KR102168863B1 - 전자파 흡수 복합 시트 - Google Patents
전자파 흡수 복합 시트 Download PDFInfo
- Publication number
- KR102168863B1 KR102168863B1 KR1020190074051A KR20190074051A KR102168863B1 KR 102168863 B1 KR102168863 B1 KR 102168863B1 KR 1020190074051 A KR1020190074051 A KR 1020190074051A KR 20190074051 A KR20190074051 A KR 20190074051A KR 102168863 B1 KR102168863 B1 KR 102168863B1
- Authority
- KR
- South Korea
- Prior art keywords
- electromagnetic wave
- film
- wave absorbing
- loss
- composite sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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- 239000002131 composite material Substances 0.000 title claims abstract description 158
- 239000010408 film Substances 0.000 claims abstract description 216
- 238000010521 absorption reaction Methods 0.000 claims abstract description 169
- 229910052751 metal Inorganic materials 0.000 claims abstract description 76
- 239000002184 metal Substances 0.000 claims abstract description 76
- 239000010409 thin film Substances 0.000 claims abstract description 75
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000002985 plastic film Substances 0.000 claims abstract description 25
- 229920006255 plastic film Polymers 0.000 claims abstract description 25
- 239000011888 foil Substances 0.000 claims abstract description 23
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 9
- 238000000576 coating method Methods 0.000 claims abstract description 9
- 230000001788 irregular Effects 0.000 claims abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 100
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 100
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 77
- 229910052802 copper Inorganic materials 0.000 claims description 58
- 239000010949 copper Substances 0.000 claims description 58
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 230000001154 acute effect Effects 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 239000010410 layer Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 239000011651 chromium Substances 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 229910017052 cobalt Inorganic materials 0.000 claims description 5
- 239000010941 cobalt Substances 0.000 claims description 5
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 5
- 239000002356 single layer Substances 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 239000011135 tin Substances 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 description 19
- 239000000853 adhesive Substances 0.000 description 15
- 230000001070 adhesive effect Effects 0.000 description 15
- 239000010419 fine particle Substances 0.000 description 14
- 239000006229 carbon black Substances 0.000 description 12
- 238000003825 pressing Methods 0.000 description 12
- 229910002804 graphite Inorganic materials 0.000 description 8
- 239000010439 graphite Substances 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 238000010030 laminating Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 229920002799 BoPET Polymers 0.000 description 4
- 239000011231 conductive filler Substances 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 238000001771 vacuum deposition Methods 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 230000002745 absorbent Effects 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000000879 optical micrograph Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000412 polyarylene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0062—Structures of standardised dimensions, e.g. 19" rack, chassis for servers or telecommunications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0069—Methods for measuring the shielding efficiency; Apparatus therefor; Isolation container for testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
- Aerials With Secondary Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018117782 | 2018-06-21 | ||
| JPJP-P-2018-117782 | 2018-06-21 | ||
| JP2018177487A JP6461416B1 (ja) | 2018-06-21 | 2018-09-21 | 電磁波吸収複合シート |
| JPJP-P-2018-177487 | 2018-09-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20190143829A KR20190143829A (ko) | 2019-12-31 |
