KR101600510B1 - Pocket-typed electric contact terminal capable for surface mounting with reflow soldering process - Google Patents

Abstract

Heat-resistant rubber core in which an inlet portion is formed along the longitudinal direction and a storage space communicating with the inlet portion is formed therein; And a heat-resistant polymer film having an inner surface bonded to the core so as to surround the core and having a solderable metal layer formed on the outer surface thereof, wherein the upper surface of the core forms a pickup surface capable of vacuum pick-up, Wherein the solder is soldered to the circuit board and the metal layer constituting the boundary between the inlet and the storage space are in contact with each other or spaced apart at regular intervals. A pocket-like electrical contact terminal is disclosed.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a pocket-type electric contact terminal capable of surface mounting by reflow soldering,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical contact terminal, and more particularly to a pocket type electrical contact terminal that is surface mountable by reflow soldering on an upper surface of a circuit board and is electrically connected to an object to be coupled at a lower surface of the circuit board.

BACKGROUND ART [0002] Resilient electrical contact terminals provided with resilient heat-resistant rubber cores in which holes made of rubber are formed by electrical contact terminals capable of reflow soldering are applied to various electric appliances.

For example, Korean Patent No. 1001354 filed by the present applicant discloses a heat-resistant rubber core having an elastic insulating hole with a tubular shape, an insulated heat-resistant rubber adhesive bonded around an elastic heat-resistant rubber core having an insulating elastic hole, And a heat-resistant polymer film having one surface bonded to an insulative heat-resistant rubber adhesive so as to wrap the insulative heat-resistant rubber adhesive and a metal layer capable of being soldered on the other surface integrally formed.

According to the electrical contact terminal of the above patent, there is an advantage that the outer surface is made of a metal layer which can be soldered, and the electrical conductivity is good and soldering is possible. The electric contact terminal is electrically connected to the circuit board by reflow- It plays a role.

In recent years, electronic devices and electronic apparatuses have a compact, slim profile or various shapes. Therefore, various structures for eliminating unnecessary electromagnetic waves have been proposed. For example, a shield case is installed on the top surface of a circuit board It is possible to consider removing unnecessary electromagnetic waves through the underside of the circuit board which is not complicated by removing the electromagnetic wave from the conventional method.

As such, it is possible to mass-produce an electrically conductive object located on the lower surface of the circuit board and electrically connect the conductive pattern located on the upper surface of the circuit board, and a competitive electric contact terminal is required.

Accordingly, it is an object of the present invention to provide a pocket type electrical contact terminal capable of surface mounting by reflow soldering which can electrically connect an electrically conductive object located on a lower surface of a circuit board to a circuit pattern formed on an upper surface of a circuit board.

Another object of the present invention is to provide a pocket type electrical contact terminal capable of surface mounting by reflow soldering with a low material cost.

Another object of the present invention is to provide a pocket type electrical contact terminal capable of surface mounting which can be electrically connected to an electrically conductive object through both the top surface and the bottom surface.

Another object of the present invention is to provide an electromagnetic wave removing device using a pocket-like electrical contact terminal.

The above object is achieved by an elastic heat-resistant rubber core in which an inlet portion is formed along a longitudinal direction on a lower surface and a storage space communicating with the inlet portion is formed therein; And a heat-resistant polymer film having an inner surface bonded to the core so as to surround the core and having a solderable metal layer formed on the outer surface thereof, wherein the upper surface of the core forms a pickup surface capable of vacuum pick-up, Wherein the solder is soldered to the circuit board and the metal layer constituting the boundary between the inlet and the storage space are in contact with each other or spaced apart at regular intervals. Is achieved by means of a pocket-like electrical contact as far as possible.

The above object is achieved by an elastic heat-resistant rubber core in which an inlet portion is formed along a longitudinal direction on a lower surface and a storage space communicating with the inlet portion is formed therein; And a heat-resistant polymer film having an inner surface bonded to the core so as to surround the core and having a solderable metal layer formed on the outer surface thereof, wherein the upper surface of the core forms a pickup surface capable of vacuum pick-up, Characterized in that a soldering portion to be soldered to a circuit board is formed on the lower surface of the housing, and the inlet portion and the housing space are defined by elastic contact portions protruding from both side walls of the inlet portion. Is achieved by a contact terminal

The above object is also achieved by an elastic heat-resistant rubber core having a cushioning hole formed along a longitudinal direction thereof; And a heat-resistant polymer film having an inner surface continuously bonded to the entire lower surface of the core and having a metal layer formed on an outer surface thereof. The upper surface of the core forms a pickup surface capable of vacuum pick-up, Type electrical contact terminal capable of surface mounting by reflow soldering, wherein the buffer hole is formed in an upper portion adjacent to the accommodating space.

