KR102327814B1 - 흡착 플레이트, 절단 장치 및 절단 방법 - Google Patents
흡착 플레이트, 절단 장치 및 절단 방법 Download PDFInfo
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- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
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- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
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- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
- B26D7/018—Holding the work by suction
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- H—ELECTRICITY
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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Abstract
Description
도 2는 봉지완료 기판(1)과, 흡착 플레이트(10)와, 절단 장치(50)의 기대(21)를 도시하는 사시도.
도 3은 흡착 플레이트(10)의 분해한 상태의 상면측에서 본 양상을 도시하는 사시도.
도 4는 흡착 플레이트(10)의 분해한 상태의 저면측에서 본 양상을 도시하는 사시도.
도 5는 절단 장치(50)의 기대(21)상에 흡착 플레이트(10)가 배치되어 있는 상태를 도시하는 단면도.
3 : 스핀들 10 : 흡착 플레이트
11 : 커버 11H, 24 : 개구부
11S, 25S : O링 12 : 재치부
12A : 표면 12B : 이면
12H : 흡착구멍 12J, 13H, 14H, 17H : 관통구멍
13 : 러버부 14 : 금속제 판형상부
14G : 홈부 15 : 베이스부
15G, 25G : 환형상 홈 16 : 테두리부
16S, 21B : 저면 17A, 17B : 리브부
17C : 후퇴부 17CS, 17DS : 단면
17D : 돌출부 18 : 흡기 경로
19 : 도통 부재 20 : 흡인기구
21 : 기대 21A : 테두리형상 지지부
22 : 볼록형상 지지부 22A : 정상면
23 : 공간 30 : 공급 기구
31 : 이동 기구 32 : 회전 기구
33 : 반송부 34 : 절단부
35 : 카메라 36 : 제1의 클리너
37 : 회전날 38 : 언로더
39 : 제2의 클리너 40 : 검사 카메라
41 : 검사용 스테이지 42 : 인덱스 테이블
43 : 이송 기구 45 : 양품용 트레이
46 : 불량품용 트레이 47 : 수용부
48 : 트레이 공급부 50 : 절단 장치
A : 공급 유닛 B : 절단 유닛
C : 검사 유닛 D : 수용 유닛
L : 절단선 P : 전자 부품
Claims (10)
- 흡인기구가 마련된 절단 장치의 기대상에 배치되는 테두리부와, 상기 테두리부의 내측에 마련된 복수의 리브부를 가지며, 복수의 상기 리브부끼리가 교차하도록 격자형상으로 배치된 베이스부와,
상기 복수의 리브부에 겹쳐지도록 배치되고, 표면측부터 이면측에 관통하는 복수의 흡착구멍이 형성된 재치부를 구비하고,
상기 복수의 리브부에 의해, 상기 흡인기구와 상기 복수의 흡착구멍을 연통시키는 복수의 흡기 경로가 상기 테두리부의 상기 내측에 형성되어 있고,
상기 재치부의 상기 이면이 상기 복수의 흡기 경로를 덮도록 배치된 상태에서, 상기 표면상에 재치된 절단 대상물은 상기 흡착구멍에 발생한 부압에 의해 상기 표면상에 흡착되고,
복수의 상기 리브부끼리가 교차하고 있는 부분의 일부는 상기 기대가 배치되는 측을 향하여 돌출하여 있는 것을 특징으로 하는 흡착 플레이트. - 제1항에 있어서,
상기 베이스부는, 수지로 형성되어 있는 것을 특징으로 하는 흡착 플레이트. - 제2항에 있어서,
상기 재치부 및 상기 베이스부를 관통하고, 상기 재치부상에 배치된 절단 대상물과 상기 기대를 전기적으로 접속하기 위한 도통 부재를 더 구비하는 것을 특징으로 하는 흡착 플레이트. - 제1항 내지 제3항 중 어느 한 항에 있어서,
복수의 상기 리브부끼리가 교차하고 있는 부분에, 상기 흡인기구와 상기 복수의 흡착구멍을 연통시키는 관통구멍이 형성되어 있는 것을 특징으로 하는 흡착 플레이트. - 제1항 내지 제3항 중 어느 한 항에 있어서,
테두리형상의 형상을 가지며, 상기 재치부의 주위부분을 상기 베이스부에 고정하는 커버를 더 구비하는 것을 특징으로 하는 흡착 플레이트. - 제5항에 있어서,
상기 커버와 상기 테두리부의 사이에, 상기 베이스부 중의 상기 복수의 리브부가 마련되어 있는 영역을 둘러싸는 실 부재를 더 구비하는 것을 특징으로 하는 흡착 플레이트. - 제1항 내지 제3항 중 어느 한 항에 있어서,
상기 재치부는, 상기 재치부의 상기 표면측의 구성 요소인 러버부와, 상기 재치부의 상기 이면측의 구성 요소인 금속제 판형상부를 포함하고,
상기 금속제 판형상부의 상기 베이스부측의 면에는, 상기 금속제 판형상부에 형성된 상기 흡착구멍의 복수를 연통시키기 위한 홈부가 형성되어 있는 것을 특징으로 하는 흡착 플레이트. - 흡인기구가 마련된 기대와,
상기 기대상에 배치되는 제1항 내지 제3항 중 어느 한 항에 기재된 흡착 플레이트를 구비하는 것을 특징으로 하는 절단 장치. - 제8항에 있어서,
상기 기대는, 상기 테두리부를 지지하는 테두리형상 지지부와, 상기 테두리형상 지지부의 내측에 마련되고, 상기 복수의 리브부를 지지한 복수의 볼록형상 지지부를 포함하는 것을 특징으로 하는 절단 장치. - 제1항 내지 제3항 중 어느 한 항에 기재된 흡착 플레이트상에 절단 대상물을 흡착시키는 공정과,
상기 절단 대상물을 상기 흡착 플레이트상에 흡착시킨 상태에서 절단하는 공정을 구비하는 것을 특징으로 하는 절단 방법.
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JP2019097980A JP6746756B1 (ja) | 2019-05-24 | 2019-05-24 | 吸着プレート、切断装置および切断方法 |
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JP2023050926A (ja) * | 2021-09-30 | 2023-04-11 | Towa株式会社 | 加工装置、及び加工品の製造方法 |
CN117198971B (zh) * | 2023-11-07 | 2024-01-30 | 沈阳和研科技股份有限公司 | 一种晶圆卡盘台 |
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JP2015050345A (ja) | 2013-09-02 | 2015-03-16 | Towa株式会社 | 切断装置及び切断方法 |
JP2016040060A (ja) | 2014-08-12 | 2016-03-24 | Towa株式会社 | 切断装置及び切断方法並びに吸着機構及びこれを用いる装置 |
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JP2015050345A (ja) | 2013-09-02 | 2015-03-16 | Towa株式会社 | 切断装置及び切断方法 |
JP2016040060A (ja) | 2014-08-12 | 2016-03-24 | Towa株式会社 | 切断装置及び切断方法並びに吸着機構及びこれを用いる装置 |
JP6338555B2 (ja) | 2015-07-10 | 2018-06-06 | Towa株式会社 | 吸着機構及び吸着方法並びに製造装置及び製造方法 |
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KR20200135182A (ko) | 2020-12-02 |
TW202042971A (zh) | 2020-12-01 |
CN111975114A (zh) | 2020-11-24 |
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