KR101985848B1 - Light irradiation device for peripheral exposure apparatus - Google Patents

Abstract

[PROBLEMS] To provide a light irradiation apparatus for a peripheral exposure apparatus capable of irradiating light having an irradiation intensity distribution that rises steeply between a circuit pattern forming region and a wafer end edge while suppressing occurrence of pattern collapse.
[Solution] A light irradiation apparatus for a peripheral exposure apparatus that includes a light source that emits light, and emits the light around the edge of the object to be irradiated to perform exposure of the edge. The predetermined light intensity distribution is formed so that the intensity of light around the edge of the edge becomes lower from the inside to the outside of the object to be irradiated.

Description

Light irradiation apparatus for peripheral exposure apparatus {LIGHT IRRADIATION DEVICE FOR PERIPHERAL EXPOSURE APPARATUS}

According to the present invention, light is irradiated around the edge of a substrate coated with a photosensitive resist, such as a semiconductor substrate, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, and exposed to remove unnecessary resist at this edge. The light irradiation apparatus used for a peripheral exposure apparatus.

Conventionally, in a semiconductor manufacturing process such as IC (Integrated Circuit) or Large Scale Integrated Circuit (LSI), a photosensitive resist is applied to the surface of a semiconductor wafer, and the circuit pattern is exposed and developed through a mask on the resist layer. Forming is done.

In general, as a method of applying a resist to the surface of a semiconductor wafer, a wafer is placed on a swivel table, a resist is dropped and rotated near the center of the wafer surface, and a spin is applied to the entire surface of the wafer by centrifugal force. Coating methods are used.

In such a spin coating method, the resist is applied not only to the circuit pattern formation region of the wafer center portion but also to the end edge portion of the wafer on which the circuit pattern is not formed. The end edge portion of the wafer is gripped by a conveying device or the like to convey the wafer. In many cases, if the resist at the edge of the wafer is left, a part of the wafer is peeled off during transportation of the wafer, resulting in a problem of missing. And if the resist of the edge part of a wafer falls and it adheres to the circuit pattern formation area of a wafer, a problem arises that a desired circuit pattern is not formed and a yield falls. For this reason, generally, the resist is exposed using the peripheral exposure apparatus which irradiates light to the periphery including the edge part of a wafer, and the unnecessary resist apply | coated to the edge part of a wafer is removed. The light irradiation apparatus for such a peripheral exposure apparatus is described in patent document 1, for example.

The light irradiation apparatus for the peripheral exposure apparatus (edge exposure apparatus) of patent document 1 is a light source unit which has a lamp inside, the 1st light guide which guides the light radiate | emitted from a light source unit, and it is radiate | emitted from the 1st light guide. A light mixing optical element (quartz rod) for mixing light, a second light guide for guiding light emitted from the light mixing optical element, and an irradiation head for projecting light from the second light guide to the end edge of the substrate; It is comprised so that light irradiated from a lamp may be condensed to the predetermined area | region of the edge part of a board | substrate.

After exposure by such a peripheral exposure apparatus, the unnecessary resist of the end edge of the wafer is removed by etching or the like, but when the unnecessary resist is not completely removed and remains thin on the wafer (a so-called gray zone occurs), It causes the lack of resist in the process. For this reason, the cross-sectional shape of the resist tip (i.e., the cross-sectional shape of the resist tip remaining in the circuit pattern formation region) after the unnecessary resist is removed sharply rises (i.e., sags) between the circuit pattern formation region and the wafer edge. It is desirable to have a small) shape.

The occurrence of such gray zone is due to the irradiation intensity distribution of the light projected from the peripheral exposure apparatus to the end edge of the substrate. That is, if the irradiation intensity distribution of the light projected from the peripheral exposure apparatus to the end edge of the substrate is gently changed between the circuit pattern formation area and the end edge of the wafer, between the circuit pattern formation area and the end edge of the wafer. Since an insufficient exposure area is generated, and the cross-sectional shape of the resist tip remaining in the circuit pattern formation area is also smooth (that is, a gray zone area is generated), projection from the peripheral exposure apparatus to the end edge of the substrate is performed. It is preferable that the irradiation intensity distribution of the light to be increased sharply (that is, less sagging) between the circuit pattern formation region and the end edge of the wafer. For this reason, in the peripheral exposure apparatus of patent document 1, the rectangular slit is formed in an irradiation head, and the light mixed by the light mixing optical element is projected on the board | substrate through a slit.

Japanese Patent No. 3947365

(Summary of invention)

(Tasks to be solved)

According to the light irradiation apparatus for peripheral exposure apparatus of patent document 1, since the light projected on a board | substrate passes through a slit and becomes only the light beam of a rectangular shape (that is, substantially parallel light beam) with the spreading angle to some extent, a circuit pattern Irradiation intensity distribution which rises relatively steeply (that is, there is little droop) is formed between the formation region and the edge of the end of the wafer, and generation of the gray zone region is suppressed to some extent.

However, at present, since the circuits formed on the wafer are becoming more integrated and the circuit patterns are becoming smaller, the irradiation intensity distribution which rises more steeply (i.e., less sag) between the circuit pattern formation region and the end edge of the wafer than before. There is a need for a light irradiation apparatus for a peripheral exposure apparatus capable of projecting light.

In order for the irradiation intensity distribution of the light projected on the substrate to rise more steeply between the circuit pattern formation region and the end edge of the wafer, it is also effective to improve the irradiation intensity itself of the light projected on the substrate, but the irradiation intensity is more than necessary. In this case, undesired stray light is generated due to reflection on the optical component or resist surface, and when the stray light is irradiated to the circuit pattern formation region, a so-called pattern collapse occurs to obtain a circuit pattern having a desired resolution. The problem of not losing occurs.

