KR101281340B1 - Printed circuit board having heat sink structure and led lighting apparatus having the same - Google Patents

Abstract

Disclosed is a printed circuit board having a heat dissipation structure capable of self-heating and an LED lighting device including the same.
The disclosed printed circuit board includes a printed circuit board including a substrate body of a metal material, the circuit unit having an LED mounted on a front surface thereof and a circuit wiring formed thereon; And a plurality of heat dissipation fin parts protruding to the rear of the circuit part by bending the substrate body of the outer portion of the circuit part, wherein the plurality of heat dissipation fin parts are joined to the opposite heat dissipation fin parts facing each other to form a ring shape.
In addition, the disclosed LED lighting device includes a housing; The printed circuit board installed inside the housing; And at least one LED mounted on the circuit unit formed on the printed circuit board.
The printed circuit board having such a heat dissipation structure and the LED lighting device including the same may achieve the effect of reducing the volume and weight of the LED lighting device since the printed circuit board itself may perform the heat dissipation function without a separate heat dissipation means.

Description

Printed circuit board having heat sink structure and LED lighting apparatus having the same}

The present invention relates to a printed circuit board having a heat dissipation structure and an LED lighting apparatus including the same, and more particularly, to a printed circuit board having a heat dissipation structure capable of self-heating and an LED lighting apparatus including the same.

BACKGROUND With the development of electronic and communication technologies, electronic devices using light emitting diodes (LEDs) have been widely used. The light emitting diode is recognized as a next-generation light source because it is more energy-saving and can be used semi-permanently than other light sources such as fluorescent lamps and incandescent lamps.

In addition, recently, the lighting using LED (LED) has received a great spotlight. LED lamps used in such illumination lamps are less in power consumption and longer in life than lamps, and they are emerging as new lamps replacing conventional lamps.

In particular, LED lamps are widely applied to street lamps and ceilings. The problem is that the life of the lamps is shortened due to the heat energy emitted when the lamps are turned on.

Therefore, many techniques for dissipating (cooling) the heat generated inside the lamp to the outside have been introduced. Most of the conventional techniques use heat sinks or members such as heat pipes to dissipate heat.

1 is an exploded perspective view showing a conventional LED lighting device.

1, the LED lighting apparatus includes a heat sink 20, a printed circuit board 30, an LED 40, and a light transmitting lens 50 in the frame 10.

Here, the frame 10 is formed with a ventilation opening 12 through which air can be ventilated so that outside air can communicate.

In addition, a plurality of heat dissipation fins 22 are formed on one surface of the heat dissipation plate 20 to dissipate heat through contact with air.

In addition, the printed circuit board 30 is mounted on the other surface of the heat sink 20, and the LED 40 is mounted on the printed circuit board 30.

In addition, the translucent lens 50 covers the printed circuit board 30 to protect the printed circuit board 30 and the LED 40 from foreign matter and distributes the LED 40 light to the other surface of the heat sink 20. Is mounted.

Such a conventional LED lighting device is provided with a separate heat sink 20 for dissipating heat generated from the LED 40, the die-casting aluminum (Al) heat sink 20 is generally used is thin because the moldability is not good. Its weight increases because it cannot be made, which is a disadvantage for lighting fixtures that need to be fixed and periodically replaced at high positions.

In addition, in the case of a folded-fin heat sink 20, the structure can be applied because it must be used directly attached to the component that generates heat.

In addition, the conventional LED lighting device has a disadvantage that the price of the device increases due to the heat sink (20).

The present invention has been made to solve at least some of the problems of the prior art as described above, in one aspect, provides a printed circuit board having a heat dissipation structure capable of performing a heat dissipation function and the LED lighting device including the same. It aims to do it.

In addition, an object of the present invention is to provide a printed circuit board having a heat dissipation structure with improved heat dissipation performance of the LED lighting device to facilitate heat transfer, and an LED lighting device including the same.

