KR101891717B1 - Light emitting device package and lighting system including the same - Google Patents

Abstract

An embodiment includes a package body; At least one first electrode pattern and a second electrode pattern disposed on the package body; Wherein at least one of the first electrode pattern and the second electrode pattern includes a light emitting element having a width of a maximum pattern and a width of a minimum pattern different from each other, Package.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a light emitting device package,

Embodiments relate to a light emitting device package and an illumination system including the same.

BACKGROUND ART Light emitting devices such as a light emitting diode (LD) or a laser diode using semiconductor materials of Group 3-5 or 2-6 group semiconductors are widely used for various colors such as red, green, blue, and ultraviolet And it is possible to realize white light rays with high efficiency by using fluorescent materials or colors, and it is possible to realize low energy consumption, semi-permanent life time, quick response speed, safety and environment friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps .

Therefore, a transmission module of the optical communication means, a light emitting diode backlight replacing a cold cathode fluorescent lamp (CCFL) constituting a backlight of an LCD (Liquid Crystal Display) display device, a white light emitting element capable of replacing a fluorescent lamp or an incandescent lamp Diode lighting, automotive headlights, and traffic lights.

In the light emitting device package, the first electrode pattern and the second electrode pattern are disposed on the package body, the light emitting device is disposed on the bottom surface of the package body, and the first electrode pattern and the second electrode pattern are electrically connected.

In the case of a light emitting device package in which a light emitting diode emitting ultraviolet rays (UV) is mounted, when the ultraviolet reflected light touches the package body, there is a problem that the reliability of the package deteriorates due to discoloration or alteration of the organic material contained in the body. Therefore, it is necessary to improve the reliability of the light emitting device package while maintaining excellent heat radiation characteristics.

1 is a view showing an arrangement of electrode patterns in a conventional light emitting device package.

The conventional UV light emitting diode that emits ultraviolet rays has a package body composed of a plurality of ceramic layers 110a, 110b, 110c, and 110d, and first electrode patterns 131, 132, 133, and 134 on the bottom surface of the package body The second electrode patterns 141, 142, 143, and 144 are disposed. A plurality of the first electrode patterns 131, 132, 133, and 134 and the second electrode patterns 141, 142, 143, and 144 may be disposed in the light emitting device package, A zener diode may be disposed on the electrode patterns 151 and 152.

However, the conventional light emitting device package has the following problems.

When AgCu or the like is applied to a contact area between silver (Ag) and copper (Cu) as a material of the electrode pattern and a package body of ceramic material, the adhesive force is not strong and separation between the package body and the electrode pattern may occur. The electrode material may be oxidized to cause insulation between the electrodes, and light emitted from the light emitting diode may be partially absorbed from the surface of the electrode pattern, thereby lowering the light efficiency of the light emitting device package.

Embodiments improve light extraction efficiency of a light emitting device package, prevent a short circuit between electrode patterns, and secure the stability of an electrode pattern structure.

An embodiment includes a package body; At least one first electrode pattern and a second electrode pattern disposed on the package body; Wherein at least one of the first electrode pattern and the second electrode pattern includes a light emitting element having a width of a maximum pattern and a width of a minimum pattern different from each other, Package.

The package body may be made of ceramic, and the package body may be exposed on a surface where the first electrode pattern and the second electrode pattern are located.

The light emitting device package may further include a light emitting layer on the exposed package body.

The light-transmitting layer may include a silicone resin.

The package body may comprise a plurality of layers.

The package body has a cavity including a bottom surface and side walls, and the first electrode pattern and the second electrode pattern may be disposed on a bottom surface of the cavity.

A light-transmitting layer is disposed in a cavity or on a cavity, and the light-transmitting layer may include at least one of a silicone resin and a glass.

The light emitting element may be disposed on the first electrode pattern.

A plurality of the first electrode patterns and the second electrode patterns may be disposed, and the light emitting devices may be disposed for each of the first electrode patterns.

Each light emitting element may be wire-bonded to the second electrode.

The second electrode pattern may include an extension pattern.

The package body has a through hole, and the extension pattern can be electrically connected to the through hole.

Another embodiment is a light emitting device package comprising: the light emitting device package described above; A circuit board electrically connected to the first electrode pattern and the second electrode pattern of the light emitting device package; And an optical member for diffusing light transmitted from the light emitting device package.

