KR101201410B1 - Elastic electric contact terminal for the printed circuit board - Google Patents
Elastic electric contact terminal for the printed circuit board Download PDFInfo
- Publication number
- KR101201410B1 KR101201410B1 KR1020110052211A KR20110052211A KR101201410B1 KR 101201410 B1 KR101201410 B1 KR 101201410B1 KR 1020110052211 A KR1020110052211 A KR 1020110052211A KR 20110052211 A KR20110052211 A KR 20110052211A KR 101201410 B1 KR101201410 B1 KR 101201410B1
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- heat
- resistant film
- elastic core
- insulating elastic
- contact terminal
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- 239000010410 layer Substances 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000012790 adhesive layer Substances 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 230000005489 elastic deformation Effects 0.000 claims 1
- 239000011135 tin Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 10
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 abstract description 3
- 230000003313 weakening effect Effects 0.000 abstract description 3
- 230000035515 penetration Effects 0.000 abstract 2
- 238000003780 insertion Methods 0.000 abstract 1
- 230000037431 insertion Effects 0.000 abstract 1
- 239000011162 core material Substances 0.000 description 32
- 239000010408 film Substances 0.000 description 28
- 239000010409 thin film Substances 0.000 description 4
- 238000010073 coating (rubber) Methods 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229920001646 UPILEX Polymers 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 229920001821 foam rubber Polymers 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Abstract
본 발명은 중앙에 형성된 관통공으로 인하여 탄성이 부여된 절연 탄성코어의 표면에 금속층을 갖는 내열필름을 감싸되 상기 내열필름에 미리 형성한 점착층이 상온에서 쉽게 점착되도록 하여 생산성이 편리하고, 또한 상기 내열필름의 양단은 상기 절연 탄성코어의 밑면 중앙에 형성된 끼움홈으로 파고들어가 빠지지 않도록 함으로써, 생산 및 운반 과정에서 점착력 약화로 인하여 상기 내열필름의 이탈이 방지되도록 한 회로기판용 탄성 전기접촉단자에 관한 것이다.
이를 위하여 본 발명은 탄성을 부여하기 위한 관통공이 내부에 형성된 절연 탄성코어의 표면에 금속층을 갖는 내열필름을 결합하여 리플로우 솔더링이 가능한 접지 및 전자파 차폐용 탄성 전기접촉단자를 구성함에 있어서, 상기 내열필름은 판재로써 안쪽에는 상온에서 상기 절연 탄성코어의 표면에 점착되는 내열성 점착층이 형성되고, 바깥쪽에는 상기 금속층이 형성되며, 상기 절연 탄성코어의 밑면 중앙에는 상기 내열필름의 양단이 파고들어가 밀착되는 끼움홈이 형성되어 상기 내열필름이 벗겨지지 않도록 한 특징이 있다.The present invention is wrapped around the heat-resistant film having a metal layer on the surface of the insulating elastic core imparted elasticity due to the through-hole formed in the center, so that the pressure-sensitive adhesive layer previously formed on the heat-resistant film is easily adhered at room temperature, and the productivity is convenient. Both ends of the heat-resistant film to prevent the penetration of the heat-resistant film due to the weakening of the adhesive force in the production and transport process by preventing the penetration into the insertion groove formed in the bottom center of the insulating elastic core relates to the elastic electrical contact terminal for the circuit board will be.
To this end, the present invention is to combine the heat-resistant film having a metal layer on the surface of the insulating elastic core formed inside the through-hole for imparting elasticity to configure the grounding and electromagnetic shielding elastic electrical contact terminal capable of reflow soldering, the heat-resistant The film is formed of a heat-resistant adhesive layer that is adhered to the surface of the insulating elastic core at room temperature inside the plate material, the metal layer is formed on the outside, both ends of the heat-resistant film is in close contact with the center of the bottom surface of the insulating elastic core. The fitting groove is formed is characterized in that the heat-resistant film is not peeled off.
