KR101294943B1 - Printed circuit board having heat sink structure and LED lighting apparatus having the same - Google Patents

Abstract

Disclosed is a printed circuit board having a heat dissipation structure capable of self-heating and an LED lighting device including the same.
The disclosed printed circuit board includes a printed circuit board including a substrate body of a metal material, the circuit unit having an LED mounted on a front surface thereof and a circuit wiring formed thereon; And a heat dissipation fin part including a concave-convex shape section which is spaced apart from both sides of the circuit part at regular intervals and bent to protrude to the rear of the circuit part, and is bent zigzag a plurality of times. do.
In addition, the disclosed LED lighting device includes a housing; The printed circuit board installed inside the housing; And at least one LED mounted on the circuit unit formed on the printed circuit board.
The printed circuit board having such a heat dissipation structure and the LED lighting device including the same may achieve the effect of reducing the volume and weight of the LED lighting device since the printed circuit board itself may perform the heat dissipation function without a separate heat dissipation means.

Description

Printed circuit board having heat sink structure and LED lighting apparatus having the same}

The present invention relates to a printed circuit board having a heat dissipation structure and an LED lighting apparatus including the same, and more particularly, to a printed circuit board having a heat dissipation structure capable of self-heating and an LED lighting apparatus including the same.

BACKGROUND With the development of electronic and communication technologies, electronic devices using light emitting diodes (LEDs) have been widely used. The light emitting diode is recognized as a next-generation light source because it is more energy-saving and can be used semi-permanently than other light sources such as fluorescent lamps and incandescent lamps.

In addition, recently, the lighting using LED (LED) has received a great spotlight. LED lamps used in such illumination lamps are less in power consumption and longer in life than lamps, and they are emerging as new lamps replacing conventional lamps.

In particular, LED lamps are widely applied to street lamps and ceilings. The problem is that the life of the lamps is shortened due to the heat energy emitted when the lamps are turned on.

Therefore, many techniques for dissipating (cooling) the heat generated inside the lamp to the outside have been introduced. Most of the conventional techniques use heat sinks or members such as heat pipes to dissipate heat.

1 is an exploded perspective view showing a conventional LED lighting device.

1, the LED lighting apparatus includes a heat sink 20, a printed circuit board 30, an LED 40, and a light transmitting lens 50 in the frame 10.

Here, the frame 10 is formed with a ventilation opening 12 through which air can be ventilated so that outside air can communicate.

In addition, a plurality of heat dissipation fins 22 are formed on one surface of the heat dissipation plate 20 to dissipate heat through contact with air.

In addition, the printed circuit board 30 is mounted on the other surface of the heat sink 20, and the LED 40 is mounted on the printed circuit board 30.

In addition, the translucent lens 50 covers the printed circuit board 30 to protect the printed circuit board 30 and the LED 40 from foreign matter and distributes the LED 40 light to the other surface of the heat sink 20. Is mounted.

Such a conventional LED lighting device is provided with a separate heat sink 20 for dissipating heat generated from the LED 40, the die-casting aluminum (Al) heat sink 20 is generally used is thin because the moldability is not good. Its weight increases because it cannot be made, which is a disadvantage for lighting fixtures that need to be fixed and periodically replaced at high positions.

In addition, in the case of a folded-fin heat sink 20, the structure can be applied because it must be used directly attached to the component that generates heat.

In addition, the conventional LED lighting device has a disadvantage that the price of the device increases due to the heat sink (20).

The present invention has been made to solve at least some of the problems of the prior art as described above, in one aspect, provides a printed circuit board having a heat dissipation structure capable of performing a heat dissipation function and the LED lighting device including the same. It aims to do it.

In addition, an object of the present invention is to provide a printed circuit board having a heat dissipation structure with improved heat dissipation performance of the LED lighting device to facilitate heat transfer, and an LED lighting device including the same.

As one aspect for achieving at least some of the above object, the present invention is a printed circuit board having a substrate body of a metal material, the LED is mounted on the front surface of the circuit portion formed circuit wiring; And a heat dissipation fin part including a concave-convex shape section which is spaced apart from both sides of the circuit part at regular intervals and bent to protrude to the rear of the circuit part, and is bent zigzag a plurality of times. Provided is a printed circuit board having a heat dissipation structure.

Preferably, the plurality of heat dissipation fin parts may be formed by cutting the substrate body according to the shape of the heat dissipation fin part and bending at a portion continuous with the circuit part.

Also preferably, the substrate body may be made of aluminum (Al), copper (Cu), aluminum alloy or copper alloy.

Also preferably, the uneven section may be formed on both sides of the circuit portion.

More preferably, the heat dissipation fin portion may include a straight section extending rearward from the circuit portion, and the uneven section may be formed while traveling in the direction of the circuit portion from the end of the straight section.