This invention is made | formed in view of such a situation, The objective is to irradiate the light which has a steeply rising irradiation intensity distribution between a circuit pattern formation area and the edge of a wafer, suppressing generation | occurrence | production of a pattern collapse. It is possible to provide a light irradiation apparatus for a peripheral exposure apparatus.

In order to achieve the above object, the light irradiation apparatus for a peripheral exposure apparatus of the present invention includes a light source for emitting light, and irradiates the light around the end edge portion of the object to be irradiated to expose the end edge portion. A light irradiation apparatus for a peripheral exposure apparatus, wherein the light source forms a predetermined light intensity distribution so that the intensity of light around the edge of the irradiated object is lowered from the inside to the outside of the irradiated object. It is done.

According to this structure, since the light of the irradiation intensity distribution which rises steeply (i.e., there is little sag) is irradiated about the edge part of a to-be-irradiated object to be irradiated, the to-be-irradiated object remains, accurately leaving the resist of a circuit pattern formation area | region. The resist at the edge of the edge can be removed accurately. In addition, since the intensity of light around the edge of the object to be irradiated is lowered from the inside to the outside of the object to be irradiated, unintended generation of stray light due to reflection on an optical component or a resist surface, etc. This suppresses the occurrence of so-called pattern collapse.

In addition, the light source includes a discharge lamp for emitting light and a light guide including a plurality of optical fiber element wires for guiding light from the discharge lamp. The light guide includes a plurality of optical fiber element wires grouped in a circle to receive light from the discharge lamp. The light incidence surface and the plurality of optical fiber element wires are bundled in a rectangular shape and have a light emission surface for emitting light incident from the discharge lamp, and the light emission surface has a portion of a plurality of optical fiber element wires located at the center of the light incidence surface. A first area and a second area in which a part of a plurality of optical fiber element wires positioned at the periphery at the light incident surface are arranged, and the light emitted from the first area is around the end edge of the object to be irradiated, and the second area. It can be comprised so that it may be located inside the to-be-exposed object rather than the light radiate | emitted from the inside. In this case, the plurality of optical fiber element wires can be configured to be randomly arranged.

In addition, the light source includes a substrate disposed in parallel with the object to be irradiated, and a plurality of light emitting elements disposed two-dimensionally on the substrate and forming a rectangular light exit surface, and parallel to two opposite sides of the light exit surface. Direction, a predetermined light intensity distribution can be formed. In this case, the light source may be disposed in each of the optical paths of the plurality of light emitting elements, and may include a lens for shaping the light emitted from each light emitting element to be substantially parallel light. In this case, the light emitting surface is composed of a first region for emitting light of a first intensity and a second region for emitting light of a second intensity lower than the first intensity, and around the end edge of the object to be irradiated. The light emitted from the first region can be configured to be located inside the object to be irradiated more than the light emitted from the second region.

Moreover, it is preferable to comprise so that light radiate | emitted from the 1st area | region may irradiate on the to-be-projected object.

Moreover, it is preferable to comprise so that at least one part of the light radiate | emitted from the 2nd area may irradiate the outer side of an to-be-irradiated object.

In addition, the first region and the second region can be configured to have substantially the same size.

Moreover, it is preferable that the cross section which mixes and exits the light radiate | emitted from the light emission surface further includes a substantially rectangular light mixer. In this case, the light mixer may be configured of a glass rod that mixes the light emitted from the first region and the light emitted from the second region. Further, the light mixer may be configured to have a first glass rod for mixing light emitted from the first region and a second glass rod for mixing light emitted from the second region.

In addition, the light preferably includes at least a wavelength of light acting on the resist layer applied to the object to be irradiated.

As described above, according to the present invention, a light irradiation apparatus for a peripheral exposure apparatus capable of irradiating light having an irradiation intensity distribution that rises steeply between a circuit pattern formation region and a wafer end edge while suppressing occurrence of pattern collapse is provided. Is realized.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows schematic structure of the peripheral exposure apparatus with which the light irradiation apparatus which concerns on 1st Embodiment of this invention is mounted.
It is a figure explaining the structure of the light guide with which the light irradiation apparatus which concerns on 1st Embodiment of this invention was equipped.
3 is a graph showing the irradiation intensity distribution of light incident on the incident end surface of the light guide included in the light irradiation apparatus according to the first embodiment of the present invention.
It is a figure when the 1st glass rod and the 2nd glass rod with which the light irradiation apparatus which concerns on the 1st Embodiment of this invention were seen from the exit end surface side of a light guide.
It is a figure explaining the irradiation pattern of the light projected around the edge part of the board | substrate from the light irradiation apparatus which concerns on the 1st Embodiment of this invention.
It is a graph explaining irradiation intensity distribution of the irradiation pattern projected around the edge part of a board | substrate from the light irradiation apparatus which concerns on the 1st Embodiment of this invention.
It is a figure which shows schematic structure of the peripheral exposure apparatus with which the light irradiation apparatus which concerns on 2nd Embodiment of this invention is mounted.
It is a figure explaining the structure of the light guide with which the light irradiation apparatus which concerns on 2nd Embodiment of this invention was equipped.
It is a figure when the 1st glass rod and the 2nd glass rod with which the light irradiation apparatus which concerns on 2nd Embodiment of this invention were seen from the exit end surface side of a light guide.
It is a figure explaining the irradiation pattern of the light projected around the edge part of the board | substrate from the light irradiation apparatus which concerns on 2nd Embodiment of this invention.
It is a figure which shows schematic structure of the peripheral exposure apparatus in which the light irradiation apparatus which concerns on 3rd Embodiment of this invention is mounted.
It is a figure explaining the irradiation pattern of the light projected around the edge part of the board | substrate from the light irradiation apparatus which concerns on 3rd Embodiment of this invention.
It is a figure which shows schematic structure of the peripheral exposure apparatus with which the light irradiation apparatus which concerns on 4th Embodiment of this invention is mounted.
It is a figure explaining the internal structure of the light irradiation apparatus which concerns on the 4th Embodiment of this invention.