Description
본 발명은 회로기판용 탄성 전기접촉단자에 관한 것으로서, 더욱 상세하게는 중앙에 형성된 관통공으로 인하여 탄성이 부여된 절연 탄성코어의 외주면으로 금속층을 갖는 내열필름을 감싸되 상기 내열필름에 미리 형성한 점착층이 상온에서 쉽게 점착되도록 하여 결합작업이 편리하고, 또한 상기 내열필름의 양단은 상기 절연 탄성코어의 밑면 중앙에 형성된 끼움홈으로 파고들어가 빠지지 않도록 함으로써, 생산 및 운반 과정에서 점착력 약화로 인하여 상기 내열필름의 이탈이 방지되도록 한 회로기판용 탄성 전기접촉단자에 관한 것이다.The present invention relates to an elastic electrical contact terminal for a circuit board, and more particularly, an adhesive formed in advance on the heat-resistant film by wrapping a heat-resistant film having a metal layer on the outer circumferential surface of the insulating elastic core provided with elasticity due to a through-hole formed in the center thereof. The layer is easily adhered at room temperature so that the bonding operation is convenient, and both ends of the heat resistant film do not penetrate into the fitting groove formed at the center of the bottom surface of the insulating elastic core, so that the heat resistance is reduced due to the weakening of the adhesive force during the production and transportation process. It relates to an elastic electrical contact terminal for a circuit board to prevent the separation of the film.
일반적으로 전자회로기판에는 다양한 회로부품들이 실장된 뒤 리플로우 솔더링(reflow soldering) 방식으로 납땜된다. 여기서 회로기판의 접지용 또는 전자파 차폐용으로 사용되는 탄성 전기접촉단자는 전기 전도도가 좋고 탄성 회복력이 우수하며, 리플로우 솔더링 온도(240℃ ～ 270℃)에 견뎌야된다.Generally, various circuit components are mounted on an electronic circuit board and soldered by reflow soldering. In this case, the elastic electrical contact terminal used for grounding the circuit board or shielding electromagnetic waves has good electrical conductivity, excellent elastic recovery, and must withstand the reflow soldering temperature (240 ° C to 270 ° C).
이러한 조건을 만족하기 위하여 국내특허 제762854호는 내부 쿠션재를 이루는 다공성 심재 표면을 금속박막으로 점착시키거나 또는 상기 금속박막을 내열성 폴리이미드필름으로 보호하는 전기접촉단자 기술이 제안된 바 있다.In order to satisfy such conditions, Korean Patent No. 762854 has proposed an electrical contact terminal technology for adhering a porous core material constituting an inner cushion material with a metal thin film or protecting the metal thin film with a heat resistant polyimide film.
그러나 종래의 특허는 내부 쿠션재가 발포된 상태로 채워져 있으므로 부품의 무게를 감소시키는 요인으로 작용하였으며, 또한 회로기판에 장착시 과도한 쿠션력으로 인해 비틀림이 발생하여 납땜이 정확한 위치에 되지않고, 내부의 발포된 기공이 리플로우 솔더링 작업시의 온도로 인해 팽창하여 제품의 형태가 비틀어져서 납땜이 정확하게 되지 않는 등의 단점이 있었다. 또한 상기 금속박막이 파이프형태로 제작되어 내부에 쿠션재를 발포하는 형태이므로 상기 금속박막을 파이프형태로 제작하는데 어려움이 있었다.However, the conventional patent is a factor that reduces the weight of the parts because the inner cushion material is filled in the foamed state, and also because the torsion occurs due to excessive cushioning force when mounted on the circuit board, soldering is not in the correct position, Foamed pores expand due to the temperature during reflow soldering operation, and the shape of the product is distorted, so that soldering is not accurate. In addition, since the metal thin film is made in the form of a pipe to foam the cushioning material therein, there is a difficulty in producing the metal thin film in the form of a pipe.
