KR101416718B1 - 유기전계발광표시장치 - Google Patents
유기전계발광표시장치 Download PDFInfo
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- KR101416718B1 KR101416718B1 KR1020080069571A KR20080069571A KR101416718B1 KR 101416718 B1 KR101416718 B1 KR 101416718B1 KR 1020080069571 A KR1020080069571 A KR 1020080069571A KR 20080069571 A KR20080069571 A KR 20080069571A KR 101416718 B1 KR101416718 B1 KR 101416718B1
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- 229910021417 amorphous silicon Inorganic materials 0.000 description 4
- 238000002161 passivation Methods 0.000 description 4
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
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- 229910000838 Al alloy Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
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- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical class C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- MGRWKWACZDFZJT-UHFFFAOYSA-N molybdenum tungsten Chemical compound [Mo].[W] MGRWKWACZDFZJT-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
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- 229920005989 resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/128—Active-matrix OLED [AMOLED] displays comprising two independent displays, e.g. for emitting information from two major sides of the display
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/90—Assemblies of multiple devices comprising at least one organic light-emitting element
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/90—Assemblies of multiple devices comprising at least one organic light-emitting element
- H10K59/95—Assemblies of multiple devices comprising at least one organic light-emitting element wherein all light-emitting elements are organic, e.g. assembled OLED displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13069—Thin film transistor [TFT]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (18)
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- 하나 또는 다수의 제 1 발광층을 포함하는 제 1 유기전계발광소자가 형성된 제 1 기판;상기 제 1 기판과 결합하며, 하나 또는 다수의 제 2 발광층을 포함하는 제 2 유기전계발광소자가 형성된 제 2 기판;상기 제 1 기판 및 제 2 기판의 가장 자리에 위치하며, 상기 제 1 기판과 제 2 기판을 결합시키기 위한 실런트;상기 제 1 기판 및 제 2 기판 사이에 위치하는 도전성 충진제;상기 제 1 유기전계발광소자와 실런트 사이 및 제 2 유기전계발광소자와 실런트 사이 중 어느 한쪽 또는 모두에 위치하는 하나 또는 다수의 배선 및상기 하나 또는 다수의 배선과 도전성 충진제 사이에 위치하는 배선 절연막을 포함하는 유기전계발광표시장치.
- 제 8 항에 있어서,상기 제 1 유기전계발광소자는 상기 제 1 기판과 제 1 발광층 사이에 위치하는 제 1 하부 전극 및 상기 제 1 발광층과 도전성 충진제 사이에 위치하는 제 1 상부 전극을 포함하고,상기 제 2 유기전계발광소자는 상기 제 2 기판과 제 2 발광층 사이에 위치하는 제 2 하부 전극 및 상기 제 2 발광층과 도전성 충진제 사이에 위치하는 제 2 상부 전극을 포함하며,상기 제 1 상부 전극과 제 2 상부 전극은 상기 도전성 충진제와 접촉하는 것을 특징으로 하는 유기전계발광표시장치.
- 제 9 항에 있어서,상기 제 1 상부 전극 및 제 2 상부 전극은 동일 재질인 것을 특징으로 하는 유기전계발광표시장치.
- 삭제
- 삭제
- 제 8 항에 있어서,상기 제 1 기판과 제 1 유기전계발광소자 사이 및 제 2 기판과 제 2 유기전계발광소자 사이 중 어느 한쪽 또는 모두에 하나 또는 다수의 박막 트랜지스터가 위치하며,상기 하나 또는 다수의 배선은 상기 박막 트랜지스터의 반도체층, 게이트 전극, 소오스 전극, 드레인 전극 및 이들의 적층으로 이루어진 군에서 선택된 어느 하나와 동일 재질인 것을 특징으로 하는 유기전계발광표시장치.
- 제 13 항에 있어서,상기 배선 절연막은 상기 박막 트랜지스터의 게이트 절연막, 층간 절연막, 상기 박막 트랜지스터 상에 위치하는 보호막 및 이들의 적층으로 이루어진 군에서 선택된 어느 하나인 것을 특징으로 하는 유기전계발광표시장치.
- 제 13 항에 있어서,상기 배선 절연막과 도전성 충진제 사이에 위치하는 흡습막을 더 포함하는 유기전계발광표시장치.
- 제 8 항에 있어서,상기 도전성 충진제는 금속 파우더를 포함하는 것을 특징으로 하는 유기전계발광표시장치.
- 제 8 항에 있어서,상기 도전성 충진제는 이방성 도전 필름인 것을 특징으로 하는 유기전계발광표시장치.
- 제 8 항에 있어서,상기 제 1 유기전계발광소자 및 제 2 유기전계발광소자는 하나 또는 다수의 발광 영역을 포함하며,상기 제 1 유기전계발광소자의 발광 영역은 상기 제 2 유기전계발광소자의 발광 영역과 중첩되는 것을 특징으로 하는 유기전계발광표시장치.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020080069571A KR101416718B1 (ko) | 2008-07-17 | 2008-07-17 | 유기전계발광표시장치 |
US12/361,916 US8138669B2 (en) | 2008-07-17 | 2009-01-29 | Double-emission organic light emitting diode display device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020080069571A KR101416718B1 (ko) | 2008-07-17 | 2008-07-17 | 유기전계발광표시장치 |
Publications (2)
Publication Number | Publication Date |
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KR20100008937A KR20100008937A (ko) | 2010-01-27 |
KR101416718B1 true KR101416718B1 (ko) | 2014-07-09 |
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KR1020080069571A Active KR101416718B1 (ko) | 2008-07-17 | 2008-07-17 | 유기전계발광표시장치 |
Country Status (2)
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US (1) | US8138669B2 (ko) |
KR (1) | KR101416718B1 (ko) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9282614B2 (en) | 2013-02-27 | 2016-03-08 | Htc Corporation | Electronic device and fabricating method of display module of electronic device |
KR102051660B1 (ko) * | 2013-09-27 | 2019-12-03 | 엘지디스플레이 주식회사 | 유기전계발광소자, 그 제조방법 및 유기전계발광 표시장치 |
KR102237163B1 (ko) * | 2014-06-26 | 2021-04-06 | 엘지디스플레이 주식회사 | 양면 발광형 유기발광표시장치 및 이의 제조방법 |
KR102303241B1 (ko) * | 2014-07-24 | 2021-09-17 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102513374B1 (ko) | 2015-04-08 | 2023-03-24 | 삼성디스플레이 주식회사 | 표시 장치 |
CN105098087A (zh) * | 2015-08-06 | 2015-11-25 | 深圳市华星光电技术有限公司 | 有机发光二极管 |
KR102406606B1 (ko) * | 2015-10-08 | 2022-06-09 | 삼성디스플레이 주식회사 | 유기 발광 소자, 이를 포함하는 유기 발광 표시 장치, 및 이의 제조 방법 |
WO2017064587A1 (en) * | 2015-10-12 | 2017-04-20 | Semiconductor Energy Laboratory Co., Ltd. | Display panel, input/output device, data processor, and method for manufacturing display panel |
US10520782B2 (en) | 2017-02-02 | 2019-12-31 | James David Busch | Display devices, systems and methods capable of single-sided, dual-sided, and transparent mixed reality applications |
KR102668689B1 (ko) * | 2018-05-10 | 2024-05-24 | 삼성디스플레이 주식회사 | 표시장치 및 그의 제조방법 |
CN113065424B (zh) * | 2021-03-19 | 2024-07-23 | 京东方科技集团股份有限公司 | 指纹识别结构及其制备方法、显示基板、显示装置 |
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US20100013380A1 (en) | 2010-01-21 |
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