(Form to carry out invention)

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described in detail with reference to drawings. In addition, the same code | symbol is attached | subjected to the same or equivalent part in drawing, and the description is not repeated.

(1st embodiment)

FIG. 1: is a figure which shows schematic structure of the principal part of the peripheral exposure apparatus 1 in which the light irradiation apparatus 100 which concerns on 1st Embodiment of this invention is mounted, FIG. 1 (a) is a peripheral exposure apparatus 1 1B is a side view of the peripheral exposure apparatus 1. The peripheral exposure apparatus 1 of this embodiment irradiates light to the periphery of the edge part of the board | substrate W, rotating the disk-shaped board | substrate W, and performs the exposure for removing the unnecessary resist of the edge part. And a rotation mechanism 10 for mainly rotating the substrate W and a light irradiation apparatus 100 for irradiating light. In addition, in FIG. 1, for convenience of explanation, the two axes parallel to the surface (that is, the horizontal plane) of the substrate W and orthogonal to each other are X and Y axes, and the axes orthogonal to the X and Y axes are shown. An XYZ Cartesian coordinate system serving as the Z axis will be attached and explained below using the XYZ Cartesian coordinate system as appropriate.

The rotary mechanism 10 includes a spin motor 12, a motor shaft 14, and a spin chuck 16. The spin chuck 16 is a disk-shaped member which is connected to the spin motor 12 through the motor shaft 14 and rotates along the rotation of the motor shaft 14, and the center C of the substrate W spins. The board | substrate W is vacuum-suctioned from the back surface so that it may be arrange | positioned on the rotating shaft AX of the motor 12, and is maintained in substantially horizontal position. Therefore, the rotation operation of the spin motor 12 is transmitted to the spin chuck 16 through the motor shaft 14, and the substrate W held by the spin chuck 16 rotates in the XY plane.

The light irradiation apparatus 100 is a device for irradiating light around the edge portion of the substrate W, and includes a light source unit 110, a light guide 120, and an irradiation head 130.

The light source unit 110 includes a discharge lamp 112, an elliptical mirror 114 reflecting light L emitted from the discharge lamp 112, and a case accommodating the discharge lamp 112 and the elliptical mirror 114. 116 is provided. In addition, the front panel 116a of the case 116 is connected to the first connector 122 (described later) of the light guide 120 and supports the proximal end side (incident end surface 120a side) of the light guide 120. And a fixing member 118 for fixing is attached.

The discharge lamp 112 is a so-called UV lamp in which a discharge medium made of mercury, a rare gas, or the like is enclosed, and has an emission spectrum in an ultraviolet wavelength region, and the arc bright point of the discharge lamp 112 is the first focal position of the elliptical mirror 114. Are arranged to approximately coincide with.

The ellipsoidal mirror 114 is an air mirror reflecting the light L emitted from the discharge lamp 112 toward the light guide 120. In this embodiment, the light reflected by the ellipsoidal mirror 114 L) is configured to condense in a substantially circular shape on the incident end surface 120a of the light guide 120.

The light guide 120 is a light guide member for guiding the light L emitted from the discharge lamp 112 along the X-axis direction, and includes n (eg, 500) optical fiber strands 121. have. The outer circumferential surface of the light guide 120 (that is, the n optical fiber element wires 121) is covered by a tube (not shown), and the fixing member is disposed on the outer circumferential surface of the proximal end side (incident end surface 120a side) of the light guide 120. A first connector 122 connectable to 118 is attached. Moreover, the 2nd connector 124 which can be connected to the irradiation head 130 is attached to the outer peripheral surface of the front-end | tip part side (outgoing end surface 120b side) of the light guide 120. As shown in FIG. As shown in FIG. 1, when the first connector 122 is connected to the fixing member 118, the incident end surface 120a of the light guide 120 is accommodated in the case 116 to form an elliptical mirror 114. Light L disposed at two focal points and reflected by the elliptical mirror 114 is incident into the light guide 120 (that is, the n optical fiber element lines 121).

FIG. 2 is a view for explaining the layout of the optical fiber element 121 in the light guide 120 of the present embodiment, and FIG. 2 (a) is a view when the incidence end surface 120a is viewed from the discharge lamp 112 side. 2B is a view when the exit end surface 120b is viewed from the irradiation head 130 side.

As shown in Fig. 2 (a), on the incident end surface 120a of the light guide 120 of the present embodiment, n optical fiber element wires 121 are bundled in a substantially circular shape, and approximately n / 2 (that is, , Approximately 250 optical fiber element wires 121 are disposed at the central portion A1 (for example, a portion of a radius of 3 mm from the center of the incident end surface 120a), and approximately n / 2 (that is, approximately 250) Optical fiber element 121 is disposed in the peripheral portion A2 (a portion indicated by gray in Fig. 2A).

In addition, as shown in Fig. 2 (b), on the exit end surface 120b of the light guide 120 of the present embodiment, n optical fiber element wires 121 are bundled in a substantially rectangular shape, and at the incident end surface 120a, About n / 2 (ie, approximately 250) optical fiber element wires 121 disposed at the central portion A1 are arranged in a random mix arrangement in the first rectangular region B1 in a rectangular shape, and the peripheral portion at the incident end surface 120a is disposed. About n / 2 (i.e., approximately 250) optical fiber element wires 121 arranged in (A2) are arranged in a random mix in the second rectangular area B2 (part shown by gray in Fig. 2 (b)). It is arranged.