The light emitting device package according to the embodiment has a strong resistance to oxidation due to the construction of electrodes made of gold and the durability of the electrode is strong and the possibility of short circuit between the electrodes can be reduced and the light reflectance in a short wavelength band such as UV is relatively low The exposed area of the ceramic layer having a relatively high UV light reflectance is increased to improve the light extraction efficiency and the bonding strength between the exposed ceramic substrate and the silicone resin in the molding part is greater, .

1 is a view showing an arrangement of electrode patterns of a conventional light emitting device package,
2 is a view illustrating an embodiment of a light emitting device package,
3A to 3C are views showing the arrangement of the electrode patterns of the light emitting device package of FIG. 2,
Figure 4 is a detailed view of a portion of Figure 3A,
FIG. 5 is a view illustrating a light emitting device disposed in the light emitting device package of FIG. 2,
6 is a view showing an embodiment of a headlamp including a light emitting device package,
7 is a view showing an embodiment of an image display device including a light emitting device package.

Embodiments will now be described with reference to the accompanying drawings.

In the description of the embodiment according to the present invention, in the case of being described as being formed "on or under" of each element, the upper (upper) or lower (lower) or under are all such that two elements are in direct contact with each other or one or more other elements are indirectly formed between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

2 is a view showing an embodiment of a light emitting device package.

In the light emitting device package 100 according to the embodiment, the package body 110 includes a plurality of ceramic layers 110a, 110b, 110c, and 110d. The package body 110 may be implemented using High Temperature Cofired Ceramics (HTCC) or Low Temperature Cofired Ceramics (LTCC) technology.

When the package body 110 is a multilayer ceramic substrate, the thickness of each layer may be the same or different. The package body 110 may be made of an insulating material such as nitride or oxide and may include, for example, SiO ₂ , Si _x O _y , Si ₃ N _y , SiO _x N _y , Al ₂ O _3, or AlN .

The widths of the plurality of ceramic layers 110a, 110b, 110c and 110d may be different from each other and the portions 110a and 110b may constitute the bottom surface of the light emitting device package 100 or the cavity, ) Can form the side wall of the cavity.

The light emitting device 200 is disposed on the bottom surface of the cavity formed of the plurality of ceramic layers 110a, 110b, 110c, and 110d. In the present embodiment, four light emitting devices 200 are disposed, and at least one light emitting device 200 may be disposed.

The light emitting device includes a plurality of compound semiconductor layers, for example, a light emitting diode (LED) using a semiconductor layer of a group III-V element, and the light emitting device includes a colored light emitting device emitting light such as blue, green, Or may be a UV light emitting element that emits UV light.

Since the package body 110 is made of an inorganic ceramic substrate such as LTCC or HTCC, a deep UV LED having a wavelength of about 280 nm or a near UV LED having a wavelength of about 365 to 395 nm Even if the light emitting device 200 including the light emitting device 200 is used, the reliability of the light emitting module can be maintained because there is no risk of the body 110 being discolored or deteriorated by the ultraviolet light emitted from the light emitting device 200.

5 is a view illustrating a light emitting device disposed in the light emitting device package of FIG.

The light emitting device 200 includes a conductive supporting substrate 265 and a reflective layer 255 and an ohmic layer 250 disposed on the supporting substrate 265 and a light emitting structure 230 on the ohmic layer 250 .

The first conductive semiconductor layer 232 may be formed of a semiconductor compound, for example, a compound semiconductor such as a group III-V element or a group II-VI element. The first conductive type dopant may also be doped. When the first conductive semiconductor layer 232 is an n-type semiconductor layer, the first conductive dopant may include Si, Ge, Sn, Se, and Te as an n-type dopant. Or the first conductivity type semiconductor layer 232 is a p-type semiconductor layer, the second conductivity type dopant may be a p-type dopant including, but not limited to, Mg, Zn, Ca, Sr, Ba, .

The first conductive semiconductor layer 232 may be formed only of the first conductive semiconductor layer, or may include an undoped semiconductor layer below the first conductive semiconductor layer. However, the present invention is not limited thereto.

The non-conductive semiconductor layer is formed to improve the crystallinity of the first conductive type semiconductor layer, and the non-conductive semiconductor layer has a lower electrical conductivity than the first conductive type semiconductor layer without doping the n-type dopant. And may be the same as the first conductive type semiconductor layer.

In the active layer 234, electrons injected through the first conductive type semiconductor layer 232 and holes injected through the second conductive type semiconductor layer 236 formed thereafter mutually meet to form an energy band unique to the active layer Is a layer that emits light having energy determined by the energy.