Also preferably, a substrate may be deleted between each of the plurality of heat dissipation fin parts.

The circuit unit may include a first parallel portion and a second parallel portion in which a plurality of LEDs are arranged and parallel to each other, and the heat dissipation fin portion may be formed at both sides of the first parallel portion and the second parallel portion.

Here, the heat dissipation fin portion formed inside each of the first parallel portion and the second parallel portion may be configured as a continuous substrate body.

Also preferably, the printed circuit board may further include a heat conductive member coupled to the front end of the circuit part and the heat dissipation fin part to thermally mediate the circuit part and the heat dissipation fin part.

And, in another aspect, the present invention is a housing; The printed circuit board installed inside the housing; And at least one LED mounted on the circuit unit formed on the printed circuit board.

Preferably, the LED lighting device may further include a floodlight cover installed in front of the LED.

More preferably, the floodlight cover may be sealed in contact with the printed circuit board to block foreign matter from entering the LED.

According to an embodiment of the present invention having such a configuration, the printed circuit board itself can perform the heat dissipation function without a separate heat dissipation means, thereby reducing the volume and weight of the LED lighting device.

In addition, according to an embodiment of the present invention, the heat transfer between the printed circuit board and the heat dissipation fin formed in one piece can be easily achieved to obtain the effect of improving the heat dissipation performance of the LED lighting device.

1 is an exploded perspective view of a conventional LED lighting device.
Figure 2 is an exploded perspective view of the LED lighting apparatus according to an embodiment of the present invention.
3 is a development of a printed circuit board according to an embodiment of the present invention.
4 to 6 are a front view, a side view and a plan view of a printed circuit board according to an embodiment of the present invention.
7 is a front view of a printed circuit board equipped with a floodlight cover.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Furthermore, the singular forms "a", "an," and "the" include plural referents unless the context clearly dictates otherwise.

In this specification, terms such as " comprise ", " comprise ", and " have "mean that there exist features, numbers, steps, operations, elements, parts, And should not be construed to preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

First, with reference to Figure 2 looks at the LED lighting apparatus according to an embodiment of the present invention.

As shown in FIG. 2, the LED lighting device 100 according to an embodiment of the present invention includes a housing 110, a printed circuit board 200, and an LED 120, and is located in front of the LED 120. It may further include a floodlight cover 130 is installed.

The housing 110 constitutes an exterior of the LED lighting apparatus 100 according to an embodiment of the present invention, and a space in which the printed circuit board 200 is embedded is formed in the housing 110. .

In addition, in one embodiment, an air vent 112 may be formed at an upper portion of the housing 110 to allow outside air to communicate with the inside of the housing 110.

The housing 110 is configured to illuminate the LED 120 to be used downward in the LED lighting device 100 according to an embodiment of the present invention, and has a structure connected to the lamppost, but this is one embodiment Since it is only an example, it is not limited to this.

In addition, the printed circuit board 200 may be installed at a portion in which the vent hole 112 is formed in the housing 110. The circuit wiring is formed on the printed circuit board 200, and the circuit wiring performs a current supply path to which a current for operating and controlling the LED 120 mounted on the substrate can be supplied.

In one embodiment, the printed circuit board 200 may be configured in the form of a bar such that the plurality of LEDs 120 may be mounted side by side in a row.

In addition, the LED lighting apparatus 100 according to an embodiment of the present invention may include a plurality of printed circuit board 200. Here, the plurality of printed circuit boards 200 may be connected to a power supply line 115 capable of supplying a current from an external power source to a circuit wiring formed on the substrate.

The printed circuit board 200 will be described in more detail with reference to FIGS. 3 to 6.

The LED 120 may be mounted on the circuit unit 220 formed on the printed circuit board 200, and a plurality of LEDs 120 may be provided at a predetermined interval in one embodiment.

In addition, the floodlight cover 130 is installed in front of the LED 120 and made of a transparent material may perform a function of light distribution of the LED (120). In one embodiment, the floodlight cover 130 may be of an integral structure that can cover all of the front surface of the plurality of printed circuit board 200 installed in the LED lighting device (100).

Next, a printed circuit board according to an embodiment of the present invention will be described with reference to FIGS. 3 to 6. 3 is an exploded view of a printed circuit board according to an exemplary embodiment of the present invention, FIG. 4 is a front view, FIG. 5 is a side view, and FIG. 6 is a plan view.

As shown in Figure 3 to Figure 6, the printed circuit board 200 according to an embodiment of the present invention includes a substrate body of a metal material.

That is, in one embodiment, the substrate body includes an insulating layer 202 and an insulating layer 202 stacked on the metal base 201 and the metal base 201 of a metal material, as shown in a partially enlarged view of FIG. 4. It may be configured to include a circuit wiring 222 formed on.