As described above, in the light guide 120 of the present embodiment, about n / 2 (that is, about 250) optical fiber element wires 121 arranged at the center portion A1 at the incident end surface 120a and the incident end surface. At 120a, about n / 2 (i.e., approximately 250) optical fiber element lines 121 disposed at the peripheral portion A2 are different in the exit end surface 120b (i.e., the first region B1 and the first region). It is divided | segmented into 2 area | regions B2), and is arrange | positioned.

3 is a graph showing the irradiation intensity distribution of the light L incident on the incidence end surface 120a of the light guide 120, the horizontal axis being the distance (mm) at which the center of the incidence end surface 120a is 0 mm, and the vertical axis. Is the relative strength when the maximum strength is 1.0. As shown in FIG. 3, since the light L incident on the incident end surface 120a of the light guide 120 has a peak-type irradiation intensity distribution with the center of the incident end surface 120a as the peak, the incident end surface Light L having a relative intensity of 0.5 or more is incident on the optical fiber element wire 121 disposed at the central portion A1 (the portion of the distance from the center of the incident end surface 120a within 3 mm) of the 120a, and the incident end surface. Light L having a relative intensity of 0.5 or less is incident on the optical fiber element wire 121 arranged at the peripheral portion A2 of the 120a (the portion from which the distance from the center of the incident end surface 120a is less than 3 mm). Therefore, light L of different irradiation intensity is emitted from the 1st area | region B1 and the 2nd area | region B2 of the emission end surface 120b of the light guide 120, respectively.

The irradiation head 130 is connected to the second connector 124 of the light guide 120, receives the tip end side (the exit end surface 120b side) of the light guide 120, and exits from the exit end surface 120b. It is a member which guides and projects light L around the edge of the board | substrate W (FIG. 1). As shown in FIG. 1, the irradiation head 130 includes a first glass rod 131 for guiding light L emitted from the first region B1 of the emission end surface 120b, and an emission end surface 120b. The second glass rod 132 for guiding the light L emitted from the second region B2 of the substrate, and the light L emitted from the first glass rod 131 and the second glass rod 132. (W) disposed between the lens 133, 134 projecting around the periphery of the edge, and disposed between the lens 133 and the lens 134, and for bending the light path of the light L emitted from the lens 133 by 90 degrees. The reflection mirror 135 is provided. In addition, the irradiation head 130 of this embodiment is fixedly installed above the board | substrate W by the arm which is not shown in figure. Moreover, in this embodiment, the slit mask 20 in which the rectangular slit (not shown) was formed between the irradiation head 130 and the board | substrate W is arrange | positioned, and the light radiate | emitted from the irradiation head 130 is provided. By passing through the rectangular slit (not shown) formed in the slit mask 20, the stray light and the like are removed, so that the predetermined rectangular irradiation pattern PA is around the edge of the substrate W. As shown in FIG. To be projected onto (FIG. 4).

4 is a view when the first glass rod 131 and the second glass rod 132 of the present embodiment are viewed from the exit end surface 120b side of the light guide 120. As shown in FIGS. 1B and 4, the first glass rod 131 is a square rod-shaped glass rod whose cross section is substantially the same as the first region B1 of the exit end surface 120b. It guides along the X-axis direction, mixing the light L radiate | emitted from 1st area | region B1, and it exits toward the lens 133. In addition, the second glass rod 132 is a square rod-shaped glass rod having a cross section substantially the same as the second region B2 of the emission end surface 120b, and the light L emitted from the second region B2. ) Is guided along the X-axis direction while mixing, and exits toward the lens 133.

As shown in FIG. 1B, the light L transmitted through the lens 133 is reflected by the reflection mirror 135 in the Z-axis direction (that is, downward in FIG. 1B) and the lens ( 134 and passes through a rectangular slit (not shown) of the slit mask 20, and projects around the end edge of the substrate W. As shown in FIG. The lenses 133 and 134 of the present embodiment are lenses constituting a so-called projection optical system, and enlarge the luminous flux of the light L emitted from the first glass rod 131 and the second glass rod 132 at a predetermined magnification. (Or reduction) to project around the end edge of the substrate W. FIG. In addition, in FIG.1 (b), although the lens 133,134 of this embodiment is shown as both convex lenses, respectively, it is not limited to this structure, A convex lens, a flat convex lens, a meniscus lens, etc. are mentioned. It can also be comprised by the lens group which combined.

As described above, in the present embodiment, the slit mask 20 is arranged between the irradiation head 130 and the substrate W for the purpose of removing stray light, but unnecessary light such as stray light is problematic. If not, the slit mask 20 is not necessary, and the slit mask 20 can be configured to directly project the light L (that is, a rectangular light beam) transmitted through the lens 134 directly onto the substrate W.

FIG. 5: is a figure explaining the irradiation pattern PA of the light L projected from the light irradiation apparatus 100 of this embodiment to the periphery of the edge part of the board | substrate W. FIG. As described above, in the present embodiment, the light L emitted from the emission end surface 120b of the light guide 120 passes through the first glass rod 131 and the second glass rod 132, and thus, is prescribed. Since it is enlarged (or reduced) at a magnification and is projected around the end edge of the substrate W through a rectangular slit (not shown) of the slit mask 20, as shown in FIG. 5, the slit A rectangular irradiation pattern PA of approximately the same size as the slit (not shown) of the mask 20 is projected around the end edge of the substrate W. As shown in FIG. In addition, as described above, the irradiation pattern PA is formed by combining light L passing through the first glass rod 131 and light L passing through the second glass rod 132. Since the light L that passes through the 133 and travels along the X-axis direction is bent downward by the reflection mirror 135 (that is, the Z-axis direction), the light L that has passed through the first glass rod 131. (I.e., the light L through which the first irradiation pattern PA1 formed by the light L emitted from the first region B1 of the exit end surface 120b passes through the second glass rod 132). (I.e., positioned inside the substrate W than the second irradiation pattern PA2 formed by the light L emitted from the second region B2 of the emission end surface 120b). And as shown in FIG. 5, in this embodiment, the boundary line of 1st irradiation pattern PA1 and 2nd irradiation pattern PA2 is substantially coincident with the tangent of the board | substrate W, and 1st irradiation pattern PA1 The irradiation head 130 is positioned and fixed above the substrate W so that is located between the circuit pattern formation area CA of the board | substrate W and the edge part of the board | substrate W.