The active layer 234 may be formed of at least one of a single well structure, a multi-well structure, a quantum-wire structure, or a quantum dot structure. For example, the active layer 224 may be formed of a multiple quantum well structure by injecting trimethyl gallium gas (TMGa), ammonia gas (NH ₃ ), nitrogen gas (N ₂ ), and trimethyl indium gas (TMIn) But is not limited thereto.

The well layer / barrier layer of the active layer 234 may be formed of any one or more pairs of InGaN / GaN, InGaN / InGaN, GaN / AlGaN, InAlGaN / GaN, GaAs (InGaAs) / AlGaAs, GaP (InGaP) But are not limited thereto. The well layer may be formed of a material having a band gap lower than the band gap of the barrier layer.

A conductive clad layer (not shown) may be formed on and / or below the active layer 234. The conductive clad layer may be formed of a semiconductor having a band gap wider than the band gap of the barrier layer of the active layer. For example, the conductive clad layer may comprise GaN, AlGaN, InAlGaN or a superlattice structure. Further, the conductive clad layer may be doped with n-type or p-type.

The second conductive semiconductor layer 236 may be formed on the active layer 234.

The second conductive semiconductor layer 236 may be formed of a semiconductor compound, for example, a group III-V compound semiconductor doped with a second conductive dopant. The second conductivity type semiconductor layer 236 has a composition formula of In _x Al _y Ga _{1 -x- y} N (0? X? 1, 0? _Y? 1, 0? _X + y? 1) Semiconductor material. When the second conductive semiconductor layer 236 is a p-type semiconductor layer, the second conductive dopant may include Mg, Zn, Ca, Sr, and Ba as p-type dopants. When the second conductive semiconductor layer 236 is an n-type semiconductor layer, the first conductive dopant may include Si, Ge, Sn, Se, and Te as an n-type dopant.

Here, the first conductive semiconductor layer 232 may include a p-type semiconductor layer and the second conductive semiconductor layer 236 may include an n-type semiconductor layer. Also, a third conductive semiconductor layer (not shown) including an n-type or p-type semiconductor layer may be formed on the first conductive semiconductor layer 232. Accordingly, np, pn, npn, and pnp junction structures.

In addition, the doping concentrations of the conductive dopants in the first conductivity type semiconductor layer 232 and the second conductivity type semiconductor layer 236 may be uniform or non-uniform. That is, the structure of the plurality of semiconductor layers may be variously formed, but is not limited thereto.

The conductive supporting substrate 265 supports the light emitting structure 230 and may be a conductive substrate. Further, it can be formed of a material having high electrical conductivity and high thermal conductivity. For example, the conductive supporting substrate 265 is a base substrate having a predetermined thickness and is made of molybdenum (Mo), silicon (Si), tungsten (W), copper (Cu) (Au), copper alloy (Cu Alloy), nickel (Ni), copper-tungsten (Cu-W), carrier wafers (e.g., GaN, Si a, Ge, GaAs, ZnO, SiGe , SiC, SiGe, Ga 2 O 3 , etc.) or a conductive sheet or the like may optionally be included.

The ohmic layer 250 may be formed in contact with the second conductive semiconductor layer 236 of the light emitting structure 230. The second conductive semiconductor layer 236 may have a low impurity doping concentration and may have a high contact resistance, which may result in poor ohmic characteristics with the metal. Therefore, the ohmic layer 250 should be formed to improve such ohmic characteristics It is not.

The ohmic layer 250 may be formed of a transparent conductive layer and a metal. For example, ITO (indium tin oxide), IZO (indium zinc oxide), IZTO (indium zinc tin oxide), IAZO oxide, IGZO, IGTO, aluminum zinc oxide, ATO, GZO, IZO, AZZO, NiO, IrOx / Au, or Ni / IrOx / Au / ITO, Ag, Ni, Cr, Ti, Al, Rh , Pd, Ir, Sn, In, Ru, Mg, Zn, Pt, Au, and Hf.

A reflective layer 255 may be disposed under the ohmic layer 250. The reflective layer 255 may be formed of a material consisting of, for example, Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, IZO, IZTO, IAZO, IGZO, IGTO, AZO, ATO, or the like. Further, the reflective layer 260 can be laminated with IZO / Ni, AZO / Ag, IZO / Ag / Ni, AZO / Ag / When the reflective layer 255 is formed of a material that is in ohmic contact with the light emitting structure (for example, the second conductivity type semiconductor layer 236), the ohmic layer 250 may not be formed separately, but the present invention is not limited thereto.

