KR100998017B1 - 발광소자 패키지용 렌즈 및 이를 구비하는 발광소자 패키지 - Google Patents
발광소자 패키지용 렌즈 및 이를 구비하는 발광소자 패키지 Download PDFInfo
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- KR100998017B1 KR100998017B1 KR1020090015007A KR20090015007A KR100998017B1 KR 100998017 B1 KR100998017 B1 KR 100998017B1 KR 1020090015007 A KR1020090015007 A KR 1020090015007A KR 20090015007 A KR20090015007 A KR 20090015007A KR 100998017 B1 KR100998017 B1 KR 100998017B1
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- South Korea
- Prior art keywords
- lens
- light emitting
- emitting device
- device package
- refractive
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N21/49—Scattering, i.e. diffuse reflection within a body or fluid
- G01N21/53—Scattering, i.e. diffuse reflection within a body or fluid within a flowing fluid, e.g. smoke
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0028—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/85—Investigating moving fluids or granular solids
- G01N2021/8592—Grain or other flowing solid samples
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (12)
- 패키지 본체 상에 실장되는 발광소자 칩을 덮어 씌우는 발광소자 패키지용 렌즈에 있어서,상기 렌즈는 상기 패키지 본체의 상부측으로 돌출형성되는 외부표면이 하나의 메인 곡률반경을 가지며, 상기 메인 곡률반경보다 작은 크기의 서브 곡률반경을 가지는 굴절렌즈가 상기 렌즈의 외부표면 상에 돌출형성되어 상기 메인 곡률반경을 따라 복수개로 구비되는 발광소자 패키지용 렌즈.
- 제1항에 있어서,상기 굴절렌즈는 플라이 아이(fly-eye) 렌즈인 것을 특징으로 하는 발광소자 패키지용 렌즈.
- 제1항에 있어서,상기 굴절렌즈는 플라이 아이 패턴을 이루는 각 굴절렌즈 간의 간격과 상기 굴절렌즈의 서브 곡률반경에 관하여 조건식2를 만족하는 것을 특징으로 하는 발광소자 패키지용 렌즈.[조건식2] d = r/2여기서, d : 굴절렌즈 간의 간격r : 서브 곡률반경
- 제1항에 있어서,상기 굴절렌즈는 상기 외부표면을 따라 일정한 간격으로 함몰형성되는 복수개의 가로선과 세로선이 서로 교차하여 구획되는 것을 특징으로 하는 발광소자 패키지용 렌즈.
- 제5항에 있어서,상기 굴절렌즈는 상기 복수개의 가로선과 세로선에 의해 볼록한 메시(mesh)형상으로 이루어지는 것을 특징으로 하는 발광소자 패키지용 렌즈.
- 실장부가 노출되도록 상부측으로 개방된 캐비티가 형성되는 패키지 본체;상기 패키지 본체에 의해 지지되는 리드프레임;상기 실장부 상에 실장되어 상기 리드프레임과 전기적으로 연결되는 적어도 하나의 발광소자 칩; 및상기 패키지 본체의 상부측으로 돌출형성되는 외부표면이 하나의 메인 곡률반경을 가지며, 상기 메인 곡률반경보다 작은 크기의 서브 곡률반경을 가지는 굴절렌즈가 상기 외부표면 상에 돌출형성되어 상기 메인 곡률반경을 따라 복수개로 구비되는 렌즈;를 포함하는 발광소자 패키지.
- 제7항에 있어서,상기 굴절렌즈는 플라이 아이(fly-eye) 렌즈인 것을 특징으로 하는 발광소자 패키지.
- 제7항에 있어서,상기 굴절렌즈는 플라이 아이 패턴을 이루는 각 굴절렌즈 간의 간격과 상기 굴절렌즈의 서브 곡률반경에 관하여 조건식2를 만족하는 것을 특징으로 하는 발광소자 패키지.[조건식2] d = r/2여기서, d : 굴절렌즈 간의 간격r : 서브 곡률반경
- 제7항에 있어서,상기 굴절렌즈는 상기 외부표면을 따라 일정한 간격으로 함몰형성되는 복수 개의 가로선과 세로선이 서로 교차하여 구획되는 것을 특징으로 하는 발광소자 패키지.
- 제11항에 있어서,상기 굴절렌즈는 상기 복수개의 가로선과 세로선에 의해 볼록한 메시(mesh)형상으로 이루어지는 것을 특징으로 하는 발광소자 패키지.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090015007A KR100998017B1 (ko) | 2009-02-23 | 2009-02-23 | 발광소자 패키지용 렌즈 및 이를 구비하는 발광소자 패키지 |
US12/607,694 US8253154B2 (en) | 2009-02-23 | 2009-10-28 | Lens for light emitting diode package |
JP2009258363A JP2010199544A (ja) | 2009-02-23 | 2009-11-11 | 発光素子パッケージ用レンズ及びこれを備える発光素子パッケージ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090015007A KR100998017B1 (ko) | 2009-02-23 | 2009-02-23 | 발광소자 패키지용 렌즈 및 이를 구비하는 발광소자 패키지 |
Publications (2)
Publication Number | Publication Date |
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KR20100095946A KR20100095946A (ko) | 2010-09-01 |
KR100998017B1 true KR100998017B1 (ko) | 2010-12-03 |
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KR1020090015007A Active KR100998017B1 (ko) | 2009-02-23 | 2009-02-23 | 발광소자 패키지용 렌즈 및 이를 구비하는 발광소자 패키지 |
Country Status (3)
Country | Link |
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US (1) | US8253154B2 (ko) |
JP (1) | JP2010199544A (ko) |
KR (1) | KR100998017B1 (ko) |
Cited By (1)
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KR101487344B1 (ko) * | 2011-03-29 | 2015-02-04 | 오스람 옵토 세미컨덕터스 게엠베하 | 광소자 및 그러한 광소자를 포함하는 복사 방출 장치 |
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- 2009-02-23 KR KR1020090015007A patent/KR100998017B1/ko active Active
- 2009-10-28 US US12/607,694 patent/US8253154B2/en active Active
- 2009-11-11 JP JP2009258363A patent/JP2010199544A/ja active Pending
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Also Published As
Publication number | Publication date |
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KR20100095946A (ko) | 2010-09-01 |
JP2010199544A (ja) | 2010-09-09 |
US8253154B2 (en) | 2012-08-28 |
US20100213480A1 (en) | 2010-08-26 |
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