6 is a graph showing the irradiation intensity distribution in the X-axis direction of the irradiation pattern PA projected around the edge of the substrate W, and the horizontal axis represents the first irradiation pattern PA1 and the second irradiation pattern PA2. Is the distance in the X-axis direction where the boundary line (ie, the tangent of the substrate W) is 0 mm, and the vertical axis is the relative strength when the maximum intensity is 1.0. As described above, in the present embodiment, light L having a relative intensity of 0.5 or more is incident on the optical fiber element 121 disposed at the central portion A1 of the incident end surface 120a of the light guide 120, and the peripheral portion ( Since light L having a relative intensity of 0.5 or less is incident on the optical fiber element wire 121 arranged in A2), the light L emitted from the first region B1 of the exit end surface 120b of the light guide 120. ) Is higher than the irradiation intensity of the light L emitted from the second region B2. Therefore, as shown in FIG. 6, the irradiation intensity of the first irradiation pattern PA1 formed by the light L emitted from the first region B1 (that is, in the range of 0 mm to 2 mm in the distance of FIG. 6). The irradiation intensity) is the irradiation intensity of the second irradiation pattern PA2 formed by the light L emitted from the second region B2 (that is, the irradiation intensity in the range of -2 mm to -0.2 mm in FIG. 6). It becomes higher and becomes irradiation intensity distribution which rises steeply in the position corresponded to the edge part (FIG. 5) of the circuit pattern formation area | region CA of the board | substrate W (that is, the position of 2 mm of distance of FIG. 6).

As described above, since the optical fiber element wires 121 arranged in the first region B1 and the second region B2 are randomly mixed, the first and second regions B1 and B2 are separated from the first region B1 and the second region B2. The irradiation intensity of the light L emitted is averaged. Therefore, the irradiation intensity of the first irradiation pattern PA1 formed by the light L emitted from the first region B1 becomes substantially uniform in the X-axis direction and the Y-axis direction, and similarly, the second region B2. Irradiation intensity of the second irradiation pattern PA2 formed by the light L emitted from the X1 is also substantially uniform in the X-axis direction and the Y-axis direction.

In addition, in this embodiment, although the irradiation intensity of 2nd irradiation pattern PA2 is about 0.3 times the intensity | strength with respect to the irradiation intensity of 1st irradiation pattern PA1, it is unnecessary in the periphery of the edge part of the board | substrate W. In order to remove the resist, the minimum required irradiation intensity is set.

Thus, in the light irradiation apparatus 100 of this embodiment, the optical fiber element wire 121 arrange | positioned at the center part A1 at the incidence end surface 120a of the light guide 120, and the peripheral part (at the incidence end surface 120a). The optical fiber element wire 121 disposed in A2) is half-placed from the exit end surface 120b into different regions (that is, the first region B1 and the second region B2), so that the inside of the substrate W is disposed. In the irradiation pattern PA of the irradiation intensity distribution having a high irradiation intensity and a steep rise (that is, less sagging) at the end of the circuit pattern forming region CA of the substrate W, the area around the end edge of the substrate W Projecting onto For this reason, the resist of the edge part of the board | substrate W can be removed correctly, leaving the resist of the circuit pattern formation area | region CA correctly.

In addition, the irradiation intensity of the second irradiation pattern PA2 located outside the substrate W is set to the minimum necessary irradiation intensity in order to remove the unnecessary resist around the edge of the substrate W (that is, suppression). Therefore, unintended generation of stray light due to reflection on the optical component or resist surface is suppressed, and the occurrence of so-called pattern collapse is also suppressed.

Although the above is description of this embodiment, this invention is not limited to said structure, A various deformation | transformation is possible within the scope of the technical idea of this invention.

For example, although the peripheral exposure apparatus 1 of this embodiment demonstrated as irradiating light to the periphery of the edge of the disk-shaped board | substrate W, the board | substrate W may be a shape which has an orientation flat part, Moreover, the rectangular substrate used for liquid crystal etc. may be sufficient. In addition, when the board | substrate W is rectangular shape, instead of the rotation mechanism 10 which rotates the board | substrate W, the irradiation head 130 is used using the XY stage which moves the board | substrate W in an XY plane. What is necessary is just to move an XY stage so that the light L radiate | emitted from it may move comparatively along the edge part of the board | substrate W. FIG.

In addition, in the light guide 120 of this embodiment, about n / 2 (that is, about 250) optical fiber element wires 121 which are arrange | positioned in the center part A1 in the incidence end surface 120a of the light guide 120 are mentioned. Is divided into half of the first region B1 of the exit end surface 120b, and about n / 2 (that is, approximately 250) optical fiber element lines 121 disposed at the peripheral portion A2 on the incident end surface 120a are removed. Although it is set as half structure to the 2nd area | region B2 of the emission end surface 120b, it is not limited to this half, irradiation intensity is the highest inside the board | substrate W, and the circuit pattern formation area | region of the board | substrate W ( What is necessary is just to divide into the irradiation pattern PA of the irradiation intensity distribution which rises steeply (that is, there is little droop) at the tip of CA).