국내특허 제1001354호는 쿠션을 갖도록 중공상의 관통공을 갖는 절연 탄성코어 표면에 비발포 고무코팅층을 도포하고 그 위에 금속층을 갖는 내열 폴리머필름을 부착한 전기접촉단자 기술이 제안된 바 있다.Korean Patent No. 1001354 has proposed an electrical contact terminal technology in which a non-foaming rubber coating layer is coated on an insulating elastic core surface having a hollow through hole to have a cushion, and a heat resistant polymer film having a metal layer is attached thereto.
그러나 종래의 특허는 상기 비발포 고무코팅층이 열경화성이므로 약 160℃에서 1시간 정도 방치하여 상기 절연 탄성코어 표면에 상기 내열 폴리머필름이 완전 부착되도록 해야되므로 생산성이 떨어지는 단점이 있으며, 경화과정에서 액상 비발포 고무코팅층이 흘러나오는 것에 대비하여 별도의 수용홈을 상기 절연 탄성코어의 밑면에 만들어주어야 되는 등의 기술적인 어려움이 있었다.However, since the non-foamed rubber coating layer is thermosetting, the conventional patent has to be left at about 160 ° C. for about 1 hour so that the heat-resistant polymer film is completely attached to the surface of the insulating elastic core. There is a technical difficulty such as making a separate receiving groove in the bottom surface of the insulating elastic core in preparation for the foam rubber coating layer flows out.
본 발명은 종래의 문제점을 감안하여 개발한 것으로서, 본 발명의 목적은 중앙에 형성된 관통공으로 인하여 탄성이 부여된 절연 탄성코어의 표면에 금속층을 갖는 내열필름을 감싸되 상기 내열필름에 미리 형성한 점착층이 상온에서 쉽게 점착되도록 하여 결합작업이 편리하고, 또한 상기 내열필름의 양단은 상기 절연 탄성코어의 밑면 중앙에 형성된 끼움홈으로 파고들어가 빠지지 않도록 함으로써, 생산 및 운반 과정에서 점착력 약화로 인하여 상기 내열필름의 이탈이 방지되도록 한 회로기판용 탄성 전기접촉단자를 제공함에 있다.The present invention was developed in view of the conventional problems, and an object of the present invention is to wrap the heat-resistant film having a metal layer on the surface of the insulating elastic core given elasticity due to the through-hole formed in the center of the adhesive pre-formed on the heat-resistant film The layer is easily adhered at room temperature so that the bonding operation is convenient, and both ends of the heat resistant film do not penetrate into the fitting groove formed at the center of the bottom surface of the insulating elastic core, so that the heat resistance is reduced due to the weakening of the adhesive force during the production and transportation process. An elastic electrical contact terminal for a circuit board is provided to prevent the separation of the film.
이를 위하여 본 발명은 탄성을 부여하기 위한 관통공이 내부에 형성된 절연 탄성코어의 표면에 금속층을 갖는 내열필름을 결합하여 리플로우 솔더링이 가능한 접지 및 전자파 차폐용 탄성 전기접촉단자를 구성함에 있어서, 상기 내열필름은 판재로써 안쪽에는 상온에서 상기 절연 탄성코어의 표면에 점착되는 내열성 점착층이 형성되고, 바깥쪽에는 상기 금속층이 형성되며, 상기 절연 탄성코어의 밑면 중앙에는 상기 내열필름의 양단이 파고들어가 밀착되는 끼움홈이 형성되어 상기 내열필름이 벗겨지지 않도록 한 특징이 있다.To this end, the present invention is to combine the heat-resistant film having a metal layer on the surface of the insulating elastic core formed inside the through-hole for imparting elasticity to configure the grounding and electromagnetic shielding elastic electrical contact terminal capable of reflow soldering, the heat-resistant The film is formed of a heat-resistant adhesive layer that is adhered to the surface of the insulating elastic core at room temperature inside the plate material, the metal layer is formed on the outside, both ends of the heat-resistant film is in close contact with the center of the bottom surface of the insulating elastic core. It is characterized in that the fitting groove is formed so that the heat-resistant film is not peeled off.