The above object is achieved by the above-mentioned electric contact terminal; And an electrically conductive member composed of a base plate and contact pins protruding from the base plate. In a state where the electrical contact terminals are soldered and fixed to the circuit pattern of the circuit board, And the contact pin is inserted into the accommodating space through the hole so that the electrical contact terminal and the contact pin are electrically connected to each other.

Preferably, the portion of the metal layer is in electrical contact with and in electrical contact with the electrically conductive member interposed therebetween, and the pressing is formed by the resilient restoring force of the core.

Preferably, a buffer hole may be formed in the core so as to penetrate the inlet and the accommodating space in the longitudinal direction.

Preferably, both side walls of the inlet portion may extend vertically from the soldering portion.

Preferably, both ends of the resilient contact portion contact each other or are spaced apart at a minute interval, and the thickness of the resilient contact portion may become thinner toward the end portion.

Preferably, the thickness of the portion between the top surface of the core and the buffer hole may be thicker than the thickness of the portion between the bottom surface of the storage space and the buffer hole.

According to the above-described configuration, it is possible to efficiently and electrically connect to an electrically conductive object located on a lower surface of a circuit board in an electric device or an electronic device having a compact, slim profile or various external shapes.

In addition, the material cost can be reduced by bonding a polymer film having a metal layer only to a part including the lower surface of the core.

In addition, it is possible to prevent the lead rising from the solder to the core storage space during soldering.

Further, the contact pin can be pressed by the resilient restoring force of the core to increase the contact force to reduce the contact resistance, and the contact area between the contact pin and the metal layer of the polymer film can be widened to reduce the contact resistance.

1 is a perspective view showing a pocket type electrical contact terminal according to an embodiment of the present invention.
2 is a front view.
Fig. 3 shows an electromagnetic wave removing apparatus to which a pocket-type electrical contact terminal is applied.
Fig. 4 shows the state before the electromagnetic wave canceller is coupled.
5 shows a state after the electromagnetic wave removing device is coupled.
6 is a modification of the pocket-like electrical contact terminal of Fig.
7 is a perspective view and a front view showing a pocket type electrical contact terminal according to another embodiment of the present invention.
8 is a perspective view and a front view showing a pocket type electrical contact terminal according to another embodiment of the present invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view showing a pocket-type electrical contact terminal according to an embodiment of the present invention, and FIG. 2 is a front view.

The pocket type electrical contact terminal 100 is composed of a core 110 having elasticity and a heat resistant polymer film 120 bonded to surround the core 110. As shown in the original drawing of FIG. 2, A metal layer 140 capable of being soldered is formed on the outer surface of the core 110, and the opposite surface is bonded to the core 110 via the adhesive layer 130.

Hereinafter, each configuration of the electrical contact terminal 100 will be described in detail.

<Core 110>

The core 110 has elasticity and can be insulative.

1, a horizontal flat surface 112 for vacuum pick-up is formed on the upper surface of the core 110, and a contact pin 112, which extends from the soldering portion 113 at a central portion, An inlet portion 111 to be fitted is formed.

The inlet portion 111 is continuously formed along the longitudinal direction of the core 110 and the contact portion 110a of the core 110 is compressed by the contact pin and the contact portion 110a is contacted And serves to press the pin.

Since the inlet portion 111 is formed continuously along the longitudinal direction of the core 110, the soldering portions 113 on both sides of the inlet portion 110 serve as legs and are soldered to the circuit board as described later.

A housing space 115 communicating with the inlet part 111 is formed in the core 110, and serves to accommodate the end of the contact pin, which will be described later. Therefore, the portions of the metal layer 140 constituting the boundary between the inlet portion 111 and the storage space 115 are in contact with each other or are spaced apart at regular intervals, and as described later, by the contact fit of the electrically conductive member with the contact pin They are electrically connected with elasticity.