Here, the insulating layer 202 may electrically block the circuit wiring 222 and the metal base 201, but may be made of a material capable of thermal conduction.

In addition, the printed circuit board 200 according to an exemplary embodiment of the present invention includes a circuit part 220 in which the circuit wiring 222 is formed and a heat dissipation fin part 230 bent to the rear of the circuit part 220.

As shown in FIG. 3, the circuit unit 220 includes a mounting unit 210 in which an LED 120 may be mounted on a front surface of the circuit unit 220, and supplies current to the LED 120 mounted in the mounting unit 210. The circuit wiring 222 can be printed so that it can be.

In one embodiment, the circuit unit 220 may be composed of a first parallel portion 220a and a second parallel portion 220b configured in a bar shape so that the plurality of LEDs 120 may be arranged. Here, the first parallel portion 220a and the second parallel portion 220b are spaced apart from each other and arranged in parallel.

In addition, the circuit wiring 222 formed in the first parallel portion 220a and the second parallel portion 220b may be connected to the power supply line 115 shown in FIG. 2 on one side.

On the other hand, the heat dissipation fin 230 may be spaced apart at regular intervals on both sides of each of the first parallel portion 220a and the second parallel portion 220b to be bent in the longitudinal direction. Here, the bent heat radiating fin 230 may include a concave-convex section f1 that protrudes to the rear of the circuit unit 220 and is bent several times in a zigzag to form a concave-convex shape.

In other words, a part of the heat dissipation fin 230 may be bent a number of times into an uneven shape, such an uneven shape section f1 is repeatedly bent in the opposite direction over a number of times as a fan while maintaining a constant length of the substrate body The cross section may be formed to constitute an uneven shape.

At this time, since the substrate body to be bent is a portion without the circuit wiring 222, there is no damage to the circuit wiring 222. That is, the heat dissipation fin unit 230 may be composed of only the metal base 201 or only the metal base 210 in which the insulating layer 202 is stacked.

In an embodiment, the uneven section f1 of the heat dissipation fin unit 230 may be formed at both sides of the circuit unit 220, that is, at both sides of each of the first parallel portion 220a and the second parallel portion 220b. .

To this end, the heat dissipation fin unit 230 may include a straight section f2 vertically extending rearward from both sides of the first parallel portion 220a and the second parallel portion 220b as shown in FIG. 4. The concave-convex section f1 may be formed following the straight section f2. Here, the uneven shape section f1 may be formed such that the unevenness is perpendicular to the straight section f2 and faces outwardly of the first parallel part 220a and the second parallel part 220b.

In addition, in one embodiment, the uneven section f1 may be formed while traveling in the direction of the circuit unit 220 from the end of the straight section f2.

That is, the uneven section f1 may be bent and formed a plurality of times in a bending direction toward the circuit section 220 from the end point of the straight section f2 extending rearward of the circuit section 220.

As a result, in one embodiment, the front end of the substrate constituting the heat dissipation fin 230 may be located at both sides of each of the first parallel portion 220a and the second parallel portion 220b. This is a structure for mounting the heat conducting member 240 to be described later.

In addition, in one embodiment, the heat dissipation fin 230 may have a predetermined width and length, and a plurality of heat dissipation fins 230 may be formed on both sides of the first parallel portion 220a and the second parallel portion 220b.

As shown in FIG. 3, the heat dissipation fin unit 230 may be formed by cutting the integral substrate body according to the shape of the heat dissipation fin unit 230 and then bending it at the bend line 205.

Here, the substrate may be deleted between each of the plurality of heat dissipation fins 230 as shown in FIG. 3 so that the plurality of heat dissipation fins 230 are formed at a predetermined interval.

In addition, in one embodiment, the heat dissipation fin portion 230 formed inside each of the first parallel portion 220a and the second parallel portion 220b may be formed of one continuous substrate body. That is, all of the first parallel portion 220a, the second parallel portion 220b, and the heat dissipation fin portion 230 may be formed on one rectangular substrate.

On the other hand, the substrate body of the printed circuit board 200 according to an embodiment of the present invention may be made of aluminum (Al) or copper (Cu) or aluminum alloys or copper alloys thereof having good thermal conductivity and formability. have.

In the printed circuit board 200 as described above, heat generated from the LED 120 mounted on the mounting unit 210 may be transferred to the heat dissipation fin unit 230, and the heat dissipation fin unit 230 may transmit the received heat to air. Through the contact of the can be emitted to the outside of the substrate, through which the printed circuit board 200 and the LED 120 mounted thereon can be cooled.

Here, the heat dissipation fin portion 230 of the printed circuit board 200 according to an embodiment of the present invention may be sufficiently secured in contact with the air through the uneven section f1.

Meanwhile, the thermally conductive member 240 may be additionally included in the printed circuit board 200 according to the exemplary embodiment of the present invention.

