KR102264482B1 - 열전도성 함불소 접착제 조성물 및 전기·전자 부품 - Google Patents
열전도성 함불소 접착제 조성물 및 전기·전자 부품 Download PDFInfo
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- KR102264482B1 KR102264482B1 KR1020170045310A KR20170045310A KR102264482B1 KR 102264482 B1 KR102264482 B1 KR 102264482B1 KR 1020170045310 A KR1020170045310 A KR 1020170045310A KR 20170045310 A KR20170045310 A KR 20170045310A KR 102264482 B1 KR102264482 B1 KR 102264482B1
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- 239000000203 mixture Substances 0.000 title claims abstract description 133
- 239000000853 adhesive Substances 0.000 title claims abstract description 69
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 67
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 76
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 72
- 125000005010 perfluoroalkyl group Chemical group 0.000 claims abstract description 39
- 125000004430 oxygen atom Chemical group O* 0.000 claims abstract description 32
- 229910052751 metal Inorganic materials 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 claims abstract description 29
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 25
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 24
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 18
- 239000011231 conductive filler Substances 0.000 claims abstract description 16
- 125000005369 trialkoxysilyl group Chemical group 0.000 claims abstract description 14
- 150000003961 organosilicon compounds Chemical class 0.000 claims abstract description 13
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 33
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 32
- 239000002245 particle Substances 0.000 claims description 26
- -1 perfluorooxy group Chemical group 0.000 claims description 26
- 125000003342 alkenyl group Chemical group 0.000 claims description 25
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 25
- 125000004432 carbon atom Chemical group C* 0.000 claims description 24
- 229910052757 nitrogen Inorganic materials 0.000 claims description 18
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 18
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- 125000000217 alkyl group Chemical group 0.000 claims description 14
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- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims description 3
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- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 3
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
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- 239000010931 gold Substances 0.000 claims description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 3
- 239000000347 magnesium hydroxide Substances 0.000 claims description 3
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- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- 229910001004 magnetic alloy Inorganic materials 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
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- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
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- 125000001183 hydrocarbyl group Chemical group 0.000 claims 10
- 150000002430 hydrocarbons Chemical class 0.000 abstract description 39
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- 229930195733 hydrocarbon Natural products 0.000 abstract 1
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- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 11
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
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Abstract
열전도성 충전제의 고충전이 가능하며, 또한 내유성 및 열전도성이 우수하고, 추가로 금속이나 플라스틱 등의 각종 기재에 대하여 강고하게 접착하는 경화물을 부여하는 열전도성 함불소 접착제 조성물 및 이것을 사용한 전기·전자 부품을 제공한다.
(해결 수단)
열전도성 충전제의 표면 처리제로서, 1분자 중에 1가의 퍼플루오로알킬기 또는 1가의 퍼플루오로옥시알킬기를 1개 이상 가지고, 추가로 규소 원자에 직결한 알콕시기를 1개 이상 가지고, 또한 분자 중에 에폭시기 및 SiH기를 가지지 않는 함불소 유기 규소 화합물을 사용하고, 접착 부여제로서, 1분자 중에 SiH기와, 1가의 퍼플루오로알킬기 또는 1가의 퍼플루오로옥시알킬기와, 산소 원자를 포함해도 되는 2가의 탄화 수소기를 통하여 규소 원자에 결합한 에폭시기 및/또는 트라이알콕시실릴기를 가지는 오르가노폴리실록세인을 사용한 열전도성 함불소 접착제 조성물.