(2nd embodiment)

FIG. 7: is a figure which shows schematic structure of the principal part of the peripheral exposure apparatus 2 in which the light irradiation apparatus 200 which concerns on 2nd Embodiment of this invention is mounted, FIG. 7B is a side view of the peripheral exposure apparatus 2. As shown in FIG. 7, in the peripheral exposure apparatus 2 of this embodiment, the irradiation head 230 and the rotating mechanism 10 are arranged along the Y-axis direction, and the light L radiate | emitted from the irradiation head 230 is shown. ) Is different from the peripheral exposure apparatus 1 of the first embodiment in that the substrate W is projected around the end edge portion in the Y-axis direction. In addition, as the projection positions of the light L emitted from the irradiation head 230 are different, the configurations of the light guide 220 and the irradiation head 230 are different from the light guide 120 and the irradiation head 130 of the first embodiment. ) Hereinafter, the point different from 1st Embodiment is demonstrated in detail.

FIG. 8 is a view for explaining the layout of the optical fiber element wire 221 in the light guide 220 of the present embodiment, and FIG. 8A is a view when the incidence end surface 220a is viewed from the discharge lamp 112 side. 8B is a view when the exit end surface 220b is viewed from the irradiation head 230 side. 9 is a figure when the 1st glass rod 231 and the 2nd glass rod 232 of the irradiation head 230 of this embodiment are seen from the emission end surface 220b side of the light guide 220. As shown in FIG.

As shown in FIG. 8A, in the light guide 220 of the present embodiment, the n optical fiber element wires 221 are formed on the incident end surface 220a in the same manner as the light guide 120 of the first embodiment. Tied in a substantially circular shape, approximately n / 2 (ie, approximately 250) optical fiber element wires 221 are disposed in the central portion A1 (for example, a portion of a radius of 3 mm from the center of the incident end surface 220a). Approximately n / 2 (i.e., approximately 250) optical fiber element wires 221 are arranged in the peripheral portion A2 (the portion indicated by gray in Fig. 8A).

However, as shown in Fig. 8 (b), in the exit end surface 220b of the light guide 220 of the present embodiment, about n / 2 (the parts arranged at the center portion A1 at the entrance end surface 220a ( That is, about 250 optical fibers element wires 221 are arranged in a random mix array, and about n / 2 (that is, approximately approximately) are arranged in the peripheral portion A2 at the incident end surface 220a. The second region B2 (part shown by gray in Fig. 8B), in which 250 optical fiber element wires 221 are arranged in a random mix arrangement, is arranged side by side in the left-right direction (i.e., Y-axis direction). It differs from the light guide 120 of 1st Embodiment in the point.

And as shown to FIG. 7 (a) and FIG. 9, the 1st glass rod 231 and the 2nd glass rod 232 of this embodiment also have the 1st area | region B1 and the 2nd area | region B2. In accordance with the arrangement of, are arranged side by side in the left-right direction (that is, the Y-axis direction).

FIG. 10: is a figure explaining the irradiation pattern PA of the light L projected from the light irradiation apparatus 200 of this embodiment to the periphery of the edge part of the board | substrate W. FIG. As described above, in the present embodiment, the first region B1 and the second region B2 of the emission end surface 220b of the light guide 220 are arranged in the Y-axis direction, and the first glass rod 231 ) And the second glass rod 232 are also arranged in the Y-axis direction, and as shown in FIG. 10, the light L (that is, the exit end surface 220b) passing through the first glass rod 231 is shown. The first irradiation pattern PA1 formed by the light L emitted from the first region B1 and the light L passing through the second glass rod 232 (that is, the first end of the emission end surface 220b). The second irradiation pattern PA2 formed by the light L emitted from the second region B2 is also arranged in the Y-axis direction. And like 1st Embodiment, 1st irradiation pattern PA1 is located inside board | substrate W rather than 2nd irradiation pattern PA2, and the 1st irradiation pattern PA1 and 2nd irradiation pattern PA2 of The boundary line substantially coincides with the tangent line of the substrate W, and the first irradiation pattern PA1 is positioned between the circuit pattern forming region CA of the substrate W and the end edge of the substrate W. As shown in FIG.

Therefore, according to the structure of this embodiment, irradiation intensity distribution is high inside the board | substrate W, and the irradiation intensity distribution which rises steeply (that is, there is few sag) at the edge part of the circuit pattern formation area | region CA of the board | substrate W is small. Irradiation pattern PA can be projected around the edge of the end of the substrate W. For this reason, the resist of the edge part of the board | substrate W can be removed correctly, leaving the resist of the circuit pattern formation area | region CA correctly.

(Third embodiment)

FIG. 11: is a top view which shows schematic structure of the principal part of the peripheral exposure apparatus 3 in which the light irradiation apparatus 300 which concerns on 3rd Embodiment of this invention is mounted. In the light irradiation apparatus 300 of the present embodiment, the irradiation head 330 includes one glass rod 331, and the first region B1 and the second region of the exit end surface 220b of the light guide 220. The light L emitted from (B2) is different from the light irradiation apparatus 200 of the second embodiment in that the light L is configured to be guided by the glass rod 331.