As one aspect for achieving at least some of the above object, the present invention is a printed circuit board having a substrate body of a metal material, the LED is mounted on the front surface of the circuit portion formed circuit wiring; And a plurality of heat dissipation fin parts protruding to the rear of the circuit part by bending the substrate body of the outer portion of the circuit part, wherein the plurality of heat dissipation fin parts are joined to a corresponding heat dissipation fin part opposite to each other to form a ring shape. It provides a printed circuit board having.

In another aspect, the present invention is a printed circuit board having a substrate body made of a metal material, the LED is mounted on the front surface of the circuit portion formed circuit wiring; And a plurality of heat dissipation fin parts protruding to the rear of the circuit part by bending the substrate body of the outer portion of the circuit part, wherein the circuit part includes a first parallel part and a second parallel part in which a plurality of LEDs are arranged and parallel to each other; And a connecting portion connecting one end of the first parallel portion and the second parallel portion to each other, wherein the first parallel portion, the second parallel portion, and the connecting portion are formed of one substrate, and the heat dissipation fin portion is formed of the first parallel portion. A printed circuit board having a heat dissipation structure formed on both sides of a first parallel portion and a second parallel portion and an outer side of the connecting portion is provided.

Preferably, the substrate body may be made of aluminum (Al), copper (Cu), aluminum alloy or copper alloy.

Also preferably, the heat dissipation fins adjacent to each other among the plurality of heat dissipation fins may be bent at different points of the outer portion of the circuit portion and may not be in contact with each other.

Also preferably, the plurality of heat dissipation fin parts may be formed by cutting the substrate body according to the shape of the heat dissipation fin part and bending the outer portion of the circuit part.

Here, the heat dissipation fins may be formed along both sides of the first parallel portion and the second parallel portion and the outside of the connection portion.

Preferably, the heat dissipation fins formed on the outer side of the first parallel portion and the second parallel portion may be joined to the opposing counterpart heat dissipation fin portion to form an annular shape.

Meanwhile, the first parallel portion and the second parallel portion may be formed of independent substrates, and the first parallel portion and the second parallel portion may be electrically connected to each other at the connection portion.

Here, the heat dissipation fins facing each other at both sides of each of the first parallel portion and the second parallel portion may be joined to the opposite heat dissipation fin portion to form an annular shape.

On the other hand, preferably, the printed circuit board may include a section in which the heat radiation fin portion is not formed in the outer portion of the circuit portion.

And, in another aspect, the present invention is a housing; The printed circuit board installed inside the housing; And at least one LED mounted on the circuit unit formed on the printed circuit board.

Preferably, the LED lighting device may further include a floodlight cover installed in front of the LED.

More preferably, the floodlight cover may be sealed around the circuit portion.

According to an embodiment of the present invention having such a configuration, the printed circuit board itself can perform the heat dissipation function without a separate heat dissipation means, thereby reducing the volume and weight of the LED lighting device.

In addition, according to an embodiment of the present invention, the heat transfer between the printed circuit board and the heat dissipation fin formed in one piece can be easily achieved to obtain the effect of improving the heat dissipation performance of the LED lighting device.

1 is an exploded perspective view of a conventional LED lighting device.
Figure 2 is an exploded perspective view of the LED lighting apparatus according to an embodiment of the present invention.
Figure 3 is a perspective view of a printed circuit board according to an embodiment of the present invention.
4 is an exploded view of the printed circuit board shown in FIG.
5 is a front cross-sectional view of the printed circuit board shown in FIG.
Figure 6 is a front sectional view of a printed circuit board according to another embodiment of the present invention.
7 is a development of a printed circuit board according to another embodiment of the present invention.
8 and 9 are front cross-sectional views of a printed circuit board according to another embodiment of the present invention.
10 is a front sectional view of a printed circuit board equipped with a floodlight cover.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Furthermore, the singular forms "a", "an," and "the" include plural referents unless the context clearly dictates otherwise.