| KR102168863B1 true KR102168863B1 (ko) | 2020-10-22 |
Family
ID=65229024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020190074051A Active KR102168863B1 (ko) | 2018-06-21 | 2019-06-21 | 전자파 흡수 복합 시트 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10667444B2 (ja) |
| JP (1) | JP6461416B1 (ja) |
| KR (1) | KR102168863B1 (ja) |
| CN (1) | CN110626017B (ja) |
| DE (1) | DE102019115966A1 (ja) |
| TW (1) | TWI708679B (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019135192A1 (en) * | 2018-01-05 | 2019-07-11 | 3M Innovative Properties Company | Stray light absorbing film |
| KR102597064B1 (ko) * | 2022-04-28 | 2023-10-31 | 주식회사 현대케피코 | 전자파 차폐재 및 그 제조방법 |
| CN115466940B (zh) * | 2022-08-15 | 2023-10-20 | 中国电子科技集团公司第十二研究所 | 一种金刚石基微波体衰减材料，制备及应用 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10135682A (ja) * | 1996-10-25 | 1998-05-22 | Michiharu Takahashi | 多層電波吸収体 |
| JP2002059487A (ja) | 2000-08-14 | 2002-02-26 | Seiji Kagawa | 多孔質フィルムの製造装置 |
| JP4889180B2 (ja) * | 2002-10-17 | 2012-03-07 | 学校法人五島育英会 | 多周波帯対応電波吸収体 |
| JP2004270143A (ja) * | 2003-03-05 | 2004-09-30 | Tdk Corp | 電波吸収体、電波吸収パネル、電波吸収衝立、電波吸収壁、電波吸収天井および電波吸収床 |
| JP2007299907A (ja) * | 2006-04-28 | 2007-11-15 | Nitto Denko Corp | 電磁波を伝導又は吸収する特性を有する構造体 |
| KR100896739B1 (ko) * | 2007-09-13 | 2009-05-11 | 주식회사 엠피코 | 전자파 흡수 및 차폐용 필름과 이의 제조 방법, 전자파흡수 및 차폐용 필름을 채용한 전선 및 케이블 |
| CN102046370B (zh) * | 2009-02-13 | 2014-05-14 | 加川清二 | 带线状痕迹的金属薄膜-塑料复合膜及其制造装置 |
| JP5559668B2 (ja) * | 2010-12-07 | 2014-07-23 | 清二 加川 | 電磁波吸収体 |
| US20130341571A1 (en) * | 2011-03-17 | 2013-12-26 | Sumitomo Chemical Company, Limited | Metallic composite composition and mixture thereof |
| KR101790684B1 (ko) * | 2011-11-30 | 2017-10-26 | 세이지 까가와 | 복합 전자파 흡수 시트 |
| US20170002488A1 (en) * | 2013-11-25 | 2017-01-05 | Asahi Kasei Kabushiki Kaisha | Noise-absorbing sheet |
| JP5563175B1 (ja) | 2014-03-05 | 2014-07-30 | 清二 加川 | 高熱伝導率の放熱シート及びその製造方法 |
| JP6309842B2 (ja) | 2014-07-03 | 2018-04-11 | 田中貴金属工業株式会社 | 光硬化型導電性インク組成物 |
| TWI608789B (zh) * | 2015-03-27 | 2017-12-11 | 台虹科技股份有限公司 | 電磁波遮蔽膜及具電磁波遮蔽功能的電路板 |
| US9907179B2 (en) * | 2016-04-25 | 2018-02-27 | Tdk Corporation | Electronic circuit package |
| US20190215994A1 (en) * | 2016-06-22 | 2019-07-11 | Maxell Holdings, Ltd. | Electric wave absorption sheet |
| JP6208394B1 (ja) * | 2017-05-23 | 2017-10-04 | 加川 清二 | 電磁波吸収フィルタ |
| EP3666732A4 (en) * | 2017-08-09 | 2021-04-28 | Sumitomo Metal Mining Co., Ltd. | ELECTROMAGNETIC WAVE-ABSORBING PARTICLE DISPERSION AND ELECTROMAGNETIC WAVE-ABSORBING TRANSPARENT LAMINATED SUBSTRATE |
-
2018
- 2018-09-21 JP JP2018177487A patent/JP6461416B1/ja active Active
-
2019
- 2019-03-05 TW TW108107159A patent/TWI708679B/zh active
- 2019-03-13 US US16/351,959 patent/US10667444B2/en active Active
- 2019-04-08 CN CN201910276359.4A patent/CN110626017B/zh active Active
- 2019-06-12 DE DE102019115966.0A patent/DE102019115966A1/de active Pending
- 2019-06-21 KR KR1020190074051A patent/KR102168863B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2020004940A (ja) | 2020-01-09 |
| CN110626017A (zh) | 2019-12-31 |
| TW202000454A (zh) | 2020-01-01 |
| KR20190143829A (ko) | 2019-12-31 |
| DE102019115966A1 (de) | 2019-12-24 |
| JP6461416B1 (ja) | 2019-01-30 |
| US10667444B2 (en) | 2020-05-26 |
| TWI708679B (zh) | 2020-11-01 |
| CN110626017B (zh) | 2021-10-29 |
| US20190394911A1 (en) | 2019-12-26 |
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Legal Events
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|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20190621 |
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Comment text: Notification of reason for refusal Patent event date: 20200421 Patent event code: PE09021S01D |
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Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20200928 |
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Comment text: Registration of Establishment Patent event date: 20201016 Patent event code: PR07011E01D |
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