Description
성분(질량부) | 실시예1 | 실시예2 | 실시예3 | 실시예4 | |
(A)성분 | (A-1) | 100 | - | 100 | - |
(A-2) | - | 100 | - | 100 | |
(B)성분 | (B-1) | 6.0 | 6.0 | 6.0 | 6.0 |
(B-2) | - | - | 1.0 | 1.0 | |
(C)성분 | (C-1) | 0.30 | 0.30 | 0.30 | 0.30 |
(D)성분 | (D-1) | 200 | - | 500 | 700 |
(D-2) | - | - | - | 200 | |
(D-3) | - | 500 | 300 | 200 | |
(D-4) | - | - | - | 200 | |
(E)성분 | (E-1) | 30.0 | 110 | 130 | - |
(E-2) | - | - | - | 160 | |
(F)성분 | (F-1) | 3.0 | - | - | 2.0 |
(F-2) | - | 3.0 | 2.0 | 2.0 | |
(F-3) | - | - | 1.0 | - | |
부가 반응 제어제 (상기 식(35)의 화합물) |
0.80 | 0.80 | 0.80 | 0.80 | |
(B)성분의 SiH기/(A)성분의 바이닐기(개수비) | 1.0 | 1.0 | 1.2 | 1.2 | |
조성물 전체의 SiH기/ 조성물 전체의 바이닐기(몰비) |
1.26 | 1.11 | 1.30 | 1.45 | |
평가 결과 | |||||
조성물의 점도(Pa·s) | 23.8 | 58.9 | 72.9 | 42.9 | |
경화물의 열전도율(W/m·K) | 1.0 | 1.0 | 1.3 | 1.8 | |
경화물의 경도(듀로미터 A) | 60 | 32 | 29 | 28 |
성분(질량부) | 실시예5 | 실시예6 | 비교예1 | 비교예2 | |
(A)성분 | (A-1) | 100 | 100 | 100 | 100 |
(A-2) | - | - | - | - | |
(B)성분 | (B-1) | 7.2 | 7.2 | 6.0 | 6.0 |
(B-2) | - | - | - | 1.0 | |
(C)성분 | (C-1) | 0.30 | 0.30 | 0.30 | 0.30 |
(D)성분 | (D-1) | 800 | 800 | 200 | 2,000 |
(D-2) | 300 | 400 | - | 800 | |
(D-3) | 200 | 400 | - | 700 | |
(D-4) | 200 | 400 | - | 700 | |
(E)성분 | (E-1) | 160 | 40.0 | - | 300 |
(E-2) | - | 160 | - | - | |
(F)성분 | (F-1) | 2.0 | - | 3.0 | 2.0 |
(F-2) | 2.0 | 2.0 | - | - | |
(F-3) | - | 2.0 | - | 2.0 | |
부가 반응 제어제 (상기 식(35)의 화합물) |
0.80 | 0.80 | 0.80 | 0.80 | |
(B)성분의 SiH기/(A)성분의 바이닐기(개수비) | 1.2 | 1.2 | 1.0 | 1.2 | |
조성물 전체의 SiH기/ 조성물 전체의 바이닐기(몰비) |
1.44 | 1.33 | 1.26 | 1.44 | |
평가 결과 | |||||
조성물의 점도(Pa·s) | 387 | 102 | 그리스상이 되지 않음 | 그리스상이 되지 않음 | |
경화물의 열전도율(W/m·K) | 2.2 | 2.7 | 측정불가 | 측정불가 | |
경화물의 경도(듀로미터 A) | 46 | 52 | 측정불가 | 측정불가 |
전단 접착력(MPa) | 실시예1 | 실시예2 | 실시예3 | 실시예4 | |
피 착 체 |
알루미늄 | 1.0 (100) |
0.9 (100) |
0.8 (100) |
0.8 (100) |
에폭시 유리 | 1.1 (100) |
0.9 (100) |
0.8 (100) |
0.8 (100) |
전단 접착력(MPa) | 실시예5 | 실시예6 | 비교예3 | |
피 착 체 |
알루미늄 | 0.9 (100) |
1.0 (100) |
1.0 (100) |
에폭시 유리 | 1.0 (100) |
1.0 (100) |
1.0 (100) |
경화물의 내구성 | 실시예1 | 실시예2 | 실시예3 | 실시예4 |
ATF침지 전의 경화물의 열전도율(W/m·K) |
1.0 | 1.0 | 1.3 | 1.8 |
ATF 침지 후의 경화물의 열전도율(W/m·K) |