In this specification, terms such as " comprise ", " comprise ", and " have "mean that there exist features, numbers, steps, operations, elements, parts, And should not be construed to preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

First, with reference to Figure 2 looks at the LED lighting apparatus according to an embodiment of the present invention.

As shown in FIG. 2, the LED lighting device 100 according to an embodiment of the present invention includes a housing 110, a printed circuit board 200, and an LED 120, and is located in front of the LED 120. It may further include a floodlight cover 130 is installed.

The housing 110 constitutes an exterior of the LED lighting apparatus 100 according to an embodiment of the present invention, and a space in which the printed circuit board 200 is embedded is formed in the housing 110. .

In addition, in one embodiment, an air vent 112 may be formed at an upper portion of the housing 110 to allow outside air to communicate with the inside of the housing 110.

The housing 110 is configured to illuminate the LED 120 to be used downward in the LED lighting device 100 according to an embodiment of the present invention, and has a structure connected to the lamppost, but this is one embodiment Since it is only an example, it is not limited to this.

In addition, the printed circuit board 200 may be installed at a portion in which the vent hole 112 is formed in the housing 110. The circuit wiring is formed on the printed circuit board 200, and the circuit wiring performs a current supply path to which a current for operating and controlling the LED 120 mounted on the substrate can be supplied.

In one embodiment, the printed circuit board 200 may be configured in the form of a bar so that the plurality of LEDs 120 can be mounted side by side in a row, the two bars are configured in a '-' shape one end is connected to each other May be

In addition, the LED lighting apparatus 100 according to an embodiment of the present invention may include a plurality of printed circuit board 200. Here, the plurality of printed circuit boards 200 may be connected to a power supply line 115 capable of supplying a current from an external power source to a circuit wiring formed on the substrate.

The printed circuit board 200 will be described in more detail with reference to FIGS. 3 to 10.

The LED 120 may be mounted on the circuit unit 220 formed on the printed circuit board 200, and a plurality of LEDs 120 may be provided at a predetermined interval in one embodiment.

In addition, the floodlight cover 130 is installed in front of the LED 120 and made of a transparent material may perform a function of light distribution of the LED (120). In one embodiment, the floodlight cover 130 may be of an integral structure that can cover all of the front surface of the plurality of printed circuit board 200 installed in the LED lighting device (100).

Next, a printed circuit board according to an embodiment of the present invention will be described with reference to FIGS. 3 to 5. 3 is a perspective view of a printed circuit board according to an embodiment of the present invention, FIG. 4 is an exploded view, and FIG. 5 is a front sectional view.

3 to 5, the printed circuit board 200 according to an embodiment of the present invention is provided with a substrate body of a metal material.

That is, in one embodiment, the substrate body may include an insulating layer 202 and an insulating layer 202 stacked on the metal base 201 and the metal base 201 of a metal material, as shown in a partially enlarged view of FIG. 5. It may be configured to include a circuit wiring 222 formed on.

Here, the insulating layer 202 may electrically block the circuit wiring 222 and the metal base 201, but may be made of a material capable of thermal conduction.

In addition, the printed circuit board 200 according to an exemplary embodiment of the present invention includes a circuit part 220 in which the circuit wiring 222 is formed and a heat dissipation fin part 230 bent to the rear of the circuit part 220.

As shown in FIG. 4, the circuit unit 220 includes a mounting unit 210 in which an LED 120 is mounted on a front surface of the circuit unit 220 to supply current to the LED 120 mounted on the mounting unit 210. Circuit wiring 222 may be printed.

In one embodiment, the circuit unit 220 may be composed of a first parallel portion 220a and a second parallel portion 220b configured in a bar shape so that the plurality of LEDs 120 may be arranged. Here, the first parallel portion 220a and the second parallel portion 220b are spaced apart from each other and arranged in parallel.

In addition, the first parallel portion 220a and the second parallel portion 220b may be connected to each other so that the circuit wirings 222 formed on each of the first parallel portion 220a and the second parallel portion 220b are connected to each other. That is, the circuit part 220 and the connection part 225 may be formed in a 'c' shape as a whole.

