | 삼성전기주식회사 | 질화물계 반도체 소자 |
WO2006105649A1 (en) * | 2005-04-06 | 2006-10-12 | Tir Systems Ltd. | White light luminaire with adjustable correlated colour temperature |
KR100665222B1 (ko) | 2005-07-26 | 2007-01-09 | 삼성전기주식회사 | 확산재료를 이용한 엘이디 패키지 및 그 제조 방법 |
KR100661614B1 (ko) | 2005-10-07 | 2006-12-26 | 삼성전기주식회사 | 질화물계 반도체 발광소자 및 그 제조방법 |
EP2372223A3 (en) * | 2005-12-21 | 2012-08-01 | Cree, Inc. | Lighting Device and Lighting Method |
KR100723247B1 (ko) | 2006-01-10 | 2007-05-29 | 삼성전기주식회사 | 칩코팅형 led 패키지 및 그 제조방법 |
KR100735325B1 (ko) | 2006-04-17 | 2007-07-04 | 삼성전기주식회사 | 발광다이오드 패키지 및 그 제조방법 |
KR100930171B1 (ko) | 2006-12-05 | 2009-12-07 | 삼성전기주식회사 | 백색 발광장치 및 이를 이용한 백색 광원 모듈 |
KR100855065B1 (ko) | 2007-04-24 | 2008-08-29 | 삼성전기주식회사 | 발광 다이오드 패키지 |
KR100982980B1 (ko) | 2007-05-15 | 2010-09-17 | 삼성엘이디 주식회사 | 면 광원 장치 및 이를 구비하는 lcd 백라이트 유닛 |
KR101164026B1 (ko) | 2007-07-12 | 2012-07-18 | 삼성전자주식회사 | 질화물계 반도체 발광소자 및 그 제조방법 |
KR101722265B1 (ko) * | 2007-10-10 | 2017-03-31 | 크리, 인코포레이티드 | 조명 장치 및 그 제조 방법 |
KR100891761B1 (ko) | 2007-10-19 | 2009-04-07 | 삼성전기주식회사 | 반도체 발광소자, 그의 제조방법 및 이를 이용한 반도체발광소자 패키지 |
KR101332794B1 (ko) | 2008-08-05 | 2013-11-25 | 삼성전자주식회사 | 발광 장치, 이를 포함하는 발광 시스템, 상기 발광 장치 및발광 시스템의 제조 방법 |
KR20100030470A (ko) | 2008-09-10 | 2010-03-18 | 삼성전자주식회사 | 다양한 색 온도의 백색광을 제공할 수 있는 발광 장치 및 발광 시스템 |
KR101530876B1 (ko) | 2008-09-16 | 2015-06-23 | 삼성전자 주식회사 | 발광량이 증가된 발광 소자, 이를 포함하는 발광 장치, 상기 발광 소자 및 발광 장치의 제조 방법 |
US8008683B2 (en) | 2008-10-22 | 2011-08-30 | Samsung Led Co., Ltd. | Semiconductor light emitting device |
US7972028B2 (en) | 2008-10-31 | 2011-07-05 | Future Electronics Inc. | System, method and tool for optimizing generation of high CRI white light, and an optimized combination of light emitting diodes |
US8339029B2 (en) | 2009-02-19 | 2012-12-25 | Cree, Inc. | Light emitting devices and systems having tunable chromaticity |
US8558782B2 (en) * | 2009-03-24 | 2013-10-15 | Apple Inc. | LED selection for white point control in backlights |
US8598793B2 (en) * | 2011-05-12 | 2013-12-03 | Ledengin, Inc. | Tuning of emitter with multiple LEDs to a single color bin |
KR20110030967A (ko) | 2009-09-18 | 2011-03-24 | 주식회사 필룩스 | 발광장치 |
KR20110102062A (ko) * | 2010-03-10 | 2011-09-16 | 삼성엘이디 주식회사 | 색온도 조절이 가능한 led 장치 |
KR101080698B1 (ko) | 2010-04-10 | 2011-11-08 | 엘지이노텍 주식회사 | 조명 장치 및 조명 장치의 제어 방법 |
US8358089B2 (en) | 2010-05-08 | 2013-01-22 | Lightel Technologies Inc. | Solid-state lighting of a white light with tunable color temperatures |
US8890435B2 (en) * | 2011-03-11 | 2014-11-18 | Ilumi Solutions, Inc. | Wireless lighting control system |
KR20130023841A (ko) | 2011-08-30 | 2013-03-08 | 엘지이노텍 주식회사 | 색 온도 제어가 가능한 발광 소자 패키지 |
KR20130027741A (ko) * | 2011-09-08 | 2013-03-18 | 엘지이노텍 주식회사 | 조명장치 및 조명제어방법 |
CN202419518U (zh) * | 2011-12-07 | 2012-09-05 | 广州市金莱照明科技有限公司 | 一种健康杀菌灯具 |
CN104206011B (zh) * | 2012-03-19 | 2017-05-24 | 飞利浦照明控股有限公司 | 用于多通道白光照明源的装置、系统和方法 |
-
2015
- 2015-10-02 KR KR1020150139390A patent/KR102374266B1/ko active Active
-
2016
- 2016-06-23 US US15/191,022 patent/US9807843B2/en active Active
- 2016-09-29 CN CN201610866041.8A patent/CN106958746B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012238596A (ja) | 2011-05-12 | 2012-12-06 | Led Engin Inc | 複数のledを備える放射体を単色のビンに合わせてチューニングするための装置および方法 |
CN203718670U (zh) | 2014-01-22 | 2014-07-16 | 杭州谨德医疗技术有限公司 | 一种台灯用全光谱led发光结构 |
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