1.0 | 1.0 | 1.3 | 1.8 |
경화물의 내구성 | 실시예5 | 실시예6 | 비교예3 |
ATF 침지 전의 경화물의 열전도율(W/m·K) |
2.2 | 2.7 | 1.8 |
ATF 침지 후의 경화물의 열전도율(W/m·K) |
2.2 | 2.7 | 0.9 |
Claims (18)
- (A) 1분자 중에 2개 이상의 알케닐기를 가지고, 또한 주쇄 중에 퍼플루오로폴리에터 구조를 가지는 직쇄상 폴리플루오로 화합물: 100질량부,
(B) 1분자 중에 1가의 퍼플루오로알킬기 혹은 1가의 퍼플루오로옥시알킬기를 가지거나 또는 2가의 퍼플루오로알킬렌기 혹은 2가의 퍼플루오로옥시알킬렌기를 가지고, 추가로 규소 원자에 직결한 수소 원자(SiH기)를 2개 이상 가지고, 또한 분자 중에 에폭시기 및 규소 원자에 직결한 알콕시기를 가지지 않는 함불소 오르가노 수소 실록세인,
(C) 백금족 금속계 촉매: (A)성분에 대하여 백금족 금속 원자의 질량 환산으로 0.1~2,000ppm,
(D) 열전도성 충전제: 100~4,000질량부,
(E) 1분자 중에 1가의 퍼플루오로알킬기 또는 1가의 퍼플루오로옥시알킬기를 1개 이상 가지고, 추가로 규소 원자에 직결한 알콕시기를 1개 이상 가지고, 또한 분자 중에 에폭시기 및 규소 원자에 직결한 수소 원자(SiH기)를 가지지 않는 함불소 유기 규소 화합물: 0.01~300질량부,
(F) 1분자 중에 규소 원자에 직결한 수소 원자(SiH기)와, 1가의 퍼플루오로알킬기 또는 1가의 퍼플루오로옥시알킬기와, 산소 원자를 포함해도 되는 2가의 탄화 수소기를 통하여 규소 원자에 결합한 에폭시기 혹은 트라이알콕시실릴기 또는 그 양쪽을 가지는 오르가노폴리실록세인: 0.1~20질량부
를 함유하는 열전도성 함불소 접착제 조성물로서, 상기 (B)성분의 배합량이 이 조성물 중에 포함되는 알케닐기 1몰에 대하여, 상기 (B)성분 중의 규소 원자에 직결한 수소 원자가 0.5~3몰이 되는 양이며, 이 조성물을 경화하여 얻어지는 경화물의 25℃에 있어서의 열전도율이 1.0W/m·K 이상인 함불소 경화물을 부여하는 것인 것을 특징으로 하는 열전도성 함불소 접착제 조성물. - 제 1 항에 있어서, 상기 (A)성분의 직쇄상 폴리플루오로 화합물의 알케닐기 함유량이 0.005~0.3mol/100g인 것을 특징으로 하는 열전도성 함불소 접착제 조성물.
- 제 1 항에 있어서, 상기 (A)성분의 퍼플루오로폴리에터 구조가 하기 일반식(1)
-(CaF2aO)b- (1)
(식 중, a는 1~6의 정수이며, b는 1~300의 정수이다.)
으로 표시되는 구조를 포함하는 것인 것을 특징으로 하는 열전도성 함불소 접착제 조성물. - 제 1 항에 있어서, 상기 (A)성분이 하기 일반식(2) 및 하기 일반식(3)
(식 중, R1 및 R2는 서로 독립적으로 알케닐기, 또는 비치환 혹은 치환의 지방족 불포화 결합을 가지지 않는 1가의 탄화 수소기이며, R1 및 R2의 합계 중 2개 이상은 알케닐기이다. R3은 서로 독립적으로 수소 원자, 또는 비치환 혹은 치환의 1가의 탄화 수소기이며, c 및 d는 각각 1~150의 정수로서, 또한 c+d의 평균값은 2~300이며, e는 1~6의 정수이다.)
(식 중, R4는 서로 독립적으로 탄소수 1~6의 알킬렌기이며, R5는 서로 독립적으로 수소 원자 또는 불소 치환되어 있어도 되는 탄소수 1~4의 알킬기이다. 또 R1, R2, c, d 및 e는 상기와 동일하다.)
로 이루어지는 군으로부터 선택되는 1종 이상의 직쇄상 폴리플루오로 화합물인 것을 특징으로 하는 열전도성 함불소 접착제 조성물. - 제 1 항에 있어서, 상기 (D)성분이 금속, 금속 산화물, 금속 질화물, 금속 수산화물, 금속 탄화물, 연자성 합금, 페라이트 및 카본블랙으로부터 선택되는 적어도 1종인 것을 특징으로 하는 열전도성 함불소 접착제 조성물.
- 제 5 항에 있어서, 상기 (D)성분이 금, 은, 구리, 철, 니켈, 알루미늄, 금속 규소, 스테인레스 스틸, 알루미나, 산화 마그네슘, 산화 베릴륨, 산화 크로뮴, 산화 타이타늄, 산화 아연, 산화 규소, 질화 붕소, 질화 규소, 질화 알루미늄, 수산화 알루미늄, 수산화 마그네슘, 탄화 붕소, 탄화 타이타늄, 탄화 규소 및 카본블랙의 군으로부터 선택되는 적어도 1종인 것을 특징으로 하는 열전도성 함불소 접착제 조성물.
