KR101032212B1 - 카메라 모듈, 카메라 모듈의 초점 조절 방법 및 카메라 모듈의 초점 조절 장치 - Google Patents
카메라 모듈, 카메라 모듈의 초점 조절 방법 및 카메라 모듈의 초점 조절 장치 Download PDFInfo
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- KR101032212B1 KR101032212B1 KR1020090086587A KR20090086587A KR101032212B1 KR 101032212 B1 KR101032212 B1 KR 101032212B1 KR 1020090086587 A KR1020090086587 A KR 1020090086587A KR 20090086587 A KR20090086587 A KR 20090086587A KR 101032212 B1 KR101032212 B1 KR 101032212B1
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- 238000000034 method Methods 0.000 title claims description 32
- 239000000758 substrate Substances 0.000 claims abstract description 59
- 239000000853 adhesive Substances 0.000 claims abstract description 26
- 230000001070 adhesive effect Effects 0.000 claims abstract description 26
- 230000003028 elevating effect Effects 0.000 claims description 8
- 230000007547 defect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- XBBRGUHRZBZMPP-UHFFFAOYSA-N 1,2,3-trichloro-4-(2,4,6-trichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=CC=C(Cl)C(Cl)=C1Cl XBBRGUHRZBZMPP-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B13/00—Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
- G03B13/32—Means for focusing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B13/00—Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
- G03B13/32—Means for focusing
- G03B13/34—Power focusing
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
- G02B7/08—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B3/00—Focusing arrangements of general interest for cameras, projectors or printers
- G03B3/10—Power-operated focusing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/804—Containers or encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Optics & Photonics (AREA)
- Studio Devices (AREA)
Abstract
Description
Claims (11)
- 렌즈를 수용하는 렌즈 배럴;상기 렌즈 배럴과 일체로 형성되는 하우징; 및상기 하우징이 접착제에 의해 상부에 접착되며, 상기 접착 시 포커싱 조절을 위해서 상기 하우징을 상하로 이동시키기 위한 승하강 수단이 통과하는 통과부가 구비되는 기판부;를 포함하는 카메라 모듈.
- 제1항에 있어서,상기 통과부는 상기 하우징과 상기 기판부의 접착 부분에 형성되는 홀인 것을 특징으로 하는 카메라 모듈.
- 제1항에 있어서,상기 통과부는 상기 기판부의 코너에 형성되는 개방된 형상인 것을 특징으로 하는 카메라 모듈.
- 제1항에 있어서,상기 렌즈 배럴과 상기 하우징은 일체의 사출물인 것을 특징으로 하는 카메라 모듈.
- 제1항에 있어서,상기 하우징은,상기 기판부와 접착되는 상기 하우징의 외측면에 테이퍼진 형상으로 형성되어 상기 접착제가 도피되도록 도피 공간을 제공하는 도피부를 포함하는 것을 특징으로 하는 카메라 모듈.
- 렌즈를 구비하는 렌즈 배럴과 일체로 형성되는 하우징을 기판부와의 접착 위치에 위치하도록 상기 기판부 상에 배치시키는 단계;상기 접착 위치인 상기 기판부에 접착제를 도포한 후에 상기 하우징을 가접착시키는 단계; 및상기 기판부에 형성되는 통과부를 통과하는 승하강 수단에 의해서 상기 하우징의 위치를 상하로 이동시켜 포커싱(focusing)하는 단계;를 포함하는 카메라 모듈의 초점 조절 방법.
- 제6항에 있어서,상기 렌즈를 금형에 배치한 후에 상기 렌즈를 내부에 수용하도록 사출하여 하우징을 형성시키는 것을 특징으로 하는 카메라 모듈의 초점 조절 방법.
- 제6항에 있어서,상기 통과부는 상기 하우징과 상기 기판부의 접착 부분에 상기 기판부를 관통하도록 홀을 형성시키는 것을 특징으로 하는 카메라 모듈의 초점 조절 방법.
- 제6항에 있어서,상기 통과부는 상기 기판부의 코너 부분을 절개하여 형성시키는 것을 특징으로 하는 카메라 모듈의 초점 조절 방법.