In addition, in one embodiment, the first parallel portion 220a, the second parallel portion 220b, and the connecting portion 225 may be formed of one substrate. That is, the first parallel portion 220a, the second parallel portion 220b, and the connecting portion 225 may be composed of one metal base 201, and the circuit wiring 222 formed on each of the metal base ( 201) may be connected to each other.

In the circuit unit 220, a plurality of LEDs 120 may be arranged side by side. That is, a plurality of mounting portions 210 may be formed at predetermined intervals along the length direction of the first parallel portion 220a and the second parallel portion 220b, and the LEDs 120 may be formed on each of the plurality of mounting portions 210. ) May be mounted.

Meanwhile, the heat dissipation fin unit 230 may be formed by bending the substrate body to the rear of the circuit unit 220 at the outer portion of the circuit unit 220, that is, the edge of the circuit unit 220. Here, since the substrate body to be bent is a portion without the circuit wiring 222, there is no damage to the circuit wiring 222. That is, the heat dissipation fin unit 230 may be composed of only the metal base 201 or only the metal base 210 in which the insulating layer 202 is stacked.

Here, the bent heat radiating fin 230 may protrude to the rear of the circuit unit 220 along the outer portion of the circuit unit 220.

In one embodiment, the heat dissipation fin 230 may be configured in a fin shape cut into a predetermined width and length, and a plurality of heat dissipation fins 230 may be formed on the outer portion of the circuit unit 220.

As shown in FIG. 4, the heat dissipation fin unit 230 may be formed by cutting the integrated substrate body according to the shape of the heat dissipation fin unit 230 and then bending the bent line 205.

In one embodiment, when the circuit unit 220 is composed of the first parallel portion 220a and the second parallel portion 220b as described above, the plurality of heat dissipation fin portions 230 may be formed of the first parallel portion 220a. It may be formed along both sides of the second parallel portion 220b and the outside of the connecting portion 225.

Here, since the heat dissipation fin unit 230 is heat-dissipated as the contact area with air is larger, the plurality of heat dissipation fin units 230 may be formed to be spaced apart from each other.

Accordingly, the heat dissipation fins 230 adjacent to each other among the plurality of heat dissipation fins 230 may be bent at different points of the outer portions of the circuit unit 220 and the connection unit 225 so that the side surfaces thereof do not contact each other.

On the other hand, when the plurality of heat radiation fins 230 that are bent at the outer portion of the circuit unit 220 are bent continuously on the same straight line, the heat dissipation fins 230 adjacent to each other are in contact with each other and have a contact area with air. This can be reduced.

To compensate for this, in one embodiment, the plurality of heat dissipation fin parts 230 formed on the outside of the first parallel part 220a and the second parallel part 220b are spaced apart from the neighboring heat dissipation fin parts 230. It may be bent to form a layer in the plane direction from the outside of the 220a and the second parallel portion 220b.

In addition, in one embodiment, each of the plurality of heat dissipation fin parts 230 formed inside the first parallel part 220a and the second parallel part 220b may have a first parallel part 220a and a second parallel part 220b. It can be staggered in a staggered fashion.

On the other hand, the substrate body of the printed circuit board 200 according to an embodiment of the present invention may be made of aluminum (Al) or copper (Cu) or aluminum alloys or copper alloys thereof having good thermal conductivity and formability. have.

In the printed circuit board 200 as described above, heat generated from the LED 120 mounted on the mounting unit 210 may be transferred to the heat dissipation fin unit 230, and the heat dissipation fin unit 230 may transmit the received heat to air. Through the contact of the can be emitted to the outside of the substrate, through which the printed circuit board 200 and the LED 120 mounted thereon can be cooled.

Next, a printed circuit board according to other embodiments of the present invention will be described with reference to FIGS. 6 to 9.