The lower surface of the soldering portion 113 is a portion directly in contact with the circuit board, and may be formed to be inclined inwardly as in this embodiment, or otherwise formed flat.

The cross-sectional shape of the core 110 is not particularly limited. In this embodiment, the cross-sectional shape of the core 110 includes a roughly flat rectangular shape including the pickup face 112 and the inlet portion 111.

The material of the core 110 may be a non-foaming heat-resisting elastic rubber having heat resistance and elasticity for reflow soldering, for example, silicone rubber, and may have a hardness of Shore A 40 to 70 for proper mechanical strength and elasticity .

<Adhesive Layer (130)>

The adhesive layer 130 is positioned between the core 110 and the surface of the polymer film 120 to reliably adhere the core 110 and the polymer film 120 and maintain the adhesive force and elasticity even before and after soldering.

The adhesive layer 130 is made of rubber having heat resistance. For example, the liquid silicone rubber may be formed by thermosetting. The liquid silicone rubber has adhesion with the opposed object while being cured. The adhesive layer 130 is formed of a solid heat- After curing, it maintains its elasticity and maintains its adhesion even when it is heated again.

&Lt; Polymer film (120) >

The polymer film 120 may be, for example, a polyimide (PI) film having good heat resistance or other heat resistant polymer film.

A solderable metal layer 140 is integrally formed on the outer surface of the polymer film 120, that is, the exposed surface. For example, the solderable metal layer 140 may be formed by sputtering a metal over the polymer film 120 to have strong adhesion with the polymer film 120, good electrical conductivity, and strong soldering strength, It can be constructed by plating tin.

Further, tin or gold-plated copper foil may be formed on the polyimide film to improve electrical conductivity or solder bonding strength, or tin or gold-plated copper foil may be bonded on the polyimide film through an adhesive.

A heat-resistant polymer film 120 having a solderable metal layer 140 may be used, for example, a one-sided flexible laminated metal plate (FCCL).

 In this embodiment, the polymer film 120 is bonded to the core 110 to enhance the manufacturing efficiency. In particular, in the manufacturing space, the polymer film 120 is partially adhered to the core 110 .

In addition, in this embodiment, both ends of the polymer film 120 are spaced apart from each other in the storage space 115, so that the workability is good and the material can be saved. However, the present invention is not limited to this, can do.

On the other hand, unlike in this embodiment, the polymer film 120 is continuously bonded only to the lower surface of the core 110, thereby reducing the material cost. Here, 'bottom' refers to a portion substantially involved in soldering when the electrical contact terminal 100 is soldered to a circuit board.

Fig. 3 shows an electromagnetic wave removing apparatus to which a pocket-type electrical contact terminal is applied.

A circuit pattern 14, for example, a ground pattern is formed on the circuit board 10 on which the pocket-type electrical contact terminal 100 is mounted, and a through hole 12, for example, a via hole is formed therebetween.

Here, the shape of the circuit pattern 14 and the shape of the through hole 12 are arbitrarily formed for convenience of description, and may be formed in various shapes and sizes.

The electrically conductive member 20 located on the lower surface of the circuit board 10 is composed of the base plate 22 and the contact pins 24 protruding therefrom.

Hereinafter, the combination and operation of the electromagnetic wave removing apparatus to which the pocket-type electrical contact terminal 100 of the present invention is applied will be described.

FIG. 4 shows the state before the electromagnetic wave removing device is coupled, and FIG. 5 shows the state after the electromagnetic wave removing device is coupled.

The soldering portion 113 of each of the plurality of electrical contact terminals 100 is placed on the solder 16 applied on the circuit pattern 14 of the circuit board 10 and the circuit board 10 is put into the oven, The reflow soldering process proceeds according to the conditions.

As a result, a circuit board 10 is provided in which a plurality of electrical contact terminals 100 are mounted by soldering, and an electrically conductive member 20 is provided from the lower surface of the circuit board 10.

The contact pin 24 is lifted up through the through hole 12 of the circuit board 10 and reaches the core 110 through the inlet portion 111 of the electrical contact terminal 100 Lt; / RTI &gt;

The upper end of the contact pin 24 pushes both the contact portions 110a of the core 110 into the accommodating space 115 while pushing the contact portions 110a in the direction of the arrow as shown in FIG. .