- 기판부에 형성되는 통과부를 통과하도록 형성되는 승하강 수단; 및포커싱을 위해서 렌즈 배럴과 일체로 형성되는 하우징을 상하로 이동시키도록 상기 승하강 수단을 이동시키는 구동부;를 포함하는 카메라 모듈의 초점 조절 장치.
- 제10항에 있어서,상기 구동부는,상기 승하강 수단의 단부에 형성되는 모터부를 포함하는 것을 특징으로 하는 카메라 모듈의 초점 조절 장치.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090086587A KR101032212B1 (ko) | 2009-09-14 | 2009-09-14 | 카메라 모듈, 카메라 모듈의 초점 조절 방법 및 카메라 모듈의 초점 조절 장치 |
US12/654,684 US8139146B2 (en) | 2009-09-14 | 2009-12-29 | Camera module, method of focusing the same, and device for focusing the same |
CN201010003400XA CN102023365B (zh) | 2009-09-14 | 2010-01-19 | 相机模块、使相机模具聚焦的方法以及装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020090086587A KR101032212B1 (ko) | 2009-09-14 | 2009-09-14 | 카메라 모듈, 카메라 모듈의 초점 조절 방법 및 카메라 모듈의 초점 조절 장치 |
Publications (2)
Publication Number | Publication Date |
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KR20110028941A KR20110028941A (ko) | 2011-03-22 |
KR101032212B1 true KR101032212B1 (ko) | 2011-05-02 |
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KR1020090086587A KR101032212B1 (ko) | 2009-09-14 | 2009-09-14 | 카메라 모듈, 카메라 모듈의 초점 조절 방법 및 카메라 모듈의 초점 조절 장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8139146B2 (ko) |
KR (1) | KR101032212B1 (ko) |
CN (1) | CN102023365B (ko) |
Families Citing this family (7)
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JP5487842B2 (ja) * | 2009-06-23 | 2014-05-14 | ソニー株式会社 | 固体撮像装置 |
US9179052B2 (en) * | 2011-09-23 | 2015-11-03 | Samsung Electro-Mechanics Co., Ltd. | Camera module |
US20140211009A1 (en) * | 2013-01-25 | 2014-07-31 | Magna Electronics Inc. | Lens assembly for vehicle vision system camera |
TWI575271B (zh) * | 2013-03-06 | 2017-03-21 | 鴻海精密工業股份有限公司 | 光通訊模組及用於該光通訊模組之點膠方法 |
KR101345703B1 (ko) * | 2013-03-11 | 2013-12-30 | 주식회사 원진일렉트로닉스 | 차량의 블로어 모터 구동기용 히트싱크 |
US9632278B2 (en) * | 2015-09-07 | 2017-04-25 | Everready Precision Ind. Corp. | Imaging-capturing and light-sensing optical apparatus |
TWI747501B (zh) | 2020-09-16 | 2021-11-21 | 大陽科技股份有限公司 | 成像鏡頭驅動模組與電子裝置 |
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2009
- 2009-09-14 KR KR1020090086587A patent/KR101032212B1/ko active IP Right Grant
- 2009-12-29 US US12/654,684 patent/US8139146B2/en not_active Expired - Fee Related
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2010
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Patent Citations (3)
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KR20070049835A (ko) * | 2005-11-09 | 2007-05-14 | 삼성전기주식회사 | 카메라 모듈 초점 조절장치 및 초점 조절방법 |
KR100831710B1 (ko) * | 2006-08-17 | 2008-05-22 | 삼성전기주식회사 | 카메라 모듈의 조립 장치 및 그 조립 방법 |
KR20100011436A (ko) * | 2008-07-25 | 2010-02-03 | 엘지이노텍 주식회사 | 카메라모듈 및 그 제작 방법 |
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US8139146B2 (en) | 2012-03-20 |
KR20110028941A (ko) | 2011-03-22 |
CN102023365A (zh) | 2011-04-20 |
US20110063493A1 (en) | 2011-03-17 |
CN102023365B (zh) | 2013-07-03 |
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