6 is a cross-sectional front view illustrating an exemplary embodiment in which the heat dissipation fin unit 230 of the printed circuit board 200 illustrated in FIGS. 3 to 5 is formed in an annular shape.

As shown in FIG. 6, the heat dissipation fin portion 230 formed outside the first parallel portion 220a and the second parallel portion 220b has an inner side of the first parallel portion 220a and the second parallel portion 220b. The heat dissipation fin unit 230 may be formed longer than the heat dissipation fin unit 230, and the heat dissipation fin unit 230 facing each other among the plurality of heat dissipation fin units 230 formed on the outside of the first parallel portion 220a and the second parallel portion 220b. May be bent in the direction of the heat dissipation fin portion 230 and each end may be joined to each other by welding or the like to form an annular shape.

In this case, the heat dissipation fins 230 opposed to each other formed on the outer side of the first parallel portion 220a and the second parallel portion 220b may be supported by each other through the joined ends, thereby dissipating the heat dissipation fins 230. ) The structural performance can be improved.

On the other hand, Figure 7 is an exploded view of a printed circuit board 200-1 according to another embodiment of the present invention.

As shown in FIG. 7, in the printed circuit board 200-1 according to another embodiment of the present invention, the first parallel part 220a and the second parallel part 220b constituting the circuit part 220 are mutually different. It can be formed on an independent substrate body.

In addition, the two substrate bodies each including the first parallel portion 220a and the second parallel portion 220b are configured to be symmetrical with each other, and the first parallel portion 220a is formed through the connecting portion 225 formed therein. And the second parallel portion 220b may be joined to enable energization of each other.

That is, the two substrate bodies may be bonded to each other to form a '-' shape like the printed circuit board 200 illustrated in FIGS. 3 to 5.

As described above, the printed circuit board 200-1 according to another embodiment of the present invention is different from the printed circuit board 200 illustrated in FIG. 4 on both sides of the first parallel portion 220a and the second parallel portion 220b. The length of the heat dissipation fin 230 may be the same, through which the air contact area of the heat dissipation fin 230 may be wider.

Here, the two substrate bodies to be connected may be combined after the bending line 205 is bent to form the heat radiation fins 230, and welding may be used as the bonding method.

As such, the printed circuit board 200-1 according to another embodiment of the present invention formed by combining two substrate bodies may form a cross-sectional shape as shown in FIG. 8.

On the other hand, in another embodiment, the heat dissipation fins 230 facing each other on both sides of the first parallel portion 220a and the second parallel portion 220b are bent in a relative direction and the respective ends are joined to each other to FIG. 9. It may also form a ring shape as shown.

In this case, the printed circuit board 200-1 has an annular heat dissipation fin 230 formed in each of the first parallel portion 220a and the second parallel portion 220b, thereby improving structural performance and improving air quality. The contact area can be further expanded.

Meanwhile, in the above embodiments, the printed circuit board 200. 200-1 may include a section in which the heat dissipation fin unit 230 is not formed in the outer portion of the circuit unit 220.

For example, in the printed circuit boards 200 and 200-1 illustrated in FIGS. 3 to 9, the heat dissipation fin unit 230 may not be formed at the center of the first parallel portion 220a and the second parallel portion 220b. .

As such, the section in which the heat dissipation fin unit 230 is not formed may serve as a vent for smoothly communicating air with respect to the heat dissipation fin unit 230.

Finally, with reference to FIG. 10 looks at the floodlight cover 130 mounted on the printed circuit board 200 of the LED lighting apparatus 100 according to an embodiment of the present invention. Here, FIG. 10 is a front sectional view of a printed circuit board 200 mounted on the LED lighting apparatus 100 according to an embodiment of the present invention.

As shown in FIG. 10, in the LED lighting apparatus 100 according to an embodiment of the present invention, the floodlight cover 130 described above with reference to FIG. 2 may be sealed around the circuit unit 220.

In one embodiment, the transparent cover 130 may be formed with a sealing portion 135 corresponding to the circumference of the circuit portion 220 to be mounted.

