KR101117502B1 - 헤드폰 장치 - Google Patents
헤드폰 장치 Download PDFInfo
- Publication number
- KR101117502B1 KR101117502B1 KR1020057024185A KR20057024185A KR101117502B1 KR 101117502 B1 KR101117502 B1 KR 101117502B1 KR 1020057024185 A KR1020057024185 A KR 1020057024185A KR 20057024185 A KR20057024185 A KR 20057024185A KR 101117502 B1 KR101117502 B1 KR 101117502B1
- Authority
- KR
- South Korea
- Prior art keywords
- headphone device
- driver unit
- headphone
- baffle
- baffle portion
- Prior art date
Links
- 239000011148 porous material Substances 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims description 7
- 239000004745 nonwoven fabric Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 229920002678 cellulose Polymers 0.000 claims description 3
- 239000001913 cellulose Substances 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 claims 2
- 238000009423 ventilation Methods 0.000 abstract description 5
- 239000004744 fabric Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000057 synthetic resin Substances 0.000 description 5
- 229920003002 synthetic resin Polymers 0.000 description 5
- 229910000861 Mg alloy Inorganic materials 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 210000005069 ears Anatomy 0.000 description 3
- 229910001069 Ti alloy Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 229920006310 Asahi-Kasei Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000737 Duralumin Inorganic materials 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 241000190021 Zelkova Species 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000002649 leather substitute Substances 0.000 description 1
- 229910001234 light alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000029058 respiratory gaseous exchange Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1008—Earpieces of the supra-aural or circum-aural type
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1058—Manufacture or assembly
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Headphones And Earphones (AREA)
Abstract
Description
Claims (10)
- 드라이버 유닛의 앞부분 개구부를 제외한 공간 주위를 둘러싸도록 구성한 배플(baffle)부 및 상기 드라이버 유닛의 배면을 덮도록 구성한 백 하우징부 중 하나 이상을 화학 섬유 부직포를 사용하여 형성하고,상기 배플부를 원뿔 형상으로 형성한,헤드폰 장치.
- 삭제
- 제1항에 있어서,상기 백 하우징의 배면에 개구부를 뚫어서 형성된, 헤드폰 장치.
- 삭제
- 드라이버 유닛의 앞부분 개구부를 제외한 공간 주위를 둘러싸도록 구성한 배플(baffle)부 및 상기 드라이버 유닛의 배면을 덮도록 구성한 백 하우징부 중 하나 이상을 셀룰로오스계 재료를 사용하여 형성하고,상기 배플부를 원뿔 형상으로 형성한,헤드폰 장치.
- 제1항에 있어서,상기 드라이버 유닛을, 프레임을 형성하는 환형 프레임을 교락(橋絡; bridge)하도록 아치형으로 형성한 브리지부에 배치한, 헤드폰 장치.
- 제1항에 있어서,상기 배플부의 원뿔 형상은 원뿔의 중심선에 대해 비대칭으로 이루어지는, 헤드폰 장치.
- 제1항에 있어서,상기 화학 섬유 부직포에 통기성을 가지는 접착층을 통하여 다공질 재료를 복합시켜서 형상이 안정되도록 이루어진, 헤드폰 장치.
- 제5항에 있어서,상기 셀룰로오스계 재료에 통기성을 가지는 접착층을 통하여 다공질 재료를 복합시켜서 형상이 안정되도록 이루어진, 헤드폰 장치.