본 발명에 따르면 금속층을 갖는 내열필름은 상온에서 쉽게 점착되는 점착층을 갖기 때문에 탄성이 부여된 절연 탄성코어의 표면에 쉽게 달라붙는다. 따라서 생산과정에서 별도의 접착 안정화시간이 필요치 않으므로 결합작업이 향상되는 이점이 있으며, 상기 내열필름은 판재로 구성되므로 종래 파이프 형태의 내열필름에 비하여 금속층 및 점착층을 펼쳐서 형성하기 때문에 파이프 곡면에 형성할 때보다 유리한 이점이 있다. 또한 상기 내열필름의 양단은 상기 절연 탄성코어를 감싼 뒤 절연 탄성코어의 밑면 중앙에 형성된 끼움홈 내부로 파고들어가 결합되는 방식이므로 되빠지지 않아 이탈 불량이 감소되는 이점이 있다.According to the present invention, since the heat-resistant film having a metal layer has an adhesive layer that is easily adhered at room temperature, the heat-resistant film easily adheres to the surface of the insulating elastic core provided with elasticity. Therefore, there is no need for a separate adhesion stabilization time in the production process, there is an advantage that the bonding operation is improved, since the heat-resistant film is composed of a plate formed on the curved surface of the pipe because it is formed by spreading the metal layer and adhesive layer compared to the heat-resistant film of the conventional pipe type There is an advantage over that. In addition, since both ends of the heat-resistant film wrap around the insulating elastic core and penetrate into the fitting groove formed at the center of the bottom surface of the insulating elastic core, there is an advantage in that the defect of the separation is reduced.
또한 상기 절연 탄성코어의 내부에 형성된 관통공에는 바닥에 내부돌기가 형성되어 절연 탄성코어의 압착정도를 제한하기 때문에 무리한 압력이 가해지더라도 내열필름 및 절연 탄성코어를 보호할 수 있으며, 상기 내부돌기 안쪽으로 상기 끼움홈이 형성되므로 끼움홈의 깊이를 최대로 늘릴 수 있는 이점이 있다.In addition, the through hole formed inside the insulating elastic core has an inner protrusion formed at the bottom to limit the crimping degree of the insulating elastic core, thereby protecting the heat-resistant film and the insulating elastic core even if excessive pressure is applied. As the fitting groove is formed there is an advantage that can increase the depth of the fitting groove to the maximum.
도 1은 본 발명 한 실시예의 탄성 전기접촉단자의 사시도
도 2는 본 발명 한 실시예의 탄성 전기접촉단자의 단면도
도 3은 본 발명 한 실시예의 탄성 전기접촉단자의 설치상태도1 is a perspective view of an elastic electrical contact terminal of an embodiment of the present invention
Figure 2 is a cross-sectional view of the elastic electrical contact terminal of an embodiment of the present invention
Figure 3 is an installation state of the elastic electrical contact terminal of an embodiment of the present invention
도 1에서 본 발명은 절연 탄성코어(10)를 갖는다. 상기 절연 탄성코어(10)는 실리콘 계열로써 리플로우 솔더링시 변형이 없도록 내열성을 갖는다. 상기 절연 탄성코어(10)는 탄성을 부여하기 위하여 내부에 중공상의 관통공(11)이 형성되는데, 상기 관통공(11)의 바닥에는 중앙으로 내부돌기(13)가 돌출 형성된다. 상기 내부돌기(13)는 상기 절연 탄성코어(10)의 상단이 전기접촉에 의해 회로기판으로부터 눌리는 깊이를 제한하는 턱 역할을 하는 것으로서, 무리한 접촉으로 절연 탄성코어(10)의 원형이 변형되는 것을 방지한다.In FIG. 1, the present invention has an insulating