12 is a graph showing the irradiation intensity distribution in the Y-axis direction of the irradiation pattern PA (FIG. 10) projected from the light irradiation apparatus 300 of the present embodiment to the periphery of the edge of the substrate W, and the horizontal axis is The distance between the first radiation pattern PA1 and the second radiation pattern PA2 (ie, the tangent of the substrate W) in the Y-axis direction (mm) is 0 mm, and the vertical axis represents the maximum intensity of 1.0. Relative strength when As described above, in the present embodiment, one glass rod 331 receives light L emitted from the first region B1 and the second region B2 of the emission end surface 220b of the light guide 220. Since light is guided by the light L, the light L emitted from the first region B1 and the light L emitted from the second region B2 are mixed inside the glass rod 331, but are not shown in FIG. 12. As described above, the irradiation pattern PA projected by the configuration of the present embodiment also has the highest irradiation intensity inside the substrate W and corresponds to the end of the circuit pattern forming region CA of the substrate W. As shown in FIG. (I.e., at a position of 2 mm distance in Fig. 12), the irradiation intensity distribution is steeply rising (i.e., less sagging). For this reason, the resist of the edge part of the board | substrate W can be removed correctly, leaving the resist of the circuit pattern formation area | region CA similarly to 1st and 2nd embodiment.

(4th Embodiment)

FIG. 13: is a side view which shows schematic structure of the principal part of the peripheral exposure apparatus 4 in which the light irradiation apparatus 400 which concerns on 4th Embodiment of this invention is mounted. The peripheral exposure apparatus 4 of this embodiment irradiates light to the periphery of the edge of the rectangular board | substrate W, and has a frame shape of 70 mm width from the edge of an edge (for example, the edge of the board | substrate W). Exposure device for removing the unnecessary resist of the region), and having the XY stage 10a instead of the rotation mechanism 10, the peripheral exposure apparatuses 1, 2, 3 of the first to third embodiments. ) In addition, the light irradiation apparatus 400 of the present embodiment includes a plurality of LEDs (Light Emitting Diodes) 402 as a light source, forms the irradiation pattern PA by the light emitted from the LEDs 402, and the substrate ( It differs from the light irradiation apparatuses 100, 200, 300 of 1st-3rd embodiment by the point which projects around the edge of W).

The XY stage 10a is a mechanism for holding the substrate W so that two opposite sides of the substrate W face in the X-axis direction and the Y-axis direction, respectively, and moving the substrate W within the XY plane. . The XY stage 10a of this embodiment moves the board | substrate W in an XY plane so that the light L radiate | emitted from the light irradiation apparatus 400 may move relatively along the edge part of the board | substrate W. FIG.

FIG. 14: is a figure explaining the internal structure of the light irradiation apparatus 400 of this embodiment, FIG. 14 (a) is a figure when the light irradiation apparatus 400 is seen from the Y-axis direction, and FIG. 14 (b) Is a view when the light irradiation apparatus 400 is seen from the Z-axis direction (that is, it is seen from the lower side of FIG. 14A).

As shown in FIG. 14, the light irradiation apparatus 400 includes a rectangular circuit board 401 parallel to the X-axis direction and the Y-axis direction, 25 LEDs 402, and an optical axis of each LED 402. The first lens 403, the second lens 404, the third lens 405, and the light guide mirror 410 disposed above are provided.

The LEDs 402 are arranged on the circuit board 401 in the form of five (X-axis direction) x five (Y-axis directions) two-dimensional square lattice, and are electrically connected to the circuit board 401. The circuit board 401 is connected to an LED driving circuit (not shown), and each LED 402 is supplied with a driving current from the LED driving circuit through the circuit board 401. When a driving current is supplied to each LED 402, ultraviolet light (for example, wavelength 365nm) of the amount of light corresponding to the driving current is emitted from each LED 402.

The first lens 403, the second lens 404, and the third lens 405 are held in a lens holder (not shown) and are disposed on the optical axis of each LED 402. The first lens 403 is a flat convex lens having a flat LED-402 side formed by injection molding of a silicone resin, for example, and has a function of narrowing the spread angle of ultraviolet light incident from the LED 402. Have. The second lens 404 and the third lens 405 are both convex lenses formed by injection molding of silicone resin, for example, both of the incidence surface and the outgoing surface are convex surfaces, and from the first lens 403 The incident ultraviolet light is shaped into approximately parallel light. Therefore, substantially parallel ultraviolet light having a predetermined beam diameter is emitted from each third lens 405.

The light guide mirror 410 is a rectangular hollow cross section whose reflection surface is formed in the inner surface, and is arrange | positioned so that 25 LEDs 402 may be seen when it sees from the Z-axis direction. Therefore, the ultraviolet light passing through each of the third lenses 405 is emitted through the light guide mirror 410, passes through the rectangular slit (not shown) of the slit mask 20, The irradiation pattern PA is projected around the end edge (FIG. 13).

Moreover, irradiation pattern PA projected by the structure of this embodiment also has the highest irradiation intensity inside the board | substrate W, and steeply in the position corresponded to the edge part of the circuit pattern formation area CA of the board | substrate W. Moreover, as shown in FIG. Although the LED 402 disposed inside the substrate W is configured to have a higher irradiation intensity distribution that rises (that is, less sagging), the amount of emitted light increases, but in the present embodiment, the movement of the substrate W Therefore, since the relative positional relationship of each LED 402 and the board | substrate W differs, the drive current supplied to each LED 402 is changed according to the moving direction and irradiation position of the board | substrate W. As shown in FIG. Specifically, when exposing around one side of the X-axis direction negative side of the board | substrate W, the drive current flows so that the output light amount may become higher, so that the LED 402 located in the X-axis direction positive side may flow, and X of the board | substrate W When exposing the periphery of one side of the positive side in the axial direction, the driving current flows so that the amount of emitted light increases as the LED 402 located in the subsidiary side of the X-axis direction increases, and the periphery of one side of the side in the Y-axis direction of the substrate W is exposed. In this case, the LED 402 located on the Y-axis direction positive side flows the driving current so that the amount of emitted light increases, and when exposing around one side of the positive side of the Y-axis direction of the substrate W, the LED is located on the negative side Y-direction. The driving current flows so as to increase the amount of emitted light as 402. Thus, according to the structure of this embodiment, similarly to 1st-3rd embodiment, the resist of the edge part of the board | substrate W can be removed correctly, leaving the resist of the circuit pattern formation area | region CA correctly. .