The reflective layer 255 effectively reflects light generated from the active layer 234, thereby greatly improving light extraction efficiency and total reflection efficiency of the light emitting device.

A bonding layer 260 may be formed between the reflective layer 255 and the supporting substrate 265. The bonding layer 260 includes a barrier metal or a bonding metal and may include at least one of Ti, Au, Sn, Ni, Cr, Ga, In, Bi, Cu, Ag, It is not limited thereto.

A passivation layer 290 may be formed on at least a portion of the side surface of the light emitting structure 230 and the first conductive semiconductor layer 232.

The passivation layer 290 may be made of an insulating material, and the insulating material is made of a non-conductive oxide or nitride to protect the light emitting structure. As an example, the passivation layer may comprise a silicon oxide (SiO ₂ ) layer, an oxynitride layer, and an aluminum oxide layer.

The first electrode pad 280 may be disposed on the first conductivity type semiconductor layer 232. The first electrode pad 280 may be formed of a metal such as aluminum (Al), titanium (Ti), chromium (Cr), nickel (Ni) (Au), and may have a single-layer structure or a multi-layer structure.

Each of the light emitting devices 200 may be directly connected to the first electrode pattern 130 and may be connected to the second electrode pattern 140 through a wire 160.

The light-transmitting layer 160 may be formed to surround the light-emitting device 200 to protect the light-emitting device 200 from foreign substances or moisture that are introduced from the outside.

The light-transmitting layer 160 may be formed so as to fill the cavity formed in the package body 110 or up to the interior of the cavity, and the upper surface of the light-transmitting layer 160 may be flat. However, It can also play a role.

When the light emitting device 200 is a UV LED, the light transmitting layer 160 may be made of a material that is not discolored or deteriorated by ultraviolet light. The light transmitting layer 160 may include a silicone resin and a glass or a fluorescent material 170 to change the wavelength of light emitted from the light emitting device 200.

The light of the first wavelength range emitted from the light emitting device 200 is excited by the phosphor 170 and is converted into the light of the second wavelength range which is longer wavelength and the light of the second wavelength range is transmitted through the lens (not shown) The light path can change as it passes.

The first electrode 130 and the second electrode 140 are electrically connected to each other through a via hole type connection electrode 121a and 122a formed in the package body 110, And are electrically connected to the frame 105a and the second lead frame 105b, respectively.

The first electrode pattern 130 or the second electrode pattern 140 may be made of gold (Au), silver (Ag), or aluminum (Al). If the electrode pattern is made of gold, The possibility of short circuit between the electrode patterns can be reduced.

FIGS. 3A to 3C are views showing electrode pattern arrangements of the light emitting device package of FIG. 2, and FIG. 4 is a detailed view of a portion of FIG. 3A.

3A, the four first electrode patterns 131, 132, 133, and 134 and the second electrode patterns 141, 142, and 143 are formed in the light emitting device package 100 of FIG. And 144, respectively. Since the four first electrode patterns 131, 132, 133, and 134 may have the same polarity to each other, they may be connected to one lead frame, and the four electrode patterns 131, 132, 133, And may be connected to another lead frame since they may be the same polarity.

In the top view of FIG. 3A, the ceramic layers 110c and 110d forming the sidewalls of the cavity are shown on the outside, and the ceramic layer 110b forming the bottom surface of the cavity is exposed at the center. In the top view of Fig. 3, the width c of the ceramic layer 110d disposed at the uppermost position in Fig. 2 is the widest, and the width b of the ceramic layer 110c located at the second position is narrower, Only the narrowest width a of the ceramic layer 110b constituting the bottom surface of the cavity is shown.

The arrangement of the first electrode patterns 131, 132, 133 and 134 and the second electrode patterns 141, 142, 143 and 144 is symmetric with respect to the center of the ceramic layer 110b constituting the bottom surface of the cavity Can be achieved. Hereinafter, a part of the electrode pattern structure will be described in detail with reference to FIG.

The first electrode pattern 131 is disposed in the center region of the bottom surface of the cavity and the second electrode pattern 132 is disposed in the edge region on the bottom surface of the cavity. The arrangement of the first electrode pattern 131 and the second electrode pattern 132 may be reversed.

The second electrode pattern 141 is arranged so that the width f of the side is narrower than the width e of the edge. The ceramic layer 110b is exposed in the region d in which the width of the side of the second electrode pattern 141 is narrow. That is, the second electrode pattern 141 may have a width of a maximum pattern and a width of a minimum pattern different from each other. This arrangement increases the area of the light emitted from the light emitting device to be reflected by the ceramic layer 110b, The light efficiency of the package can be improved.