The thermally conductive member 240 may be coupled to the front end of the circuit unit 220 and the heat dissipation fin unit 230 to thermally mediate the circuit unit 220 and the heat dissipation fin unit 230. In other words, the heat conducting member 240 is composed of a plate having thermal conductivity in contact with both the circuit portion 220 and the front end of the heat dissipation fin portion 230 except for the mounting portion 210 so that the heat of the circuit portion 220 is the heat dissipation fin portion ( 230) can be aided in conducting.

In addition, the heat conductive member 240 may fix the position of the heat dissipation fin 230 by coupling the distal end of the plurality of heat dissipation fin 230 and the circuit 220 to the plate, and overall structure of the printed circuit board 200 It can be stabilized.

Finally, with reference to Figure 7 looks at with respect to the floodlight cover mounted on the printed circuit board of the LED lighting apparatus according to an embodiment of the present invention. 7 is a front view of a printed circuit board mounted to the LED lighting apparatus according to an embodiment of the present invention.

As shown in FIG. 7, in the LED lighting device 100 according to an embodiment of the present invention, the floodlight cover 130 described above with reference to FIG. 2 is configured to block foreign matter from penetrating into the LED 120. The contact portion with the printed circuit board 200 may be sealed.

To this end, in one embodiment, the transparent cover 130 may be formed with a sealing portion 135 in a shape that can wrap the circuit portion 220 of the printed circuit board 200 is mounted.

When the floodlight cover 130 is bonded to the front of the printed circuit board 200 through the bolt 300 and the sealing unit 135 is sealed, the LED 120 and the LED 120 mounted on the mounting unit 210. The peripheral circuit wiring 222 may be covered by the floodlight cover 130, through which the floodlight cover 130 may protect the LED 120 from external foreign matter and moisture.

When the printed circuit board 200 according to an embodiment of the present invention is compared with an existing separate heat sink and an assembly of a printed circuit board (hereinafter, a conventional assembly), the printed circuit board according to an embodiment of the present invention. The temperature of 200 is only about 0.2 ° C. higher than that of the conventional assembly, while the weight is reduced to about three quarters of the weight of the conventional assembly.

While the present invention has been particularly shown and described with reference to particular embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention as defined by the following claims I would like to make it clear.

100: LED lighting device 110: housing
112: vent 120: LED
130: floodlight 200: printed circuit board
210: mounting portion 220: circuit portion
222: circuit wiring 230: heat radiation fin
240: heat conductive member

Claims (12)

In a printed circuit board having a substrate body of a metal material,
A circuit unit in which an LED is mounted on a front surface and a circuit wiring is formed; And
A heat dissipation fin unit including a concave-convex section which is spaced apart at regular intervals from both sides of the circuit unit and bent to protrude to the rear of the circuit unit, and is bent zigzag a plurality of times;
Including;
The heat dissipation fin portion includes a straight section extending rearward from the circuit portion,
The uneven section is a printed circuit board having a heat dissipation structure, characterized in that it is formed running in the direction of the circuit portion from the end of the straight section. The method of claim 1,
A plurality of heat dissipation fins,
The printed circuit board having a heat dissipation structure characterized in that the substrate body is cut according to the shape of the heat dissipation fin portion and bent at the outer portion of the circuit portion. The method of claim 1,
The substrate body is a printed circuit board having a heat dissipation structure, characterized in that made of aluminum (Al), copper (Cu), aluminum alloy or copper alloy. The method of claim 1,
The uneven section is a printed circuit board having a heat radiation structure, characterized in that formed on both sides of the circuit portion. delete The method of claim 1,
A printed circuit board having a heat dissipation structure, wherein a substrate is disposed between each of the plurality of heat dissipation fin parts. The method of claim 1,
The circuit portion includes a first parallel portion and a second parallel portion in which a plurality of LEDs are arranged and parallel to each other,
The heat dissipation fin portion is a printed circuit board having a heat dissipation structure, characterized in that formed on both sides of the first parallel portion and the second parallel portion. The method of claim 7, wherein
The heat dissipation fin portion formed inside each of the first parallel portion and the second parallel portion is a printed circuit board having a heat dissipation structure, characterized in that consisting of a continuous substrate body. The method of claim 1,
And a heat conduction member coupled to the front end of the circuit part and the heat dissipation fin part to thermally mediate the circuit part and the heat dissipation fin part. housing;
A printed circuit board according to any one of claims 1 to 4 and 6 to 9 installed inside the housing; And
At least one LED mounted on the circuit unit formed on the printed circuit board;
LED lighting device comprising a. The method of claim 10,
LED lighting device further comprises; a floodlight cover installed in front of the LED. 12. The method of claim 11,
The floodlight cover is an LED lighting device, characterized in that the contact portion with the printed circuit board is sealed so that foreign matter penetrates into the LED.

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