상기 절연 탄성코어(10)의 밑면에는 중앙으로 끼움홈(12)이 형성되는데, 후술할 내열필름(20)의 양단이 파고들어가는 부분이다. 상기 끼움홈(12)은 바람직하게는 상기 내부돌기(13)의 중앙으로 연장되어 상기 절연 탄성코어(10)의 내부로 깊게 형성하는 것이 좋다.The bottom surface of the insulating
내열필름(20)은 상기 절연 탄성코어(10)의 표면을 감싸는 것으로서, 상온에서 점착되는 점착층(30)이 안쪽면에 형성되고 바깥면에는 금속층(40)이 형성된다. 상기 내열필름(20)은 내열성이 좋은 폴리이미드필름으로써, 유연성 및 강도를 고려하여 0.01 ～ 0.05mm 두께로 형성하는 것이 좋으며, 금속층(40)은 남땜성을 고려하여 0.002 ～0.01mm 두께로 형성된다.Heat-
상기 점착층(30)은 실리콘으로써, 리플로우 솔더링시 온도에 영향을 받지 않는 내열성을 가지면서 상온에서 상기 내열필름(20)과 절연 탄성코어(10)를 쉽게 부착시키는 성능을 갖는다.The pressure-sensitive
상기 금속층(40)은 니켈을 스퍼터링 하고 그 위에 구리를 도금하였으며, 상기 구리 위에 니켈과 주석을 차례로 도금한 것이다. 상기 구리 위쪽으로 니켈을 한번 더 도금함으로써 구리의 산화를 효과적으로 방지할 수 있다.The
상기 내열필름(20)은 점착층(30)을 보호하기 위하여 이형지로 덮이고 롤 상태로 말려 보관되는데, 상기 절연 탄성코어(10)와의 합체과정에서 이형지는 제거된다. 상기 절연 탄성코어(10)와 내열필름(20)은 파이프 형태의 금형을 다수개 통과하면서 잡아당겨지고 이때 밀착 및 점착되는데, 상기 내열필름(20)의 양단은 상기 절연 탄성코어(10)의 밑면 중앙에 형성된 끼움홈(12) 내부로 접혀 들어가 밀착 마감된다.The heat-
도 3은 본 발명 한 실시예의 사용상태로써, 하부 인쇄회로기판(50)의 표면에 형성된 인쇄패턴(51)에 상기 내열필름(20)의 밑면 금속층(40)이 리플로우 솔더링으로 납땜(60)되어 회로적으로 연결된 상태이며, 내열필름(20)의 상부 금속층(40)에는 상부 인쇄회로기판(50a)이 놓인다. 이때 상부 인쇄회로기판(50a)의 무게로 인하여 상기 절연 탄성코어(10)의 내부가 탄성적으로 압착되는데, 내부의 내부돌기(13)에 의해 무리한 압착으로 인한 절연 탄성코어(10)의 변형이 방지된다.3 is a state of use of one embodiment of the present invention, the
10 : 절연 탄성코어 11 : 관통공
12 : 끼움홈 13 : 내부돌기
20 : 내열필름 30 : 점착층
40 : 금속층 50 : 인쇄회로기판10: insulated elastic core 11: through hole
12: fitting groove 13: internal protrusion
20: heat resistant film 30: adhesive layer
40: metal layer 50: printed circuit board
Claims (3)
상기 절연 탄성코어(10)의 밑면 중앙에는 상기 내열필름(20)의 양단이 파고들어가 밀착되는 끼움홈(12)이 형성되어 상기 내열필름(20)이 벗겨지지 않도록 한 것을 특징으로 하는 회로기판용 탄성 전기접촉단자.The heat-resistant film 20 having the metal layer 40 is bonded to the surface of the insulating elastic core 10 formed therein, through-hole 11 for imparting elasticity, the heat-resistant film 20 is a plate material at room temperature The heat-resistant adhesive layer 30 is formed on the surface of the insulating elastic core 10, the metal layer 40 is sputtered nickel and plated copper on the nickel, nickel and tin in turn above the copper In the elastic electrical contact terminal for the circuit board to prevent oxidation by plating,
For the circuit board, characterized in that the fitting groove 12 is formed in the center of the bottom surface of the insulating elastic core 10 so that both ends of the heat-resistant film 20 is in close contact with the heat-resistant film 20. Elastic electrical contact terminal.
