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KR101987946B1 - 다가 하이드록시 수지, 에폭시 수지, 그들의 제조방법, 에폭시 수지 조성물 및 그 경화물 - Google Patents

다가 하이드록시 수지, 에폭시 수지, 그들의 제조방법, 에폭시 수지 조성물 및 그 경화물 Download PDF

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Publication number
KR101987946B1
KR101987946B1 KR1020147026281A KR20147026281A KR101987946B1 KR 101987946 B1 KR101987946 B1 KR 101987946B1 KR 1020147026281 A KR1020147026281 A KR 1020147026281A KR 20147026281 A KR20147026281 A KR 20147026281A KR 101987946 B1 KR101987946 B1 KR 101987946B1
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South Korea
Prior art keywords
epoxy resin
polyhydric hydroxy
aralkyl
resin
hydroxy compound
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KR1020147026281A
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Korean (ko)
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KR20140129227A (ko
Inventor
히사시 야마다
에이지로 아오야기
케이스케 와타나베
유타카 오카자키
히데야스 아사카게
Original Assignee
닛테츠 케미컬 앤드 머티리얼 가부시키가이샤
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Publication of KR20140129227A publication Critical patent/KR20140129227A/ko
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/04Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020147026281A 2012-02-23 2013-02-21 다가 하이드록시 수지, 에폭시 수지, 그들의 제조방법, 에폭시 수지 조성물 및 그 경화물 Active KR101987946B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012037210 2012-02-23
JPJP-P-2012-037210 2012-02-23
PCT/JP2013/054278 WO2013125620A1 (ja) 2012-02-23 2013-02-21 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物

Publications (2)

Publication Number Publication Date
KR20140129227A KR20140129227A (ko) 2014-11-06
KR101987946B1 true KR101987946B1 (ko) 2019-06-11

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KR1020147026281A Active KR101987946B1 (ko) 2012-02-23 2013-02-21 다가 하이드록시 수지, 에폭시 수지, 그들의 제조방법, 에폭시 수지 조성물 및 그 경화물

Country Status (7)

Country Link
JP (1) JP6124865B2 (ja)
KR (1) KR101987946B1 (ja)
CN (1) CN104334597B (ja)
MY (1) MY169844A (ja)
SG (1) SG11201405075SA (ja)
TW (1) TWI548681B (ja)
WO (1) WO2013125620A1 (ja)

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Publication number Priority date Publication date Assignee Title
TWI595019B (zh) * 2012-11-12 2017-08-11 Dic股份有限公司 含有酚性羥基樹脂、環氧樹脂、硬化性樹脂組成物、其硬化物及半導體封裝材料
JP6406847B2 (ja) * 2014-03-26 2018-10-17 新日鉄住金化学株式会社 変性多価ヒドロキシ樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
CN109071780B (zh) * 2016-04-28 2022-04-08 昭和电工材料株式会社 环氧树脂组合物及电子部件装置
JP7142233B2 (ja) * 2017-12-14 2022-09-27 パナソニックIpマネジメント株式会社 封止用エポキシ樹脂組成物、硬化物、及び半導体装置
TWI751064B (zh) * 2021-03-29 2021-12-21 長春人造樹脂廠股份有限公司 多元酚樹脂、多元酚樹脂之縮水甘油醚及其應用

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JP2004067968A (ja) 2002-08-09 2004-03-04 Sumitomo Bakelite Co Ltd 樹脂組成物、プリプレグおよび積層板
JP2004323630A (ja) 2003-04-23 2004-11-18 Lignyte Co Ltd フェノール樹脂の製造方法
JP2010235819A (ja) 2009-03-31 2010-10-21 Nippon Steel Chem Co Ltd 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物

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JPH0356526A (ja) * 1989-07-25 1991-03-12 Denki Kagaku Kogyo Kk 半導体封止用エポキシ樹脂組成物
JP3196141B2 (ja) * 1991-11-14 2001-08-06 東都化成株式会社 エポキシ樹脂組成物
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EP0549968A1 (de) * 1991-12-20 1993-07-07 Hoechst Aktiengesellschaft Grenzflächenaktive Verbindungen auf Basis modifizierter Novolakoxalklylate, ihre Herstellung und ihre Verwendung
JPH06128183A (ja) * 1992-02-27 1994-05-10 Mitsui Toatsu Chem Inc ビスフェノールf及びノボラック型フェノール樹脂の併産方法
JP3587570B2 (ja) 1994-10-20 2004-11-10 三井化学株式会社 ベンジル化ポリフェノール、そのエポキシ樹脂、それらの製造方法および用途
JP3579800B2 (ja) * 1994-12-14 2004-10-20 東都化成株式会社 低誘電性エポキシ樹脂組成物
JPH10158352A (ja) * 1996-11-28 1998-06-16 Dainippon Ink & Chem Inc フェノ−ル樹脂の製造方法
JPH11140166A (ja) 1997-11-11 1999-05-25 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP3349963B2 (ja) 1998-10-21 2002-11-25 日本電気株式会社 難燃性エポキシ樹脂組成物及びそれを用いた半導体装置
JP2000273280A (ja) * 1999-03-26 2000-10-03 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP4188022B2 (ja) 2002-07-30 2008-11-26 新日鐵化学株式会社 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造法、それらを用いたエポキシ樹脂組成物及び硬化物
JP2005344081A (ja) 2004-06-07 2005-12-15 Nippon Steel Chem Co Ltd エポキシ樹脂組成物及び硬化物
JP2008106219A (ja) * 2006-03-29 2008-05-08 Sumitomo Bakelite Co Ltd フェノール樹脂の製造方法
JP5228328B2 (ja) * 2007-02-01 2013-07-03 宇部興産株式会社 低溶融粘度フェノールノボラック樹脂、その製造方法およびそれを用いたエポキシ樹脂硬化物
JP5462559B2 (ja) * 2009-09-08 2014-04-02 新日鉄住金化学株式会社 多価ヒドロキシ化合物、それらの製造方法及びエポキシ樹脂組成物並びにその硬化物
JP5209660B2 (ja) * 2010-03-29 2013-06-12 新日鉄住金化学株式会社 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造法、それらを用いたエポキシ樹脂組成物及び硬化物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004067968A (ja) 2002-08-09 2004-03-04 Sumitomo Bakelite Co Ltd 樹脂組成物、プリプレグおよび積層板
JP2004323630A (ja) 2003-04-23 2004-11-18 Lignyte Co Ltd フェノール樹脂の製造方法
JP2010235819A (ja) 2009-03-31 2010-10-21 Nippon Steel Chem Co Ltd 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
JP6124865B2 (ja) 2017-05-10
CN104334597A (zh) 2015-02-04
KR20140129227A (ko) 2014-11-06
JPWO2013125620A1 (ja) 2015-07-30
WO2013125620A1 (ja) 2013-08-29
TWI548681B (zh) 2016-09-11
MY169844A (en) 2019-05-17
TW201345958A (zh) 2013-11-16
SG11201405075SA (en) 2014-10-30
CN104334597B (zh) 2016-06-22

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