When the floodlight cover 130 is bonded to the front surface of the printed circuit board 200 through the bolt 300 and the sealing unit 135 is sealed, the LED 120 and the circuit wiring 222 mounted on the mounting unit 210 are connected. ) May be sealed by the floodlight cover 130, through which the floodlight cover 130 may protect the LED 120 from foreign matter and moisture.

When the printed circuit board 200 according to an embodiment of the present invention is compared with an existing separate heat sink and an assembly of a printed circuit board (hereinafter, a conventional assembly), the printed circuit board according to an embodiment of the present invention. While the temperature of 200 is only about 2.4 ° C. higher than that of the conventional assembly, the weight is reduced to one fifth of the weight of the conventional assembly.

While the present invention has been particularly shown and described with reference to particular embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention as defined by the following claims I would like to make it clear.

100: LED lighting device 110: housing
112: vent 120: LED
130: floodlight 200, 200-1: printed circuit board
201: metal base 202: insulating layer
210: mounting portion 220: circuit portion
222: circuit wiring 230: heat radiation fin

Claims (12)

In a printed circuit board having a substrate body of a metal material,
A circuit unit in which an LED is mounted on a front surface and a circuit wiring is formed; And
And a plurality of heat dissipation fin parts protruding to the rear of the circuit part by bending the substrate body of the outer portion of the circuit part.
And a plurality of heat dissipation fin parts having a heat dissipation structure which is joined to the opposite heat dissipation fin parts to form an annular shape. In a printed circuit board having a substrate body of a metal material,
A circuit unit in which an LED is mounted on a front surface and a circuit wiring is formed; And
And a plurality of heat dissipation fin parts protruding to the rear of the circuit part by bending the substrate body of the outer portion of the circuit part.
The circuit portion includes a first parallel portion and a second parallel portion in which a plurality of LEDs are arranged and parallel to each other,
A connection part for connecting one end of the first parallel part and the second parallel part to each other is provided,
The first parallel portion, the second parallel portion and the connecting portion is composed of one substrate,
The heat dissipation fin portion has a heat dissipation structure formed on both sides of the first parallel portion and the second parallel portion and the outer side of the connection portion. The method according to claim 1 or 2,
The substrate body is a printed circuit board having a heat dissipation structure, characterized in that made of aluminum (Al), copper (Cu), aluminum alloy or copper alloy. The method according to claim 1 or 2,
The heat dissipation fins adjacent to each other among the plurality of heat dissipation fins are bent at different points of the outer portion of the circuit portion, and thus have a heat dissipation structure. The method according to claim 1 or 2,
A plurality of heat dissipation fins,
The printed circuit board having a heat dissipation structure characterized in that the substrate body is cut according to the shape of the heat dissipation fin portion and bent at the outer portion of the circuit portion. The method of claim 2,
The heat dissipation fin portion formed on the outer side of the first parallel portion and the second parallel portion is bonded to the opposing relative heat dissipation fin portion to form a ring shape, characterized in that the printed circuit board. The method of claim 2,
The first parallel portion and the second parallel portion are formed on a substrate independent of each other,
And the first parallel portion and the second parallel portion are electrically connected to each other by the connection portion. The method of claim 7, wherein
The heat dissipation fin portion facing each other on both sides of each of the first parallel portion and the second parallel portion is bonded to the opposite heat dissipation fin portion to form a ring shape, characterized in that the heat dissipation structure. The method according to claim 1 or 2,
The printed circuit board,
Printed circuit board having a heat dissipation structure, characterized in that it comprises a section in which the heat dissipation fin portion is not formed in the outer portion of the circuit portion. housing;
A printed circuit board according to claim 1 or 2 installed inside the housing; And
At least one LED mounted on the circuit unit formed on the printed circuit board;
LED lighting device comprising a. The method of claim 10,
LED lighting device further comprises; a floodlight cover installed in front of the LED. The method of claim 11,
And the floodlight cover is sealed around the circuit portion.

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