- 제1항, 제3항, 제5항, 제6항, 및 제7항 중 어느 한 항에 있어서,상기 헤드폰 장치에 마이크로폰 장치를 부가한, 헤드폰 장치.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004121918A JP4127235B2 (ja) | 2004-04-16 | 2004-04-16 | ヘッドホン装置 |
JPJP-P-2004-00121918 | 2004-04-16 | ||
PCT/JP2005/007579 WO2005101895A1 (ja) | 2004-04-16 | 2005-04-14 | ヘッドホン装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070001782A KR20070001782A (ko) | 2007-01-04 |
KR101117502B1 true KR101117502B1 (ko) | 2012-03-07 |
Family
ID=35150370
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020057024185A KR101117502B1 (ko) | 2004-04-16 | 2005-04-14 | 헤드폰 장치 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7983438B2 (ko) |
JP (1) | JP4127235B2 (ko) |
KR (1) | KR101117502B1 (ko) |
CN (1) | CN1788522B (ko) |
BR (1) | BRPI0504914A (ko) |
TW (1) | TW200603650A (ko) |
WO (1) | WO2005101895A1 (ko) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4899810B2 (ja) | 2006-11-10 | 2012-03-21 | ソニー株式会社 | ヘッドホン及びイヤーパッド |
US20080170710A1 (en) * | 2006-11-13 | 2008-07-17 | Solteras, Inc. | Headphone driver with improved frequency response |
DE102007005620B4 (de) * | 2007-01-31 | 2011-05-05 | Sennheiser Electronic Gmbh & Co. Kg | Dynamischer Schallwandler, Hörer und Hör-Sprech-Garnitur |
JP2010263460A (ja) * | 2009-05-08 | 2010-11-18 | Audio Technica Corp | イヤーマフ及びヘッドホン |
US9154866B2 (en) | 2009-06-10 | 2015-10-06 | Apple Inc. | Fiber-based electronic device structures |
JP5340833B2 (ja) * | 2009-07-06 | 2013-11-13 | 株式会社オーディオテクニカ | イヤーマフ及びヘッドホン |
CN101851717B (zh) | 2010-06-14 | 2012-09-19 | 清华大学 | 壳体及应用该壳体的发声装置 |
CN101851716B (zh) | 2010-06-14 | 2014-07-09 | 清华大学 | 镁基复合材料及其制备方法,以及其在发声装置中的应用 |
TWI428029B (zh) * | 2010-06-25 | 2014-02-21 | Hon Hai Prec Ind Co Ltd | 耳機 |
TWI565389B (zh) * | 2010-06-25 | 2017-01-01 | 鴻海精密工業股份有限公司 | 殼體及應用該殼體的發聲裝置 |
KR101641758B1 (ko) * | 2011-03-29 | 2016-07-21 | 울트라소네 아게 | 음향의 최적화된 방사를 갖는 헤드폰 |
TWI457009B (zh) * | 2011-12-02 | 2014-10-11 | Giga Byte Tech Co Ltd | 耳機耳殼及耳機 |
JP6436519B2 (ja) * | 2014-07-03 | 2018-12-12 | 株式会社オーディオテクニカ | ヘッドホン及びその製造方法 |
KR102383768B1 (ko) * | 2014-09-04 | 2022-04-06 | 하만인터내셔날인더스트리스인코포레이티드 | 헤드폰 이어 쿠션 |
JP2016058891A (ja) * | 2014-09-09 | 2016-04-21 | Pioneer DJ株式会社 | ヘッドホン |
DE102014221583B4 (de) * | 2014-10-23 | 2020-11-12 | Sennheiser Electronic Gmbh & Co. Kg | Elektroakustischer Schallwandler und Hörer |
WO2016181531A1 (ja) * | 2015-05-13 | 2016-11-17 | Omotenasy合同会社 | ヘッドフォン |
JP6520520B2 (ja) * | 2015-07-24 | 2019-05-29 | 株式会社Jvcケンウッド | スピーカ及びヘッドホン |
JP6727852B2 (ja) * | 2016-03-01 | 2020-07-22 | 株式会社オーディオテクニカ | ヘッドホン |
US20190215593A1 (en) * | 2018-01-11 | 2019-07-11 | Te-Sheng LIU | Highly-Closed Headphone Apparatus with Wearing Comfort |
US10771886B2 (en) * | 2019-01-11 | 2020-09-08 | Evga Corporation | Headphone structure for extending and enhancing resonance |
KR102636014B1 (ko) * | 2023-08-21 | 2024-02-08 | 김종호 | 헤드셋 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2468721A (en) * | 1945-07-09 | 1949-04-26 | Volkmann John | Earphone socket and noise shield |
US3112005A (en) * | 1960-07-28 | 1963-11-26 | Ca Nat Research Council | Earphones |
US3220505A (en) * | 1964-04-01 | 1965-11-30 | Willard B Hargrave | Audiometric headset |
JPS51129217A (en) * | 1975-05-06 | 1976-11-10 | Victor Co Of Japan Ltd | Headphone |
US4058688A (en) * | 1975-05-27 | 1977-11-15 | Matsushita Electric Industrial Co., Ltd. | Headphone |
US4097689A (en) * | 1975-08-19 | 1978-06-27 | Matsushita Electric Industrial Co., Ltd. | Out-of-head localization headphone listening device |
DE2836937B2 (de) * | 1977-08-31 | 1981-06-25 | AKG Akustische u. Kino-Geräte GmbH, Wien | Kopfhörer |
AT361555B (de) * | 1979-02-12 | 1981-03-25 | Akg Akustische Kino Geraete | Kopfhoerer |
US4654898A (en) * | 1985-10-11 | 1987-04-07 | Ishikawa Gerald K | Removable ear muff for headphones |
US4922542A (en) * | 1987-12-28 | 1990-05-01 | Roman Sapiejewski | Headphone comfort |