- 제 6 항에 있어서, 상기 (D)성분이 알루미나인 것을 특징으로 하는 열전도성 함불소 접착제 조성물.
- 제 7 항에 있어서, 상기 (D)성분이 부정형 알루미나 및/또는 구상 알루미나인 것을 특징으로 하는 열전도성 함불소 접착제 조성물.
- 제 8 항에 있어서, 상기 (D)성분의 부정형 알루미나의 평균 입경이 0.2~5.0μm인 것을 특징으로 하는 열전도성 함불소 접착제 조성물.
- 제 8 항에 있어서, 상기 (D)성분의 구상 알루미나의 평균 입경이 5.0~100μm인 것을 특징으로 하는 열전도성 함불소 접착제 조성물.
- 제 1 항에 있어서, 상기 (E)성분이 1분자 중에 규소 원자, 산소 원자 및 질소 원자를 포함해도 되는 2가의 탄화 수소기를 통하여 알콕시기가 직결한 규소 원자에 결합한 1가의 퍼플루오로알킬기 또는 1가의 퍼플루오로옥시알킬기를 1개 이상 가지는 함불소 유기 규소 화합물인 것을 특징으로 하는 열전도성 함불소 접착제 조성물.
- 제 11 항에 있어서, 상기 (E)성분이 하기 일반식(4)
AfR7 gSi(OR6)4 -f-g (4)
(식 중, A는 서로 독립적으로 규소 원자, 산소 원자 및 질소 원자를 포함해도 되는 2가의 탄화 수소기를 통하여 알콕시기가 직결한 규소 원자에 결합한 1가의 퍼플루오로알킬기 또는 1가의 퍼플루오로옥시알킬기이며, R6은 서로 독립적으로 탄소수 1~6의 알킬기이며, R7은 서로 독립적으로 비치환 혹은 치환의 1가의 탄화 수소기이다. 또 f는 1~3의 정수이며, g는 0, 1 또는 2로서, 또한 f+g는 1~3의 정수이다.)
으로 표시되는 함불소 유기 규소 화합물인 것을 특징으로 하는 열전도성 함불소 접착제 조성물. - 제 1 항에 있어서, 상기 (E)성분을 105℃에서 3시간 가열했을 때의 질량 감소율이 50.0질량% 이하인 것을 특징으로 하는 열전도성 함불소 접착제 조성물.
- 제 1 항에 있어서, 상기 (F)성분이 1분자 중에 규소 원자, 산소 원자 및 질소 원자를 포함해도 되는 2가의 탄화 수소기를 통하여 규소 원자에 결합한 1가의 퍼플루오로알킬기 또는 1가의 퍼플루오로옥시알킬기를 1개 이상 가지는 오르가노폴리실록세인인 것을 특징으로 하는 열전도성 함불소 접착제 조성물.
- 제 14 항에 있어서, 상기 (F)성분이 하기 일반식(17)으로 표시되는 환상 오르가노폴리실록세인인 것을 특징으로 하는 열전도성 함불소 접착제 조성물.
(식 중, R15는 서로 독립적으로 비치환 또는 치환의 1가의 탄화 수소기이며, X는 서로 독립적으로 규소 원자, 산소 원자 및 질소 원자를 포함해도 되는 2가의 탄화 수소기를 통하여 규소 원자에 결합한 1가의 퍼플루오로알킬기 또는 1가의 퍼플루오로옥시알킬기이며, Y는 서로 독립적으로 산소 원자를 포함해도 되는 2가의 탄화 수소기를 통하여 규소 원자에 결합한 에폭시기 혹은 트라이알콕시실릴기이다. k'는 1~6의 정수이며, l'는 1~4의 정수이며, m'는 1~4의 정수이며, k'+l'+m'는 4~10의 정수이다. 단 -(SiO)(H)R15-, -(SiO)(X)R15- 및 -(SiO)(Y)R15-의 결합의 순번은 한정되지 않는다.) - 제 1 항에 있어서, 상기 열전도성 함불소 접착제 조성물의 23℃에 있어서의 점도가 1,000Pa·s 이하인 것을 특징으로 하는 열전도성 함불소 접착제 조성물.
- 제 1 항 내지 제 16 항 중 어느 한 항에 기재된 열전도성 함불소 접착제 조성물의 경화물이 적어도 그 구성의 일부인 것을 특징으로 하는 전기·전자 부품.
- 제 17 항에 있어서, 차량용인 것을 특징으로 하는 전기·전자 부품.
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