상기 절연 탄성코어(10)의 관통공(11) 바닥에는 상부로 돌출되어 상기 절연 탄성코어(10)의 탄성변형 높이를 제한하는 내부돌기(13)가 형성되는데, 상기 내부돌기(13)는 상기 끼움홈(12)의 일부를 수용하여, 상기 내열필름(20)의 양단이 상기 절연 탄성코어(10)의 내부로 깊게 들어가도록 한 것을 특징으로 하는 회로기판용 탄성 전기접촉단자.The method of claim 1,
An inner protrusion 13 protrudes upward from the bottom of the through-hole 11 of the insulating elastic core 10 to limit the height of the elastic deformation of the insulating elastic core 10. Receiving a part of the fitting groove 12, the both ends of the heat-resistant film 20 so that the deep inside the insulating elastic core 10, the elastic electrical contact terminal for a circuit board.
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| Application Number | Priority Date | Filing Date | Title |
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| KR1020110052211A KR101201410B1 (en) | 2011-05-31 | 2011-05-31 | Elastic electric contact terminal for the printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020110052211A KR101201410B1 (en) | 2011-05-31 | 2011-05-31 | Elastic electric contact terminal for the printed circuit board |
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| KR101201410B1 true KR101201410B1 (en) | 2012-11-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR1020110052211A Expired - Fee Related KR101201410B1 (en) | 2011-05-31 | 2011-05-31 | Elastic electric contact terminal for the printed circuit board |
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| KR101538435B1 (en) * | 2014-04-04 | 2015-07-22 | 조인셋 주식회사 | Solderable elastic electric contact terminal |
| KR20160023513A (en) * | 2014-08-22 | 2016-03-03 | 조인셋 주식회사 | Pocket-typed electric contact terminal capable for surface mounting with reflow soldering process |
| CN105390850A (en) * | 2014-08-22 | 2016-03-09 | 卓英社有限公司 | Cystic electrical contact terminal for realizing surface mounting with the help of reflow soldering |
| WO2016153116A1 (en) * | 2015-03-23 | 2016-09-29 | 조인셋 주식회사 | Elastic electric contact terminal with improved environmental resistance, and fabrication method therefor |
| EP3093923A1 (en) * | 2015-05-15 | 2016-11-16 | Joinset Co., Ltd | Elastic electric contact terminal adapted to small size |
| US10128584B2 (en) | 2015-03-23 | 2018-11-13 | Joinset Co., Ltd. & Sun-Ki Kim | Elastic electric contact terminal with improved environmental resistance and fabrication method therefor |
| KR20200134031A (en) * | 2019-05-21 | 2020-12-01 | 조인셋 주식회사 | Elastic electric connect terminal assembly |
| WO2021200642A1 (en) * | 2020-03-31 | 2021-10-07 | 積水ポリマテック株式会社 | Conductive member |
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| KR101538435B1 (en) * | 2014-04-04 | 2015-07-22 | 조인셋 주식회사 | Solderable elastic electric contact terminal |
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| CN105390850B (en) * | 2014-08-22 | 2017-12-29 | 卓英社有限公司 | The surface-pasted bladder type electric contact terminal of Reflow Soldering can be achieved with |
| WO2016153116A1 (en) * | 2015-03-23 | 2016-09-29 | 조인셋 주식회사 | Elastic electric contact terminal with improved environmental resistance, and fabrication method therefor |
| US10128584B2 (en) | 2015-03-23 | 2018-11-13 | Joinset Co., Ltd. & Sun-Ki Kim | Elastic electric contact terminal with improved environmental resistance and fabrication method therefor |
| EP3093923A1 (en) * | 2015-05-15 | 2016-11-16 | Joinset Co., Ltd | Elastic electric contact terminal adapted to small size |
| KR20200134031A (en) * | 2019-05-21 | 2020-12-01 | 조인셋 주식회사 | Elastic electric connect terminal assembly |
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| WO2021200642A1 (en) * | 2020-03-31 | 2021-10-07 | 積水ポリマテック株式会社 | Conductive member |
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