In addition, it should be thought that embodiment disclosed this time is an illustration and restrictive at no points. The scope of the present invention is shown not by the above description but by the claims, and is intended to include all modifications within the meaning and range equivalent to the claims.

1, 2, 3, 4 peripheral exposure device 10 rotation mechanism
10a XY stage 12 spin motor
14 motor shaft 16 spin chuck
20 slit mask 100, 200, 300, 400 light irradiation device
110 Light source unit 112 Discharge lamp
114 elliptical mirror 116 case
116a front panel 118 retention member
120, 220 Light guide 120a, 220a End face
120b, 220b Exit end 121, 221 Fiber optic wire
122 first connector 124 second connector
130, 230 Irradiation head 131, 231 First glass rod
132, 232 Second Glass Rod 133, 134 Lens
135 Reflective Mirror 331 Glass Rod
401 Circuit Board 402 LED
403 First Lens 404 Second Lens
405 third lens 410 light guide mirror
W substrate PA irradiation pattern
PA1 First Irradiation Pattern PA2 Second Irradiation Pattern
CA circuit pattern formation area

Claims (20)

As a light irradiation apparatus for a peripheral exposure apparatus provided with the light source which emits light, this light is irradiated to the periphery of the edge of a to-be-projected object, and this edge is exposed,
The light source includes a discharge lamp for emitting the light and a light guide including a plurality of optical fiber element wires for guiding light from the discharge lamp,
The light guide includes a light incidence surface in which the plurality of optical fiber element wires are enclosed in a circle, and the light from the discharge lamp is incident, and a light emission surface in which the plurality of optical fiber element wires are bundled in a rectangular shape and emit light incident from the discharge lamp. With
The light exit surface may include a first region in which a part of the plurality of optical fiber element wires disposed at the center of the light incident surface is disposed, and a second part of the plurality of optical fiber element wires located in the periphery of the light incidence surface. Consists of realms,
Light emitted from the first area is located inside the object to be irradiated from the light emitted from the second area around an edge portion of the object to be irradiated,
The light irradiation apparatus for a peripheral exposure apparatus, characterized in that the intensity of the light around the end edge portion of the irradiated object is lowered from the inner side to the outer side of the irradiated object. The method of claim 1,
The plurality of optical fiber element wires are randomly arranged, The light irradiation apparatus for peripheral exposure apparatus characterized by the above-mentioned. The method according to claim 1 or 2,
The light irradiating apparatus for the peripheral exposure apparatus characterized by irradiating the light radiate | emitted from the said 1st area on the said to-be-exposed object. The method according to claim 1 or 2,
At least a part of the light emitted from the second area irradiates the outside of the irradiated object, the light irradiation apparatus for the peripheral exposure apparatus. The method of claim 3, wherein
At least a part of the light emitted from the second area irradiates the outside of the irradiated object, the light irradiation apparatus for the peripheral exposure apparatus. The method according to claim 1 or 2,
The size of the said 1st area | region and the said 2nd area | region is the same, The light irradiation apparatus for peripheral exposure apparatuses characterized by the above-mentioned. The method of claim 3, wherein
The size of the said 1st area | region and the said 2nd area | region is the same, The light irradiation apparatus for peripheral exposure apparatuses characterized by the above-mentioned. The method of claim 4, wherein
The size of the said 1st area | region and the said 2nd area | region is the same, The light irradiation apparatus for peripheral exposure apparatuses characterized by the above-mentioned. The method of claim 5,
The size of the said 1st area | region and the said 2nd area | region is the same, The light irradiation apparatus for peripheral exposure apparatuses characterized by the above-mentioned. The method according to claim 1 or 2,
A light irradiation apparatus for a peripheral exposure apparatus, characterized by further comprising a rectangular light mixer having a cross section for mixing and exiting the light emitted from the light exit surface. The method of claim 3, wherein
A light irradiation apparatus for a peripheral exposure apparatus, characterized by further comprising a rectangular light mixer having a cross section for mixing and exiting the light emitted from the light exit surface. The method of claim 4, wherein
A light irradiation apparatus for a peripheral exposure apparatus, characterized by further comprising a rectangular light mixer having a cross section for mixing and exiting the light emitted from the light exit surface. The method of claim 5,
A light irradiation apparatus for a peripheral exposure apparatus, characterized by further comprising a rectangular light mixer having a cross section for mixing and exiting the light emitted from the light exit surface. The method of claim 6,
A light irradiation apparatus for a peripheral exposure apparatus, characterized by further comprising a rectangular light mixer having a cross section for mixing and exiting the light emitted from the light exit surface. The method of claim 7, wherein
A light irradiation apparatus for a peripheral exposure apparatus, characterized by further comprising a rectangular light mixer having a cross section for mixing and exiting the light emitted from the light exit surface. The method of claim 8,
A light irradiation apparatus for a peripheral exposure apparatus, characterized by further comprising a rectangular light mixer having a cross section for mixing and exiting the light emitted from the light exit surface. The method of claim 9,
A light irradiation apparatus for a peripheral exposure apparatus, characterized by further comprising a rectangular light mixer having a cross section for mixing and exiting the light emitted from the light exit surface. The method of claim 10,
And the light mixer is a glass rod for mixing light emitted from the first region and light emitted from the second region. The method of claim 10,
The light mixer has a first glass rod for mixing light emitted from the first region and a second glass rod for mixing light emitted from the second region. . The method according to claim 1 or 2,
And the light includes at least a wavelength of light acting on the resist layer applied to the object to be irradiated.

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