The area of contact of the exposed ceramic layer 110b with the light-transmitting layer also increases. The bonding strength between the ceramic layer 110b and the silicone resin in the light-transmitting layer, rather than the bonding force between the second electrode pattern 141 made of metal and the light- The stability within the structure of the light emitting device package can be increased.

A protrusion p may be formed at the edge of the second electrode pattern 141. Hole type connecting electrode is disposed in the ceramic layer 110b forming the package body corresponding to the protrusion p so that the first electrode pattern 141 can be connected to the lead frame, ). ≪ / RTI > The protrusions p to the extension patterns may be electrically connected to the through holes formed in the package body and electrically connected to the lead frame or the like under the package body.

In FIG. 3B, the first electrode patterns 131 to 134 are patterned to form a narrow region d of the electrode pattern, and the first electrode patterns 131 to 134 are narrowly arranged d, the ceramic layer 110b is exposed. That is, the area where the first electrode patterns 131 to 134 are narrowly disposed increases the area reflected by the ceramic layer 110b, thereby improving the light efficiency of the light emitting device package.

In FIG. 3C, the first electrode patterns 131 to 134 are patterned to form a region d in which the electrode pattern is narrowly arranged in the edge region, and the effect is the same as that described in FIG. 3B.

3A to 3C, the structure in which the electrode pattern is narrowly formed to expose the ceramic layer may be implemented in at least one of the four first electrode patterns 131 to 134 and the second electrode patterns 141 to 144, respectively. have.

In Fig. 4, when the width f of the side of the second electrode pattern 141 is 0.35 millimeters, the edge width e may be 0.45 millimeters. The width between the second electrode pattern 141 and the first electrode pattern 131 may be 0.1 millimeter and the width g of the second electrode pattern 141 may be 0.45 Millimeter.

A plurality of light emitting device packages according to embodiments may be arranged on a substrate, and a light guide plate, a prism sheet, a diffusion sheet, and the like may be disposed on the light path of the light emitting device package. Such a light emitting device package, a substrate, and an optical member can function as a light unit. Still another embodiment may be implemented as a display device, an indicating device, a lighting system including the semiconductor light emitting device or the light emitting device package described in the above embodiments, for example, the lighting system may include a lamp, a streetlight . Hereinafter, a head lamp and a backlight unit will be described as an embodiment of an illumination system in which the above-described light emitting device package is disposed.

6 is a view showing an embodiment of a headlamp including a light emitting device package.

The light generated by the light source module 401 is reflected by the reflector 420 and the shade 430 and the light generated by the light source module 401 and the light reflected by the reflector 420 are refracted by the lens 440 It can be directed to the front of the vehicle body.

The light source module 401 may be a light source module according to the above-described embodiments and includes a light emitting device package on a circuit board.

In the light emitting device package in the light source module disposed in the head lamp, since the electrode pattern is formed of gold, the durability of the electrode pattern is strong and the area of the electrode pattern is reduced to increase the exposed area of the ceramic layer, And the bonding strength with the silicone resin or the like in the light-transmitting layer is greater, and the stability of the structure is improved.

7 is a view showing an embodiment of an image display device including a light emitting device package.

The image display device 800 according to the embodiment includes the light source modules 830 and 835, the reflection plate 820 on the bottom cover 810 and the light source module 820 disposed in front of the reflection plate 820, A first prism sheet 850 and a second prism sheet 860 disposed in front of the light guide plate 840 and a second prism sheet 860 disposed in front of the second prism sheet 860, And a color filter 880 disposed in the first half of the panel 870. The color filter 880 includes a plurality of color filters 880,

The light source module includes the light emitting device package 835 described above on the circuit board 830. [ Here, a PCB or the like may be used for the circuit board 830, and the light emitting device package 835 is as described in the above embodiments.

The bottom cover 810 may house the components in the display device 800. The reflection plate 820 may be formed as a separate component as shown in the drawing, or may be formed to be coated on the rear surface of the light guide plate 840 or on the front surface of the bottom cover 810 with a highly reflective material Do.

Here, the reflection plate 820 can be made of a material having a high reflectance and can be used in an ultra-thin shape, and polyethylene terephthalate (PET) can be used.

