KR101510379B1 - 인쇄회로기판 어셈블리 - Google Patents
인쇄회로기판 어셈블리 Download PDFInfo
- Publication number
- KR101510379B1 KR101510379B1 KR20080019336A KR20080019336A KR101510379B1 KR 101510379 B1 KR101510379 B1 KR 101510379B1 KR 20080019336 A KR20080019336 A KR 20080019336A KR 20080019336 A KR20080019336 A KR 20080019336A KR 101510379 B1 KR101510379 B1 KR 101510379B1
- Authority
- KR
- South Korea
- Prior art keywords
- insulating member
- connection terminal
- printed circuit
- circuit board
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
Claims (7)
- 절연부재;상기 절연부재 위에 형성되는 제 1 도전층;상기 제 1 도전층 위에 형성되어 상기 제 1 도전층의 상면을 덮는 레지스트층;상기 레지스트층 위에 부착되는 전자 소자;상기 절연부재의 하부의 내부에 매립되어 형성되며, 일면이 상기 절연부재의 하면과 동일 평면상에 놓이면서 외부로 노출되어 있는 도전성 재질의 접속 단자;상기 레지스트층 위에 형성되고, 상기 전자 소자의 측면 및 상면을 덮으며 상기 전자 소자를 매립하는 보호층; 및상기 절연부재를 관통하며, 상기 전자 소자와 상기 접속단자를 전기적으로 연결하는 연결 부재를 포함하고,상기 전자 소자는,하면이 상기 레지스트층의 상면과 직접 접촉하여 상기 레지스트층 위에 부착되고,상기 보호층은,상기 레지스트층의 상면을 덮는 인쇄회로기판 어셈블리.
- 삭제
- 제1항에 있어서,상기 절연부재에는 상기 전자소자를 향하는 관통홀이 형성되며,상기 연결부재는 상기 관통홀을 관통하는 도전성 재질의 와이어를 포함하는 것을 특징으로 하는 인쇄회로기판 어셈블리.
- 제1항에 있어서, 상기 접속단자는,상기 절연부재 내에 매립되어 배치되는 제 2 도전층; 및상기 제 2 도전층의 외면에 형성되며, 상기 제 2 도전층의 산화를 방지하는 산화 방지층을 포함하는 것을 특징으로 하는 인쇄회로기판 어셈블리.
- 제1항에 있어서,상기 절연부재에는 외부기판과 전기적으로 연결하기 위한 외부접속단자가 더 구비되는 것을 특징으로 하는 인쇄회로기판 어셈블리.
- 삭제
- 제1항에 있어서,상기 보호층과 상기 절연부재는 공통의 수지 계열 성분을 포함하는 것을 특징으로 하는 인쇄회로기판 어셈블리.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20080019336A KR101510379B1 (ko) | 2008-02-29 | 2008-02-29 | 인쇄회로기판 어셈블리 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20080019336A KR101510379B1 (ko) | 2008-02-29 | 2008-02-29 | 인쇄회로기판 어셈블리 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20090093672A KR20090093672A (ko) | 2009-09-02 |
| KR101510379B1 true KR101510379B1 (ko) | 2015-04-06 |
Family
ID=41302127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR20080019336A Active KR101510379B1 (ko) | 2008-02-29 | 2008-02-29 | 인쇄회로기판 어셈블리 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR101510379B1 (ko) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017212796A1 (de) * | 2017-07-26 | 2019-01-31 | Robert Bosch Gmbh | Elektrische Baugruppe |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050122482A (ko) * | 2004-06-24 | 2005-12-29 | 삼성전자주식회사 | 스크린 프린팅 공정을 갖는 반도체 칩 패키지 제조 방법 |
| KR20060027653A (ko) * | 2004-09-23 | 2006-03-28 | 삼성전자주식회사 | 와이어 본딩 검사 영역을 구비한 단일층 인쇄회로기판 |
| JP2007031826A (ja) * | 2005-06-23 | 2007-02-08 | Hitachi Chem Co Ltd | 接続用端子、およびこれを有する半導体搭載用基板 |
-
2008
- 2008-02-29 KR KR20080019336A patent/KR101510379B1/ko active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050122482A (ko) * | 2004-06-24 | 2005-12-29 | 삼성전자주식회사 | 스크린 프린팅 공정을 갖는 반도체 칩 패키지 제조 방법 |
| KR20060027653A (ko) * | 2004-09-23 | 2006-03-28 | 삼성전자주식회사 | 와이어 본딩 검사 영역을 구비한 단일층 인쇄회로기판 |
| JP2007031826A (ja) * | 2005-06-23 | 2007-02-08 | Hitachi Chem Co Ltd | 接続用端子、およびこれを有する半導体搭載用基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090093672A (ko) | 2009-09-02 |
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