JPH0536991A (ja) | 1991-07-31 | 1993-02-12 | Nippon Steel Corp | 半導体記憶装置 |
JPH0536991U (ja) * | 1991-10-17 | 1993-05-18 | ソニー株式会社 | ヘツドホン装置 |
JPH1032892A (ja) | 1996-05-16 | 1998-02-03 | Sony Corp | 開放型ヘッドホン |
JPH11331972A (ja) | 1998-05-15 | 1999-11-30 | Sony Corp | ヘッドホン装置 |
US6466681B1 (en) * | 1999-09-21 | 2002-10-15 | Comprehensive Technical Solutions, Inc. | Weather resistant sound attenuating modular communications headset |
CN2416704Y (zh) * | 1999-12-27 | 2001-01-24 | 刘玉清 | 单耳耳鼓膜送受话器 |
US6856690B1 (en) * | 2002-01-09 | 2005-02-15 | Plantronis, Inc. | Comfortable earphone cushions |
US20030134553A1 (en) * | 2002-01-14 | 2003-07-17 | L.S.I. (420) Import Export And Marketing Ltd. | Sound absorbing article |
JP3950750B2 (ja) | 2002-06-28 | 2007-08-01 | 株式会社オーディオテクニカ | ヘッドホン |
EP1539483A4 (en) * | 2002-09-13 | 2008-07-30 | Cta Acoustics Inc | IMPROVED PHONIC ISOLATION MATERIAL AND METHOD OF MANUFACTURING THE SAME |
US7466838B1 (en) * | 2003-12-10 | 2008-12-16 | William T. Moseley | Electroacoustic devices with noise-reducing capability |
-
2004
- 2004-04-16 JP JP2004121918A patent/JP4127235B2/ja not_active Expired - Fee Related
-
2005
- 2005-04-12 TW TW094111523A patent/TW200603650A/zh not_active IP Right Cessation
- 2005-04-14 WO PCT/JP2005/007579 patent/WO2005101895A1/ja active Application Filing
- 2005-04-14 US US10/560,892 patent/US7983438B2/en not_active Expired - Fee Related
- 2005-04-14 KR KR1020057024185A patent/KR101117502B1/ko not_active IP Right Cessation
- 2005-04-14 CN CN2005800003865A patent/CN1788522B/zh not_active Expired - Fee Related
- 2005-04-14 BR BRPI0504914-8A patent/BRPI0504914A/pt not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200603650A (en) | 2006-01-16 |
JP4127235B2 (ja) | 2008-07-30 |
US7983438B2 (en) | 2011-07-19 |
JP2005311448A (ja) | 2005-11-04 |
KR20070001782A (ko) | 2007-01-04 |
US20060188121A1 (en) | 2006-08-24 |
CN1788522A (zh) | 2006-06-14 |
CN1788522B (zh) | 2011-05-18 |
WO2005101895A1 (ja) | 2005-10-27 |
TWI301382B (ko) | 2008-09-21 |
BRPI0504914A (pt) | 2006-10-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101117502B1 (ko) | 헤드폰 장치 | |
US4856118A (en) | Headphone cushioning | |
EP0208389B1 (en) | Headphone apparatus | |
JP3745602B2 (ja) | 身体セット型スピーカ装置 | |
US8213632B2 (en) | Electroacoustic transducer and ear speaker device | |
US20090268935A1 (en) | Headset device | |
TWI524783B (zh) | 耳機 | |
CN108605180A (zh) | 用于头戴式受话器的耳垫 | |
JPH01221504A (ja) | ヘルメットの音響装置 | |
GB2313248A (en) | Fully-open headphones with acoustic equalizer | |
CN210579147U (zh) | 一种降噪耳机 | |
CN204948303U (zh) | 一种动圈式耳机 | |
JP2019033465A (ja) | ヘッドホン | |
JP3864081B2 (ja) | 密閉型ヘッドホン | |
JP6905181B2 (ja) | ヘッドホン並びにスピーカーユニット | |
CN112243179A (zh) | 一种防汗防油的头戴式耳机 | |
JP2019145964A (ja) | イヤホン | |
JP2008521320A (ja) | インイヤ式ヘッドホン | |
JP2953800B2 (ja) | ヘッドホン | |
KR102577024B1 (ko) | 기압 평형 구조를 구비하는 리시버 | |
CN216451522U (zh) | 一种头戴式耳机的腔体调节结构 | |
CN222235021U (zh) | 一种便于更换耳罩的头戴式降噪耳机 | |
CN220629546U (zh) | 风噪降低结构和采用该结构的头戴式耳机 | |
CN218550141U (zh) | 外放式耳机和采用该外放式耳机的蓝牙耳机 | |
CN217693675U (zh) | 一种可调音的压耳式耳罩及耳麦 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0105 | International application |
Patent event date: 20051216 Patent event code: PA01051R01D Comment text: International Patent Application |
|
PG1501 | Laying open of application | ||
A201 | Request for examination | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20100316 Comment text: Request for Examination of Application |
|
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20110720 Patent event code: PE09021S01D |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20111123 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20120210 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20120210 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
LAPS | Lapse due to unpaid annual fee |