The light guide plate 840 scatters light emitted from the light emitting device package module so that the light is uniformly distributed over the entire screen area of the LCD. Accordingly, the light guide plate 830 is made of a material having a good refractive index and transmittance. The light guide plate 830 may be formed of polymethyl methacrylate (PMMA), polycarbonate (PC), or polyethylene (PE). An air guide system is also available in which the light guide plate is omitted and light is transmitted in a space above the reflective sheet 820.

The first prism sheet 850 is formed on one side of the support film with a transparent and elastic polymeric material, and the polymer may have a prism layer in which a plurality of steric structures are repeatedly formed. As shown in the drawings, the plurality of patterns may be repeatedly provided with a stripe pattern.

In the second prism sheet 860, the edges and the valleys on one surface of the support film may be perpendicular to the edges and the valleys on one surface of the support film in the first prism sheet 850. This is to disperse the light transmitted from the light source module and the reflection sheet evenly in all directions of the panel 870.

In the present embodiment, the first prism sheet 850 and the second prism sheet 860 form an optical sheet, which may be formed of other combinations, for example, a microlens array or a diffusion sheet and a microlens array Or a combination of one prism sheet and a microlens array, or the like.

A liquid crystal display (LCD) panel may be disposed on the panel 870. In addition to the liquid crystal display panel 860, other types of display devices requiring a light source may be provided.

In the panel 870, the liquid crystal is positioned between the glass bodies, and the polarizing plate is placed on both glass bodies to utilize the polarization of light. Here, the liquid crystal has an intermediate property between a liquid and a solid, and liquid crystals, which are organic molecules having fluidity like a liquid, are regularly arranged like crystals. The liquid crystal has a structure in which the molecular arrangement is changed by an external electric field And displays an image.

A liquid crystal display panel used in a video display device is an active matrix type, and a transistor is used as a switch for adjusting a voltage supplied to each pixel.

A color filter 880 is provided on the front surface of the panel 870 so that light projected from the panel 870 transmits only red, green, and blue light for each pixel.

The light emitting device package disposed in the image display device has an electrode pattern formed of gold, and the durability of the electrode pattern is strong, the area of the electrode pattern is reduced, and the exposed area of the ceramic layer is increased. Thus, the light efficiency is improved, The bonding force with the silicone resin or the like in the layer is greater and the stability of the structure is improved.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, This is possible.

Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined by the equivalents of the claims, as well as the claims.

100: light emitting device package 105a, 105b: lead frame
110: ceramic substrate 110a, 110b, 110c, 110d: ceramic layer
121a, 122a: connecting electrode
130, 131, 132, 133, 134: a first electrode pattern
140, 141, 142, 143, 144: a second electrode pattern
160: Transparent layer 170: Phosphor
200: light emitting element 400: head lamp
410: light emitting device module 420: reflector
430: Shade 440: Lens
800: Display device 810: Bottom cover
820: reflector 830: circuit board module
840: light guide plate 850, 860: first and second prism sheets
870: Panel 880: Color filter

Claims (13)

A package body having a cavity, the package body including a plurality of ceramic layers;
At least one first electrode pattern and a second electrode pattern disposed on the package body;
And a light emitting element electrically connected to the first electrode pattern and the second electrode pattern and disposed on a bottom surface of the cavity,
At least one of the first electrode pattern and the second electrode pattern on the bottom surface of the cavity has a width of a maximum pattern and a width of a minimum pattern,
Wherein the plurality of ceramic layers are each formed with a through hole, the plurality of ceramic layers forming a bottom surface of the cavity, and the other of the ceramic layers forming a side wall of the cavity, and the inner surface of the ceramic layers constituting the side wall Forming a step,
Wherein the first electrode pattern is disposed in a central region of a bottom surface of the cavity, the second electrode pattern is disposed in an edge region of a bottom surface of the cavity,
The ceramic layer is exposed in a region where the width of the second electrode pattern is smaller than the edge width and the width of the side of the second electrode pattern is small,
A protrusion is formed from the edge of the second electrode pattern, and the protrusion is electrically connected to the through hole. delete The method according to claim 1,
And a light transmitting layer disposed on the exposed package body and made of a silicone resin. delete 4. The method according to any one of claims 1 to 3,
And the light emitting element is disposed on the first electrode pattern. 6. The method of claim 5,
Wherein a plurality of the first electrode patterns and the second electrode patterns are disposed, and the light emitting elements are disposed for each of the first electrode patterns. The method according to claim 6,
And each of the light emitting devices is wire-bonded to the second electrode pattern. delete delete The method according to claim 1,
And the through holes formed in the respective ceramic layers are not overlapped in the vertical direction. delete delete delete

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