As a result, the contact portion 110a of the core 110 is pressed against both sides of the contact pin 24 by the resilient restoring force of the core 110, and the contact portion 122 of the polymer film 120 is contacted And contacts both sides of the pin 24.

Thereafter, when the electric conductive member 20 is prevented from rising by the lower surface of the circuit board 10, the connection is completed in the state shown in Fig.

In this state, an electrical path is formed through the circuit pattern 14 of the circuit board 10 - the solder 16 - the metal layer 140 of the polymer film 120 - the contact pin 24 - the base plate 22 And the base plate 22 are grounded, as a result, a plurality of circuit patterns 12 on the circuit board 10 can be commonly connected to the ground.

Therefore, electromagnetic waves can be effectively removed by using a lower surface of a circuit board having a relatively less complicated structure in an electric apparatus or an electronic apparatus having a compact and slim contour.

On the other hand, it is also possible to electrically connect the upper surface of the electrical contact terminal 100 by electrically contacting an object, such as a shield case, with the electromagnetic contact surface using the lower surface of the circuit board.

6 is a modification of the pocket-like electrical contact terminal of Fig.

As shown in the figure, a cushioning hole 116 is formed in the core 110 adjacent to the inlet 111 and the receiving space 115 of the core 110 so as to penetrate through the longitudinal direction.

As a result, there is an advantage that the contact portion 110a of the core 110 is smoothly and smoothly pushed into the core 110 by the small force of the contact pin 24 by the buffer hole 116. [

It goes without saying that the distance that the buffer hole 116 is adjacent to the inlet portion 111 of the core 110 and the storage space 115 can be appropriately adjusted.

7 is a perspective view and a front view showing a pocket type electrical contact terminal according to another embodiment of the present invention.

According to this embodiment, both side walls of the inlet portion 211 extend substantially vertically from the soldering portion 213, and the inlet portion 211 is formed to be wider. The inlet portion 211 and the storage space 215 are formed by the elastic contact portions 211, (Not shown).

The elastic contact portion 214 protrudes integrally from both side walls of the inlet portion 211. The elastic contact portion 214 may have a cross-sectional shape in which both ends thereof contact each other or are spaced apart at a minute interval and become thinner toward the end portion as shown in FIG. 7 (b) .

As described above, the polymer film 220 can be separated from the core 210 without being adhered in the normal receiving space 215 of the manufacturing process.

According to this embodiment, when the contact pin 24 having a width corresponding to the width of the inlet portion 211 is fitted through the inlet portion 211, the upper end of the contact pin 24 enters the storage space 215 The elastic contact portion 214 of the core 210 is pushed up and the elastic contact portion 214 is maintained in a bent state.

As a result, since the elastic contact portion 214 is in contact with both sides of the contact pin 24 in the pressed state, the circuit pattern 14 of the circuit board 10 as described above is contacted with the metal layer of the polymer film 220, Is electrically connected to the electrically conductive member (20) through the through hole (24).

According to this embodiment, since the both side walls of the inlet portion 211 are perpendicular to each other, it is possible to control the rise of the solder during the soldering, and the deformation of the elastic contact portion 214, (24) can be inserted, so that insertion is easy.

8 is a perspective view and a front view showing a pocket type electrical contact terminal according to another embodiment of the present invention.

Unlike the embodiment, a single receiving space 315 is formed without forming a separate entrance part.

A cushioning hole 317 penetrating in the longitudinal direction is formed in the core 310 at the upper part of the accommodating space 315. The cross sectional shape of the cushioning hole 317 is not particularly limited and in this embodiment, Shape.

The buffer hole 317 is formed on the upper portion adjacent to the storage space 315 so that the thickness of the portion 318 between the pickup surface 312 and the buffer hole 317 is smaller than the thickness of the bottom surface of the storage space 315 and the buffer hole 317 The thickness of the portion 316 between the adjacent portions 316 is larger than the thickness of the portion 316 between the adjacent portions. That is, the thickness of the portion 318 between the pickup surface 312 and the buffer hole 317 is desirably formed to such an extent as to sufficiently accommodate pickup during vacuum pick-up by the pickup device, The thickness of the portion 316 between the buffer hole 317 and the buffer hole 317 is preferably such that the bottom surface of the storage space 315 is smoothly moved up and down by contact with the contact pin 24.

The polymer film 320 is continuously bonded over the entire lower surface of the core 310. [ As described above, 'bottom' is a portion substantially involved in soldering when the electrical contact terminal 300 is soldered to the circuit board.

The contact pin 24 rises and pushes up the bottom surface of the housing 315 in contact with the bottom surface of the receiving space 315. As described above, the bottom surface of the receiving space 315 and the bottom surface of the core 310 The thickness of the portion 316 between the buffer holes 317 is thin so that the portion 316 is pressed by the contact pin 24 and pushed into the buffer hole 317.

According to this embodiment, since the metal layer of the polymer film 320 adhered to the both side surfaces and the bottom surface of the storage space 315 is in contact with the contact pin 24 and is electrically connected thereto, There is an advantage that the contact resistance is reduced.

An electrical path is formed through the circuit pattern 14 of the circuit board 10-the metal layer-contact pin 24 of the polymer film 32-the base plate 22 and the base plate 22 is grounded So that a plurality of circuit patterns 12 on the circuit board 10 can be commonly connected to the ground.

While the present invention has been particularly shown and described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. Such changes and modifications are intended to fall within the scope of the present invention unless they depart from the scope of the present invention. The scope of the present invention should be determined by the following claims.

100, 200, 300: pocket type electrical contact terminal
110, 210, 310: core
111 and 211:
112, 212, 312: pickup surface
113, 213, 313: soldering portion
115, 215, 315: storage space
120, 220, 320: polymer film
130: Adhesive layer
140: metal layer

Claims (10)

And an accommodating space for accommodating an end of the contact pin is formed in the inside of the elastic heat-resistant rubber core. And
And a heat-resistant polymer film having an inner surface bonded to the core so as to surround the core and a metal layer capable of being soldered on the outer surface,
Wherein a top surface of the core forms a pickup surface capable of vacuum pick-up, a bottom surface of the core at both sides of the inlet portion forms a soldering portion to be soldered to a circuit board,
Wherein the metal layer is in contact with or spaced apart from a boundary portion between the inlet portion and the storage space,
Wherein the metal layer is in electrical contact with the contact pin by being in press contact with the contact pin at the boundary portion. delete The method according to claim 1,
Wherein the pressing is formed by an elastic restoring force of the core. The method according to claim 1,
Further comprising a buffer hole formed in the core so as to penetrate through the core and adjacent the inlet and the accommodating space in the longitudinal direction. Heat-resistant rubber core in which an inlet portion is formed along the longitudinal direction and a storage space communicating with the inlet portion is formed therein; And
And a heat-resistant polymer film having an inner surface bonded to the core so as to surround the core and a metal layer capable of being soldered on the outer surface,
Wherein a top surface of the core forms a pickup surface capable of vacuum pick-up, a bottom surface of the core at both sides of the inlet portion forms a soldering portion to be soldered to a circuit board,
Wherein the inlet portion and the accommodation space are defined by elastic contact portions protruded from both side walls of the inlet portion. The method of claim 5,
And both side walls of the inlet portion extend vertically from the soldering portion. &Lt; Desc / Clms Page number 20 &gt; The method of claim 5,
Wherein the resilient contact portion has both ends thereof contacting each other at a small interval, and the thickness of the resilient contact portion gradually becoming thinner toward an end portion thereof, wherein the resilient contact portion is surface-mountable by reflow soldering. delete delete An electrically conductive member composed of a base plate and contact pins protruding from the base plate; And
An elastic heat-resistant rubber core having an inlet portion formed at a lower surface thereof along the longitudinal direction with the contact pin inserted therein and having a storage space communicating with the inlet portion for receiving an end portion of the contact pin, And an electrical contact terminal made of a heat resistant polymer film adhered to the core and having a metal layer capable of being soldered on the outer surface,
Wherein a top surface of the core forms a pickup surface capable of vacuum pick-up, a bottom surface of the core at both sides of the inlet portion forms a soldering portion to be soldered to a circuit board,
Wherein the metal layer is in contact with or spaced apart from each other at a boundary portion between the inlet portion and the storage space, and the metal layer is electrically connected to the contact pin in a press contact state,
Wherein the contact pin is inserted into the accommodating space through a through hole formed in the circuit board between the circuit patterns while the electrical contact terminal is soldered and fixed to the circuit pattern of the circuit board, And are electrically connected to each other.

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